JP5727171B2 - ガス排気方法及びガス排気を行う基板加熱装置 - Google Patents

ガス排気方法及びガス排気を行う基板加熱装置 Download PDF

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Publication number
JP5727171B2
JP5727171B2 JP2010182795A JP2010182795A JP5727171B2 JP 5727171 B2 JP5727171 B2 JP 5727171B2 JP 2010182795 A JP2010182795 A JP 2010182795A JP 2010182795 A JP2010182795 A JP 2010182795A JP 5727171 B2 JP5727171 B2 JP 5727171B2
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substrate
shutter
heating
storage container
heat insulating
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English (en)
Japanese (ja)
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JP2011114339A (ja
JP2011114339A5 (enrdf_load_stackoverflow
Inventor
声 求 姜
声 求 姜
良 洙 金
良 洙 金
康 赫 李
康 赫 李
俊 南
俊 南
起 天 尹
起 天 尹
珍 洙 金
珍 洙 金
敬 善 閔
敬 善 閔
鉉 中 李
鉉 中 李
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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Publication of JP2011114339A5 publication Critical patent/JP2011114339A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

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  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
  • Furnace Details (AREA)
JP2010182795A 2009-11-27 2010-08-18 ガス排気方法及びガス排気を行う基板加熱装置 Active JP5727171B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090115557A KR101671873B1 (ko) 2009-11-27 2009-11-27 가스 배기 방법 및 이를 수행하기 위한 기판 가열 장치
KR10-2009-0115557 2009-11-27

Publications (3)

Publication Number Publication Date
JP2011114339A JP2011114339A (ja) 2011-06-09
JP2011114339A5 JP2011114339A5 (enrdf_load_stackoverflow) 2013-09-19
JP5727171B2 true JP5727171B2 (ja) 2015-06-03

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JP2010182795A Active JP5727171B2 (ja) 2009-11-27 2010-08-18 ガス排気方法及びガス排気を行う基板加熱装置

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Country Link
JP (1) JP5727171B2 (enrdf_load_stackoverflow)
KR (1) KR101671873B1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014054511A1 (ja) * 2012-10-03 2014-04-10 シャープ株式会社 基板焼成装置
KR102315008B1 (ko) * 2014-11-24 2021-10-20 엘지디스플레이 주식회사 디스플레이패널 제조용 열처리장치 및 열처리장치용 셔터장치
KR102528927B1 (ko) 2021-05-07 2023-05-03 피코앤테라(주) 웨이퍼 수납용기
KR20250087813A (ko) 2023-12-08 2025-06-17 주식회사 대지메카트로닉스 워킹빔타입 pcb 건조 장치 및 방법
KR20250087815A (ko) 2023-12-08 2025-06-17 주식회사 대지메카트로닉스 수직타입 원적외선 pcb 건조 장치 및 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149020A (ja) * 1983-02-16 1984-08-25 Hitachi Ltd 縦型反応炉
JP2564288B2 (ja) * 1987-01-23 1996-12-18 株式会社日立製作所 ベ−ク装置
JPH03209714A (ja) * 1990-01-11 1991-09-12 Mitsubishi Electric Corp レジスト塗布装置
JPH0684781A (ja) * 1992-09-03 1994-03-25 Fujitsu Ltd 半導体製造装置
JP3247976B2 (ja) * 1993-09-06 2002-01-21 東京エレクトロン株式会社 熱処理装置
JP3555734B2 (ja) * 1998-03-24 2004-08-18 大日本スクリーン製造株式会社 基板加熱処理装置
JP4564624B2 (ja) * 2000-04-28 2010-10-20 小糸工業株式会社 陶芸用電気炉
JP3855127B2 (ja) * 2003-02-20 2006-12-06 光洋サーモシステム株式会社 熱処理装置
JP2005019593A (ja) * 2003-06-25 2005-01-20 Matsushita Electric Ind Co Ltd 熱処理方法および装置
JP2005061645A (ja) * 2003-08-12 2005-03-10 Clean Technology Kk 基板加熱乾燥装置に設ける換気構造
JP4255789B2 (ja) * 2003-09-08 2009-04-15 メタウォーター株式会社 誘導加熱式乾留炉
JP4833005B2 (ja) * 2006-09-11 2011-12-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

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Publication number Publication date
KR20110058985A (ko) 2011-06-02
JP2011114339A (ja) 2011-06-09
KR101671873B1 (ko) 2016-11-04

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