JP5721585B2 - 部品実装ライン - Google Patents
部品実装ライン Download PDFInfo
- Publication number
- JP5721585B2 JP5721585B2 JP2011175210A JP2011175210A JP5721585B2 JP 5721585 B2 JP5721585 B2 JP 5721585B2 JP 2011175210 A JP2011175210 A JP 2011175210A JP 2011175210 A JP2011175210 A JP 2011175210A JP 5721585 B2 JP5721585 B2 JP 5721585B2
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- 239000000758 substrate Substances 0.000 claims description 96
- 238000004519 manufacturing process Methods 0.000 claims description 45
- 238000012546 transfer Methods 0.000 claims description 35
- 238000009826 distribution Methods 0.000 claims description 20
- 230000007246 mechanism Effects 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims 2
- 238000000034 method Methods 0.000 description 29
- 230000008569 process Effects 0.000 description 23
- 238000012545 processing Methods 0.000 description 20
- 230000008859 change Effects 0.000 description 12
- 239000000047 product Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- Supply And Installment Of Electrical Components (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011175210A JP5721585B2 (ja) | 2011-08-10 | 2011-08-10 | 部品実装ライン |
CN201210285663.3A CN102958343B (zh) | 2011-08-10 | 2012-08-10 | 元件安装线 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011175210A JP5721585B2 (ja) | 2011-08-10 | 2011-08-10 | 部品実装ライン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013038335A JP2013038335A (ja) | 2013-02-21 |
JP5721585B2 true JP5721585B2 (ja) | 2015-05-20 |
Family
ID=47766337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011175210A Active JP5721585B2 (ja) | 2011-08-10 | 2011-08-10 | 部品実装ライン |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5721585B2 (zh) |
CN (1) | CN102958343B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6244551B2 (ja) * | 2014-02-26 | 2017-12-13 | パナソニックIpマネジメント株式会社 | 部品実装ライン及び部品実装方法 |
DE102014222940A1 (de) | 2014-11-11 | 2016-05-12 | Siemens Aktiengesellschaft | Bestücken von Leiterplatten |
DE102015200414A1 (de) | 2015-01-14 | 2016-07-14 | Siemens Aktiengesellschaft | Verfahren und System zur Bestückung von Leiterplatten |
CN111447822B (zh) * | 2015-11-17 | 2021-05-07 | 株式会社富士 | 安装处理方法、安装系统及元件安装机 |
US11586169B2 (en) * | 2017-05-18 | 2023-02-21 | Yamaha Hatsudoki Kabushiki Kaisha | Production management device |
CN112586105B (zh) * | 2018-08-23 | 2022-03-08 | 株式会社富士 | 移动作业管理装置、安装系统及移动作业管理方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4495069B2 (ja) * | 2005-11-15 | 2010-06-30 | パナソニック株式会社 | 撮像装置、部品実装機 |
DE112009000071T5 (de) * | 2008-01-23 | 2011-01-13 | Panasonic Corporation, Kadoma-shi | Bestimmungsverfahren für Bauteilmontagebedingungen |
JP5009939B2 (ja) * | 2008-02-25 | 2012-08-29 | パナソニック株式会社 | 実装条件決定方法 |
JP4394745B2 (ja) * | 2009-05-11 | 2010-01-06 | 富士機械製造株式会社 | 電子回路部品装着システム |
JP5047233B2 (ja) * | 2009-06-26 | 2012-10-10 | 株式会社日立ハイテクインスツルメンツ | 部品装着方法、部品装着システム、基板の投入順序を特定する装置及び基板の投入順序を特定させるプログラム |
JP4457173B2 (ja) * | 2009-07-29 | 2010-04-28 | 富士機械製造株式会社 | 電子回路部品装着システム |
JP4420980B2 (ja) * | 2009-07-29 | 2010-02-24 | 富士機械製造株式会社 | 電子回路部品装着システム |
-
2011
- 2011-08-10 JP JP2011175210A patent/JP5721585B2/ja active Active
-
2012
- 2012-08-10 CN CN201210285663.3A patent/CN102958343B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102958343A (zh) | 2013-03-06 |
JP2013038335A (ja) | 2013-02-21 |
CN102958343B (zh) | 2016-08-24 |
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