JP5721585B2 - Component mounting line - Google Patents

Description

  The present invention relates to a component mounting line in which a plurality of component mounting machines in which mounting heads can be replaced are arranged in series, and more specifically, each component mounting prior to continuous production of substrates of a plurality of substrate types. The present invention relates to a means for determining a mounting head of a machine.

  There are solder printing machines, component mounting machines, reflow machines, board inspection machines, etc., as equipment for producing boards with a large number of components mounted on them. It has become. Furthermore, a component mounting line is often configured by arranging a plurality of modular component mounting machines in series. With this type of component mounting machine or component mounting line, the type, size, and number of components to be mounted change according to the type of board to be produced. In many cases, efficiency is improved. For example, a general-purpose head having only one suction nozzle can suck from small parts to large parts and has many types of parts that can be mounted. On the other hand, each part reciprocates between the part supply device and the board. Efficient wearing efficiency is low. Conversely, a high-speed head having a large number of suction nozzles restricts the size of the parts sucked by each suction nozzle, so that the number of parts that can be mounted is reduced. Since a large number of parts can be mounted simply, mounting efficiency increases.

  Here, in the case of a configuration in which the mounting head can be replaced by a plurality of component mounting machines on the component mounting line, all types of required components can be reliably mounted if all are general-purpose heads, but the required time is extended. On the other hand, if all the high-speed heads are used in order to shorten the required time, there may be cases in which component types that cannot be mounted remain. Therefore, in the component mounting line, there are combinations of mounting heads for each component mounting machine that can mount all types of required components and shorten the required time to increase production efficiency.

  In addition, the distribution of component types to each component mounter is determined according to the combination of mounting heads. At this time, it is preferable to allocate the component types so that the individual cycle times required for component mounting by each component mounter are made as uniform as possible. Thus, a bottleneck called a bottleneck does not occur in the component mounting line, the board type cycle time indicated by the maximum value of the individual cycle time is shortened, and the throughput, that is, the production efficiency is further improved.

  The applicant of the present application discloses a technique relating to the determination of this type of mounting head combination in the setup data group creation method of Patent Document 1. This technique is intended for an electronic circuit component mounting system (component mounting line) including a plurality of mounting units (component mounting machines) capable of changing the configuration of the mounting head and the arrangement of a plurality of component supply tools (component storage devices). . Then, prior to the start of assembly work (component mounting operation) of multiple types of electronic circuits, the number of times of at least one of mounting and dismounting of the component supply tool is as much as possible on condition that the configuration change of the mounting head is allowed It is characterized by creating fewer setup data groups. As a result, if the setup change is performed according to the created setup data group, the number of setup changes for the component supply tool can be reduced, the time required for the setup change can be shortened, and the productivity can be improved.

Japanese Patent No. 4644162

  By the way, the technique of patent document 1 has the effect of reducing the frequency | count of mounting and removal of a component supply tool on the conditions which permit the change of the mounting head of each mounting unit (component mounting machine) whenever a board | substrate type is changed. However, the same combination of mounting heads is not used consistently when a plurality of substrate types are continuously produced. Therefore, in the case of high-mix low-volume production with a small number of boards for each board type, the ratio of the setup change time to the operation time of the component mounting line is increased, and the setup change time is extended by changing the mounting head. Production efficiency is greatly reduced. For this reason, when a plurality of board types are produced in a variety of small-quantity production, if the mounting heads of the component mounting machines are continuously used without being changed, the production efficiency is improved.

  In addition, when the types and quantity of mounting heads are limited, for example, when there is not a sufficient number of mounting heads, or when the mounting heads are shared and used by multiple component mounting lines in the office, mass production Even so, the change of the mounting head is restricted. Therefore, the combination of the mounting heads of each component mounting machine is fixed so that a plurality of board types are continuously produced and the production efficiency of the entire board type is improved, and the distribution of the component types to each component mounting machine Optimizing the arrangement order of the component types in the component supply device of each component mounter is effective in improving production efficiency.

  The present invention has been made in view of the above problems of the background art, and has a configuration in which a plurality of component mounting machines in which mounting heads can be replaced are arranged in series, and through a period in which a plurality of board types are continuously produced. It is an object to be solved to provide a component mounting line that improves the production efficiency by determining the type of mounting head so as to reduce the time required for mounting under the condition that the mounting head is not replaced.

  The invention of the component mounting line according to claim 1 that solves the above-described problem is a set of a substrate transfer device that loads, positions, and unloads a board at a component mounting position, and a plurality of component storage devices that store a plurality of components. And a component transfer device having a mounting head for mounting the component on the substrate that has been sampled from the component storage device of the component supply device and a head driving mechanism for driving the mounting head. This is a component mounting line in which multiple component mounting machines are arranged in series, and the component transfer device of each of the multiple stages of component mounting machines can be mounted with a general-purpose head with many mountable component types and low mounting efficiency. It is possible to selectively mount multiple types of mounting heads, including high-speed heads with a small number of component types and high mounting efficiency, and prior to component mounting operation, The type of mounting head of the component transfer device of each of the component mounting machines is determined so as to shorten the time required for mounting under the condition that the mounting head is not replaced throughout the period of mounting the components on the number of substrates. And operating condition determining means for determining distribution of component types to be accommodated in a plurality of component accommodating devices of the component supply device of each of the component mounting machines.

  According to a second aspect of the present invention, in the first aspect, the operation condition determining means can reduce each individual cycle time required for the component mounters to mount a component on one board of a certain board type as much as possible. The maximum value among the individual cycle times of the component mounting machines is set as the board type cycle time of the board type, and the board type cycle times obtained for all board types are added to obtain the required time.

  According to a third aspect of the present invention, in the first aspect, the operation condition determining means can provide each individual cycle time required for each component mounting machine to mount a component on one board of a certain board type as much as possible. After equalizing, the maximum value of the individual cycle times of each component mounting machine is set as the board type cycle time of the board type, and the board type cycle time obtained for each board type is multiplied by the respective production number. To the required time.

  According to a fourth aspect of the present invention, in the first aspect, the operating condition determining means can provide each individual cycle time required for the component mounters to mount a component on a single board of a certain board type as much as possible. Equalize and use the maximum value among the individual cycle times of each component mounting machine as the board type cycle time of the board type, and multiply the board type cycle time obtained for each board type by the priority coefficient for each board type. After that, it adds to make the required time.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the operation condition determining means first sets the types of mounting heads of the component transfer devices of all the component mounters to the general-purpose head. Next, in order from the component mounting machine on the front side, the type of the mounting head is sequentially changed from the general-purpose head to a mounting head with relatively few mounting types and a relatively high mounting efficiency. The required time is calculated when all predetermined types of parts can be mounted on all types of boards, and the mounting head is replaced when there is no expectation that all predetermined types of parts can be mounted on all types of boards. Finally, the combination of the types of mounting heads that require the shortest time is adopted.

  According to a sixth aspect of the present invention, in any one of the first to fourth aspects, the operation condition determining unit first sets the type of the mounting head of the component transfer device of all the component mounters to the high-speed head. Next, in order from the component mounting machine on the rear stage side, the type of the mounting head is sequentially changed from the high-speed head to a mounting head having a relatively large number of mountable component types and a relatively low mounting efficiency. The required time is calculated when all the specified types of parts can be mounted on all types of boards, and when the required time obtained by the calculation becomes excessive, the replacement of the mounting head is terminated, and finally the required Adopt a combination of mounting head types that minimizes time.

  According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the arrangement order of the component types of the plurality of component accommodating devices in the component supply device of each component mounter can be changed for each of the substrate types. The operating condition determining means determines the arrangement order of the component types for each substrate type.

  The invention according to claim 8 is the invention according to claim 7, wherein the operation condition determining means minimizes each individual cycle time required for each component mounter to mount a component on one substrate for each substrate type. The order of arrangement of the optimum part types to be converted is determined.

  In the invention of the board production line according to the first aspect, the component transfer device of each of the plurality of component mounting machines can selectively mount a plurality of types of mounting heads including a general-purpose head and a high-speed head, for component mounting operation. First, determine the type of mounting head for each component mounter so as to reduce the estimated time required for mounting under the condition that the mounting head is not replaced for multiple board types. Determine the distribution of component types. This eliminates the need for a setup change operation in which the operator replaces the mounting head throughout the period of producing a plurality of substrate types, and can shorten the required time, thereby improving production efficiency.

  In the invention according to claim 2, since the individual cycle time of each component mounting machine is equalized as much as possible for a certain board type, and the maximum value is set as the board type cycle time, no bottleneck is generated in the component mounting line, and the board Seed cycle time is reduced. Further, the substrate type cycle times obtained for all the substrate types are added to obtain the required time. For this reason, the required time, which means the time required to produce one substrate of each substrate type, is shortened and the production efficiency is improved.

  In the invention according to claim 3, as in the case of claim 2, a bottleneck is not generated and the substrate type cycle time is shortened. In addition, the substrate type cycle time obtained for each of the substrate types is multiplied by the number of each production, and then added to obtain the required time. For this reason, the time required corresponds to the total production time required to produce each board type for each production number (strictly, the total production time excluding the setup change time). Efficiency is improved.

  In the invention according to claim 4, as in claim 2, a bottleneck is not generated and the substrate type cycle time is shortened. Further, the substrate type cycle time obtained for each of the substrate types is multiplied by the priority coefficient for each substrate type and then added to obtain the required time. For this reason, the required time means a scale of production efficiency considering the priority of each substrate type, and the required time is shortened to improve the production efficiency.

  In the invention according to claim 5, the operation condition determining means first temporarily places all the component mounting machines on the general-purpose head, and then sequentially from the front stage side to the mounting head having a relatively high mounting efficiency. The required time is calculated for each replacement, and the combination of the types of mounting heads that ultimately requires the shortest time is adopted. In the invention according to claim 6, the operating condition determining means first temporarily places all the component mounting machines on the high-speed head, and then, in order from the rear stage side, from the high-speed head to the mounting head having a relatively low mounting efficiency. Then, the required time is calculated for each, and the combination of the types of mounting heads that ultimately requires the shortest time is adopted. In either aspect, it is possible to determine the optimum mounting head combination that requires the shortest time by calculating the required time for only a part of the mounting head combinations, and it is possible to eliminate the trouble of calculating the required time for all the combinations.

  In either aspect, since the high-speed head is preferentially arranged on the front side and the general-purpose head is preferentially arranged on the rear side, the mounting order of the component types is automatically optimized. In other words, small parts such as chip resistors and chip capacitors are first mounted on the high-speed head on the front side, and then large parts such as IC elements and LSI elements are mounted on the general-purpose head on the back side. Parts do not interfere with the installation of large parts. If the general-purpose head is arranged on the front side and the large component is mounted first, the mounted large component may become an obstacle when the small component is mounted on the high-speed head on the rear side. This is because a high-speed head has a plurality of suction nozzles, and on the other hand, a large component has a high component height, so that there is a high possibility that they interfere with each other.

  In the invention according to claim 7, the arrangement order of the component types of the plurality of component accommodating devices in the component supply device of each component mounter can be changed for each board type, and the operating condition determining means can mount each component for each board type. Determine the arrangement order of the component types in the machine. Further, in the invention according to claim 8, the operation condition determining means is configured to optimize the optimum component type for minimizing each individual cycle time required for each component mounter to mount a component on one substrate for each substrate type. Determine the order of arrangement. When the mounting head of each component mounter is determined, the distribution of the component types is also determined, but the order of arrangement of the component types in the component supply device of each component mounter is not determined. Here, since the operating condition determination means optimizes the arrangement order of the component types of each component mounting machine, the individual cycle time is minimized, and the substrate type cycle time and the required time are also minimized, so that the production efficiency is remarkably increased. To improve.

It is a perspective view which shows the whole structure of the component mounting line of 1st Embodiment. It is a perspective view which shows one component base, ie, two component mounting machines. It is a perspective view explaining three types of mounting heads that can be selectively attached by the component transfer device, wherein (1) is a high-speed head, (2) is a medium-speed head, and (3) is a general-purpose head. It is the figure which arranged and showed the outline size of the parts which can mount three kinds of mounting heads. It is a figure of the arithmetic processing flow which shows the content of the arithmetic processing which an operation condition determination means performs. It is a figure of a list which shows an example of a precondition of a calculation processing flow, and a calculation processing process. It is a figure which illustrates the operation | movement which an operation condition determination means determines the combination of a mounting head in the component mounting line of 1st Embodiment. It is a figure of the arithmetic processing flow which shows the content of the arithmetic processing which an operation condition determination means performs in 2nd Embodiment. It is a figure which illustrates the operation | movement which an operation condition determination means determines the combination of a mounting head in the component mounting line of 2nd Embodiment.

  A component mounting line 1 according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing an overall configuration of a component mounting line 1 according to the first embodiment. The component mounting line 1 is configured by arranging four system bases 11 on which two component mounting machines having the same structure are mounted. Accordingly, the component mounting line 1 is configured with a total of eight component mounters 21 to 28 arranged in series, with the component mounter 21 on the left back side being the front stage and the component mounter 28 on the right front side being the rear stage. Become the side. In addition, as indicated by the XY coordinate axes in the figure, the direction in which the boards are carried into and out of the eight component mounting machines 21 to 28 in order is the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction. And FIG. 2 is a perspective view showing one component base, i.e., two component mounters 27 and 28 of the system base 11. The apparatus configuration of the component mounter 28 will be described in detail with reference to FIG.

  The component mounter 28 is configured by assembling the substrate transport device 3, the component supply device 4, the component transfer device 5, the component camera 6, the nozzle accommodating device 8, the control computer 7, and the like on the base 9. The board transfer device 3 is disposed near the center in the longitudinal direction (Y-axis direction) of the component mounting machine 2. The substrate transfer device 3 is a so-called double conveyor type device in which a first transfer device 31 and a second transfer device 32 are arranged in parallel. The first transport device 31 includes a pair of guide rails arranged in parallel on the base 9 in parallel in the X-axis direction, and a pair of conveyor belts that are guided by the guide rails and transport the substrate by placing the substrate thereon (not shown). Etc. The first transport device 31 is provided with a clamp device (not shown) that pushes up and positions the substrate transported to the component mounting position from the base 9 side. The second transport device 32 is configured in the same manner as the first transport device 31.

  The component supply device 4 is provided at the front portion in the longitudinal direction of the component mounter 28 (the left front side in FIG. 2). The component supply device 4 is configured by detachably attaching a plurality of cassette type feeders 41 on a main body (not shown). The cassette-type feeder 41 corresponds to a component housing device, and includes a feeder main body 42, a supply reel 43 that is rotatably and detachably attached to a rear portion of the feeder main body 42 (front side of the component mounting machine 28), and a tip of the feeder main body 42. And a component supply unit 44 provided near the center of the component mounter 28. The supply reel 43 is a medium for supplying parts, and is wound with a carrier tape (not shown) holding a predetermined number of parts at regular intervals. The leading end of the carrier tape is pulled out to the component supply unit 44, and different components are supplied for each carrier tape.

  The component transfer device 5 is a so-called XY robot type device that is movable in the X-axis direction and the Y-axis direction, and supplies components from the rear part (right rear side in FIG. 2) in the longitudinal direction of the component mounter 28 to the front part. It is arranged above the device 4. The component transfer device 5 includes a head drive mechanism 51, a mounting head 52, and the like. As will be described later, there are a plurality of types of mounting heads 52 that can be selectively mounted by an operator. The head drive mechanism 51 drives the mounting head 52 in the X axis direction and the Y axis direction.

  The component camera 6 is a device that determines the quality of the component sucked by the suction nozzle of the mounting head 52 of the component transfer device 5 and the quality of the component suction state. The component camera 6 is disposed on the base 9 between the component supply unit 44 of the component supply device 4 and the first transport device 31. Further, a nozzle accommodating device 8 is disposed on the base 9 adjacent to the component camera 6. The nozzle accommodating device 8 is an apparatus that accommodates the suction nozzle in each of the plurality of nozzle holding holes.

  The control computer 7 is disposed on the upper front side of the upper cover 91. The control computer 7 is linked with the substrate transfer device 3, the component supply device 4, the component transfer device 5, and the component camera 6 through control lines, and issues commands while appropriately exchanging information. The control computers 7 of the eight component mounters 21 to 28 are linked to a host computer (not shown), and the control computer 7 and the host computer control the component mounting operation in cooperation. Yes.

  Under the control of the control computer 7, the mounting head 52 of the component transfer device 5 first moves to the component supply device 4 to suck the component, and then moves to the component camera 6 to pick up the component suction state. Then, the component is moved to the substrate and the component is mounted. This series of operations is referred to as a mounting cycle, and the time required for one mounting cycle is referred to as a mounting cycle time. Further, by repeating the mounting cycle in each of the component mounting machines 21 to 28, the time required to mount the component of the allocated component type is the individual cycle time. In the first embodiment, the first and second transfer devices 31 and 32 alternately carry in and out the substrates, and the component transfer device 5 alternately mounts the components.

  Next, the type of the mounting head 52 of the component transfer device 5 will be described. In the first embodiment, the mounting head 52 can be selectively attached to the head driving mechanism 51 and can be replaced by an operator. FIG. 3 is a perspective view for explaining three types of mounting heads 52 that can be selectively attached by the component transfer device 5. (1) is a high-speed head 52H, (2) is a medium-speed head 52M, and (3). Is a general-purpose head 52L. The mounting head 52 is not limited to three types, and the present invention can be implemented even in the case of two types of the high-speed head 52H and the general-purpose head 52L, or in the case of four or more types.

  The high-speed head 52H shown in (1) of FIG. 3 is a mounting head that has a small number of mountable components and high mounting efficiency. The high speed head 52H holds the holder holding body 54H so as to be movable up and down and rotatable under the head main body 53H. The holder holder 54H has a plurality of, for example, eight nozzle holders 55H facing downward, and each nozzle holder 55H holds the suction nozzle 56H detachably. The nozzle holder 55H and the suction nozzle 56H of the high-speed head 52H are small, and there are restrictions on the distance between the suction nozzles 56H adjacent to each other, so that the parts that can be mounted are limited to small parts such as a chip resistor and a chip capacitor. On the other hand, a maximum of eight parts can be mounted in one mounting cycle, and the mounting efficiency is high.

  A general-purpose head 52L shown in (3) of FIG. 3 is a mounting head with many types of components that can be mounted and low mounting efficiency. The general-purpose head 52L holds only one nozzle holder 55L on the lower side of the head main body 53L so that the nozzle holder 55L can be raised and lowered, and the nozzle holder 55L holds the suction nozzle 56L so as to be detachable downward. Since the nozzle holder 55L and the suction nozzle 56L of the general-purpose head 52L are large-sized, large-sized parts and special-shaped parts can be mounted, and the versatility is excellent, and extremely small parts cannot be mounted. On the other hand, one mounting cycle is required for each part, and the mounting efficiency is low.

  A medium speed head 52M shown in (2) of FIG. 3 is a mounting head having intermediate characteristics between the high speed head 52H and the general-purpose head 52L. The medium speed head 52M holds two nozzle holders 55M and 57M below the head main body 53M. One nozzle holder 55M is similar to the large nozzle holder 55L of the general-purpose head 52L, and holds a large suction nozzle 56M in a detachable manner downward. The other nozzle holder 57M holds a plurality of, for example, six suction nozzles 58M around the horizontal axis so as to be selectable. The medium-speed head 52M has a nozzle selection device (not shown). The nozzle selection device rotates a plurality of suction nozzles 58M of the other nozzle holder 57M around the axis, and is disposed downward and is suctioned downward. The nozzle 58M1 is selected. One nozzle holder 55M and suction nozzle 56M of the medium-speed head 52M can be mounted with large parts or special-shaped parts, and is excellent in versatility, and the other nozzle holder 57M is a component that can be mounted because the suction nozzle 58M can be selected. More types. On the other hand, one mounting cycle is required for every two parts, and the mounting efficiency is moderate.

  Although omitted in FIG. 3, each of the mounting heads 52H, 52M, and 52L has a nozzle drive unit and a pneumatic control unit inside the head main bodies 53H, 53M, and 53L. The nozzle drive unit is a part for moving the suction nozzles 56H, 56M, 56L, and 58M up and down, and uses a servo motor as a drive source. The air pressure control unit is a part that generates and controls negative pressure when adsorbing components, and includes an air pump, valves, and the like.

  FIG. 4 is a diagram showing the outline sizes of components that can be mounted on the three types of mounting heads 52H, 52M, and 52L. In the drawing, the horizontal axis indicates the size L of the component, and the vertical axis indicates the type of the mounting head 52. As shown in the drawing, the high-speed head 52H can mount only small components having a minimum size L1 to L3. In the medium speed head 52M, the minimum size L2 of the mountable components is larger than the minimum size L1 of the high speed head 52H, and the maximum size L4 of the mountable components is the maximum size L3 of the high speed head 52H. (L1 <L2 <L3 <L4). Further, in the general-purpose head 52L, the minimum size L2 of components that can be mounted is about the same as the medium-speed head 52M, and the maximum size L5 of components that can be mounted is larger than the maximum size L4 of the medium-speed head 52M ( L4 <L5).

  Next, the function of the operating condition determining means possessed by the host computer will be described. FIG. 5 is a flowchart of an arithmetic processing flow showing the contents of the arithmetic processing performed by the operating condition determining means. The operation condition determining means calculates a required time T that is estimated to be required for mounting under the condition that the mounting head 52 is not replaced throughout the period of mounting the components on the respective production number of boards of a plurality of board types before the component mounting operation. The type of the mounting head 52 of the component transfer device 5 of each of the component mounters 21 to 28 is determined so as to shorten it. Further, the operating condition determining means determines the types of components stored in the plurality of cassette type feeders 41 (component storage devices) of the component supply devices 4 of the component mounting machines 21 to 28 under the determined combination of the mounting heads 52. Determine the allocation.

  First, the preconditions of the arithmetic processing flow will be described with reference to FIG. FIG. 6 is a table showing an example of preconditions for the arithmetic processing flow and arithmetic processing steps. In the list of FIG. 6, the “substrate type information” column in the first row indicates a plurality of substrate types that are continuously produced without replacing the mounting head 52. For example, four types of substrate types A to D are shown. Show. The column of “component type information” in the second row shows information on the component types PA to PD (= ΣPAk to ΣPDk) of all components mounted on the respective board types A to D. Specifically, the information on the component type PA includes information indicating how many component types PA1, PA2, PA3... Are mounted on the substrate of the substrate type A, and the component types PA1, PA2, PA3. Information on the type of mounting head 52 that can be mounted. Further, the column “production number N” in the third row shows the planned production numbers NA to ND of the substrates of the substrate types A to D, respectively. The column of “priority coefficient K” in the fourth row shows the respective priority coefficients KA to KD set for the board types A to D. The production number N and the priority coefficient K are used when calculating specific required times TN and TK as described later.

  The operating condition determining means first grasps the precondition in step S1 of FIG. As preconditions, in addition to the above-described board type information, component type information, production quantity N, and priority coefficient K, selection of mounting cycle time and required time T according to the type of each mounting head 52H, 52M, 52L Including decisions. These preconditions are stored in advance in a memory in the host computer or input and set prior to the component mounting operation.

The required time T is an evaluation parameter to be used when finally determining the combination of the types of the mounting heads 52 of the component mounters 21 to 28, and is selected from the three listed below in consideration of the production plan and the like. Make a decision.
(1) Required time TS: Sum of substrate type cycle times of all substrate types (2) Required time TN: Sum of products of substrate type cycle time of each substrate type and production number N for all substrate types (3 ) Required time TK: Sum of products of substrate type cycle time and priority factor K of each substrate type for all substrate types

  The required time TS of (1) means the time required to produce one substrate of each substrate type A to D. The required time TS is a preferable evaluation parameter when the production numbers NA to ND are substantially equal, for example, when the substrates of the substrate types A to D are combined into one final product. The required time TS can also be selected when the number of produced sheets NA to ND is undecided or indefinite. The required time TN of (2) corresponds to the total production time required to produce each substrate type A to D by the respective production number NA to ND, strictly speaking, the total production time excluding the setup change time. The required time TN is a preferable evaluation parameter when the production numbers NA to ND are greatly different. The required time TK in (3) means a scale of production efficiency in consideration of the priorities of the substrate types A to D. The required time TK is a preferable evaluation parameter when the priority of a specific substrate type is high, for example, when the delivery date of a specific substrate type is imminent and needs to be produced.

  Next, in step S2, the type of the mounting head 52 of the component transfer device 5 of all the component mounters 21 to 28 is temporarily placed on the general-purpose head 52L. Next, in step S3, the distribution of the component types PA to PD to the component mounters 21 to 28 in each of the board types A to D is optimized. The optimization of distribution means that the individual cycle times of the component mounters 21 to 28 required to mount components on one board of a certain board type are made as uniform as possible. By the optimization, the individual cycle time tji shown in the 5th to 12th lines in FIG. 6 is calculated. Note that the subscript j of the individual cycle time tji indicates the distinction between the component mounters 21 to 28, and the subscript i indicates the distinction between the board types A to D.

  For example, in the example of FIG. 6, the individual cycle times t1A to t8A are obtained as a result of optimizing the distribution of the component type PA to the component mounting machines 21 to 28 in the board type A. Similarly, individual cycle times t1B to t8B, individual cycle times t1C to t8C, and individual cycle times t1D to t8D are obtained for the substrate types B to D. Here, the individual cycle times t1A to t8D are approximately determined by the product of the number of mounting cycles and the mounting cycle time in each of the component mounters 21 to 28. Therefore, the operation condition determining means not only distributes the mountable component types in consideration of the types of mounting heads 52 of the component mounters 21 to 28, but also distributes the component types as evenly as possible to the component mounters 21 to 28. PA to PD and its number of parts are allocated. However, since the calculation process for optimization is complicated depending on the combination of the types of the mounting heads 52, the operating condition determination unit performs optimization by repeating trial and error as necessary.

  Next, in step S4, substrate type cycle times tA to tD of the respective substrate types A to D are obtained. For example, the board type cycle time tA of the board type A in the 13th row of FIG. 6 is obtained as the maximum value among the individual cycle times t1A to t8A (5th to 12th lines) of the component mounters 21 to 28.

Next, in step S5, one of the three required times TS, TN, and TK is calculated using one of the following three formulas.
TS = Σti (i = A to D)
TN = Σ (Ni × ti) (i = A to D)
TK = Σ (Ki × ti) (i = A to D)
Up to this point, the calculation processing up to the bottom row in FIG. 6 is performed, and the required time T (TS or TN or TK) is obtained. The required time T is obtained for one type of combination of the mounting heads 52.

  Next, in step S6, it is investigated whether or not the required time T has been shortened. If it has been shortened, the process proceeds to step S7, and if not, the process proceeds to S8. In the first step S6, which is all the general-purpose head 52L, the initial value of the required time T is obtained, so the process proceeds unconditionally to step S7. In step S7, the combination of the mounting heads 52 (set in step S9) and the distribution of component types (set in step S3) for which the shortened required time T can be obtained are updated and held.

  After step S7, the process is merged into step S8, and it is investigated whether the general-purpose head 52L can be replaced with the high-speed head 52H or the medium-speed head 52M in order from the front-side component mounting machine. That is, it is investigated whether or not the general-purpose head 52L is still left, and whether or not there is a possibility of mounting the parts of the predetermined all kinds PA to PD on the boards of all the board types A to D when the replacement is performed. To do. When the replacement is possible, the process proceeds to step S9, and the mounting head 52 is replaced. For example, in the first step S <b> 9, the general-purpose head 52 </ b> L of the foremost component mounter 21 is replaced with the high-speed head 52. Thereafter, the process returns to step S3. In addition, when the quantity which can be used is limited with the kind of mounting head 52, replacement within a limited range is implemented.

  In the second and subsequent steps S3 to S6, for each combination of the new mounting heads 52 that has been set, the calculation process in the fifth row and thereafter in FIG. To investigate the. When the required time T is shortened, a preferable calculation result is obtained. Therefore, the combination of the mounting heads 52 and the distribution of the component types are updated and held in step S7, and the process proceeds to step S8. If the required time T is not shortened, it is not a preferable calculation result, so the process proceeds to step S8 without performing update holding.

  In the second and subsequent steps S8, it is investigated whether or not the mounting head 52 can be replaced, and the calculation process returning from step S9 to step S3 is repeated while it is possible. Then, when the general-purpose head 52L disappears, or when there is no possibility that the components of the predetermined all kinds PA to PD can be mounted on the boards of all the board types A to D, the replacement of the mounting head 52 is aborted, and the process proceeds to step S10. . In step S10, the combination of the mounting heads 52 held and the distribution of the component types are adopted, and the arithmetic processing flow is terminated. The calculation processing result adopted is preferable because the required time T is finally shortened most.

  Thereafter, the operating condition determining means determines the optimum component type that minimizes the individual cycle times t1A to t8D of the component mounting machines 21 to 28 for each of the substrate types A to D, based on the distribution of the adopted component types. Determine the sequence order. That is, the arrangement order of the cassette type feeders 41 of the component feeders 4 of the component mounters 21 to 28 is determined. For example, the operating condition determining means concludes the arrangement order so that the component types that are frequently used are arranged closer to the center and the component types that are less frequently used are arranged closer to the end in the component supply device 4 of a certain component mounting machine. Thereby, the total moving distance of the mounting head 52 can be shortened, and the individual cycle times t1A to t8D can be minimized. Note that the arithmetic processing for determining the arrangement order of the cassette type feeders 41 may be shared by the control computer 7 of each of the component mounters 21 to 28.

  Next, the operation of the component mounting line 1 according to the first embodiment will be described by way of example. FIG. 7 is a diagram illustrating the operation in which the operation condition determining unit determines the combination of the mounting heads 52 in the component mounting line 1 of the first embodiment. The column “Case No.” in FIG. 7 indicates the number of repetitions of steps S3 to S8 in the calculation processing flow of FIG. 5, and the column “Suction nozzle type of each component mounting machine” is in steps S2 and S9. A combination of the set mounting heads 52 is shown. In addition, the “mountability determination” column determines whether or not components of all predetermined product types PA to PD can be mounted on the boards of all board types A to D (circle in the figure) or not (x in the figure). A result is shown, and the column of “required time T” is a value obtained when mounting is possible.

  In the case C1 of FIG. 7, when all the component mounting machines 21 to 28 are temporarily placed on the general-purpose head 52L, it is possible to mount the components of all the predetermined product types PA to PD on the substrates of all the substrate types A to D (can be mounted) ), The calculation process in the fifth line and thereafter in FIG. 6 is performed to obtain the required time T = T1. In the next case C2, when the general-purpose head 52L of the front-stage component mounting machine 21 is replaced with the high-speed head 52H, mounting is possible and the required time T = T2 is obtained. In the following cases C3 to C5, the general-purpose heads 52L of the component mounting machines 22 to 24 from the second stage to the fourth stage can be replaced with the high-speed heads 52H in order, so that they can be mounted, and the required times T = T3, T4 , T5 is obtained.

  In the next case C6, when the general-purpose head 52L of the fifth-stage component mounting machine 25 is replaced with the high-speed head 52H, it becomes impossible to mount all predetermined types of components on the boards of all board types A to D. In this situation, for example, the number of high-speed heads 52H that cannot be mounted is excessively increased with respect to the number of large-sized parts among all types of products PA to PD, and the medium-speed head 52M and the general-purpose head 52L that can mount this increase. Occurs when there is a shortage. Therefore, in the next case C7, when the high-speed head 52H of the fifth-stage component mounting machine 25 is replaced with a medium-speed head, mounting becomes possible, and the required time T = T7 is obtained.

  Further, in the next case C8, it is clear that the general-purpose head 52L of the sixth-stage component mounting machine 26 cannot be mounted even if the high-speed head 52H is replaced. Therefore, when the general-purpose head 52L is replaced with the medium-speed head 52M, The required time T = T8 can be obtained. In the next case C9, if the general-purpose head 52L of the seventh-stage component mounting machine 27 is replaced with the medium-speed head 52M, mounting becomes impossible. Here, since there is no possibility that the components of all predetermined product types PA to PD can be mounted on the substrates of all the substrate types A to D, the replacement of the mounting head 52 is aborted. The minimum value of the required time T = (T1 to T5, T7, T8) obtained so far is automatically updated and held, and the combination of the types of the mounting heads 52 can be adopted. it can.

  According to the component mounting line 1 of the first embodiment, prior to the component mounting operation, the required time T estimated to be required for mounting under the condition that the mounting head 52 is not replaced with respect to a plurality of board types A to D is shortened. Thus, the type of the mounting head 52 of each of the component mounters 21 to 28 is determined, and the distribution of the component type of each of the component mounters 21 to 28 is determined. Therefore, it is not necessary to perform a setup change operation in which the operator replaces the mounting head 52 throughout a period of producing a plurality of substrate types A to D, and the required time T can be shortened, so that the production efficiency is improved.

  Further, the individual cycle times t1A to t8A of the component mounting machines 21 to 21 for a certain board type A are equalized as much as possible, and the maximum value is set to the board type cycle time tA. The substrate type cycle time tA is shortened. Further, considering the production plan and the like, the time TS necessary for producing one board of each board type A to D and the production number NA to ND of each board type A to D are produced. It is possible to appropriately select a required time TK that represents a required time TN corresponding to the total production time required and a scale of production efficiency considering the priorities KA to KD of the substrate types A to D. The combination of the mounting heads 52 can be determined so as to shorten the required time T (TS or TN or TK), and the production efficiency is improved.

  Further, all the component mounting machines 21 to 28 are temporarily placed on the general-purpose head 52L, and then the general-purpose head 52L is sequentially replaced with the high-speed and medium-speed heads 52H and 52M to calculate the required time T. The trouble of calculating the required time T for all the combinations can be omitted. For example, in the apparatus configuration of the first embodiment, the total number of combinations of the mounting heads 52 is 6561 in three powers, and in the example of FIG. 7, it is only necessary to calculate the required time T with nine combinations. Further, since the high-speed head 52H is preferentially arranged on the front stage side and the general-purpose head 52L is preferentially arranged on the rear stage side, the mounting order of the component types is automatically optimized. That is, first, small components such as chip resistors and chip capacitors are mounted on the front-side high-speed head 52H, and then large components such as IC elements and LSI devices are mounted on the rear-side general-purpose head 52L. The small parts do not get in the way when installing large parts. If the general-purpose head 52L is arranged on the front side and the large component is mounted first, the mounted large component may become an obstacle when the small component is mounted on the high-speed head 52H on the rear side. .

  In addition, since the operating condition determining means determines the optimal arrangement order of the component types that minimizes the individual cycle times t1A to t8D of the component mounting machines 21 to 28 for each of the substrate types A to D, the substrate type cycle The times tA to tD and the required time T are also minimized, and the production efficiency is remarkably improved.

  Next, regarding the component mounting line of the second embodiment in which the content of the arithmetic processing of the operation condition determining means is different, the points different from the first embodiment will be mainly described. The overall configuration of the component mounting line of the second embodiment and the device configuration of each component mounter are the same as those of the first embodiment shown in FIGS. FIG. 8 is a flowchart of an arithmetic processing flow showing the contents of arithmetic processing performed by the operating condition determining means in the second embodiment. When determining the combination of the mounting heads 52, the operating condition determination unit of the second embodiment differs in the temporary placement method and replacement procedure of the mounting heads 52.

  The operation condition determining means of the second embodiment grasps the preconditions in step S21 of FIG. 8 as in the first embodiment. Next, in step S22, the type of the mounting head 52 of the component transfer apparatus 5 of all the component mounters 21 to 28 is temporarily placed on the high-speed head 52H. Next, in step S23, it is investigated whether or not the components of the predetermined all kinds PA to PD can be mounted on the boards of all the board types A to D, and when possible, to each of the component mounting machines 21 to 28 in each of the board types A to D. Optimize distribution of component types PA-PD. As a result of repeating the trial and error as necessary and optimizing the distribution, the individual cycle times t1A to t8D of the component mounting machines 21 to 28 in the respective board types A to D are obtained. Next, in step S24, substrate type cycle times tA to tD of the respective substrate types A to D are obtained. Next, in step S25, one of the three required times TS, TN, and TK is calculated.

  Next, in step S26, it is investigated whether or not the required time T (TS or TN or TK) has been shortened. If it has been shortened, the process proceeds to step S27, and if not, the process proceeds to step S28. It should be noted that the process proceeds to step S27 unconditionally at the first time when a condition for mounting components of all predetermined product types PA to PD is established on the boards of all board types A to D. In step S27, the combination of the mounting heads 52 (set in step S29) and the distribution of component types (set in step S23) for which the shortened required time T can be obtained are updated and held.

  After step S27, the process merges with step S28 to investigate whether or not the required time T is excessive. When one required time T is not yet obtained and when the required time T is not excessive, the process proceeds to step S29. In step S29, the high-speed head 52H is replaced with the low-speed head 52L or the medium-speed head 52M in order from the subsequent component mounting machine. For example, in the first step S9, the high speed head 52H of the last stage component mounter 28 is replaced with the low speed head 52L. Thereafter, the process returns to step S23.

  In the second and subsequent steps S23 to S26, the required time T is obtained for each set of the set new mounting heads 52, and it is investigated whether the required time T has been shortened. When the required time T is shortened, a preferable calculation result is obtained. In step S27, the combination of the mounting heads 52 and the distribution of the component types are updated and held. If the required time T is not shortened, it is not a preferable calculation result, so the process proceeds to step S28 without performing update holding.

  In the second and subsequent steps S28, it is investigated whether or not the required time T is excessive, and the calculation process returning from step S29 to step S23 is repeated while it is not excessive. Then, when the required time T becomes excessive, the replacement of the mounting head 52 is aborted, and the process proceeds to step S30. In step S30, the combination of the mounting heads 52 held and the distribution of the component types are adopted, and the calculation processing flow ends. The employed calculation result is a preferable result in which the required time T is finally shortened most.

  Thereafter, the operating condition determining means determines the optimum component type that minimizes the individual cycle times t1A to t8D of the component mounting machines 21 to 28 for each of the substrate types A to D, based on the distribution of the adopted component types. Determine the sequence order. That is, the arrangement order of the cassette type feeders 41 of the component feeders 4 of the component mounters 21 to 28 is determined.

  Next, the operation of the component mounting line 1 according to the second embodiment will be described by way of example. FIG. 9 is a diagram illustrating by way of example the operation in which the operating condition determining means determines the combination of the mounting heads 52 in the component mounting line of the second embodiment. In FIG. 9, the preconditions such as the substrate types A to D are the same as those in the first embodiment, and the notation format in the table is the same as that in FIG. 7 of the first embodiment. In the case C21 of FIG. 9, when all the component mounters 21 to 28 are temporarily placed on the high-speed head 52H, it is impossible to mount the components of the predetermined all types PA to PD on the substrates of all the substrate types A to D. In the next cases C21 and C22, even if the high-speed head 52H of the last-stage and seventh-stage component mounting machines 28 and 27 is replaced with the low-speed head 52L in order, all the parts of the types PA to PD cannot be mounted.

  In the next case C24, when the high-speed head 52H of the sixth-stage component mounting machine 26 is replaced with a general-purpose head 52L, it is possible to mount components of all predetermined product types PA to PD on all the substrate types A to D (possible mounting) Thus, the required time T = T24 is obtained. This situation occurs, for example, when the general-purpose head 52L capable of mounting this is sufficient for the quantity of large-sized parts of all the types PA to PD. Therefore, in the next case C25, when the general-purpose head 52L of the sixth-stage component mounting machine 25 is replaced with the medium-speed head 52M, mounting is possible, and the required time T = T25 is obtained.

  Further, in the next case C26, it is clear that the required time T will be excessive even if the high speed head 52H of the fifth stage component mounter 25 is replaced with the low speed head 52L, so the high speed head 52H is replaced with the medium speed head 52M. Can be implemented, and the required time T = T26 is obtained. In the next case C27, if the high-speed head 52H of the fourth-stage component mounting machine 24 is replaced with the medium-speed head 52M, mounting is possible and the required time T = T27 is obtained. Here, since the required time T = T27 has become excessive, the replacement of the mounting head 52 is aborted. The minimum value of the required time T (= T24 to T26) obtained so far is automatically updated and held, and the combination of the mounting heads 52 can be adopted.

  According to the component mounting line of the second embodiment, all the component mounters 21 to 28 are temporarily placed on the high-speed head 52H, and then the high-speed head 52H is sequentially replaced with the low-speed and medium-speed heads 52L and 52M. Since T is calculated, the trouble of calculating the required time T for all the combinations of the mounting heads 52 can be omitted. Further, the effect of improving the production efficiency is the same as that of the first embodiment, and therefore detailed description thereof is omitted.

  The present invention can also be implemented when the mounting head 52 is replaced with only a part of the plurality of component mounters 21 to 28 arranged in series. For example, since a certain amount of small components are generally mounted on a general board, the component mounting machines 21 to 23 up to the third stage are fixed to the high-speed head 52H to mount the small components. The mounting head 52 may be replaced by the component mounting machines 24 to 28 in the fourth and subsequent stages. Further, the structures of the high-speed head 52H, the medium-speed head 52M, and the general-purpose head 52L are not limited to the embodiments. Various other applications and modifications are possible for the present invention.

1: Component mounting line 11: System base 21-28: Component mounter 3: Board transfer device 31: First transfer device 32: Second transfer device 4: Component supply device 41: Cassette feeder 5: Component transfer device 51 : Head drive mechanism 52: Mounting head
52H: High-speed head 53H: Head main body 54H: Holder holder
55H: Nozzle holder 56H: Suction nozzle
52M: Medium speed head 53M: Head body
55M, 57M: Nozzle holder
56M, 58M, 58M1: Adsorption nozzle
52L: General-purpose head 53H: Head body
55L: Nozzle holder 56L: Adsorption nozzle 6: Component camera 7: Control computer 8: Nozzle housing device 9: Base 91: Cover A, B, C, D: Substrate type PA, PB, PC, PD: Component type N, NA, NB, NC, ND: Production quantity K, KA, KB, KC, KD: Priority factor t, tA, tB, tC, tD: Substrate type cycle time T, TS, TN, TK: Time required

Claims (8)

A board conveying device that carries a substrate into a component mounting position, positions and unloads, a component supply device that detachably sets a plurality of component accommodation devices that accommodate a plurality of components, and the component accommodation device of the component supply device A component mounting line in which a plurality of component mounting machines each including a mounting head for mounting on a substrate that has been sampled and positioned and a component transfer device having a head driving mechanism for driving the mounting head is arranged in series. And
The component transfer device of each of the multi-stage component mounting machines has multiple types of mounting heads, including general-purpose heads with many mountable component types and low mounting efficiency, and high-speed heads with few mountable component types and high mounting efficiency. Can be selectively attached,
Prior to the component mounting operation, each of the components is shortened to reduce the time required for mounting under the condition that the mounting head is not replaced throughout the period of mounting the component on the production number of boards of a plurality of board types. A component further comprising operating condition determining means for determining the type of mounting head of the component transfer device of the mounting machine and determining the distribution of component types to be accommodated in the plurality of component accommodating devices of the component supply device of each of the component mounting machines. Mounting line.   2. The operation condition determining means according to claim 1, wherein each component mounter equalizes as much as possible each individual cycle time required for each component mounter to mount a component on a single board of a certain board type. A component mounting line in which the maximum value of the individual cycle times is set as the substrate type cycle time of the board type, and the board type cycle time obtained for all board types is added to obtain the required time.   2. The operation condition determining means according to claim 1, wherein each component mounter equalizes as much as possible each individual cycle time required for each component mounter to mount a component on a single board of a certain board type. The maximum value of the individual cycle times is set as the substrate type cycle time of the substrate type, and the required time is obtained by multiplying the respective substrate type cycle times obtained for all the substrate types after multiplying the respective production numbers. Component mounting line.   2. The operation condition determining means according to claim 1, wherein each component mounter equalizes as much as possible each individual cycle time required for each component mounter to mount a component on a single board of a certain board type. The maximum value of the individual cycle times is set as the substrate type cycle time of the substrate type, and the substrate type cycle time obtained for all the substrate types is multiplied by a priority coefficient for each substrate type and then added. Component mounting line for required time. The operation condition determining means according to any one of claims 1 to 4,
First, temporarily place the type of mounting head of the component transfer device of all component mounting machines on the general-purpose head,
Next, in order from the component mounting machine on the front stage side, the type of the mounting head is sequentially changed from the general-purpose head to a mounting head that has a relatively small number of mountable component types and a relatively high mounting efficiency. Calculate the required time when all the parts of a given variety can be mounted on a seed board,
When it is no longer possible to mount all types of parts on all board types, the mounting head replacement will be discontinued.
Finally, a component mounting line that employs a combination of mounting head types that requires the shortest time. The operation condition determining means according to any one of claims 1 to 4,
First, temporarily place the type of the mounting head of the component transfer device of all the component mounting machines on the high-speed head,
Next, in order from the component mounting machine on the rear stage side, the type of the mounting head is sequentially changed from the high-speed head to a mounting head having a relatively large number of mountable component types and a relatively low mounting efficiency. Calculate the required time when all the parts of a given variety can be mounted on a seed board,
When the required time obtained by calculation becomes excessive, replacement of the mounting head is aborted.
Finally, a component mounting line that employs a combination of mounting head types that requires the shortest time.   7. The arrangement order of the component types of the plurality of component storage devices in the component supply device of each of the component mounting machines according to claim 1, wherein the order of arrangement of the component types can be changed for each of the substrate types. A component mounting line for determining an arrangement order of the component types for each of the substrate types.   8. The optimum arrangement of component types according to claim 7, wherein the operation condition determining means minimizes the individual cycle time required for each component mounter to mount a component on one substrate for each substrate type. Component mounting line that determines the order.

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