JP4457173B2 - Electronic circuit component mounting system - Google Patents

Description

  The present invention relates to an electronic circuit component mounting system, and more particularly, to an electronic circuit that mounts an electronic circuit component on a single circuit board in cooperation with a plurality of mounting units that mount the electronic circuit component on a circuit board. The present invention relates to an improvement of a circuit component mounting system.

  This type of electronic circuit component mounting system is already known (for example, Patent Document 1). Each of the plurality of mounting units includes a component supply unit, a circuit board holding unit, and a component mounting unit, and the electronic circuit component supplied from the component supply unit is mounted on the circuit board held on the circuit board holding unit by the component mounting unit. The plurality of mounting units are provided in series, and each mounts a predetermined electronic circuit component on the circuit board.

  Each of the plurality of mounting units includes various components, but a part of the configuration can be changed. For example, the mounting unit itself can be replaced or increased, and the component mounting part, the feeder of the part supply unit, etc. can be replaced. The setting is made so that the electronic circuit components can be mounted as efficiently as possible. For each of a plurality of changeable configurations, the configuration is determined and combined, and the configuration is determined so that the mounting efficiency is as high as possible.

JP 2001-111300 A

  However, the electronic circuit component mounting system described in the above publication still has room for improvement.

The present invention has been made against the background of the above circumstances, and according to the present invention, a plurality of types of electronic circuit components, each including a component supply unit, a circuit board holding unit, and a component mounting unit, are supplied from the component supply unit. The component mounting unit includes a plurality of mounting units that are mounted in series on the circuit board held by the circuit board holding unit, and the mounting operation of the electronic circuit component on one circuit board is performed by the plurality of mounting units. A high-efficiency electronic component mounting system that has a general-purpose mounting head and a smaller number of electronic circuit components that can be mounted on each component mounting part of multiple mounting units than the general-purpose mounting head, but has excellent mounting efficiency. A plurality of types of mounting heads including a mounting head can be selectively mounted, and the types of mounting heads used in each of the plurality of mounting units are determined in advance. Includes a mounting head selection unit for determining in accordance with conventions, and the mounting head selection unit, is capable of producing a printed circuit board production plan by a plurality of mounting units, and the mounting number of universal mounting head fewest Thus, an electronic circuit component mounting system characterized in that the type of mounting head is determined can be obtained.

The electronic circuit component mounting system is capable of selectively mounting a plurality of types of mounting heads including a general-purpose mounting head and a high-efficiency mounting head on each component mounting portion of a plurality of mounting units constituting the unit, and If the mounting head selection unit is included, the electronic circuit component mounting system can be easily changed to one suitable for manufacturing various types of printed circuit boards, and produced by the electronic circuit component mounting system. The number of general-purpose mounting heads to be installed is the smallest in the range where printed circuit boards can be produced, and the number of high-efficiency heads to be installed is increased as much as possible, and the mounting work efficiency is increased. An effect is obtained.

Aspects of the Invention

The present invention further provides an electronic circuit component mounting system according to the following aspects. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating understanding of the present invention, and should not be construed as limiting the technical features described in the present specification and the combinations thereof to those described in the following sections. . In addition, when a plurality of items are described in one section, it is not always necessary to employ the plurality of items together. It is also possible to select and employ only some items.
In addition, some of the following aspects are not inventions described in the claims or subordinate concepts thereof, but they are useful for understanding the invention described in the claims. Since it contains a description, it will be left as it is.

(1) A plurality of mountings each including a component supply unit, a circuit board holding unit, and a component mounting unit, and mounting electronic circuit components supplied from the component supply unit on the circuit board held by the circuit board holding unit by the component mounting unit Units are included in series, and the mounting of electronic circuit components on a single circuit board is carried out jointly with these multiple mounting units, and a part of the configuration of each mounting unit can be changed according to the type of target circuit board Electronic circuit component mounting system,
A target input unit for inputting a target throughput or a target cycle time of the mounting work;
When changing the type of the target circuit board, the changeable configuration of the plurality of mounting units can be changed within a range where the target throughput or target cycle time input by the target input means can be achieved. An electronic circuit component mounting system that includes a configuration change determination unit that automatically determines as little as possible.
The target throughput can be set by, for example, the number of electronic circuit components that can be mounted per unit time by the electronic circuit component mounting system and the number of circuit boards that can be produced per unit time. The target cycle time can be set, for example, by the time interval at which the circuit boards on which the mounting of the electronic circuit components by all the mounting units is completed are carried out from the exit of the electronic circuit component mounting system.
It is not always desirable for electronic circuit component mounting systems to be operated at maximum efficiency. Even if throughput is slightly reduced, it is desirable that the number of man-hours required for the setup change work is as small as possible, or that the required amount of electronic circuits can be assembled at the required time and meet the prescribed delivery date. It may be desirable to have as little work in progress as possible under certain conditions. According to the electronic circuit component mounting system of this section, it is automatically configured so that the changeable configuration of a plurality of mounting units can be changed as little as possible within a range in which the target throughput or target cycle time is achieved. Changes are determined. Therefore, if the operator makes this determined configuration change, the time required for the setup change can be shortened. It should be noted that at least part of the configuration change can be automatically performed by the electronic circuit component mounting system itself.
Note that the “electronic circuit component mounting system including a plurality of mounting units in series” is a system in which a plurality of mounting units arranged in series cooperate with each other to mount an electronic circuit component on a single circuit board. All mounting systems do not necessarily have to be arranged in a line. For example, in some cases, a plurality of mounting units may be arranged in parallel, and the mounting operation may be performed in parallel by these parallel mounting units. When connecting one row portion to a plurality of row portions, for example, the circuit boards may be distributed into a plurality of rows by a sorting conveyor or the like. In the opposite case, the circuit boards are connected in series by a merging conveyor or the like. What is necessary is just to be made to join the part of.

(2) Each of the mounting units has a plurality of the changeable configurations, and a change priority order is determined in advance for the plurality of changeable configurations, and the configuration change determination unit determines the priority order. The electronic circuit component according to (1), further including a priority order changing unit that sequentially determines a change of a lower priority when the target throughput or the target cycle time cannot be achieved by the change of the upper one. Mounting system.
According to the electronic circuit component mounting system of this section, even when one of a plurality of configurations is changed and the target throughput or target cycle time cannot be achieved, it can be achieved by changing another configuration. There is a case. If the priority of configuration change is set in the order of ease of configuration change work, the effect of facilitating the setup change work can be obtained, and if priority is set in order of the magnitude of the effect, priority is given in many cases Preliminary configuration that is the component (device that can be attached / detached and replaced) whose priority should be prepared for configuration change, with the effect that the target throughput or target cycle time can be achieved only by configuration change with higher order If the elements are determined in the order in which they are inexpensive, an effect capable of achieving the object as low as possible can be obtained. In practice, it is desirable to prioritize by comparing all of the above.
(3) When the configuration change determining unit cannot achieve the target throughput or the target cycle time even after changing all of the changeable configurations, the plurality of units obtained up to the stage where the fact is found The electronic circuit component mounting system according to the item (2), including a best configuration change selection unit that selects, as a final configuration change, one having the best throughput or cycle time among the types of configuration changes.
The target throughput and the target cycle time can be input as they should actually be achieved, or it can be input that is clearly not actually achieved. In the former case, it is possible to obtain an effect that the time required for the actual configuration change can be shortened. In the latter case, the best electronic circuit component mounting system configuration can be known. According to the characteristics of this section, it is possible to obtain an electronic circuit component mounting system configuration in which setup change work can be reduced as much as possible by simply changing the input values of the target throughput and target cycle time. The obtained electronic circuit component mounting system configuration can also be obtained. Furthermore, if information on hand-held devices, which are all components that can be used in the electronic circuit component mounting system, is input in advance, the best electronic circuit component mounting system configuration can be known to the extent that can be achieved with the hand-held device. Alternatively, if information on the maximum allowable time allowed for the operation of the configuration change determining unit is input, the best electronic circuit component mounting system configuration that can be reached within the maximum allowable time can be obtained. If the target throughput or target cycle time cannot be achieved, information indicating that the target cannot be achieved by the configuration change is output to the output unit (which may be a display or a printer) together with the final configuration change information. It is desirable to output.

(4) A unit number increasing unit that increases the number of the mounted units when the configuration change determining unit cannot achieve the target throughput or the target cycle time even if all the changeable configurations are changed. The electronic circuit component mounting system according to any one of (1) to (3).
If the number of mounted units is increased, the amount that cannot be achieved can be allocated and achieved. By inputting information on the number of mounting units that can be used to change the electronic circuit component mounting system, it is possible to obtain an electronic circuit component mounting system configuration that can achieve the maximum throughput or cycle time achieved by the mounting unit on hand. it can.
(5) The system according to any one of (1) to (4), including an output unit that outputs the configuration change determined by the configuration change determination unit and the throughput or cycle time achieved by the configuration change in association with each other Electronic circuit component mounting system.
The output unit preferably includes at least one of a display and a printer.
When the configuration change determining unit includes the priority order changing unit, the achieved throughput or cycle time varies depending on the determined configuration change. Therefore, if multiple types of configuration changes and the throughput and cycle time achieved by each of these configuration changes are output, the operator can select them, and the electronic circuit component with the optimal configuration according to the situation Can be mounted on a circuit board.

(6) The output unit outputs a change required time required for the configuration change in association with the configuration change determined by the configuration change determination unit (1) to (5) Electronic circuit component mounting system.
If the time required for the configuration change is output, the operator can know the time required for the configuration change. In particular, the configuration change determination unit includes a priority order change unit, and the output unit outputs a change required time required for each configuration change in association with a plurality of types of configuration changes determined by the priority order change unit. In some cases, the operator can select a configuration change to employ, taking into account the time available for the configuration change at that time. Furthermore, if this section is dependent on section (5) and the required change time and throughput or cycle time are output, it is possible to select a configuration change to be adopted taking them into account. it can. In this case, the sum of the setup change time (change required time) required for the configuration change and the total operation time of the electronic circuit component mounting system required to assemble all the circuit boards to be produced is also output to the output section. It is desirable to do so.

(7) It includes a plurality of types of mounting heads having different numbers of holder holding units for holding the component holders that hold the electronic circuit components, and the component mounting unit selectively selects the plurality of types of mounting heads. The electronic circuit component mounting system according to any one of (1) to (6), further comprising an attachable head mounting portion, wherein the replacement of the plurality of types of mounting heads corresponds to the change in the configuration.
The component holder may be, for example, a component adsorbing device that adsorbs and holds an electronic circuit component by negative pressure, or a component holding device that holds and releases an electronic circuit component by opening and closing a plurality of holding members. .
(8) The plurality of types of mounting heads include a mounting head with excellent versatility and a mounting head with excellent mounting efficiency, and the configuration change determining unit includes the general purpose in at least one of the plurality of mounting units. Check whether the target throughput or the target cycle time is achieved when the mounting head with excellent performance is mounted. If not, at least a part of the mounting head with excellent versatility is mounted. The electronic circuit component mounting system according to item (7), further including a mounting head selection unit that changes to a mounting head with excellent efficiency and checks whether the target throughput or the target cycle time is achieved again.
Mounting heads with excellent versatility inevitably have low mounting efficiency instead of many types of electronic circuit components that can be mounted, and mounting heads with high mounting efficiency have fewer types of electronic circuit components that can be mounted. Usually it is unavoidable. Therefore, in order to achieve the target throughput or target cycle time, it is desirable to mount as many mounting heads with high mounting efficiency as possible, but it is also possible to have a system configuration in which all necessary electronic circuit components can be mounted. It is essential. According to the feature of this section, it is possible to easily obtain a system configuration capable of mounting all necessary electronic circuit components and achieving the target throughput or the target cycle time.

(9) Each of the plurality of mounting units includes a plurality of types of the holders, and includes a plurality of types of holder storage devices for exchanging the component holders with the mounting head. A storage device mounting portion capable of selectively mounting the holding device storage device is provided, and replacement of the storage device storage device of the storage device mounting portion corresponds to the change in the configuration (1) to (8) The electronic circuit component mounting system according to 1.
If the holder holding device is included, for example, it is possible to mount the electronic circuit component on the circuit board using more types of component holders than the mounting head can hold, or to the component holder By exchanging when damage or the like occurs, the electronic circuit component can be efficiently mounted without interrupting the mounting of the electronic circuit component or without reducing the number of component holders.
(10) The plurality of types of holding device accommodating devices correspond to each of a plurality of types of mounting heads having different numbers of holding device holding parts for holding the component holding device for holding the electronic circuit component, The electronic circuit component mounting system according to item (9), wherein the configuration change determining unit includes a head-compatible receiving device changing unit that changes the holder receiving device in accordance with the change of the mounting head.
Various types of mounting heads generally have a holding device accommodating device that is optimal for the mounting head, and it is often desirable to change the holding device receiving device as the mounting head is replaced. However, it is not essential. For example, when the holder housing device can hold all the component holders used in all types of mounting heads, the holder housing device does not need to be replaced even if the mounting head is replaced. .

(11) A plurality of component feeders each containing one type of electronic circuit component and supplied from a predetermined component supply location, and a feeder holding member that detachably holds these component feeders. The electronic circuit component mounting system according to any one of items (1) to (10), wherein changing the component feeder mounted on the feeder holding member corresponds to the change in the configuration.
As the component feeder, for example, a tape feeder, a bulk feeder, a stick feeder or the like can be adopted.
(12) The configuration change determining unit mounts the electronic circuit component supplied to the target circuit board from the component feeder currently mounted on each component supply unit of the mounting unit on the target circuit board. The electronic circuit component mounting system according to item (11), further including a feeder sequential adding unit that sequentially adds component feeders that are newly required in order from the component supply unit of the mounting unit that has the shortest total time required for.
It is possible to easily obtain a system configuration in which all the necessary electronic circuit components can be mounted on the target circuit board while using the component feeder that is currently mounted as it is for supplying electronic circuit components.

(13) A feeder-type supply device that includes a plurality of component feeders each containing one type of electronic circuit component and supplied from a predetermined component supply location, and a feeder holding member that detachably holds these component feeders. When,
A tray-type supply device including a tray holding unit that holds a tray for positioning and storing a plurality of electronic circuit components each having one type, and the component supply unit includes the feeder-type supply device, the tray-type supply device, and the like. The electronic device according to any one of items (1) to (12), wherein a supply device attachment portion capable of selectively attaching the feeder-type supply device and a tray-type supply device corresponds to the change in the configuration. Circuit component mounting system.
The feeder-type supply device is suitable for supplying electronic circuit components that are relatively small and have a large number of components mounted on one circuit board, and the tray-type supply device is relatively large and can be mounted on one circuit substrate. It is suitable for supplying a small number of electronic circuit components, and by replacing them, it becomes easy to make the electronic circuit component mounting system suitable for the target circuit board.
(14) A current configuration information acquisition unit that acquires information about a current configuration of the entire electronic circuit component mounting system before the operation of the configuration change determination unit is started. Any of (1) to (13) The electronic circuit component mounting system according to 1.
The current configuration information acquisition unit can be, for example, means for reading the configuration of the electronic circuit component mounting system at the time of mounting the electronic circuit component on the previous target circuit board from the previous system configuration storage unit. In addition, when each mounting unit includes a replaceable device detection unit that detects the type of each replaceable device for configuration change, information collection for collecting information from the replaceable device detection unit Part. In any case, if the current configuration is obtained, the configuration can be changed using the current configuration.
(15) A program change unit for changing a mounting program including at least one of a mounting order of electronic circuit components in each mounting unit and an arrangement of component feeders in the component supply device after the configuration change determination by the configuration change determination unit. The electronic circuit component mounting system according to any one of (1) to (14).
The mounting program is changed, for example, so that the mounting efficiency becomes the highest.

(16) The electronic circuit component mounting system according to any one of (1) to (15), wherein the plurality of mounting units have the same configuration other than the configuration changeable portion.
“The configuration other than the part where the configuration can be changed is the same as each other” means that, in the part where the configuration can be changed, the configuration may be different due to the configuration change. Means that the configurations are the same. The electronic circuit component mounting system according to this section is a system in which a plurality of mounting units having the same basic configuration are arranged in series, and a representative one will be described in detail in the section of the embodiment. It is a modular system. If the configuration of the plurality of mounting units is the same as each other, it is easy to change the automatic configuration of the electronic circuit component mounting system. In other words, in the electronic circuit component mounting system according to any one of the items (1) to (15), each of the plurality of mounting units is modularized, and the basic configuration is the same as each other. That is not essential. For example, the present invention can be applied to a system in which electronic circuit component mounting machines configured independently of each other are arranged in series. In this case, each electronic circuit component mounting machine is a mounting unit. . Note that at least one of the electronic circuit component mounting machines configured independently of each other may be composed of a plurality of modules.

(17) including a spare component storage unit storing a spare component that is a component that can be used for the configuration change of the plurality of mounting units by the configuration change determination unit, and the configuration change When the determining unit determines the change of the configuration, it checks whether or not a spare component necessary for the configuration change to be determined is stored in the usable element storage unit and stored. The electronic circuit component mounting system according to any one of (1) to (16), wherein the change of the configuration is determined.
What is stored in the spare component storage unit is information that can be used to identify components that can be used at the present time in order to change the configuration of the target electronic circuit component mounting system. For example, all the components prepared for the entire target system are stored, and it is determined whether those components are already installed in the system or not installed yet. Information to be obtained may be given, or information on only components that have not yet been attached may be stored.
(18) A mounting unit number increase determination unit that determines to increase the number of mounting units constituting the electronic circuit mounting system;
A spare mounting unit storage unit that stores a spare mounting unit that is a mounting unit that can be used to increase the number of mounting units;
When the mounting unit number increase determination unit determines an increase in the number of mounting units, it checks whether or not a mounting unit is stored in the spare mounting unit storage unit. The electronic circuit component mounting system according to any one of (1) to (17).
The description of the spare component storage unit also applies to the spare mounting unit storage unit in this section. In addition, when there is one type of mounting unit, it is only necessary to store the number, but when there are a plurality of types, it is necessary to store the type and the number in association with each other.

(19) A plurality of mountings each including a component supply unit, a circuit board holding unit, and a component mounting unit, and mounting electronic circuit components supplied from the component supply unit onto the circuit board held by the circuit board holding unit by the component mounting unit An electronic circuit component mounting system that includes units in series and performs mounting work of electronic circuit components on a single circuit board in cooperation with the plurality of mounting units,
A head that includes a plurality of types of mounting heads having different numbers of holder holding units that hold component holders that hold electronic components, and the component mounting unit is capable of selectively mounting the plurality of types of mounting heads. An electronic circuit component mounting system including a mounting portion.
The explanations in paragraphs (7) and (8) also apply to the electronic circuit component mounting system in this section.
(20) Each of the plurality of mounting units includes a plurality of types of holder holding devices that each store a plurality of types of the component holders and exchange the component holders with the component mounting head. The electronic circuit component mounting system according to item (19), further including a storage device mounting portion to which the holder storage device can be selectively mounted.

(21) The plurality of types of mounting heads include at least a general-purpose mounting head that has a large number of types of electronic circuit components that can be mounted but a low mounting efficiency, and a high efficiency that has a small number of types of electronic circuit components that can be mounted but has a high mounting efficiency. The electronic circuit component mounting system includes: (a) an electronic circuit component mounting operation on the circuit board; and (b) an upstream side of the plurality of mounting units. A high-efficiency system configuration that obtains a system configuration that requires the least number of general-purpose mounting heads as a high-efficiency system configuration on the condition that the high-efficiency mounting head is attached to the device and the general-purpose mounting head is attached to the downstream device. The electronic circuit component mounting system according to item (19) or (20), including a system configuration acquisition unit.
(22) The high-efficiency system configuration acquisition unit
From the initial state where the general-purpose mounting heads are mounted on all of the plurality of mounting units, it is assumed that the general-purpose mounting heads of a set number of mounting units are changed to the high-efficiency mounting heads in order from the upstream mounting unit. Assumed means to
A determination means for determining whether or not all of the mounting work of the electronic circuit component to the circuit board can be achieved in a state assumed by the assumption means;
If the determination by the determination unit is YES, the assumption unit is further assumed to have changed the set number of general-purpose mounting heads to a high-efficiency head. The electronic circuit component mounting system according to (21), further comprising: a determination unit that determines a state assumed by the assumption unit as the high-efficiency system configuration.
According to the feature of this section, a highly efficient system configuration can be easily acquired.

(23) A plurality of mountings each including a component supply unit, a circuit board holding unit, and a component mounting unit, and mounting electronic circuit components supplied from the component supply unit on the circuit board held by the circuit board holding unit by the component mounting unit An electronic circuit component mounting system that includes units in series and performs mounting work of electronic circuit components on a single circuit board in cooperation with the plurality of mounting units,
A feeder-type supply device including a plurality of component feeders each containing one type of electronic circuit component and supplied from a predetermined component supply location; and a feeder holding member that detachably holds these component feeders;
A tray-type supply device including a tray holding unit that holds a plurality of electronic circuit components each of which is positioned and accommodated, and the component supply unit includes the feeder-type supply device and the tray-type supply device. And an electronic circuit component mounting system including a supply device mounting portion that can be selectively mounted.
The explanation of the items (11), (12), (13), etc. also applies to this item.

1 is an overall perspective view showing several aspects of an electronic circuit component mounting system according to an embodiment of the present invention. It is a perspective view which removes the exterior component of one circuit component mounting apparatus, and shows the electronic circuit component mounting system of a basic aspect. The perspective view of the system base which comprises the electronic circuit component mounting system of a basic aspect is shown. It is a perspective view which shows the whole wiring board conveying apparatus arranged by the mounting module which comprises the said electronic circuit component mounting system. It is the figure which looked at one of the conveyor rails of the said wiring board conveying apparatus from the front, and its sectional drawing. It is a perspective view which shows the mounting head and head moving apparatus with which the said mounting module is provided. It is a horizontal sectional view showing the X slide device of the head moving device. It is a perspective view which shows the said head moving apparatus typically. It is a perspective view which shows the mounting head with which the said mounting module is provided. It is a schematic diagram which shows the movement of the mounting head by the said X slide apparatus. It is a schematic diagram showing a method of moving the mounting head by stopping the first X slide at a predetermined stop position in the movement of the mounting head by the X slide device. It is a control block diagram of a mounting module. It is a partial right side sectional view of the electronic circuit component mounting system of the basic mode. It is a front fragmentary sectional view of the electronic circuit component mounting system of a basic mode. It is a perspective view which shows the use condition of the table apparatus prepared for the electronic circuit component mounting system of a basic aspect, and the table apparatus. It is a perspective view which shows the connection apparatus which connects the system base and table apparatus of the electronic circuit component mounting system of a basic aspect. It is a general view perspective view which shows some another aspect about an electronic circuit component mounting system. It is a perspective view which shows the electronic circuit component mounting system which installed the mounting module from which width differs. It is a perspective view which shows another electronic circuit component mounting system which installed the mounting module from which width differs. It is a perspective view which shows the system base which can arrange | position eight mounting modules of unit width in alignment. It is a conceptual diagram for demonstrating the arrangement | positioning system of the mounting module of various width | variety taking the system base shown in FIG. 20 as an example. It is a perspective view which shows the electronic circuit component mounting system of the aspect which has arrange | positioned between the mounting modules the conveyance work apparatus which mainly performs the conveyance work of a wiring board. It is a perspective view which shows the board | substrate work system which has arrange | positioned the various board | substrate working apparatuses from which the kind of board | substrate work differs. In an electronic circuit component mounting system, it is a mimetic diagram showing the state where a plurality of wiring board conveyance devices were arranged. It is a schematic diagram which shows the 1st example of the conveyance method of a wiring board in an electronic circuit component mounting system. It is a schematic diagram which shows the 2nd example of the conveyance method of a wiring board in an electronic circuit component mounting system. It is a schematic diagram which shows the 3rd example of the conveyance method of a wiring board in an electronic circuit component mounting system. In an electronic circuit component mounting system, it is a schematic diagram showing the operation of mounting heads and the like of two devices, with one mounting module as a target device of attention and a mounting module adjacent to one side thereof as a side-by-side device. It is a schematic diagram which shows the wiring board straddling two mounting modules used for component mounting operation in an electronic circuit component mounting system. FIG. 6 is a schematic diagram showing an operation mode when performing a component mounting operation on a wiring board straddling two mounting modules in an electronic circuit component mounting system. FIG. 5 is a schematic diagram showing another working mode when performing a component mounting operation on a wiring board straddling two mounting modules in an electronic circuit component mounting system. It is a functional block diagram regarding the mounting apparatus control apparatus with which each mounting module of the electronic circuit component mounting system was equipped. It is a figure explaining attachment and detachment of the feeder type supply apparatus with respect to the said mounting module. It is a side view which shows the attachment part attached to the component supply apparatus attachment part provided in the said mounting module, and the component supply apparatus attachment part of a feeder type supply apparatus. It is a front view which shows the attachment part attached to the said component supply apparatus attachment part and the component supply apparatus attachment part of a feeder type | mold supply apparatus. It is a side view which shows the state with which the tray type supply apparatus attached to the said component supply apparatus attachment part was mounted in the trolley | bogie. It is a front view which shows the said tray type supply apparatus with a tray positioning device. It is a top view which shows a part of said tray type supply apparatus and tray moving apparatus. It is a rear view (part cross section) which shows a part of said tray moving apparatus. It is a perspective view which shows each of three types of mounting heads selectively attached to the said mounting module. It is a perspective view which shows the structure of the part attached to the head mounting part provided in the said mounting module, and the mounting head mounting part of a mounting head. It is a figure which shows the head fixing device of the head attachment part provided in the said mounting module in the cross section in a side surface and a front, respectively. It is a front view (partial cross section) which shows the accommodation apparatus attaching part and nozzle accommodation apparatus which were provided in the said mounting module. It is a top view which shows the said nozzle accommodation apparatus. It is a figure which shows the structure change performed by the system control apparatus which performs overall control of this electronic circuit component mounting system as a flowchart. It is a figure which shows the setup change time shortening type | mold structure change performed by the said system control apparatus with a flowchart. It is a figure explaining the part addition type | mold change in the said setup change time reduction type | mold structure change, and a non-use part removal type | mold change. It is a figure explaining the example of the combination of the component supply apparatus in each of the some mounting module which comprises an electronic circuit component mounting system. It is a chart which shows the combination in the present condition of the combination of the component supply apparatus in each of the some mounting module which comprises the said electronic circuit component mounting system, and the next production time. It is a figure explaining the allocation of the components at the time of a setup change time shortening type | mold configuration change when the feeder type supply apparatus is provided in all the some mounting modules which comprise the said electronic circuit component mounting system. A description will be given of component allocation at the time of execution of a change-over-time-type configuration change when a feeder type supply device is provided in a part of a plurality of mounting modules constituting the electronic circuit component mounting system and a tray type supply device is provided in the rest. FIG. Reduced setup change time when the feeder type supply device is provided in all of the plurality of mounting modules constituting the electronic circuit component mounting system to a state in which the feeder type supply device and the tray type supply device are provided. It is a figure explaining allocation of the components at the time of configuration change execution. It is a chart explaining selection of a mounting head about each of a plurality of mounting modules which constitute an electronic circuit component mounting system in mounting head selection type composition change. It is a figure which shows the attachment module number setting type | mold structure change performed by the said system control apparatus with a flowchart. FIG. 46 is a diagram illustrating a state in which cycle times, setup change times, and the like obtained by executing the configuration change illustrated in FIG. 45 are displayed in association with each other.

  Several specific embodiments of the present invention will be described below with reference to the drawings. The present invention is not limited to the following embodiments, and in addition to the embodiments, the embodiments described in the above section [Problems to be Solved by the Invention, Problem Solving Means and Effects] are included. The present invention can be implemented in various modifications and improvements based on the knowledge of those skilled in the art.

<Basic-to-board working system>
i) Overall Configuration of System FIG. 1 (a) shows one basic mode of a substrate-based work system. The system shown in FIG. 1A is an electronic circuit component mounting system (hereinafter abbreviated as a mounting system) for performing electronic circuit component mounting work, and has the same configuration as a mounting unit on one system base 10. Two mounting modules 12 are arranged adjacent to each other in the same orientation. For convenience of the following description, the direction in which the mounting modules 12 are arranged is referred to as the left-right direction, and the horizontal direction perpendicular to the direction is referred to as the front-rear direction.

ii) Outline of Configuration of Mounting Device FIG. 2 is a perspective view in which a part of an exterior component of one mounting module 12 in the system of the basic mode is removed. Each of the mounting modules 12 has a module main body 18 configured to include a frame 14 part and a beam part 16 overlaid on the frame part 14. Each of the mounting modules 12 includes a component supply unit 22 in a portion of the module body 18 in front of the frame unit 14. The component supply unit 22 includes a supply device attachment portion 27 (see FIGS. 33 to 35) to which a feeder-type supply device 23 and a tray-type supply device 25 (see FIGS. 23 and 37) can be selectively attached. .

  As shown in FIG. 33 and the like, the feeder-type supply device 23 has a plurality of tapes as component feeders for supplying components one by one from an electronic circuit component taping in which electronic circuit components (hereinafter abbreviated as components) are taped. A feeder (hereinafter abbreviated as a feeder) 20 and a feeder pallet 29 as a feeder holding member that detachably holds the feeder 20 are included. The feeder type supply device 23 is one type of electronic circuit component supply device, and the device shown in the figure is a device mainly composed of a feeder that supplies components from a taped electronic component wound around a reel. Each of the plurality of feeders 20 accommodates one type of component and supplies it from a predetermined component supply location. The feeder pallet 29 is detachably attached to the frame portion 14, and arbitrary feeders 20 corresponding to the types of components can be arranged in an arbitrary order. The tray type supply device 25 and the supply device mounting portion 27 will be described later.

  Further, each mounting module 12 transports a printed wiring board (hereinafter abbreviated as “wiring board”), which is a type of circuit board, and holds the board in a fixed position. A wiring board transport device 24 having a function as a device is also provided. In a state where the two mounting modules 12 are located at predetermined positions, the two wiring board transport devices 24 are aligned with each other and can transport the wiring boards in cooperation with each other. In the system of this aspect, the wiring board is conveyed in the left-right direction, which is the direction in which the mounting modules 12 are arranged. That is, the direction is the wiring board transport direction (also referred to as “substrate transport direction”) in the system of this aspect. The wiring board transport device 24 will be further described later.

  Each of the mounting modules 12 takes out a component from a component supply device attached to the component supply unit 22 and mounts the component on a wiring board held by the wiring board transport device 24 (1 of the working head). Seeds). Each of the mounting modules 12 includes a component mounting portion 31, and the mounting head 26 is a mounting head moving device (hereinafter referred to as “head”) that is an XY robot type moving device provided in each beam portion 16. The component supply unit 22 (to be precise, a component supply device attached to the component supply unit 22) and the wiring board transport device 24 are moved by a moving device 28. The mounting head 26 and the head moving device 28 constitute a component mounting device 33. The mounting head 26 and the head moving device 28 will be described in detail later.

  Each mounting module 12 is provided with a component imaging device 30 having a CCD camera as an imaging device between the component supply unit 22 and the wiring board transport device 24 in the frame unit 14. The device 30 captures the posture of the component held by the mounting head 26 and the like. In addition, each of the mounting modules 12 has an operation panel 34 as an input / output device in front of a top cover 32 which is a kind of exterior component. Reference numeral 12 denotes a mounting device control device 36 (see FIG. 12) mainly composed of a computer for controlling various devices provided to itself, such as the component supply device 23 or 25 attached to the component supply unit 22. An image processing unit 38 (see FIG. 12) for processing image data obtained by the imaging device 30 and the like is included.

  As described above, each mounting module 12 is a modularized apparatus that includes the component supply unit 22, the component mounting unit, and the board holding unit, and is modularized. In addition, since up to the wiring board transport device 24 is provided in the mounting module 12, the mounting module 12 is a transport device deployment module. Further, as will be described in detail later, each mounting module 12 has a structure that can be easily separated from the system base 10, and can be arranged by being replaced. Each mounting module 12 is a movable device that is movable with respect to the system base 12 in a front-rear direction that is a direction perpendicular to the wiring board conveyance direction and that is substantially horizontal. A structure for enabling this movement will also be described later.

iii) Overview of System Base Configuration FIG. 3 is a perspective view of the system base 10. The system base 10 on which the two mounting modules 12 are arranged has a base body 56 that includes a frame 50, an exterior plate 52, and a top plate 54. The base body 56 includes a power supply unit 58 as a shared device and a shared device for the mounting module 12, piping devices 60 and 62 from external positive pressure and negative pressure air sources, and the like. A driving force supply unit that supplies driving force to the module 12 is configured. Although not shown in the figure, the base body 56 exchanges control signals and information between the mounting modules 12 and between the mounting modules 12 and a system control device (to be described later) for overall control of the system. The communication cable and its terminal are also provided. The top plate 54 is provided with openings for these maintenances, and a canopy 64 for closing the openings is attached. Further, another opening 66 is provided in the upper part near the front part, and inside the base main body 56 communicating with the opening 66, a carrier tape and a top for electronic component taping discharged from the component supply device 22 are provided. A tape collection container 68 for collecting the cover tape and the like is provided. Although not described, the mounting module 12 is provided with a cutter device that cuts a carrier tape or the like, and the carrier tape that is arbitrarily cut is configured to be discharged into the tape collection container 62. A tape recovery device that is a shared device of the mounting module 12 is configured including the opening 66, the tape recovery container 68, and the like. Although not shown, the collected tapes can be taken out of the system base 10. As described above, the device configuration for making each mounting module 12 a movable device and the device configuration for making it easily separable will be described later.

iv) Configuration of Wiring Board Conveying Device FIG. 4 shows the entire wiring board conveying device 24. The wiring board transport device 24 is a conveyor device, and includes four conveyor rails (hereinafter simply referred to as “rails”) 100 to 106 that extend in the wiring board transport direction (left-right direction) and are positioned in parallel to each other. The rail 100 located at the forefront is paired with the rail 102 located at the rear of the rail 100, and the rail 104 located at the rear and the rail 106 located at the rear are paired. Face each other. The present wiring board transport device 24 has two conveyor sections, a front conveyor section 110 and a rear conveyor section 112, the front conveyor section 110 is formed by the rail 100 and the rail 102, and the rear conveyor section 112 is formed by the rail 104 and the rail 106. Is formed. That is, each of the rail 100 and the rail 102 functions as a reference rail and a subordinate rail of the front conveyor unit 110, and each of the rail 104 and the rail 106 functions as a reference rail and a subordinate rail of the rear conveyor unit 112, respectively.

  The rail 100 is a fixed rail provided in front of the base 114, and the rails 102, 104, and 106 are provided so as to be movable in the front-rear direction along two guides 116 provided on the base 114. Movable rail. On the right side of the apparatus, three ball screws 118 that engage with nuts provided on each of the three movable rails 102, 104, and 106 are disposed. Rail position change motors 120 that are three electric motors (stepping motors) serving as driving sources are provided (one is hidden), and the three rail position change motors 120 are driven independently. The three movable rails 102, 104, and 106 are independently moved in the front-rear direction. Thereby, the conveyor width | variety of the front conveyor part 110 and the rear conveyor part 112 can be changed arbitrarily. A reference mark 122 is provided at the center of the upper part of each rail 100 to 106, and the mounting module 12 for each rail is used by using a mark imaging device (described later) provided in the head moving device 28 together with the mounting head 26. The position at is picked up, and the conveyor width is adjusted based on the recognition result of the image. That is, the present wiring board transport device 24 supports the board width that changes the width of the conveyor units 110 and 112 in accordance with the width according to the width of the transported wiring board (the length in the direction perpendicular to the wiring board transport direction). The board width-corresponding width changing device includes a movable rail 102, 104, 106, a rail position changing motor 120, and the like.

  The wiring board transport device 24 can use both the front conveyor section 110 and the rear conveyor section 112 when transporting a narrow wiring board. That is, it is used as a two-line transfer device. In that case, the position of the rail 104 which is the reference rail of the rear conveyor unit 112 is fixed to the set position, and the conveyor width of each of the two conveyor units 110 and 112 is adjusted. On the other hand, when a wide wiring board is conveyed, only one of the front conveyor unit 110 and the rear conveyor unit 112 can be used as a one-line conveying device. In that case, the rail 104 is moved to the rear or front of the apparatus, and the width of one conveyor to be used is adjusted.

  The structure of the rails 100 to 106 will be described using the rail 102 as an example. FIG. 5 shows the rail 102. Fig.5 (a) is the figure seen from the front, FIG.5 (b) is sectional drawing in AA. The rail 102 includes two brackets 130, a rail main body plate 132 passed between the two brackets 130, and a guide rod 134 provided on the upper portion of the rail main body plate 132. A drive pulley 136 is disposed on one side of the bracket 130. A spline shaft 138 (see FIG. 4) extending in the front-rear direction is disposed on the left side of the wiring board transport device 24. Although omitted in the drawing, the drive pulley 136 is spline-fitted with the spline shaft 138, The rotation of the spline shaft 138 can be transmitted to the drive pulley 136 regardless of the position of the rail 102 in the front-rear direction. Further, a plurality of driven pulleys 140 are rotatably disposed on the bracket 130 and the rail body plate 132, and a conveyor belt 142 is wound around the drive pulley 136 and the driven pulley 140 in a state as shown in the figure. ing. The spline shaft 138 is connected to a wiring board transfer motor (see FIG. 4) 144 that is an electric motor (servo motor with encoder) disposed on the rear side of the apparatus. The belt 142 goes around. Since the other rails 100, 104, and 106 have the same structure, description thereof will be omitted.

  The wiring board 150 is supported by a horizontally stretched portion above the conveyor belt 142, and is moved in the wiring board conveyance direction which is the left and right direction by the circumference of the conveyor belt 142 while being restricted by the guide rod 134 in the front-rear direction. Is done. Since the conveyor belts 142 provided on the four rails 100 to 106 circulate all at once, the transport operation of the front conveyor unit 110 and the transport operation of the rear conveyor unit 112 cannot be controlled independently. Yes.

  The wiring board transport device 24 also functions as a board holding unit that holds the wiring board 150 in a fixed position for component mounting work. The wiring board transport device 24 includes two support plates 152. On the upper surface of the support plate 152, a plurality of backup devices 156 having backup pins 154 can be attached at arbitrary positions. The wiring board 150 supported and transferred by the conveyor belt 142 is stopped at a position set in accordance with the type of the wiring board, the form of component mounting work, and the like by stopping the circulation of the conveyor belt 142. In this state, the support plate 152 is raised by a predetermined distance by a support plate lifting device 158 (see FIG. 12) (not shown) (see the two-dot chain line in FIG. 5A). Then, the tip of the backup pin 154 comes into contact with the back surface of the wiring board 150 and the wiring board 150 is lifted, the support by the conveyor belt 142 is released, and the surface of the end portion of the wiring board 150 is the guide rod 134. The locking portion 158 is locked with an appropriate force. That is, in this state, the wiring board 150 is fixed and held at a position set for component mounting work.

  In addition, the start and stop of the circumference | surroundings of the conveyor belt 142 are the said wiring board conveyance apparatus 24, or the wiring board detector (a kind of board | substrate detector) provided in the conveyance apparatus connected to the upstream and downstream of it. Control is based on the detection signal of the photoelectric sensor 160 (omitted in FIGS. 4 and 5, see FIGS. 12 and 24). This will be described in detail later. Further, as described above, in the present wiring board transport device 24, the transport operation of the front conveyor unit 110 and the transport operation of the rear conveyor unit 112 have a structure that cannot be controlled independently. When the wiring board 150 is held in one of the 110 and the rear conveyor unit 112, if the conveying operation is performed by the other, the work in two efficient lines using two conveyor units Can be executed.

v) Configuration of Head Moving Device FIG. 6 is a perspective view of the mounting head 26 and the head moving device 28, and FIG. 7 is a horizontal sectional view of an X slide device (described later). A schematic perspective view of the head moving device 28 is shown in FIG. The head moving device 28 includes two linear moving devices that move the mounting head 26 in two orthogonal directions. One of them is a Y slide device 200 which is a moving device in the front-rear direction (hereinafter referred to as “Y-axis direction”) which is a horizontal direction perpendicular to the wiring board conveyance direction, and the other is parallel to the wiring board conveyance direction. This is an X slide device 202 which is a moving device in the right and left direction (hereinafter referred to as “X-axis direction”). The mounting head 26 is moved in one plane by these two linear movement devices. That is, the mounting module 12 is a work head plane moving type device.

  The Y-slide device 200 includes two Y-axis direction guides (hereinafter abbreviated as “Y guides”) 210 provided on the beam unit 16 in parallel with the Y-axis direction, and four sliding members that slide on the Y guide 210. (Linear bearing) 212 having a Y slide 214 that moves in the Y-axis direction, a Y ball screw 216 that is provided in the beam section 16 and extends in the Y-axis direction, and is screwed into the Y ball screw to be rotatable. A Y-axis having a Y-axis motor 220 as a drive source that is fixed in position and provided on a Y-slide 214 and a Y-axis motor 220 that is provided behind and rotates an Y-ball screw 216 (servo motor with encoder). And a driving device 222.

  The X slide device 202 is a multistage moving device, that is, a two-stage moving device, and includes two slide devices, a first X slide device 230 that moves the mounting head 26 in directions parallel to each other, and a second X slide device 232. It is configured to include. The first X slide device 230 is fixedly provided on a first X slide 242 having two first X axis direction guides (hereinafter abbreviated as “X1 guides”) 240 parallel to the X axis direction, and a Y slide 214. Four sliding members (linear bearings) 244 that slide the guide 240, an X1 ball screw 246 that is provided on the Y slide 214 and extends in the X-axis direction, and is screwed into the X1 ball screw 246 to be rotatable and positioned. And X1 axis motor 250 which is an electric motor (servomotor with encoder) provided on Y slide 214 and rotating X1 ball screw 246 as a drive source. And the second X slide device 232 includes a first X slide 24 parallel to the X axis direction. Two X-axis direction guides (hereinafter abbreviated as “X2 guides”) 260 provided on the X2 guide, a second X-slide 264 having two sliding members (linear bearings) 262 that slide on the X2 guide 260, An X2 ball screw 266 provided on the 1X slide 242 and extending in the X-axis direction; an X2 nut 268 provided on the second X slide 264 that is rotatably engaged with the X2 ball screw 266 and fixed in position; and X1 And an X2 axis driving device 272 having an X2 axis motor 270 which is an electric motor (servo motor with encoder) provided on the slide 244 and rotates an X2 ball screw 266 as a drive source.

  The X slide device 202 is a double-stage linear moving device having the above-described configuration, specifically a two-stage linear movement device. The Y slide 214 having the sliding member 244 that slides the X1 guide 240 functions as a first track forming unit that forms the first track, and the first X slide 242 having the X2 guide 260 is the first slide. The second X slide 264 that moves along the X2 guide 260 and functions as a second track forming unit that moves along the track and forms a second track parallel to the first track, moves along the second track. It functions as a moving unit that moves. That is, the X slide device 202 is a telescopic type (telescopic type) moving device. The mounting head 26 is held by the second X slide 264 that is the moving part. If the moving direction of the mounting head 26 by the multistage moving device is a specific direction, in the mounting module 12, the X-axis direction corresponds to the specific direction. By controlling the rotation of the Y-axis motor 220, the X1-axis motor 250, and the X2-axis motor 270, the mounting head 26 moves in one plane and is positioned at an arbitrary position in the work area.

vi) Configuration of Mounting Head FIG. 9 is a perspective view of the mounting head 26. The mounting head 26 held by the second X slide 264 includes a head main body 280 serving as a housing of the head, various components and components arranged at various positions of the head main body 280, and a head cover 282 that covers these components and the like. (See FIG. 6). FIG. 9 is obtained by removing the head cover 282.

  The mounting head 26 includes a nozzle holder 290 that holds a plurality of, more specifically, eight suction nozzles 288, which are component holders, at the tip. The nozzle holder 290 that holds the suction nozzle 288 is referred to as a nozzle-equipped holder 291. Although not shown, each of the suction nozzles 288 communicates with negative pressure air and a positive pressure air passage via a positive / negative pressure selective supply device 292 (see FIG. 12), and sucks the component to the tip portion with negative pressure. The structure is such that the held parts are detached by being held and supplied with a slight positive pressure. The nozzle holder 290 having a generally axial shape constitutes a holder holding portion, and is held on the outer peripheral portion of the holder holder 294 that rotates intermittently at an equiangular pitch in a state where the axial direction is vertical. In addition, each nozzle holder 290 can rotate and move in the axial direction. The holder holding body 294 is driven by a holder holding body rotating device 298 having a holding body rotating motor 296 which is an electric motor (servo motor with encoder), and is rotated intermittently by an angle equal to the arrangement angle pitch of the nozzle holder 290. Thus, the nozzle-equipped holder 291 is rotated intermittently. In a holder lifting / lowering station (station located at the foremost position) that is one stop position of the nozzle-equipped holder 291 in intermittent rotation, the holder with nozzle 291 located at that station is a holder lifting / lowering that is an electric motor (servomotor with encoder). It is lifted and lowered by a holder lifting device 302 having a motor 300 as a drive source. The operation of taking out the component from the component supply device 22 and the operation of mounting the component on the wiring board held by the wiring board transport device 24 are performed by the holder with nozzle 291 located at the lifting station, and at that time, the nozzle attached The holder 291 is lowered by the set distance. Each nozzle holder 290 is rotated by a holder rotation device 306 having a holder rotation motor 304 as an electric motor (servo motor with encoder) as a drive source for the purpose of adjusting the mounting direction of the sucked and held components. . The plurality of nozzle holders 290 are configured to rotate at the same time. The above is the main configuration of the mounting head 26. The second X slide 264 is provided with a mark imaging device 308 including a CCD camera as an imaging device, which is an apparatus for imaging a reference mark or the like attached to the surface of the wiring board. (See FIG. 6).

vii) Movement of Mounting Head by X Slide Device FIG. 10 schematically shows movement of the mounting head 26 by the X slide device 206. In the figure, only the mounting head 26 held by the Y slide 214 as the first track forming portion, the first X slide 242 as the second track forming portion, and the second X slide 264 as the moving portion is shown. AA indicated by a solid line is a line indicating a side surface of the mounting module 12, and AA-AA indicates an apparatus area of the mounting module 12. The Y slide 214 does not move in the X axis direction, but moves only in the Y axis direction while maintaining the center position of the device area in the X axis direction, which is a specific direction. The first X slide 242 is allowed to move within a certain range in the X-axis direction along the first trajectory formed by the Y slide 214. Further, the mounting head 26 moves over the entire range of the first X slide 242 along the second trajectory formed by the first X slide 242.

  The Y slide 214 and the first X slide 242 both have a length in the X-axis direction, which is a specific direction, smaller than the module width. In the state indicated by the solid line in the figure, the first X slide 242 exists at the center position in the X-axis direction, and in this state, the first X slide 242 is within the apparatus area AA-AA. The mounting head 26 is generally movable along the second track until the end of the mounting head 26 is positioned at the end of the first X slide 242. Although not shown in the drawing, even if the mounting head 26 is moved in a state where the first X slide 242 is located at the center position, the end of the mounting head 26 reaches only a position leaving a certain distance from the device side surface AA. It is in a state not to do. By moving the first X slide 242 by a predetermined distance from the center position, the first X slide 242 is positioned in the vicinity of the apparatus side surface AA so that the first X slide 242 does not advance from the apparatus side surface AA. It can be expanded to a range where the end of the device does not protrude from the device side surface AA. In the expanded state, the mounting work in the range of WA1-WA1 shown in the figure is possible. If the first X slide 242 is further moved away from the center position, the end of the first X slide 242 advances out of the device area. As a result, the mounting head 26 also moves out of the apparatus area, and the movable range of the mounting head 26 further extends beyond the apparatus area AA-AA to the range WA2-WA2. As described above, the mounting module 12 employs a multistage moving device, so that the mounting module 12 is compact and has a wide work area.

  In the actual control of the head moving device 28, the first X slide 242 has a plurality of stop positions (corresponding to the track portion stop positions that are the stop positions of the second track forming portion) within the movement range on the first track. The mounting head 26 is moved along the second track formed by the first X slide while the first X slide 242 is stopped at any one of the stop positions. FIG. 11 schematically shows the movement of the mounting head 26 performed by stopping the first X slide 242 at a predetermined stop position. In the X slide device 202, four stop positions on the first track of the first X slide 242 are set. Each stop position is numbered ST1-ST4. As shown in FIGS. 11B and 11C, the state where the first X slide 242 is positioned at ST2 and ST3 is the state where the first X slide 242 does not advance out of the device area in the right direction and the left direction, respectively. Yes, no matter where the mounting head 26 is positioned on the second track, the mounting head 26 does not advance out of the apparatus area. On the other hand, as shown in FIGS. 11A and 11D, the state in which the first X slide 242 is positioned at ST1 and ST4 is that the first X slide 242 is outside the device area in the right direction and the left direction, respectively. In this state, the mounting head 26 can be moved out of the apparatus area accordingly.

  The case where the component mounting operation is performed on the wiring board that protrudes from the device area of the mounting module 12 will be described. For example, when a component is mounted at a mounting position located in the device area of the wiring board, The first X slide 242 is stopped at the stop position of ST2, and the first X slide 242 is stopped at the stop position of ST3 and the mounting head 26 is moved. To control. When mounting a component at a mounting position located outside the device area of the wiring board, when the mounting position exists on the right side outside the device area, the first X slide 242 is stopped at the stop position of ST1 and the mounting is performed. When the position is on the left side outside the apparatus area, the first X slide 242 is stopped at the stop position of ST4 and the mounting head 26 is moved. Thus, based on the situation where the mounting position exists, the movable area of the mounting head 26 is divided into a plurality of divided areas, and based on which divided area the mounting head 26 is stopped. Then, the control for determining the stop position of the first X slide 242 is performed. The position of the first X slide 242 is grasped by the mounting device control device 36 described later based on the signal of the encoder provided in the X1 axis motor 250.

  In the mounting module 12, the head movement control described above is performed on the head moving device 28 regarding the movement of the mounting head 26. In the head movement control, specifically, a track that moves the mounting head 26 along the second track while the first X slide 242 that is the second track forming unit is stopped at any one of a plurality of stop positions. Part stop head movement control is performed, and by moving the first X slide 242 to a position where a part of the second track advances out of the apparatus area, the mounting head 26 can be extended out of the apparatus area. The advance control to be performed is performed.

  As described above, the mounting operation in which the first X slide 242 and the mounting head 26 are allowed to advance from the side surface of the apparatus is performed, but the side surface exterior plate 320 of the mounting module 12 includes the right side surface and the left side surface. In any case, an opening 322 is provided in a portion where the side wiring board transport device 24 exists, and when the mounting head 26 advances outside the device area, the first X slide 242 and the first X slide 242 and the opening head 322 pass through the opening 322. The mounting head 26 is moved out of the apparatus area (see FIG. 1A). In the mounting module 12, the movable area of the mounting head 26 is expanded to the outside of the apparatus area when a component mounting operation is performed, such as a component extraction operation from the component supply device 22. In some cases, the first X slide 242 is positioned at ST2, ST3, or another stop position set between them, and the mounting head 26 is moved within the apparatus area.

viii) Mounting Device Control Device FIG. 12 is a control block diagram of the mounting module 12 centering on a portion deeply related to the present invention. The mounting system of the basic mode has two mounting modules 12, each of which has its own mounting device controller 36. The figure is a block diagram centering on one mounting module 12 and the mounting device controller 36 provided in the mounting module 12. The mounting device control device 36 is a control device having a computer 350 as a main component. The computer 350 includes a PU (processing unit) 352, a ROM 354, a RAM 356, an input / output interface 358, and a bus 360 that connects them to each other. Have. The input / output interface 358 is connected to each tape feeder 20 of the component supply device 22, the three rail position changing motors 120 of the wiring board transport device 24, and the wiring board transfer via the respective drive circuits 362 included in the mounting device control device 36. Motor 144, support plate lifting / lowering device 158, positive / negative pressure selection / supplying device 292 of mounting head 26, holder rotating motor 296, holder lifting / lowering motor 300, holder rotation motor 304, Y-axis motor 220 of head moving device 28, X1-axis motor 250 , X2 axis motors 270 are connected to each other. Further, the component imaging device 30 and the mark imaging device 308 are connected via an image processing unit 38 that performs data processing until various recognition results are obtained from the imaging data obtained by them. Further, the photoelectric sensor 160 provided in the wiring board transport device 24 is connected to the input / output interface 358.

  One of the two mounting modules 12 operates in conjunction with the operation of the other. In addition, the system according to this basic aspect includes a system control device 370 (not shown in FIGS. 1 and 2) that controls the entire system separately from the system base 10 and the mounting module 12. Therefore, the other mounting module 12 and the system control device 370 are connected to the input / output interface 358 via the communication cable 372. Note that the system control device 370 is also used as a system control device for another on-board work system when the system is connected to another on-board work system to form a larger system. Further, the mounting module 12 is modular and may be placed in another system. In this case, the mounting apparatus control device 36 can be connected to a control device provided in another substrate work apparatus in the other system and a system control apparatus of the other system.

  The ROM 354 stores a basic operation program of the mounting module 12 and the like, and the RAM 356 performs operations related to operation control according to the work mode, cooperative operation with other substrate work apparatuses, cooperative operation control, and the like. Program, application program such as mounting position correction program according to deviation of holding position of wiring board, suction holding position of parts, etc., mounting order data set according to wiring board on which component mounting work is performed, mounting position Various data such as data related to a component supply device such as data, data of a component mounted at a mounting position, component-specific data regarding the mounted component, and which component is supplied from which tape feeder 20 are stored. These data and the like are also stored in a system control computer 980 that is a computer of the system control device 370.

ix) Outline of Component Mounting Operation Next, a component mounting operation by one mounting module 12 will be briefly described by taking as an example a task for a wiring board having a size that can be accommodated in the device area of the mounting module 12. The wiring board transferred from the upstream side is stopped at the set work position in the apparatus area by the wiring board transfer device 24. The stopped wiring board is fixed and held by the wiring board holding device 24 when the support plate lifting / lowering device 158 is raised at that position. Next, the mark imaging device 308 is moved above the reference mark attached to the wiring board by the head moving device 28 and images the reference mark. A shift in the holding position of the held wiring board is detected from the imaging data. In the case of a cooperative operation by two mounting modules 12 described later, each of the wiring board holding devices 24 provided in each of the mounting modules 12 cooperates, and one wiring board is fixedly held. In that case, the reference mark existing in the device area of each mounting module 12 is imaged by the mark imaging device 308 of each mounting module 12, and the result of processing the imaging data is passed to each other, so that each mounting is performed. A shift in the holding position of the wiring board in the module 12 is detected.

  Next, the mounting head 26 is moved above the component supply device 22, and the components are sucked and held by the suction nozzle 288 in accordance with the set extraction order. Specifically, the nozzle-equipped holder 290 located in the elevating station is positioned above the component extraction portion of the tape feeder 20 that supplies components to be held, and the nozzle-equipped holder 290 is lowered at that position. The negative pressure is supplied to the suction nozzle 288 held at the tip, and the part is sucked and held. And the holder 290 with a nozzle is intermittently rotated, and the same component extraction operation | movement regarding the holder 290 with a next nozzle is performed. In this manner, the component take-out operation (in many cases, eight times) is sequentially performed on the nozzle-mounted holder 290 included in the mounting head 26.

  Next, the mounting head 26 holding the component is moved above the component imaging device 30. At that position, the component imaging device 30 images the held component within one field of view. A shift in the holding position of each component is detected from the obtained imaging data. The mounting head 26 is moved above the wiring board. During the movement, the holder 291 with nozzle is rotated by the holder rotation device 306, and the mounting orientation and detection set for the components held by the holder 291 are detected. Based on the printed wiring board holding position deviation amount and the component holding position deviation amount, it is rotated to an appropriate rotational position. The holder holder 294 or the nozzle-equipped holder 290 is intermittently rotated intermittently until the first holder 290 for holding the component to be mounted is positioned at the elevating station, and the nozzle-equipped holder 290 for mounting the component during the intermittent rotation. Is rotated.

  Subsequently, the mounting head 26 is moved to above the wiring board, and the parts held on the surface of the wiring board are mounted according to the set mounting order. Specifically, first, the nozzle-equipped holder 290 located at the holder lifting / lowering station is positioned above the appropriate mounting position. At this time, the movement position of the mounting head 26 is optimized based on the detected displacement amount of the wiring board holding position and the holding position displacement amount of the component. At that position, the nozzle-equipped holder 290 is lowered by a predetermined distance, positive pressure is supplied to the suction nozzle 288, and the held component is mounted on the surface of the wiring board. Subsequently, the nozzle-equipped holder 290 is intermittently rotated, and a similar component mounting operation for the next nozzle-equipped holder 290 is performed. In this way, the component mounting operation is sequentially performed on the holder with nozzle 290 that holds the component.

  The mounting head 26 is reciprocated between the component supply device 22 and the wiring board until the mounting of all the scheduled components is completed, and the component extraction operation and the component mounting operation are repeatedly performed. After the mounting of all the components is completed, the support plate lifting / lowering device 158 of the wiring board transport device 24 is lowered, and the fixed holding of the wiring board is released. The wiring board is transferred downstream by the wiring board holding device 24. In this way, the component mounting work scheduled for the wiring board is completed. The conveyance of the wiring board by the wiring board conveyance device 24 whose description is omitted will be described in detail later. It should be noted that the two mounting modules 12 arranged in the system of the basic mode can perform component mounting work even on a wiring board having a size straddling both. This will be described later.

<Moving device etc. to system base>
i) Mounting Device Movement Permissive Device As shown in FIG. 3, four rail rows 472 each including a plurality of guide rails 470 arranged in a straight line are provided on the upper portion of the system base 10 (FIG. 1). The illustration is omitted in FIG. When viewed from the front, the left and right outer rail rows 472 are each composed of two guide rails 470, and the inner two rail rows 472 are each composed of three guide rails 470. The four rail rows 472 are arranged in parallel to each other. The four rail rows 472 can be divided into two rail pairs. The rail pair constituted by the two right rail rows 472 is related to the right mounting module 12, and the rail pair constituted by the two left rail rows 472 is related to the left mounting device. It has become. Note that the two rail pairs are equal to each other, and the distance between the rail rows 472 constituting each rail pair is the same.

  FIG. 13 is a partial right side sectional view of the system of the above basic aspect, and FIG. The mounting module 12 has a wheel device that rotatably holds a total of eight wheels 474 arranged in two rows of four at a lower portion of the frame portion 14 via bearings, and the wheels 474 serve as engaging members. , And the guide rails 470 as the track forming members constituting the respective rail rows 472 that make a pair. Thereby, the mounting module 12 can be moved relative to the system base 10 in the front-rear direction. That is, the mounting module 12 is a movable device that can move along a device track extending in the front-rear direction. The device track is a straight track that intersects the right and left direction, which is the wiring board conveyance direction, at right angles, and extends horizontally. In addition, the present system includes two mounting device movement permission devices as movable device movement permission devices that allow the movement of the mounting module 12 as a movable device, and each of the mounting device movement permission devices. Are provided with a pair of rails 472 as a device trajectory forming unit fixed in position on the system base 10 and fixed in position on the mounting module 12 and are movable relative to the guide rail 470. It is comprised including the wheel apparatus as a paired track | orbit engaging part. When the mounting module 12 moves forward, one of the wheels 474 may be located at a position where there is no guide rail 470 (gap between the rails) in one rail row 472. The wheels 474 engage with any one of the guide rails 470 constituting the pair of rail rows 472. The wheel device functions as a movable device movement facilitating means, and the mounting module 12 can be easily moved by human power. Therefore, for example, when a change in the arrangement of the backup pins 154 with respect to the support plate 152 or a replacement of the backup pins 154 occurs due to a change in the type of the wiring board 150, the mounting module 12 is pulled out from the system base 10. Then, the wiring board transport device 24 is moved to a position where it is detached from the system base 10, and operations such as rearrangement can be easily and efficiently performed in a wide space in front of the system base 10.

  As shown in FIG. 14, the outer peripheral portion of the wheel 474 is flattened, but the guide rail 70 constituting the pair of rail rows 472 has an outer portion in the left-right direction that prevents the wheel 474 from being removed. Thus, the mounting module 12, which is a movable device, does not deviate from the device track. The shapes of the guide rail 470 and the wheel 474 that are engaged with each other are not limited to the above shapes. For example, a guide rail with a flat top shape and a wheel provided with a collar that prevents the wheel from coming off are engaged (similar to the relationship between a rail and a wheel in a railway vehicle), and a guide rail having a chevron-shaped cross section and fitting to it The upper surface of a pair of guide rails that engage with a wheel having a groove having a V-shaped cross-sectional shape is inclined in opposite directions to each other (for example, inclined so as to form a “C” shape) and fitted into the taper. It can also be set as the aspect of employ | adopting the wheel which has a shape outer peripheral surface.

ii) Mounting Device Fixing Device As shown in FIG. 3, the system base 10 has a locking member for locking a contact member 480 as a locked member fixedly provided at the lower rear of the mounting module 12. One stopper 482 is provided at each of the middle portions of the two rail pairs at the rear of the upper part. When the mounting module 12 is moved along the device trajectory, a part of the contact member 480 comes into contact with a part of the stopper 482, and the rearward movement of the mounting module 12 is prohibited. Further, the system base 10 has a cylinder device 486 as a biasing force generation device, and can bias a biased member 488 fixedly provided at the lower portion of the mounting module 12 via a link mechanism. A biasing device 490 is provided for each of the two rail pairs at an intermediate portion between the two rail rows 472 constituting the rail pair near the central portion in the front-rear direction. 3 shows a state in which the urging tool 492 of the urging device 490 is in the non-biasing position, and in FIG. 13, a state in which the urging tool 492 is rotated so as to protrude upward from the top plate 54. The state in the biased position is shown. The abutting member 488 is urged backward by the urging device 490 in a state where the abutting member 480 is abutted against the stopper 482, whereby the abutting state of the abutting member 480 to the stopper 482 is changed. And the forward movement of the mounting module 12 is prevented. That is, the present system includes a mounting device fixing device as a movable device fixing device that fixes the movable device at a fixed position on the device trajectory, and the contact member 480 and the stopper 482 are disposed on the device trajectory of the mounting module 12. The urging device 490 and the member to be urged 488 are in contact with each other when the urging device 490 and the member to be urged 488 are in contact with each other. It functions as a contact state release prohibiting portion that prohibits the release, and the mounting device fixing device is configured to include these contact portions and the contact state release prohibiting portion. The fixing position of the mounting module 12 by the mounting apparatus fixing device is a predetermined arrangement position of the mounting module 12 with respect to the system base 10.

iii) Table device When the fixing by the mounting device fixing device is released and the mounting module 12 is moved forward along the device track, the mounting module 12 can be moved so as to overhang from the system base 10, When the moving distance is large, the mounting module 12 may fall from the system base 10. Therefore, in this system, a table device on which at least a part of the mounting module 12 can be placed is prepared. FIG. 15 shows a table device and a use state of the table device. The table device 500 has a width that is slightly larger than the width in the left-right direction of the mounting module 12 (width in the wiring board conveyance direction), is substantially the same as the length in the front-rear direction of the mounting module 12, and is substantially the same as the upper surface of the system base 10. It is mainly composed of a base portion 502 having a height upper surface. Two guide rails 504 having the same cross-sectional shape as the above-described guide rail 470 are provided on the upper surface of the base portion 502. The two guide rails 504 are arranged in parallel with each other, and the distance between them is equal to the distance between the two rail rows 472 constituting the one rail pair. The table apparatus 500 is arranged so that each of the two guide rails 504 extends in front of the system base 10 so as to extend each pair of rail rows 472 engaged with the mounting module 12 to be moved. It is positioned and placed beside it.

  After placing the table device 500, the mounting device fixing device described above is operated to release the mounting module 12, and the mounting module 12 is moved forward. A part of the mounting module 12 is placed on the table device 500 while being moved a certain distance. Specifically, some of the plurality of wheels 474 of the mounting module 12 engage with the guide rail 504 provided in the table apparatus 500. In this state, a part of the moved mounting module 12 is shifted forward with respect to the other adjacent mounting module 12, so that operations such as maintenance and adjustment can be easily performed. That is, the table device 500 functions as an auxiliary base unit in the system. Then, by moving the mounting module 12 further forward, the mounting module 12 is transferred to the table device 500. FIG. 15 shows this transferred state. In FIG. 15, the state indicated by the alternate long and short dash line is a state in which a part of the mounting module 12 is placed on the table device 500. In a state where the mounting module 12 is transferred to the table apparatus 500, the mounting module 12 is separated from the system base 10. By using the table device 500 in this system, the table device-side movable device movement permitting device is configured including the guide rail 504 as the extended track forming member and the wheel 474 as the engaging member engaged therewith. It is.

  The table device 500 is provided with a stopper 506 as a table-side locking member at a front portion on the upper surface of the base portion 502 and at an intermediate portion between the two guide rails. Further, an urging device 508 having a structure similar to that of the urging device 490 provided in the system base 10 is provided. The stopper 506 locks a contact tool (not shown) different from the above-described one fixedly provided on the mounting module 12, and the biasing device 508 is fixedly provided on the mounting module 12. A biased member (not shown) different from the above-described one is biased. That is, the table device side movable device fixing device is configured including the stopper 506, the biasing device 508, and the like. Since the function is the same as that of the mounting device fixing device on the system side described above, the description is omitted, but the position of the mounting module 12 is fixed at a fixed position on the extension track by the fixing device on the table side. In the table apparatus 500, the mounting module 12 can be fixed at a position where it is separated from the system base 10 and transferred to the table apparatus 500.

  Further, the table device 500 has a caster 510 as a movement facilitating unit at a lower portion, and is a movable table that can be easily moved by human power. By moving the table device with the mounting module 12 placed on the upper surface, the mounting module 12 can be transported to a maintenance area or the like existing outside the mounting line, for example. In other words, the table device 500 also functions as a substrate work apparatus transport device that transports the substrate work apparatus disposed in the system base 10.

  In this system, in order to facilitate positioning of the table device 500 at a position where the device track is extended, a connecting device that connects the system base 10 and the table device 500 is employed. FIG. 16 shows the connecting device. As shown in FIG. 16A, a pair of connection blocks 520 as base side connection portions are provided on the front surface of the system base 10 for each mounting module 12 (only one of them is shown in the figure). Further, as shown in FIG. 16B, a pin projecting device 524 for projecting the fitting pin 522 upward is provided on the surface of the table device 500 that faces the front surface of the system base 10. One pair is provided corresponding to 520 (only one is shown in the figure). If the lever 526 of each pin protruding device 524 is pushed down with the table device 500 moved to the approximate position, each fitting pin 522 is fitted into the corresponding fitting hole 528 of each connecting block 520. To do. In this state, the table device 500 is positioned so that the guide rail 504 of the table device 500 and the rail row 472 of the system base 10 are positioned on a straight line. In order to achieve such a state, the positions of the connecting portions are optimized. In this system base 10, the connection block 520 corresponds to each of both mounting modules 12 so that the same table device can be used when moving any one of the two mounting modules 12. Is provided.

iv) Relative movement restriction device between devices In the present system exemplified as a basic mode, both of the two mounting modules 12 are movable devices, and can move independently with respect to the system base 10, and It is separable alone. Further, in the present system, since the device tracks of the two mounting modules 12 are parallel to each other, they can be moved together and separated together. That is, relative movement with respect to the system base 10 is possible while maintaining the relative position of the two mounting modules 12 substantially constant. In that case, instead of the table device 500 described above, a table device on which two mounting modules 12 can be placed, specifically, a table device having two pairs of guide rails parallel to each other can be adopted.

  As an effective means for moving the two mounting modules 12 together while maintaining the relative positional relationship between them, in this system, an inter-device relative movement limiting device for limiting relative movement between the mounting modules 12 is provided. Mounting module 12 has. This will be described with reference to FIGS. 13 and 14. The mounting module 12 is provided with a pin projecting device 542 for projecting the fitting pin 540 from the left side of the device at the front portion thereof, specifically, the lower portion of the portion of the frame portion 14 where the component supply device 22 is provided. In addition, a fitting hole 544 into which the fitting pin 540 is fitted is provided in the right side portion of the frame portion 14 of the corresponding device. The pin protruding device 542 is mainly composed of a cylinder device 546. The fitting pin 540 is supported by a support hole 548 provided in a portion located on the left side surface of the frame portion 14 so as to be movable in the front-rear and up-down directions and in the left-right direction so as to extend in the left-right direction. Yes. The rear end portion of the fitting pin 540 is connected to the rod tip portion of the cylinder device 546, and when the cylinder device 546 is operated, the fitting pin 540 protrudes from the left side surface of the mounting module 12 and does not protrude. The state can be selectively switched.

  FIG. 13 shows the pin projecting device 542 provided on the right mounting module 12, and as shown in the figure, the two projecting modules 12 are projected when both are located at a predetermined arrangement position. For example, the tip of the fitting pin 540 is in a state of being fitted into the fitting hole 544 of the left mounting module 12. That is, the fitting pin 540 functions as an engaging portion of one mounting module 12 and the fitting hole 544 functions as an engaging portion of the other mounting module 12. The outer dimension of the fitting pin 540 is reduced to have a slight gap with respect to the inner dimension of the fitting hole 544 (the arrangement accuracy of the fitting pin 540 and the fitting hole 544 in the mounting module 12 is reduced). To be considered). When the fitting pin 540 of one mounting module 12 and the fitting hole 544 of the other mounting module 12 are engaged with each other, the relative movement of the two mounting modules 12 is limited in the direction in which the apparatus track extends. Both of them can be moved together along the device trajectory while maintaining the relative positional relationship between them. Conversely, when the fitting pin 540 is in a non-projecting state, there is no restriction on the relative position with the adjacent mounting module 12, and any mounting module 12 can be moved along the device track alone. It can be done.

  In this system illustrated as a basic mode, the positions of the two mounting modules 12 can be interchanged, that is, the right one can be arranged on the left side and the left one can be arranged on the right side. In this system, each of the two mounting modules 12 is provided with a pin protrusion device 542 and a fitting hole 544, and even when the two mounting modules 12 are replaced, the pin protrusion on the side that has not been used in the state where the two mounting modules 12 are not replaced. By using the device 542 and the fitting hole 544, it is possible to move the two mounting modules 12 while maintaining the relative positional relationship between them.

  As will be described in detail later, the mounting module 12 can perform a component mounting operation on one wiring board located across both devices in cooperation with the adjacent mounting module 12. In that case, for example, when a problem occurs in any of the mounting modules 12 during the collaborative work, the mounting module 12 is moved while holding the one wiring board in the wiring board transport device 24 provided in both apparatuses. Need to be made. When such a need arises, the inter-device relative movement limiting device is an effective means.

<Variation etc. of the substrate work system>
The board-to-board working system is not limited to the above-described mounting system of the basic mode, and there are many types that include a variety of variations. Some of them are described below.

i) Variations related to the number of arrangements of the substrate working apparatus The ones shown in FIGS. 1B to 1D are mounting systems in which the number of mounting modules 12 is different. In the system of the basic mode shown in FIG. 1 (a), there are two mounting modules 12, but in the system shown in FIG. 1 (b), four mounting modules 12 are shown in FIG. 1 (c). FIG. 1D shows a system in which six mounting modules 12 and eight mounting modules 12 shown in FIG. 1D are arranged in the left-right direction, which is the wiring board conveyance direction. The mounting module 12 has the same configuration in any of FIGS. 1A to 1D. Each of these systems differs in the width of the system base (length in the wiring board conveyance direction) depending on the number of mounting modules 12, and each of the systems shown in FIGS. 1 (b), (c), and (d). The system bases 570, 572, and 574 are about twice as wide, about three times, and about four times as wide as the system base 10 of the system shown in FIG.

  Any of the mounting modules 12 shown in FIG. 1 is the above-described movable device, and the upper surfaces of the system bases 570, 572, and 574 are the same as those in the basic mode shown in FIG. The rail rows 472 are arranged in 4 pairs, 6 pairs, and 8 pairs, respectively, according to the number of mounting modules 12 arranged. The device tracks formed by the rail rows 472 intersect each other at right angles to the wiring board transport direction and extend horizontally in the front-rear direction. That is, the above-described mounting device movement allowance devices are provided for all the mounting modules 12. Also, the number of mounting device fixing devices having the same configuration as described above is provided according to the number of mounting modules 12 arranged. In addition, each mounting module 12 is provided with a relative movement restriction device between the devices, and maintains the relative positional relationship between one mounting module 12 alone or two or more mounting modules 12 adjacent to each other. However, it can be moved toward the front of the system.

ii) System-based modularization and board-to-board work structure FIG. 17 shows some other aspects of the mounting system from the above aspects. The system shown in FIGS. 17A to 17C is a system in which a plurality of systems of the basic mode shown in FIG. 1A are aligned in the wiring board conveyance direction. As shown in FIGS. 13 and 14, in the system of the basic aspect, the system base 10 has a plurality of casters 580, and the system itself can be easily moved. In installing the system, it is possible to install the system at an arbitrary position while adjusting the height using the jack devices 582 and 584. The systems shown in FIGS. 17A to 17C are obtained by arranging two, three, and four systems of the basic mode, respectively, and are externally shown in FIGS. 1B to 1D. And approximate. The difference is that the former has a plurality of the same system bases 10 installed side by side, whereas the latter is constituted by one system base 570, 572, 574 having different widths. That is, in the system of the aspect shown in FIG. 17, each of the system bases 10 functions as a modularized base module, and these systems are system bases 590 and 592 configured by a plurality of the base modules. , 594. Thus, in the on-board work system, the system base may be configured to include a plurality of base modules. The illustrated system bases 590, 592, and 594 may be simply installed side by side with the system base 10 as a base module, or may be integrally connected using a dedicated connecting device.

  In the case of the mode shown in FIG. 17, an electronic circuit component mounting structure (a type of work-to-board work structure) is configured to include one system base 10 as a base module and two mounting modules 12 arranged thereon. It can also be regarded as being done. That is, the system of the above-mentioned basic aspect can be handled here as one electronic circuit component mounting structure. The system of the basic mode as an electronic circuit component mounting structure can be moved independently by itself, and can be freely exchanged for each structure, so that the system is highly versatile. Become.

iii) Variations related to module width of substrate working apparatus A mounting system in which a mounting apparatus different from the mounting module 12 described above is arranged will be described. FIG. 18A shows a system in which mounting modules 600 having different module widths in the wiring board transport direction are arranged on the system base 10 used in the system of the previous basic mode. Specifically, it has a module width approximately twice that of the mounting module 12. The wiring board transport device 602 provided in the mounting module 600 is approximately twice as long as the wiring board transport device 24 provided in the mounting module 12 according to the module width (device length in the wiring board transport direction). have. Therefore, it is possible to mount a component by positioning a wiring board larger than the wiring board that fits in the module area of the mounting module 12 (about twice as long) in the module area. In addition, the component supply device 604 can mount more tape feeders 20 than the component supply device 22 of the mounting module 12, and the mounting module 600 can mount a wider variety of components. . The mounting head and head moving device have the same configuration as that of the mounting module 12 described above, but the head can be moved in the X-axis direction (wiring board transport direction) as the module width increases. The area has been enlarged. Other deployment apparatuses and the like have the same configuration as the mounting module 12.

  The mounting system shown in FIG. 18 (b) is a system according to the above-described basic mode in which the system shown in FIG. 18 (a) is used as one electronic circuit component mounting structure, and the structure and another structure. Are arranged side by side. Each of the two system bases 10 serves as a base module, and constitutes one system base 590, similar to that shown in FIG. This system is a system in which two mounting modules 12 and one mounting module 600 are arranged on the system base 590 so as to be aligned in the wiring board conveyance direction. As will be described in detail later, the two mounting modules 12 can perform the mounting operation in cooperation with respect to the wiring board located across both. Accordingly, the wiring board is transported from the upstream side toward the downstream side (which may be the left or right side upstream), the wiring board is positioned in the device area of the mounting device 200, and a component mounting operation by one mounting head; A system in which the wiring board is positioned across the two mounting modules 12 and the component mounting work by the two mounting heads can be sequentially performed in an arbitrary order. For example, it is possible to adopt a work form in which a small quantity and a large number of parts are mounted by the two mounting modules 12 and a large variety and a small quantity of parts are mounted by the mounting module 600. Become.

  FIG. 19 shows another aspect of the mounting system in which mounting devices having different module widths are arranged. FIG. 19A shows a system base 572 (same as that of the system shown in FIG. 1C) on which six mounting modules 12 used in the system of the basic mode can be arranged. In this system, four mounting modules 12 are arranged in alignment, and a mounting module 600 having a width approximately twice that of the mounting module 12 is disposed adjacent to the mounting modules 12. In addition, in FIG. 19B, three mounting modules 12 are arranged on a system base 574 (same as the system shown in FIG. 1D) on which eight mounting modules 12 can be arranged. A mounting module 600 having a width approximately twice that of the mounting module 12 is disposed adjacent to the mounting module 12, and a mounting device 610 having a width approximately three times that of the mounting module 12 is further adjacent thereto. It is a deployed system. In this manner, it is possible to adopt a mode in which mounting devices having different widths in the wiring board conveyance direction are arranged and arranged.

iv) Modularization of on-board work apparatus The mounting systems of various modes enumerated so far are arranged with a plurality of mounting apparatuses, all of which are modularized. That is, since the system is configured by arranging a modular device that can be separated from the system base, for example, even when one modular device fails, the system has the same configuration as that device. If other modularized devices are prepared, these devices can be replaced in a short time, and the system can be easily restored. Further, it is possible to quickly cope with a change in system configuration, for example, a change or replacement of the placement position of the mounting device. In particular, the system shown in FIG. 1 and FIG. 17 is a system constituted by a single type of mounting module 12, and is constituted by a single modularized device, so that the system is more convenient.

  All of the mounting devices are modularized in such a manner that various devices such as a component supply device, a wiring board transport device, a mounting head, and a mounting head moving device are provided. Further, the above system has a control device (corresponding to the above-described mounting device control device 36) for controlling those deployment devices for each mounting device, and the control device is also deployed and modularized. System. In addition, the system base is provided with various shared devices and dedicated devices for each mounting device as described above. When the modularized mounting apparatus is fixed at a predetermined arrangement position, the connection between the shared apparatus, the dedicated apparatus, and the mounting apparatus is standardized, and a system with excellent convenience is realized. For example, the power supply line that connects the mounting device and the system base, the positive pressure and negative pressure supply paths, and the signal line that exchanges signals between the control devices are joints that can be connected and disconnected with one touch on the back side of the system. To each other (not shown).

v) Adjacent arrangement of substrate-to-board working apparatus and standardization of module width In the system of each aspect described above, the plurality of mounting apparatuses are arranged adjacent to each other. That is, each of the mounting devices is a mutually adjacent arrangement device, and constitutes an adjacent device group in which these devices are arranged adjacent to each other. As a result, a compact system is realized. Side surfaces (left and right side surfaces) in the wiring board transport direction of each mounting device are substantially flat, and each mounting device is arranged with almost no gap between the devices. In the system of each aspect described above, each mounting and mounting that constitutes the adjacent device group is a modularized device whose module width is standardized. The module width of the mounting module 12 used in the system of the basic aspect described above is used as a unit width, and the adjacent device group is configured only by devices having a module width that is substantially an integral multiple of the unit width. For example, taking the system shown in FIG. 19B as an example, the mounting module 12 has a module width that is about 1 times the unit width, the mounting module 600 has a module width that is about twice, and the mounting device 610 has a size that is about 3 times. It is a device of module width. By configuring the adjacent arrangement group with the modularized apparatus in which the module width is standardized in this way, the width of the entire adjacent apparatus group, that is, the width of the entire system is standardized in the case of the system according to the above aspect.

  In the above system, in addition to the standardization of the width of the mounting device, the placement position and layout method of the mounting device are also standardized. FIG. 20 shows a system base 574 on which eight unit width mounting modules 12 can be arranged and arranged. FIG. 21 shows an example of the arrangement system of mounting devices of various widths using the system base 174 as an example. A conceptual diagram is shown. The system base 574 has a pair of rails 472 that are parallel to each other so that the unit-width mounting modules 12 can be arranged adjacent to each other (similar to that of the system of the basic aspect described above). 8) are provided in parallel with each other. The distance between the two rail rows 472 constituting the rail pair is the same in any of the rail pairs, and the eight rail pairs are arranged at a pitch equal to the unit width.

  In the case of the mounting module 12 having a unit width, the wheels 474 of the mounting module 12 are engaged and arranged as shown in FIG. On the other hand, when the mounting module 600 having about twice the unit width is arranged, as shown in FIG. 21B, among the four rail rows 472 constituting each of the two rail pairs arranged side by side. The wheels 474 of the mounting module 600 are engaged with the two outer rail rows 472. Similarly, when the mounting device 610 having about three times the unit width is arranged, as shown in FIG. 21 (c), the outer two of the six rail rows 472 constituting the three rail pairs aligned with each other. The wheels 474 of the mounting device 610 are engaged with one rail row 472. Both mounting devices are standardized by providing the wheels 474 so that each side surface of the device that determines the module width in the wiring board conveyance direction is positioned at the approximate center of the adjacent rail pair. Even if any of the mounting devices is arranged side by side, it is possible to make adjacent mounting devices adjacent to each other with almost no gap between the side surfaces of the devices. Even if the mounting device has a module width of about 4 times the unit width or more, if it is a mounting device that is a substantially integer multiple, it can be arranged adjacently in the same manner. In any of the mounting devices described here, the wheel 474 is configured to engage with two rail rows 472 existing on the left and right outer sides. A configuration in which the wheel 474 engages with a part or all of the other rail row 472 existing in the lower part of the apparatus may be adopted.

  The stopper 482 and the urging device 490 constituting the mounting device fixing device as described above are respectively provided in the intermediate portion between the two rail rows 472 constituting one rail pair. Although a detailed description is omitted, in the case of a mounting device having a unit width of about twice or more the unit width, a plurality of stoppers 482, biasing devices 490, and the like exist below the mounting device. In that case, the arrangement position in the front-rear direction may be determined by any one or more of the plurality of stoppers 482 and the like.

  As can be understood from the above description, the present system is provided with a plurality of arrangement position determination devices that determine the arrangement positions of the mounting apparatuses that are mutually adjacent arrangement apparatuses. The arrangement position determination device includes a conveyance direction position determination unit that determines an arrangement position in the wiring board conveyance direction, and a cross direction position determination unit that determines an arrangement position in a direction crossing the wiring board conveyance direction, The conveyance direction position determination unit includes a pair of rail rows 472 that constitute the mounting apparatus movement allowance device, and the cross direction position determination unit includes a stopper 482 that configures the mounting apparatus fixing device. ing. Further, the mounting devices constituting the adjacent device group are all movable devices, and any of the mounting devices can be moved in a direction orthogonal to the wiring board transport direction. The mounting devices are arranged adjacent to each other, but one or more of them can be easily moved without interference with adjacent ones. Note that the above-described apparatus relative movement restriction device described above may be standardized and provided in each of the mounting devices that are mutually adjacently arranged devices.

vi) A system in which an on-board work apparatus for performing auxiliary work is arranged The mounting system exemplified so far is configured by arranging only the mounting apparatus on the system base. In addition to these aspects, an apparatus that performs at least one of the operations related to board transfer such as transfer, carry-in, carry-out, standby, stock, change of transfer direction / path, change of direction of wiring board, etc. Can be arranged as an auxiliary work device. FIG. 22 shows a mounting system in a mode in which a transport work device that mainly transports wiring boards is arranged between the mounting devices. In this system, instead of the third mounting module 12 from the right in the system shown in FIG. 1 (d), a transport work device 620 mainly for transporting a wiring board is arranged at that position. The transport work device 620 is a device that excludes deployment devices such as the mounting head 26, the head moving device 28, and the component supply device 22, with the wiring board transport device 24 deployed in the mounting module 12 as a main deployment device. Such a transfer work device 220 can be conveniently used when, for example, one of the mounting modules 12 fails. In that case, if the other mounting modules 12 share the component mounting work assigned to the mounting modules 12 that have been arranged, a significant system operation loss can be avoided. Operation loss can also be avoided by holding the same mounting module 12 as a spare, but the transport work device 620 is a simpler device configuration and is lower in cost than the mounting module 12, so that the cost of the entire facility is reduced. There is also an advantage that it can be suppressed. Note that the transfer work device 620 can be used not only in the case of a failure or the like, but also as a device that supplements the empty space when a system is created in which an empty space where no mounting device is arranged on the system base is created. . A substrate transfer-related work device such as the transfer work device 220 is a device useful for improving the flexibility and convenience of the system.

vii) Variations on Types of Board Work The system exemplified so far is a system that performs component mounting work, but a system that performs other kinds of board work can also be constructed. FIG. 23 shows an on-board working system in which various on-board working apparatuses having different types of on-board work are arranged. The system base 630 of this system is composed of two base modules. One of them is a system base 574 capable of arranging eight unit width-to-board work apparatuses adjacent to each other, and the other one is a system capable of arranging two unit-width-on-board work apparatuses adjacent to each other. Base 10. The system base 574 is located on the upstream side (left side), and the system base 10 is located on the downstream side (right side), and is disposed adjacent to each other. On the system base 574, in order from the upstream side, a solder printing apparatus 632 that performs a cream solder printing operation, which is one type of high-viscosity coating operation, on the wiring board, and an adhesive, which is a type of another high-viscosity coating operation. The adhesive application device 634 that performs the application operation, the two mounting modules 12 and the mounting module 600 having the unit width described above, and the mounting result inspection device 636 that inspects the mounting result of the components are arranged adjacent to each other. . The other devices except for the two mounting modules 12 are devices having a module width approximately twice the unit width. In other words, the system includes (A) a first pair including a system base 574 and a solder printing device 632, an adhesive application device 634, two mounting modules 12 and a mounting module 600 disposed thereon. It can be said that the present system is configured to include the substrate work structure and (B) the second substrate work structure including the system base 10 and the mounting result inspection device 636 disposed thereon. In addition, the 1st board | substrate work structure and the 2nd board | substrate work structure are each a board | substrate work system independently.

viii) Others For example, the circuit board is carried into the various board-to-board working systems exemplified above, for example, the board board transporting device provided in the upstream-side board working apparatus mainly includes a carry-in machine (for example, a carry-in conveyor). For example, a carry-out machine (for example, a carry-out conveyor). Etc.) and the like, and so on. It is also possible to arrange on the system base, for example, by modularizing it as a kind of the substrate work apparatus provided with the carry-in device and the carry-out device. Moreover, the said board-to-board work system may be used in the aspect which bears a part of mounting line by connecting and using with another system, a board-side work machine, etc.

<Conveyance of wiring board>
With reference to an example of the mounting system shown in FIG. 1 in which the mounting modules 12 whose module width is a unit width are arranged adjacent to each other, the conveyance of the wiring board will be described below.

i) Configuration of System Transfer Device In the circuit board mounting system according to this aspect, the plurality of mounting modules 12 are arranged adjacent to each other. The wiring board transport device 24 has a width that is substantially equal to the module width of the mounting module 12 (the transport length and the length in the wiring board transport direction), and the plurality of mounting modules 12 are at predetermined positions. When arranged, the respective wiring board transfer devices 24 arranged in the respective mounting modules 12 are positioned adjacent to each other. In addition, the wiring board transport device 24 is arranged at a fixed position in the mounting module 12, and when the plurality of mounting modules 12 are disposed at predetermined positions, the wiring board transport devices 24 are arranged in a straight line. It becomes. By arranging the wiring board transport devices 24 in a line, a device for transporting the wiring boards throughout the system is configured. The apparatus serves as a substrate transfer apparatus in the system, and is referred to as a “system transfer apparatus” to be distinguished from each wiring board transfer apparatus. This system transfer apparatus can be considered to be configured by a series of transfer modules that are partly modularized. That is, each of the wiring board transport devices 24 provided as the deployed transport device in each mounting module 12 corresponds to a transport module in the system transport device. In addition, each mounting module 12 is a device that is also modularized by providing a transport device, and thus can be referred to as a transport device deployment module device. In addition, about the structure of the wiring board conveying apparatus 24, it shall refer to the previous description and description here is abbreviate | omitted.

  The mounting system of the present embodiment is a system in which only mounting modules 12 having a unit width are arranged. As described above, there is also a system in which a mounting device having a module width that is approximately an integral multiple of twice or more the unit width is arranged. Even in such a case, if the wiring board transport device provided in the mounting device has a width corresponding to the module width, a similar system transport device can be configured. Further, in the mounting apparatus having a module width that is approximately an integral multiple of twice or more the unit width, the wiring board transport devices 24 used in the unit width mounting module 12 are arranged in series by the number corresponding to the module width. A similar system transport device can be obtained by deploying to the system.

ii) Recognizing Wiring Board Existence Position In the system transfer device, adjacent wiring board transfer devices 24 cooperate to transfer the wiring board, and at least a part of the wiring board is defined as a work area of the mounting module 12. It is located at the designated work position. For example, it conveys by coordinating the conveyor operations of the mutual wiring board conveying devices 24. That is, transport cooperative control is performed. As a premise for carrying out transport cooperative control, it is necessary to grasp where the wiring board currently exists. In this system transfer device, each of the wiring board transfer devices 24 includes a photoelectric sensor 160 as a wiring board detector, and the presence position of the wiring board is recognized based on the detection result by the photoelectric sensor 160. . Hereinafter, a method for recognizing the position of the wiring board will be described. As described above (see FIG. 4), in the mounting system of this example, the wiring board can be transported by both the front conveyor unit 110 and the rear conveyor unit 112, but the following explanation is understood. In consideration of easiness, only the front conveyor unit 110 will be described. Further, the conveyor operation means the start of the circulation of the conveyor belt 142 (see FIG. 5) for the purpose of conveying and stopping the wiring board, the stop of the rotation, the change of the rotation speed, and the like. These are simply referred to as starting, stopping and changing the speed of the conveyor.

  FIG. 24 schematically shows a state in which a plurality of wiring board transfer devices 24 constituting the system transfer device are arranged in the system of this aspect. The figure shows the entirety of four of the plurality of wiring board transfer devices 24, and these wiring board transfer devices 24 are numbered in order from the upstream side (left side) and are referred to as device [X]. I will decide. In the figure, device [1], device [2], device [3], and device [4] are arranged in order from the upstream side. Reflective photoelectric sensors 160 as wiring board detectors (a kind of substrate detectors) are provided at the upstream end portion and the downstream end portion of the rail 100 (see FIG. 4) serving as the reference rail. The photoelectric sensor 160 (hereinafter simply referred to as “sensor”) is capable of emitting a detection signal of a wiring board, and is associated with the number X of the wiring board transport device 24, and each sensor on the upstream side is a sensor [X]. U, downstream sensor [X] L. A downstream sensor [X-1] L of a downstream device [X-1] of a device [X-1] upstream of a certain device [X] passes through the position of the sensor [X-1] L. As a result, an ON state (detection state) is established. Thereby, it is recognized that the wiring board 350 enters the device [X]. Further, the upstream sensor [X + 1] U of the device [X + 1] on the downstream side of the device [X] is turned off when the upstream end of the wiring board 150 passes the position of the sensor [X + 1] U. It becomes a state (non-detection state). Thereby, it is recognized that the wiring board 150 comes out of the device [X]. Based on the recognition result, the wiring board presence / absence information indicating whether or not at least a part of the wiring board 350 exists in a certain device [X] is acquired. The presence / absence of the wiring board is managed by the control device 36 provided in the mounting module 12 in which the target device [X] is provided, and a recognition signal from the sensor of the upstream device [X-1]. The recognition signal from the sensor of the downstream device [X + 1], the wiring board presence / absence information, and the like are exchanged with the mounting device control device 36 provided in the mounting module 12 in which these devices are provided.

iii) Transporting a wiring board that fits within the device area of one mounting device FIG. 25 schematically shows a first example of a wiring board transport method. The transport method of the present example is a wiring board having a length shorter than the width of the wiring board transport device 24 (length in the wiring board transport direction), or, in other words, a size that fits within the device area of one mounting module 12. This is a transport method suitable for transporting a wiring board (actually, a wiring board shorter than the module width by a predetermined length due to the structure of the apparatus). First, in the state shown in FIG. 25A, the wiring board 150 is fixedly held at the center position in the wiring board conveyance direction of the device [1], and the component is mounted by the mounting module 12 in which the device [1] is arranged. It is in a state of being used for work. When the component mounting operation is completed, the fixing of the wiring board is released. Subsequently, after it is confirmed that there is no wiring board in the device [2], the conveyor of the device [1] is started. When the wiring board 150 moves and reaches the position shown in FIG. 25 (b), the sensor [1] L is turned ON and the conveyor of the apparatus [2] is started. In addition, the conveyor speed of apparatus [1] and the conveyor speed of apparatus [2] are made equal. Subsequently, when the wiring board 150 reaches the position shown in FIG. 25C, the sensor [2] U is turned on, and the control of the transport distance starting from that point is started. The conveyance distance is controlled by controlling the rotation amount (rotation angle) of the electric motor 344 described above. The length of the wiring board 350 is known, and the rotation amount is controlled so that the downstream end of the wiring board 350 is moved to a set distance from the position of the sensor [2] U. By this control, the wiring board 150 can be stopped at an arbitrary position. In this example, the center of the wiring board 150 is set to stop at the center position in the wiring board conveyance direction. Next, when the wiring board 150 reaches the position shown in FIG. 25 (d), the sensor [2] U is turned OFF and the conveyor of the apparatus [1] stops. Then, as shown in FIG. 25 (e), when the wiring board 350 reaches the set position, the conveyor of the apparatus [2] stops and the control of the transport distance is finished. At this position, the wiring board 150 is fixed and held, and the component mounting operation by the mounting module 12 in which the device [2] is installed is started.

Each wiring board conveyance device 24 sequentially repeats the conveyance as described above, and the wiring board 150 sequentially moves each mounting module 12. In many cases, each mounting module 12 performs a component mounting operation in parallel, and a wiring board 150 exists for each wiring board transport device 24 existing in the system. Therefore, in actual conveyance, first, the downstream wiring board conveyance device 24 is made empty (the wiring board 150 is not present), and the wiring board is transferred from the upstream side to fill the empty state. One transfer operation is sequentially performed from the downstream side toward the upstream side, and all the wiring boards 150 existing in the system transfer apparatus are transferred. As another method, the conveyor operations of all the wiring board conveying devices 24 may be performed simultaneously to convey the wiring boards in the system conveying device at the same time. Also, loading into the system (carrying into the wiring board transfer device located at the uppermost stream) and carrying out from the system (carrying out from the wiring board transfer device 24 located at the most downstream position) are also performed on the conveyor device outside the system. It is also possible to carry out the carrying operation in cooperation with the same method as described above by providing the photoelectric sensor 160. Further, the transfer speed of the wiring board is changed by changing the rotation speed of the conveyor belt 142 based on the detection signal of the photoelectric sensor 160 or by providing another photoelectric sensor and based on the detection signal of the photoelectric sensor. It is also possible to perform the transport cooperative control of the mode to be performed.

iv) Method 1 for transferring a wiring board across a plurality of mounting devices
FIG. 26 schematically shows a second example of the method for transporting the wiring board. The transport method of this example is a transport method suitable for transporting a wiring board having a length longer than the width of the wiring board transporting device 24, that is, a wiring board having a size straddling a plurality of mounting devices. This is effective when a wiring board straddling a plurality of mounting modules 12 adjacent to each other performs component mounting work in cooperation with each other. In this example, a case where a wiring board having a size straddling two mounting modules 12 is conveyed will be described.

  First, in the state shown in FIG. 26A, the center of the wiring board 150 is located at an intermediate position between the device [1] and the device [2], and is fixedly held by these devices. It is in a state where it is used for component mounting work by two mounting modules 12 in which each of the two devices is provided. When the component mounting operation is completed, the fixing of the wiring board by both devices is released. Subsequently, after it is confirmed that there is no wiring board in the devices [3] and [4], the conveyors of the devices [1] and [2] are started. When the wiring board 150 moves and reaches the position shown in FIG. 26 (b), the sensor [2] L is turned ON and the conveyor of the apparatus [3] is started. Subsequently, when the wiring board 150 reaches the position shown in FIG. 26 (c), the sensor [2] U is turned OFF and the conveyor of the apparatus [1] is stopped. Subsequently, when the wiring board 150 reaches the position shown in FIG. 26 (d), the sensor [3] L is turned on and the conveyor of the apparatus [4] is started. Next, when the wiring board 150 reaches the position shown in FIG. 26 (e), the sensor [4] U is turned on, and the transport distance control (the same control as described above) starting from that point is performed. Be started. Next, when the wiring board 150 reaches the position shown in FIG. 26 (f), the sensor [3] U is turned OFF and the conveyor of the apparatus [2] is stopped. Then, as shown in FIG. 26 (g), when the center of the wiring board 150 reaches an intermediate position between the device [3] and the device [4], the two conveyors of the device [3] and the device [4] are used. Are simultaneously stopped and the control of the transport distance is terminated. At this position, the wiring board 150 is fixed and held, and the component mounting operation by the two mounting modules 12 that deploy each of the devices [3] and [4] is started.

  In the transport method of the present example, the wiring board 150 is sent at a time by two widths of the wiring board transport device 24. The transfer method when many wiring boards exist in the system, the loading of the wiring boards into the system, the method of carrying out the wiring boards from the system, the change of the transfer speed, etc. can be carried out in the same manner as in the first example. It is. As exemplified above, when the mounting device having a module width of about twice the unit width is arranged at any position, the portion is similarly inferred from the above two transport methods. The conveying method (specific description is omitted) may be applied. When the transport method of this example is used, in the system of this aspect, the device [1] and the device [2] constitute one working device group, and the device [3] and the device [4] Constitutes another working device group. According to the transport method of this example, the transport of the wiring board with the working device group as one unit is realized. This transport mode is referred to as a group unit transport mode.

iv) Wiring board transport method 2 across multiple mounting devices
FIG. 27 schematically shows a third example of the method for transporting the wiring board. The transport method of this example is suitable for transporting a wiring board having a length longer than the width of the wiring board transporting device 24, that is, a wiring board having a size straddling a plurality of mounting devices, as in the second example. It is a conveyance method. This is effective when a wiring board straddling a plurality of mounting modules 12 adjacent to each other performs component mounting work in cooperation with each other. In this example, a case where a wiring board having a size straddling two mounting modules 12 is conveyed will be described.

  First, in the state shown in FIG. 27A, the center of the wiring board 150 is located at an intermediate position between the device [1] and the device [2], and is fixedly held by these devices. It is in a state where it is used for component mounting work by two mounting modules 12 in which each of the two devices is provided. When the component mounting operation is completed, the fixing of the wiring board 150 is released. Subsequently, after it is confirmed that there is no wiring board in the device [3], the conveyors of the devices [1] and [2] are started. When the wiring board 150 moves and reaches the position shown in FIG. 27 (b), the sensor [2] L is turned on and the conveyor of the apparatus [3] is started. Subsequently, when the wiring board 150 reaches the position shown in FIG. 27C, the sensor [3] U is turned on, and the above-described control of the transport distance starting from that point is started. Next, when the wiring board 150 reaches the position shown in FIG. 27 (d), the sensor [2] U is turned OFF and the conveyor of the apparatus [1] stops. Then, as shown in FIG. 27 (e), when the center of the wiring board 150 reaches an intermediate position between the device [2] and the device [3], the two conveyors of the device [2] and the device [3] Are simultaneously stopped and the control of the transport distance is terminated. At this position, the wiring board 150 is fixed and held, and the component mounting operation by the two mounting modules 12 that deploy each of the devices [2] and [3] is started.

  In the transport method of this example, unlike the second example, the wiring board 150 is transported only one by one for the wiring board transport device 24. Conveying method when many wiring boards are present in the system, carrying the wiring board into the system, carrying out the wiring board from the system, changing the transfer speed, mounting device having a module width approximately twice the unit width The conveyance or the like when the is arranged is the same as in the second example described above. When the transport method of this example is used, in the system of this aspect, the device [1] and the device [2] constitute one working device group, and the device [3] and the device [4] Constitutes another working device group. In other words, it can be said that the device [2] and the device [3] constitute one working device group. According to the transfer method of this example, not the transfer of the wiring board with the working device group as a unit, but the feeding with one mounting device constituting the working device group as a unit is realized. That is, it is fed forward for each mounting device. This conveyance form is referred to as an apparatus unit conveyance form. In the system of this aspect, it is possible to selectively adopt the apparatus unit transport mode and the group unit transport mode described above according to the work mode of the system.

<Collaboration work with multiple mounting devices>
As an example of the mounting system shown in FIG. 1 in which the mounting modules 12 each having a module width of a unit width are arranged adjacent to each other, cooperative work by a plurality of mounting devices will be described below. In this system, a plurality of mounting modules 12 are arranged adjacent to each other, and a plurality of these modules cooperate with each other with respect to a wiring board positioned across the device areas of the plurality of adjacent ones. Thus, the parts can be mounted. Each of the mounting modules 12 is an apparatus having the same configuration, and the wiring module straddling any mounting module 12 can be cooperatively operated with any mounting module 12 adjacent to the mounting module 12. is there. The following description will be made with respect to component mounting on a wiring board straddling the two mounting modules 12. In particular, the wiring located at the boundary between the two mounting modules 12 that exists in the normal movement operation of the mounting head 26. The moving operation of the mounting head 26 is mainly performed to eliminate the dead zone in the plate mounting area. For the configuration and operation of the mounting head 26 and the head moving device 28, the above description made with reference to FIGS.

i) Movement of mounting head not exceeding the device area and specific region In FIG. 28, one mounting device is a target device, and a mounting device adjacent to one side of the mounting device is a side-by-side device. The operation of the above is schematically shown. In the figure, the left mounting module 12 is a device of interest, and the right mounting module 12 is a side-by-side device. The target device is the device [M], and the juxtaposed device is the device [N]. The wiring board is held at a position where the center in the wiring board conveyance direction is located at the center between the apparatus [M] and the apparatus [N]. The apparatus [M] and the apparatus [N] are arranged so that the X-axis direction, which is the moving direction of each first X slide, that is, the specific directions in each apparatus are the same direction.

  As described above, the head moving device 28 moves the mounting head 26 in a state where the first X slide 242 as the second track forming unit is stopped at any of the stations ST1 to ST4 on the first track. Move. As shown in FIG. 11, when the first X slide 242 is positioned at ST2 and ST3, the mounting head 26 to the first X slide 242 do not advance from the own device area. Accordingly, when a component mounting operation is performed with one wiring board within its own device area, the component is usually mounted by moving the mounting head 26 with the first X slide 242 positioned at ST2 or ST3. Is possible.

  FIG. 28A shows a state in which the first X slide 242 of the apparatus [M] is positioned at ST2, and the first X slide 242 of the apparatus [N] is positioned at ST3. In this state, the mounting head 26 and the first X slide 242 of both apparatuses do not interfere with each other, regardless of the position of the mounting heads 26 on the second track. (Hereinafter, the components of the mounting device that may cause interference are abbreviated as “mounting heads and the like”.) However, in this state, within the mounting area of the wiring board (the area related to the component mounting position where the component is mounted) There is a specific area 666 (hatched area in the figure) that becomes a dead zone in which neither of the mounting heads 26 of both apparatuses can be mounted. Due to the presence of the specific region 666, the above-described normal movement operation of the mounting head 26 cannot perform satisfactory cooperative work.

ii) Movement of the mounting head beyond the device area and interference avoidance control Therefore, in this system, in order to expand the head movable area of both the device [M] and the device [N], that is, the work region, each other is moved to the other device region. The mounting head 26 can be advanced, and the other mounting heads 26 are allowed to advance into their own device areas. At this time, interference avoidance control for moving the mounting heads 26 to each other is performed while avoiding interference between the work heads of both apparatuses. Speaking of the device [M] that is the target device of interest, specifically, as shown in FIG. 28 (b), when the first X slide 242 of the device [N] that is a side-by-side device is located at ST2, By positioning the first X slide 242 of the device [M] at ST1, it is possible to mount the component in the specific area 666 by the device [M] while avoiding interference between the mounting heads and the like. On the contrary, as shown in FIG. 28 (c), when the first X slide 242 of the device [N] is positioned or is positioned at ST4, the first X slide 242 of the device [M] is positioned at ST3. By doing so, it is possible to mount the component in the specific area 666 by the apparatus [N] while avoiding interference between the mounting heads and the like.

  More detailed description is as follows. Even when the mounting head 26 of one apparatus is positioned at any position on the second track, the working head of the one apparatus does not advance into the apparatus area of the other apparatus. The limit position on the first track where the one first X slide 242 is positioned is determined as the non-advance limit position for one device. Then, ST1 of the device [M] and ST4 of the device [N] are set as the advance stop position which is a stop position set beyond the non-advance limit position in the relationship between both devices. In addition, when the work head of the other device is most advanced into the device area of the one device, the work head 26 of the one device is positioned at any position on the second track. In the range where the working head of one device and the working head of the other device do not interfere with each other, the limit position on the first track where the first X slide 242 of one device is positioned is It is defined as the non-interference limit position for the device. Then, ST3 of the apparatus [M] and ST2 of the apparatus [N] are set as one or more non-interference stop positions that exist at positions that do not exceed the non-interference limit position in the relationship between both apparatuses.

  The interference avoidance control is mainly performed by controlling the position of the first X slide 242 which is the second trajectory forming unit. Regarding the device [M], which is the target device of interest, when the first X slide 242 of the device [N] is located at a position not exceeding the non-interference limit position, the first X slide 242 of the device [M] It is allowed to be located beyond the non-advance limit position. That is, the first X slide 242 of the apparatus [M] is allowed to stop at ST1 that is the advance stop position. In addition, when the first X slide 242 of the device [N] is positioned at a position beyond the non-advance limit position, the first X slide 242 of the device [M] is positioned beyond the non-interference limit position. It is forbidden. That is, the first X slide 242 of the apparatus [M] is stopped at ST3 which is the non-interference stop position. The same control is performed for the device [N], which is a side-by-side device, in relation to the device [M]. Thus, in the system according to this aspect, the control of the position of the first X slide 242, that is, the position control of the second trajectory forming unit is performed in the interference avoidance control.

  In the system of this aspect, the mounting module 12 may also be arranged on the left side of the device [M], which is the device of interest. In that case, the interference avoidance control is performed with the left mounting module 12. In relation to the left mounting module 12, ST4 set in the apparatus [M] is the advance stop position, and ST2 is the non-interference stop position. The interference avoidance control may be performed only between the adjacent mounting modules 12 or may be performed simultaneously with the adjacent mounting modules 12.

<Working form for wiring boards across multiple mounting devices>
As an example of the mounting system shown in FIG. 1 in which the mounting modules 12 each having a module width of unit width are arranged adjacent to each other, component mounting work is performed on a wiring board across a plurality of mounting devices. A working mode at the time of performing will be described.

i) Wiring board and working device group FIG. 29 schematically shows a wiring board used for component mounting work. The wiring board 150 shown in the figure has a size that spans the two mounting modules 12, and two types of components 690 are mounted to simplify the description. One of the two types of parts is referred to as a part a, and for convenience, the parts a1 to a9 are numbered sequentially from the left side of the wiring board 150. Similarly, another type of component is referred to as component b, and is numbered as components b1 to b8 sequentially from the left side of the wiring board 150 for convenience. If the mounting area, which is the work area of the wiring board 150, is divided into two at approximately the center, the parts a1 to a5 and the parts b1 to b4 are on the left partial area 694, and the parts a6 to a9 and the parts b5 to b8 are on the right side. It is located in the partial area 694. The parts a5 and a6 and the parts b4 and b5 are mounted in the specific area 666 described above. The mounting system constitutes a working device group including two adjacent ones among the plurality of mounting modules 12. Although the number of working device groups included in the system varies depending on the number of mounting modules 12, the description will be given for one working device group. Therefore, it is assumed that the component 690 is mounted in the one working device group. The present mounting system is capable of selecting two work modes, and on the premise of the above, these two work modes will be described in order.

ii) Work Form by Collective Work Control FIG. 30 schematically shows one work form of the two work forms. In the figure, the wiring board is conveyed from the left side, which is the upstream side, toward the right side, which is the downstream side. As for the two mounting modules 12 constituting the working device group, the upstream one is the device [A] and the downstream one is the device [B]. Note that only the conveyor of the mounting device is illustrated, and other portions are omitted. In this work mode, the wiring board 150 is transported with a working device group as a unit. Specifically, in a state where the previous wiring board 150 does not exist in the device [A] and the device [B], the wiring board 150 is transferred from the upstream side of the device [A], and the center is the device [A] and the device [B]. ], And after the component 690 is mounted at that position, downstream of the device [B] so that the wiring board 150 does not exist in the devices [A] and [B]. It is transferred. Specifically, the conveyance in the group unit conveyance form among the conveyance forms of the wiring board described above is performed. Note that the work mode described here is referred to as a batch work mode, and control for executing the work in that mode is referred to as batch work control.

  30A shows a state before the component 690 is mounted, and FIG. 30B shows a state after the component 690 is mounted. In this work mode, both the part a and the part b are mounted on the left partial area 694 by the apparatus [A], and the part a, b is mounted on the right partial area 696 by the apparatus [B]. Both parts b are mounted. Specifically, components a1 to a5 and components b1 to b4 are mounted by the device [A], and components a6 to a9 and components b5 to b8 are mounted by the device [B] (see FIG. 29). The mounting of the component on the specific area 666 is performed by moving the mounting head 26 by the advance control and the interference avoidance control described above. In this work mode performed in this way, the component mounting work determined for each of the devices [A] and [B] is a fixed work. That is, in both the apparatus [A] and the apparatus [B], the mounting area of the wiring board 150 to be worked on and the parts 690 to be mounted are fixed for each apparatus.

  In the collective work mode, partial areas 694 and 696 are set as one pattern. Alternatively, the partial area may be a plurality of patterns according to the type of component to be mounted. That is, for example, the component mounting operation can be performed in such a manner that the mounting area in which each apparatus operates is changed for each type of component 690. In the collective work mode, when each type of component 690 is mounted over the entire wiring board mounting region, each type of component must be prepared for each of the plurality of mounting modules 12. That is, the tape feeder 20 that supplies the same type of component 690 must be provided in the component supply device 22 included in each mounting module 12. This is a slight demerit, but compared to the work mode described below, this work mode has the advantage that the time for transporting the wiring board can be shortened, and quick component mounting work can be performed. is there.

iii) Work Form by Progressive Work Control FIG. 31 schematically shows another work form of the two work forms. The names related to the transport direction of the wiring board, the working device group, and the mounting module 12 constituting the working device group are the same as in the collective work mode. In this work mode, the wiring board 150 is transported in order for each mounting device constituting the work device group. Specifically, first, the wiring board 150 is transferred from the upstream side and stopped at a position where approximately half of the downstream side of the wiring board 150 is accommodated in the device area of the device [A]. At that position, after the mounting of the component 690 by the device [A] to the wiring board 150 is completed, the wiring board 150 is transferred and stopped at a position where the center is an intermediate position between the devices [A] and [B]. It is done. Next, at the position, after the mounting of the device [A] and the device [B] to the wiring board 150 is completed, the wiring board 150 is transferred and upstream of the wiring board 150 in the device area of the device [B]. It is stopped at the position where approximately half of the side fits. After the device [B] has been attached to the wiring board 150 at that position, the wiring board 150 is transferred to the downstream side of the device [B]. Specifically, transport in the apparatus unit transport mode among the transport modes of the wiring board described above is performed. Actually, several wiring boards 150 are transported in a row, and when approximately half of the downstream side of the wiring board 150 is located in the equipment area of the equipment [A], the inside of the equipment area of the equipment [B]. About half of the upstream side of the previous wiring board 150 is positioned. 31 (a) and 31 (b) show the state. FIGS. 31 (c) and 31 (d) show that the wiring board 150 is centered between the device [A] and the device [B]. It shows a state of stopping at the position. Note that the work mode described here is referred to as a progressive work mode, and control for executing the work of the form is referred to as progressive work control.

  31A and 31C show a state before the component 690 is mounted, and FIGS. 30B and 30D show a state after the component 690 is mounted. The operations for one wiring board 150 will be described in order as follows. First, as shown in FIGS. 31 (a) and 31 (b), parts a6 to a9 are mounted on the right partial region 696 of the wiring board 150 by the device [A] (see FIG. 29 for part numbers). And so on). At this time, the mounting of the part a6 on the specific area 666 is performed by the advance control described above and, if necessary, interference avoidance control. Next, after the wiring board 150 is conveyed by one device, as shown in FIGS. 31C and 31D, the component [A] is applied to the left partial region 694 of the wiring board 150 by the device [A]. A1 to a5 are mounted, and components b5 to b8 are mounted on the right partial region 696 by the device [B]. The mounting of the part a5 and the part b5 to the specific area 666 is performed by moving the mounting head 26 by the aforementioned advance control and interference avoidance control as in the case of the collective work mode. Then, after the wiring board 150 is further conveyed by one device, as shown in FIGS. 31 (a) and 31 (b), the component [b] is applied to the left partial region 694 of the wiring board 150 by the device [b]. b1 to b4 are mounted. Similarly, the mounting of the part a6 on the specific area 666 is performed by the advance control described above and, if necessary, interference avoidance control. At this time, in the apparatus [A], the next wiring board 150 is attached to the partial region 696 on the right side.

  In the collective work mode described above, the component mounting work determined for each of the devices [A] and [B] is a fixed work. On the other hand, in this work mode, both the device [A] and the device [B] change the component mounting work on the wiring board 150 each time. That is, in this aspect, both apparatuses are changed so that two different component mounting operations are sequentially repeated. In the two component mounting operations, the mounting area of the target wiring board 150 is also changed sequentially, and accordingly, the type and mounting position of the component 690 mounted in that area are also different. (Note: In this example, only two types of parts are shown for the sake of simplicity, and only one type of component is mounted on one mounting device. Therefore, the same type of component is mounted on each mounting device. However, this does not mean that the parts to be mounted are the same.) Note that it is not possible to change the partial area into a single pattern but to perform a work while changing to a plurality of parts. Possible as in the case of work forms

  In this work mode, in the relationship between the device [A] and the device [B], only the device [A] mounts the component a, and only the device [B] mounts the component b. Therefore, it is not necessary to prepare the part a in the apparatus [A], and it is not necessary to prepare the part b in the apparatus [A]. That is, the system of the aspect which arrange | positions the tape feeder 20 which supplies the component a only in the component supply apparatus 22 of an apparatus [A], and deploys the tape feeder 20 which supplies the component b only in the component supply apparatus 22 of an apparatus [B]. Can be built. This leads to a reduction in the number of tape feeders 20 provided in the system, and enables a reduction in the width and cost of the system itself in the wiring board conveyance direction.

<Functional blocks related to mounting system control>
In the above, several forms about the component mounting operation in the mounting system and the operation centered on the mounting module 12 according to the form have been described. As described above, the mounting system includes a system control device 376 that controls the entire system as a control device, and a mounting device control that functions as a substrate work device control device provided in each mounting module 12. Device 36. In the mounting system described above, distributed control is performed. Mainly, each mounting device control device 36 exchanges information, signals, and the like with each other by communication to control each mounting module 12 so that the entire system is controlled. Be controlled. Therefore, the function relating to the mounting device control device 36, which is the center of control, will be described below.

  FIG. 32 shows a functional block diagram of the mounting device control device 36 with respect to portions deeply related to the present invention. The mounting device control device 36 includes various control units that control various deployment devices and the like deployed in the mounting module 12. As one of them, there is a head movement control unit 710 that performs movement control of the mounting head 26, that is, control of the head moving device 28. The head movement control unit 710 includes a track unit stop head control unit 712, an advance control unit 714, and an interference avoidance control unit 716, and the interference avoidance control unit 716 includes the second track formation unit position. A control unit 718 is included. Each of them is a part that performs various controls related to the movement of the mounting head 26 described above. To briefly explain each of them, the track stop head control unit 712 moves the first X slide 242 that is the second track forming unit to the first. The advance control unit 714 advances the first X slide 242 outside its own device area to move the mounting head 26 while moving the mounting head 26 while stopping at a predetermined stop position on one track. This is the part that performs control outside the device area. The interference avoidance control unit 716 is a part that controls the adjacent mounting module 12 work heads and the like so that their work heads do not interfere with each other, and the second trajectory forming unit position control unit 718, in the interference avoidance control, This is a part for controlling the position of the first X slide 242. Each of these control units plays a role to control the movement of the mounting head 26.

  Further, the mounting device control device 36 includes a wiring board transfer control unit 720 that controls the wiring board transfer device 24 as a board transfer module. The wiring board transport device 24 is mainly composed of a conveyor, and when the respective wiring board transport devices 24 operate in cooperation, the system transport device over the entire system as the substrate transport device is operated. Specifically, as described above, transport cooperative control is performed to coordinate the start / stop of each conveyor. The part that performs this transport cooperative control is a wiring board transport cooperative control unit 722 as a board transport cooperative control unit included in the wiring board transport control unit 720.

  In the mounting system, as described above, an operation mode can be selected for a wiring board that straddles a plurality of mounting modules 12. As one of the work forms, there is a collective work form, and the mounting apparatus control device 36 has a collective work control part 724 as a control part when performing collective work control. The collective work control unit 724 exists as a part that controls the head movement control unit 710 and the wiring board conveyance control unit 720 in an integrated manner. Similarly, there is a progressive work form as another work form, and a progressive work control unit 726 is provided as a control unit when performing the forward work control. Similarly, the progressive operation control unit 726 also exists as a part that controls the head movement control unit 710 and the wiring board conveyance control unit 720 in an integrated manner. Further, the mounting device control device 36 has a work mode selection control unit 728 as a part for selecting whether to perform batch work control or progressive work control and to execute the control of the selected one. Yes.

  In the present mounting system, each of the mounting modules 12 and the like has the component supply section 22 having the supply apparatus mounting section 27 and selectively attaches the feeder type supply apparatus 23 and the tray type supply apparatus 25 as described above. In addition, the head mounting portion 750 (see FIG. 6) is provided, and a plurality of types of mounting heads 26 can be selectively mounted. Further, the suction nozzle 288 is accommodated in a nozzle accommodating device 752, and a plurality of types of nozzle accommodating devices 752 are selectively attached to accommodating device attaching portions 754 (see FIG. 43) provided in each of the mounting modules 12 and the like. Is possible. In the present embodiment, the component feeder 20, the tray 810, the component supply devices 23 and 25, the mounting head 26, and the nozzle accommodating device 752 described later can be changed. Be changed. The mounting module 12 and the like have the same configuration except for the portion where the configuration can be changed. Hereinafter, attachment of the supply devices 23 and 25, the mounting head 26, and the nozzle accommodating device 752 will be described.

<Installation of parts supply device>
The supply device mounting portion 27 will be described.
As shown in FIG. 33, the supply device mounting portion 27 is provided on the frame portion 14 as a pair of mounting members respectively provided at two positions separated in the left-right direction (X-axis direction) of the frame portion. (Only one is shown in FIG. 33). As shown in FIGS. 34 and 35, the mounting base 760 is provided with a guide groove 762 that is long in the front-rear direction (Y-axis direction) and extends in the front-rear direction.

  In addition, a fixing device 766 (see FIG. 34) for detachably fixing the feeder pallet 29 of the feeder-type supply device 23 is provided at an intermediate portion in the left-right direction of the supply device attachment portion 27. The fixing device 766 uses an air cylinder 768 as a drive source in this embodiment, and its piston rod 770 is expanded and contracted in the front-rear direction and rotated by supplying air to the air cylinder 768. Thereby, the engaging member 772 fixed to the piston rod 770 is rotated forward or backward around the axis of the piston rod 770 while being moved forward and backward, as shown in FIG. An engaging position 774 provided at the free end of the engaging member 772 engages with an engaging portion, which will be described later, of the feeder pallet 29 to fix the feeder pallet 29 to the feeder mounting portion 27, and an engaging portion And is moved to a release position where the fixation of the feeder pallet 29 is released.

  The feeder type supply device 23 is attached to the supply device attachment portion 27 in the feeder pallet 29. As shown in FIG. 35, the feeder pallet 29 is provided with a plurality of slots 780 as feeder mounting portions or feeder mounting portions at equal intervals so that the feeder 20 can be attached. The feeder 20 has a plurality of different widths according to the dimensions of the parts to be supplied, and the slots 780 are provided at intervals corresponding to the narrowest feeder 20. Therefore, the wide feeder 20 is attached to the feeder pallet 29 using a space for a plurality of slots.

  As shown in FIGS. 34 and 35, the feeder pallet 29 is also provided with attachment portions 784 on both sides separated in the left-right direction (only one is shown in FIGS. 34 and 35). . Each of the mounting portions 784 is provided with a plurality of guide rollers 786 so as to be rotatable around the horizontal axis, and another guide roller 788 is provided outside the guide rollers 786 so as to be rotatable around the vertical axis, and the guide rollers 786 are provided. A plurality of engagement rollers 790 are provided on the inner side so as to be rotatable around a vertical axis.

  As shown in FIG. 34, each of the pair of attachment portions 784 is provided with leg portions 794 extending downward from the rear portion thereof, and the engaging portions 796 project at two positions separated in the vertical direction. It is installed. The feeder pallet 29 is further provided with an engaging portion 798 (see FIG. 34) in which the engaging member 772 of the fixing device 766 is engaged at the center in the left-right direction.

  In the feeder type supply device 23, the plurality of feeders 20 can be individually attached to and removed from the feeder pallet 29 to change the feeder 20 mounted on the feeder pallet 29. Further, the feeder pallet 29 can be attached to and detached from the supply device attaching portion 27 while the feeder 20 is mounted. The feeder type supply device 23 can be attached to and detached from the mounting module 12, and this attachment and removal is performed using a carriage 800 in this mounting system as shown in FIG.

  As shown in FIG. 33 (a), the cart 800 has a gripping arm 802 as a pair of gripping portions that extend forward on both sides in the left-right direction. The feeder-type supply device 23 is lowered from the carriage 800 when the attachment system is in operation and attached to the attachment module 12, and guide rollers 786 provided on the pair of attachment portions 784 of the feeder pallet 29 are provided. It is fitted into the guide groove 762 of the mounting base 760 and supported from below, and the engaging roller 790 is fixed to the supply device mounting portion 27 by the fixing device 766 in a state of being engaged with the side surface of the mounting base 760.

  When removing the feeder type supply device 23 from the mounting module 12, as shown in FIG. 33 (b), the carriage 800 is advanced, and the gripping arm 802 is engaged with the engaging portion 796 of the feeder pallet 29. A cart 802 holds the feeder supply device 23. Then, when the carriage 800 is moved backward as shown in FIG. 33C in a state where the fixing by the fixing device 766 is released, the feeder type supply device 23 is removed from the supply device mounting portion 27.

  When the feeder type supply device 23 is attached to the mounting module 12, the carriage 800 holding the feeder type supply device 23 is advanced, the guide roller 786 is fitted into the guide groove 762, and the guide roller 788 is engaged with a plurality of engagements. The attachment base 760 is sandwiched between the rollers 790 and the feeder-type supply device 23 is advanced and supported by the attachment base 760. Then, in a state where the feeder type supply device 23 is advanced to a predetermined position, the feeder pallet 29 is fixed to the mounting base 760 by the fixing device 766, and the feeder type supply device 23 is fixed to the frame portion 14.

<Description of Configuration of Tray Type Supply Device>
The tray type supply device 25 will be described with reference to FIGS.
As shown in FIG. 37, the tray type supply device 25 includes a tray 810 and a multistage rack 812 in which the tray 810 is accommodated. The tray 810 has, for example, a plurality of storage recesses (not shown) as component storage portions, and the components are respectively positioned and stored in the storage recesses. Each type of component is accommodated in the tray 810. The tray 810 is accommodated in a tray pallet 814 serving as a tray holding unit and is held by the multistage rack 812. The multi-stage rack 812 is provided with a plurality of pairs of rails 816 as pallet support members that form a pair, and is provided at equal intervals in the vertical direction. It can be accommodated. Depending on the size of the parts, the depth of the tray pallet 814 is large, and one tray pallet 814 can be accommodated by a space corresponding to a plurality of shelves. At least one tray 810 is stacked and accommodated in the tray pallet 814. Here, it is assumed that one tray 810 is accommodated in the tray pallet 814.

  The tray type supply device 25 is attached to the mounting module 12 while being mounted on the carriage 820 and supplies parts. Therefore, the cart 850 is configured to position one of the plurality of tray pallets 814 accommodated in the multi-stage rack 812 at a component supply position set in advance in the height direction, thereby positioning the tray 810 ( 37), a component delivery position in which the tray pallet 814 positioned at the component supply position is pulled out from the multi-stage rack 812, and the components can be received from the tray 810 by the mounting head 26, and accommodated in the multi-stage rack 812. A tray moving device 824 (see FIG. 38 and FIG. 39) is provided for moving to the storage position. The tray moving device 824 is also a tray pallet moving device.

  As shown in FIG. 39, the tray positioning device 852 includes an electric motor 840 as a drive source, a pair of screw shafts 844 provided on the apparatus main body 842 so as to be rotatable around a vertical axis, and a pair of nuts fixed to the multistage rack 812. 846 and the screw shaft 844 is rotated by the electric motor 840, whereby the multi-stage rack 812 is guided by a plurality of guide rails 848 (one of which is typically shown in FIG. 38) as a guide member. Can be raised and lowered. The tray positioning device 852 is also a tray lifting device.

  As shown in FIGS. 36, 38, and 39, the tray moving device 854 has a conveyor 844 provided so as to protrude forward from the tray positioning device 822. The conveyor 844 is a belt conveyor in this embodiment, and has a pair of conveyor belts 846 as shown in FIGS. Each of the pair of conveyor belts 846 is wound around a plurality of pulleys 850 respectively provided on the pair of support members 848. The conveyor belt 846 and the pulley 850 are a timing belt and a timing pulley, respectively. A drive pulley 850 that is one of a plurality of pulleys 850 is rotated by an electric motor 852 as a drive source, whereby the conveyor belt 846 is moved in the longitudinal direction, and both ends of the pair of conveyor belts 846 are fixed. The member 854 is moved in the front-rear direction. The movement of the moving member 854 is guided by a guide roller 856 as a guided member provided on the moving member 854 and a guide rail 858 provided on the support member 848.

  As shown in FIG. 38, the moving member 854 is provided with a gripping device 864 that grips the tray pallet 814. The gripping device 864 includes a pair of gripping members 866 and a gripping member driving device 868, and the pair of gripping members 866 is below the gripped portion 872 protruding from the front portion of the tray pallet 814 by the movement of the moving member 854. The gripped member driving device 914 drives the gripped member 866 to grip the gripped portion 872 by a pair of claw portions 870 provided on the gripping members 866, respectively. If the moving member 854 is moved by the conveyor 844 in this state, the tray pallet 814 is moved, pulled out from the multi-stage rack 812 and moved to the parts transfer position, or returned to the multi-stage rack 812.

  The tray pallet 814 is supported at its both left and right edges from below by a conveyor belt 846, and as shown in FIG. 39, a plurality of clamp members 872 provided on the pair of support members 848, respectively. (Only one clamp member 872 is shown in FIG. 39) is positioned and moved in the left-right direction. A plurality of clamp members 872 provided on one support member 848 are movable clamp members as shown in FIG. 39, and are engaged with the side surface extending in the front-rear direction of the tray pallet 814 by the bias of a spring 874 as a biasing device. The plurality of clamp members 872 that are urged in the mating direction and are provided on the other support member 848 are fixed clamp members 872, although not shown. Therefore, when the tray pallet 814 is gripped and moved by the moving member 854, the plurality of movable clamp members 872 press the tray pallet 814 and press it against the fixed clamp member 872, and position it by sandwiching it from the left and right directions.

  Each of the pair of support members 848 of the conveyor 844 is provided with a mounting portion 880 as shown in FIG. These attachment portions 880 are configured in the same manner as the attachment portion 784 provided on the feeder pallet 29 of the feeder type supply device 23, and the tray moving device 824 is fixed to the attachment base 760 of the supply device attachment portion 27. As a result, the tray type supply device 25 is fixed to the supply device mounting portion 27 in the same manner as the feeder type supply device 23. The tray-type supply device 25 is moved closer to and away from the mounting module 600 by moving the carriage 820 forward and backward, and is attached to and removed from the supply device attachment portion 27 at the attachment portion 880 and remains mounted on the carriage 820 when components are supplied. It is fixed to the supply device mounting portion 27 in a state.

  Thus, both the feeder-type supply device 23 and the tray-type supply device 25 are commonly attached to and detached from the supply device attachment portion 27 provided in the frame portion 14. For example, in the attachment module 600, The tray type supply device 25 can be easily replaced and changed. For example, the feeder 800 is held on the carriage 800 and removed from the feeder attachment section 27, and the tray-type feeder 25 mounted on the carriage 820 is attached to the feeder attachment section 27.

  The components mounted on the wiring board 150 in this mounting system are supplied by the feeder-type supply device 23 or the tray-type supply device 25 as described above. Feeder supply parts that are parts supplied by the feeder type supply device 23 are often small, and tray supply parts that are parts supplied by the tray type supply apparatus 23 are relatively large.

<Configuration of mounting head, removal method, etc.>
In the present embodiment, the mounting head 26 can be attached to and detached from the mounting head moving device 28, and can be mounted by selecting from a plurality of different configurations. In other words, the component mounting unit can replace the mounting head 26 with a different type. FIG. 40 shows three mounting heads 26A, 26B, and 26C as an example of the mounting head 26 that can be mounted.

  The three mounting heads 26A, 26B, and 26C will be briefly described. The mounting head 26A shown in FIG. 40 (a) is the mounting head described above with reference to FIG. 9, and is a mounting head 26 suitable for high-speed mounting of relatively small components. The mounting head 26 is a component supplied by the feeder 20, and among them, a small component is mounted, and there are few types of components that can be mounted, but the mounting head 26 has a high mounting efficiency. Hereinafter, the mounting head 26A is referred to as a high-efficiency mounting head 26A. In the mounting head 26A, a plurality of, for example, eight suction noses 288 are detachably held by the nozzle holder 290. The holding configuration is, for example, the suction described in JP-A-11-220294. The suction nozzle 288 is mechanically held or held by the nozzle holder 290 based on relative movement in the axial direction between the nozzle holder 290 and the suction nozzle 288 accommodated in the nozzle accommodating device 752. It is set as the structure canceled.

  The mounting head 26C shown in FIG. 40 (b) is the mounting head 26 provided with one nozzle holder 290. The nozzle-equipped holder 291 is lowered above the feeder 20 and above the wiring board, so that the feeder 20 and the wiring board are lowered. In one reciprocation of 150, one component is mounted. In the mounting head 26C, the nozzle holder 290 is moved up and down and rotated by the holder lifting device and the holder rotation device, respectively, but does not have the holder holder rotating device 298 provided in the high efficiency mounting head 26A. Although the mounting head 26C has a relatively low mounting speed, it can also be equipped with a relatively large suction nozzle 288, which can mount large parts and specially shaped parts, although there are many types of parts that can be mounted. This is a mounting head 26 with low mounting efficiency and excellent versatility. Hereinafter, the mounting head 26C is referred to as a general-purpose mounting head 26C. The general-purpose mounting head 26 </ b> C can mount both the components supplied by the feeder 20 and the components supplied by the tray 810. In the general-purpose mounting head 26C, the suction nozzle 288 is detachably held by a nozzle holder 290. It is supposed to be absorbed and held.

  The mounting head 26B shown in FIG. 40 (b) is a mounting head having two nozzle holders 290, and is a mounting head 26 having intermediate characteristics between the mounting head 26A and the mounting head 26C. Since the mounting head 26B has two nozzle holders 290 that can be moved up and down independently, the mounting head 26B has two holder lifting devices. The two nozzle holders 290 are rotated by a common rotating device.

  Of the two nozzle holders 290, the nozzle holder 290 on the front side holds a plurality of suction nozzles 288 arranged radially around an axis perpendicular to the axis of the nozzle holder 290. The nozzle to be used is selected by being rotated around the axis. Therefore, the mounting head 26 </ b> B is provided with a nozzle selection device for selecting the suction nozzle 288 in one nozzle holder 290. This configuration is described in Japanese Patent Laid-Open No. 6-342998, and a description thereof is omitted. The mounting head 26B holds a relatively small part by a plurality of suction nozzles 288 held by one nozzle holder 290, and the general-purpose mounting head 26C by a suction nozzle 288 held by only one nozzle holder 290. Large parts can be mounted in the same manner as in the above, and there are many types of parts that can be mounted. Since the mounting head 26B includes two types of nozzle holders 290, components supplied by the feeder 20 and components supplied by the tray 810 can be mounted, but the mounting speed is slower than that of the high-efficiency mounting head 26A. Hereinafter, the mounting head 26B is referred to as an intermediate mounting head 26B. The intermediate mounting head 26B is a component supplied by the feeder 20 and can mount a component that is not mounted by the high-efficiency mounting head 26A. In the intermediate mounting head 26B, for example, the suction nozzle 288 is held in the same manner as in the high-efficiency mounting head 26A by the nozzle holder 290 that holds the plurality of suction nozzles 288 out of the two types of nozzle holders 290, and one suction The nozzle holder 290 that holds the nozzle 288 is held in the same manner as in the general-purpose mounting head 26C.

  As described above, the mounting head 26 is detachably attached to the second X slide 264 and is attached to the mounting head moving device 28. Hereinafter, a mounting mechanism of the mounting head 26 will be described. 41 shows a perspective view from the back side of the mounting head 26 (FIG. 41A) and a perspective view from the front side of the second X slide 264 (FIG. 41B).

  In the mounting head 26, the back surface portion 892 of the head main body 280 constitutes the attached portion, and the front portion 894 of the second X slide 264 constitutes the head attaching portion 750. The back surface portion 892 of the head main body has two leg portions 896 at the lower portion and an engagement block 898 at the upper portion. On the other hand, the front part 894 of the second X slide 264 has a leg support part 900 that supports the leg part 896 at the lower part, and two lower engagement rollers 908 slightly above the leg support part 900. ing. In addition, a head fixing device 906 (see FIG. 41) for hooking and fixing a part of the engagement block 898 is provided on the upper portion of the front portion 894 of the second X slide 264, and slightly below the head fixing device 906. Is provided with an engagement hole 910 having two upper engagement rollers 908 for allowing the engagement block 898 to enter. These leg support portions 900 and the like constitute a head mounting portion 750 together with the front portion 894. In a state where the mounting head 26 is mounted, the back surface portion 892 of the head main body 280 and the front surface portion 894 of the second X slide 264 are made to fit substantially exactly.

  The leg portion 896 has a wedge-shaped tip, and is fitted to a leg support portion 900 having a V shape. Thereby, the vertical position of the mounting head 26 is defined. Further, the opposing side surfaces of the portion where the distance between the upper portions of the leg portions 896 is made to engage closely with the outer peripheral surfaces of the two lower engaging rollers 908, and both side surfaces of the engaging block 898 However, the position of the mounting head 26 in the left-right direction is defined by the two upper engaging rollers 908.

  FIG. 42 shows a cross section of the head fixing device 906. FIG. 42A is a cross section cut at the center in the left-right direction of the second X slide 264, and FIG. 42B is a cross section taken along the plane AA in FIG. The head fixing device 906 has a structure in which a latching pin 916 is engaged with a latching roller 914 (see FIG. 41) provided on the upper part of the engagement block 898. More specifically, the head fixing device 906 includes a latch pin 916 that is supported by a pin hole 918 provided in the upper portion of the front portion 894 so as to be vertically movable, and a latch pin operating device 920 that moves the latch pin 916 up and down. It is comprised including. The latch pin actuating device 920 includes a slightly flexible rod 922, a disc-shaped cam plate 924 provided eccentrically at one end of the rod 922, and a generally pipe-like shape that rotatably supports the rod 922. Rod support member 926 and a grip 928 provided at the other end of the rod 922 for rotating the rod 922. The latch pin actuating device 336 is attached to the upper portion of the front portion 894 of the second X slide 264 in the rod support member 926 (see FIG. 41). A groove 930 having a width slightly larger than the outer diameter of the cam plate 924 is formed on the upper portion of the latch pin 916, and the cam plate 924 is engaged with the groove 930. When the grip 928 is rotated, the latch pin 916 is moved up and down.

  When the mounting head 26 is mounted, the grip 928 is rotated in one direction (in this embodiment, counterclockwise when viewed from the front), and the latch pin 916 is moved upward, and the back surface portion 892 of the mounting head 26 is moved. Is closely engaged with the front portion of the second X slide 264, and in this state, the grip 928 is rotated in the opposite direction (clockwise as viewed from the front in this embodiment). By operating the grip 928, the latch pin 916 is lowered, and an inclined surface 932 formed at the lower end portion of the latch pin 916 is brought into contact with the outer periphery of the latch roller 914 before the lowest end. Further, by rotating the grip 928, the latch pin 916 latches the latch roller 914 in a state of pressing the mounting head 26 downward and pressing backward by the action of the inclined surface 932. The state is maintained by the frictional force generated between the outer periphery of the cam plate 924 and the lower surface of the groove 930. In order to maintain the state more reliably, the latch pin actuating device 336 is provided with a torsion spring 934. And the torsion spring 934 biases the rod 922 in the direction in which the latch pin 916 is directed downward. In order to detach the mounting head 26, the grip 928 may be rotated in the opposite direction.

  In the present embodiment, the work module 12 can be provided with various mounting heads 26, but all the mounting heads 26 have the same structure regarding the mounting mechanism, and the mounted mounting heads 26 are mounted. Can be detached with one touch, and any mounting head 26 can be mounted with one touch.

<Description of nozzle housing device and housing device mounting portion>
The suction nozzle 288 used for mounting is housed in the nozzle housing device 752 and attached to the mounting module 12 or the like. As described above, the type of component to be mounted differs depending on the type of mounting head 26, the type and number of suction nozzles 288 used for mounting are also different, the type of mounting head 26, and the type of component to be mounted by the mounting head 26. A plurality of types of nozzle accommodating devices 752 for accommodating the number and types of suction nozzles 288 corresponding to the number of the suction nozzles 288 are prepared, and the suction nozzles 288 are exchanged with the mounting head 26 by being selectively attached to the mounting module 12 or the like. For this reason, the accommodation device attachment portion 754 is provided in each of the mounting modules 12 and the like. In this embodiment, the nozzle housing device 752 and the housing device mounting portion 754 are configured in the same manner as the nozzle housing device and the housing device mounting portion described in JP-A-11-220294, and will be described briefly.

  The nozzle accommodating device 752 includes a nozzle holding member 940 as shown in FIGS. 43 and 44. The nozzle holding member 940 is provided with a large number of nozzle holding holes 942 so that the suction nozzles 288 are accommodated one by one. The nozzle holding member 940 is provided with a detachment preventing member 944 that can move. The separation preventing member 944 has a plate shape and is provided with a plurality of openings 946 corresponding to the nozzle holding holes 942. The separation preventing member 944 is moved in a direction parallel to the plate surface by the separation preventing member moving device 948. A separation preventing position that covers the opening of the hole 942 to prevent the suction nozzle 288 from being detached from the nozzle holding hole 942 and the opening of the nozzle holding hole 942 is released to allow the suction nozzle 288 to be taken out from the nozzle holding member 940. It is moved to the release position. In this embodiment, the configuration of the nozzle accommodating device 752 is such that even if the suction nozzle 288 is supplied by negative pressure by the nozzle holder 290, the nozzle holder 290 is mechanically moved by relative movement in the axial direction with the nozzle holder 290. It is the same even if it is detachably attached, and is similarly accommodated in the nozzle holding hole 942.

  As shown in FIG. 43, the accommodation device attachment portion 754 is provided on the frame portion 14. The storage device mounting portion 754 includes a holding member holding device 956 that holds the nozzle holding member 940, and the holding member holding device 956 includes a holding member receiving base 958. The holding member pedestal 958 is provided with a positioning device 960 for positioning the nozzle holding member 940 and a fastener 962 as a fixing device for fixing the nozzle holding member 940, and is moved up and down by the lifting device 964. The nozzle holding member 940 in which the suction nozzle 288 is accommodated is positioned and placed by the positioning device 960 on the holding member receiving base 958 and is detachably fixed by the fastener 962. The fastener 962 is operated by an operator.

  The mounting head 26 is moved onto the nozzle holding member 940, and the nozzle holder 290 holds the suction nozzle 288 held by the nozzle holding member 940 based on the raising / lowering of the nozzle holder 290 and the raising / lowering of the holding member receiving base 958. Alternatively, the suction nozzle 288 held by the nozzle holder 290 is returned to the nozzle holding member 940. When the suction nozzle 288 is held by the nozzle holder 290 with a negative pressure, the supply of the negative pressure is interrupted when the suction nozzle 288 is returned, and the negative pressure is supplied when the suction nozzle 288 is held.

  The nozzle holding member 940 accommodates the type and number of suction nozzles 288 corresponding to the type of the mounting head 26. A plurality of types of nozzle accommodating devices 752 having different types, numbers, and the like of the suction nozzles 288 that are held are selectively attached to a holding member holding device 956 that is a holding device holding device. At the time of attachment, the nozzle holding member 940 is positioned and placed on the holding member receiving base 958 by the positioning device 960 and is fixed to the holding member receiving base 958 by the fastener 962. At the time of removal, the fixing by the fastener 962 is released, the nozzle holding member 940 is removed from the holding member receiving base 958, and the nozzle accommodating device 752 is removed from the accommodating device attaching portion 754. The separation preventing member 944 also serves to prevent the suction nozzle 288 from dropping from the nozzle holding member 940 when the nozzle accommodating device 750 is conveyed.

  The nozzle accommodating device 752 includes a plurality of types in which the number and size of the nozzle holding members 940 differ depending on the type and number of the suction nozzles 288 to be accommodated, and are selectively attached to the accommodating device mounting portion 754. It is done. At least one storage device mounting portion 754 is provided in each of the various mounting modules such as the mounting module 12. In the case where a plurality of storage devices are provided, the storage device mounting portions 754 may be the same, for example, different in size, and may be able to cope with a significant change in the type of the nozzle storage device 752. The nozzle accommodating device 752 may accommodate the adsorption holding type adsorption nozzle and the mechanical holding type adsorption nozzle exclusively.

<Explanation of configuration change of installed module>
Hereinafter, a change in the configuration of the mounting module 12 and the like when the type of the target wiring board that is a component mounting target is changed will be described.
When the type of the wiring board 150 on which the component is mounted changes, the setup is changed in the mounting system. For example, change of the configuration of the mounting system by replacement, addition, or reduction of the mounting module, configuration change of the mounting module, change of the wiring board transfer width in the wiring board transfer device 24, change of the arrangement of the backup pins 154 in the board holding unit, etc. Various operations are performed. In this embodiment, the mounting module is configured by replacing the mounting head 26, replacing the nozzle accommodating device 752, changing the feeder 20 mounted on the feeder pallet 29, changing the tray 810 accommodated in the multistage rack 812, and feeder type. It is changed by exchanging the supply device 23 and the tray type supply device 25. Therefore, in this mounting system, the configuration change routine is executed by the system control computer 980, which is a computer of the system control device 370, and the components are mounted within the set target cycle time and the number of setup changes is as small as possible. The configuration of the mounting module is automatically determined so that it can be completed. FIG. 45 is a flowchart showing the configuration change routine. This flowchart is for explaining the contents and order of the configuration change, and does not necessarily match the control program that is actually executed by the computer. The same applies to other flowcharts.

  In step 1 of the configuration change routine (hereinafter abbreviated as S1. The same applies to other steps), configuration change information, which is information for changing the configuration, is acquired. The configuration change information includes, for example, the current configuration of the entire mounting system, the type and number of mounting modules held by the user of the mounting system, information on the next printed circuit board to be produced, and the target cycle time. The printed circuit board is a component in which components are mounted on the printed wiring and soldering joining is completed, and mounting is completed. Information on the printed circuit board includes, for example, the type of the printed circuit board (wiring board 150), There are information such as the number of production, the mounting position of the parts, and the parts to be mounted. The cycle time is a time interval at which the wiring board 150 in which the mounting of all the mounting modules has been completed is carried out from the exit of the mounting system, and the target cycle time is set according to, for example, the type of the printed circuit board For example, it is input and stored by the operator using the input device 982 (see FIG. 12) during the execution of S1. The input device 982 includes, for example, a pointing device such as a mouse, a keyboard, and the like. It may be set in advance according to the type of the printed circuit board, input, stored in the storage unit, and read out.

  The current configuration of the entire mounting system includes, for example, the type and number of a plurality of mounting modules constituting the mounting system, the component supply form of the component supply unit 22 in each mounting module, that is, the feeder-type supply device 23 and the tray-type supply device. 25 is used to supply the parts, the type and number of parts supplied by each supply device 23, 25, the mounting position of the feeder 20 on the feeder pallet 29, or the receiving position of the tray 810 (tray pallet 814) in the multistage rack 812 , The type of mounting head 26 attached to the component mounting unit 31, the type and number of suction nozzles 288 stored in the nozzle storage device 752, and the like.

  For example, as described above, the mounting module includes the mounting module 12 having the smallest module width and unit width, the mounting module 600 having a module width twice that of the mounting module 12, and the mounting module 610 having three times the module width. . In this mounting system, only the feeder type supply device 23 is attached to the mounting module 12, but the feeder type supply device 23 and the tray type supply device 25 can be selectively attached to the mounting modules 600 and 610. The basic line configuration of the mounting system includes a plurality of mounting modules 12 and at least one mounting module 600 in series, and the mounting module 600 is provided on the most downstream side in the wiring board wiring direction. Parts are mounted on the wiring board 150 in order to avoid interference between the already mounted parts already mounted on the wiring board 150 and the suction nozzle 288 or the parts sucked by the suction nozzle 288. Although often mounted first, the parts supplied by the tray-type supply device 25 attached to the mounting module 600 are large, and even the feeder-type supply device 23 supplies relatively large parts. It is because it is desirable to be mounted with. Hereinafter, the mounting module 12 is referred to as a small mounting module 12 and the mounting module 600 is referred to as a large mounting module 600 as necessary. In the present embodiment, in order to simplify the description, it is assumed that the component supply unit 22 included in the component supply unit 22 of one mounting module is of one type and is a feeder type or a tray type. The mounting module 610 is rarely used and will be described as not used here. However, even if the configuration is changed based on the use of a mounting module other than the mounting modules 12 and 600, such as the mounting module 610. Good.

  The configuration change information is acquired, for example, by reading information from a storage unit such as the configuration change information storage unit of the system control computer 980. It is also acquired by information input by an operator using the input device 982. When information input by an operator is performed in advance, the input information is stored and read out, for example, in a configuration change information storage unit. The configuration change information storage unit stores, for example, the type and number of mounting modules that the user has, and if the configuration change information storage unit is used to add a mounting module, the configuration change information storage unit stores the spare component storage unit and the spare A mounting module storage unit is configured. The information may be acquired by reading information from a computer or an external storage device of a control device different from the system control computer 980. The current configuration of the mounting system is stored, for example, in the previous system configuration storage unit provided in the system control computer 980 every time a component is mounted on one type of wiring board 150, and the operation of the mounting system is started. If not, it is read from the previous system configuration storage unit. At the start of the operation of the mounting system, for example, the number of mounting modules constituting the mounting system is read from the storage unit storing the data set in advance as the basic configuration of the mounting system. For the changeable configuration, the initial state is that nothing is attached to the mounting module.

  Next, S2 is executed, and the setup change time shortening type configuration change is executed. In this mounting system, the mounting head 26, the component supply devices 23 and 25, the feeder 20, the tray 810, and the nozzle storage device 752 can be changed in each of the large and small mounting modules 12 and 600. In this embodiment, the possible change orders of the configurations are set in advance such that the feeder 20 and the tray 810 are first, the nozzle storage device 752 is second, and the mounting head 26 is third. When the cycle time is not achieved, the next configuration change is performed, and the configuration change is performed with the shortest possible setup change time. The component supply device is changed when the component supply mode is changed, and is performed together with the change of the feeder 20 or the tray 810.

The setup change time shortening type configuration change will be schematically described.
The configuration change time shortening type configuration change is performed in the order shown in the flowchart in FIG. As shown in S21 to S23, the configuration of the component supply unit 22 is first changed. This change is performed in three stages in the present embodiment. In the first stage, all the feeders 20 or trays 810 that are actually mounted on the component supply unit 22 are left mounted, and the components are mounted on the printed circuit board to be produced next. A feeder 20 that holds a component that is not mounted (hereinafter referred to as a non-mounted component, which is a component that is unique to a printed circuit board to be produced next) is mounted in an empty slot 780, Alternatively, the tray pallet 814 in which the tray 810 is accommodated is accommodated in an empty shelf 818 of the multistage rack 812. By addition, the feeder 20 or the tray 810 to be mounted is changed. After all the unmounted parts are allocated, the arrangement and the mounting order of the feeder 20 or the tray 810 are optimized to calculate the cycle time, and it is checked whether or not the target cycle time can be obtained. This change is referred to as a component addition type change. The part addition type change is shown in FIG. 47A by taking the feeder 20 as an example.

  If the target cycle time is not achieved in the first stage, the second stage shown in S22 is executed. In the second stage, of the feeder 20 or the tray 810 that is actually mounted on the component supply unit 22, the component that is also used for mounting the component on the printed circuit board to be produced next (hereinafter referred to as a common component). The feeder 20 or tray 810 holding the tray 810 is left mounted, the feeder 20 holding unused parts (hereinafter referred to as non-use parts) is removed from the feeder pallet 29, or the tray pallet 814 holding the tray 810 is placed in multiple stages. The feeder 20 or the tray pallet 814 holding the unmounted components is removed from the rack 812, and the feeder pallet 29 or the multistage rack 812 is disposed in an empty position. The configuration of the mounting module is changed by adding the feeder 20 and the tray 810 that hold unmounted components or replacing the feeder 20 and the tray 810 that hold unused components. After all the unmounted parts are allocated, optimization is performed to calculate the cycle time, and it is checked whether the target cycle time can be obtained. This configuration change is referred to as a non-use part removal type change. FIG. 47 (b) shows an example of changing the non-use part removal type by taking the feeder 20 as an example.

  If the target cycle time is not achieved in the second stage, the third stage shown in S23 is executed. In the third stage, all the feeders 20 or trays 810 actually mounted on the component supply unit 22 are removed from the component supply unit 22, and the feeder 20 holding the components to be mounted on the printed circuit board to be produced next is replaced with the feeder. A tray pallet 814 mounted on the pallet 29 or containing the tray 810 is accommodated in the multistage rack 812. The configuration is changed by exchanging all the feeders 20 and trays 810. After all the unmounted parts are allocated, optimization is performed to calculate the cycle time, and it is checked whether the target cycle time can be obtained. This configuration change is referred to as an all parts removal type change.

  If the target cycle time is not achieved in the third stage, the configuration of the nozzle accommodating device 752 shown in S24 is changed, and the type and number of the suction nozzles 288 accommodated in the nozzle accommodating device 752 are the components, the mounting head 26, etc. Is set according to Here, the cycle time is calculated by performing optimization including the set type of the suction nozzle 288 and the like, and if the target cycle time is not achieved, the mounting head 26 is changed to S25 and the mounting head 26 is changed. The cycle time is calculated by performing optimization including the change. Here, if the target cycle time is not achieved, another configuration change is performed in S4 and S5 of the configuration change routine.

  If the target cycle time is achieved in each step, that is, if the cycle time is equal to or less than the target cycle time, the configuration change shortening type configuration change is completed at that stage, and the cycle time and the content of the step change are stored in the system control computer 980. It is stored in a storage unit for configuration change contents or a storage unit for configuration change contents. The production of printed circuit boards requires the arrangement of parts in accordance with it. First, the configuration is changed by changing the feeder 20 and the tray 810. Initially, the changes are made as little as possible, and step by step. The number of changes is increased. If the target cycle time is not achieved by changing the feeder 20 and the like, the number of items to be changed is further increased. The earlier the target cycle time is achieved, the fewer the configuration changes and the shorter the setup change time. Even when the target cycle time is not achieved at each stage, the obtained cycle time and the contents of the stage change are stored.

  In the present embodiment, the initial state at the start of operation of the mounting system is that, as described above, no changeable configuration is attached to the mounting module, but the number of mounting modules is set, and Configuration changes are made based on this. Allocation is performed in order from the upstream mounting module, and the mounting head 26 and the nozzle accommodating device 752 are set in accordance with the allocation. It may be considered that S25 is executed.

Hereinafter, each step will be described in detail. First, the component addition type change in S21 will be described.
The combination of the component supply forms of the component supply units 22 in the plurality of mounting modules 12 and the like constituting the mounting system is the following two types. As shown in FIG. 48 (a), when both the mounting module to which the feeder type supply device 23 is attached and the mounting module to which the tray type supply device 25 is attached, as shown in FIG. This is a case where each of the component supply devices included in the component supply unit 22 is a feeder-type supply device 23. In addition, if the component supply apparatus attached to the large mounting module 600 is the feeder type supply apparatus 23, the feeder type supply apparatus 23 is an apparatus having a size corresponding to the large mounting module 600. Further, the setting of the mounting head 26 shown in FIG. 48 is an example, and is not limited to the illustrated mode. The same applies to the number of modules. The same applies to the diagrams showing the settings of other component supply devices such as FIG. The present state of the combination of the component supply devices included in each component supply unit 22 such as a plurality of mounting modules 12 in the mounting system, and each component supply unit 22 such as a plurality of mounting modules 12 should be included in the next printed circuit board production. The relationship with the combination of component supply devices is shown in FIG.

  The combination of the current component supply devices is obtained, for example, by inputting configuration change information in S1, and the combination at the next production is, for example, among the information about the printed circuit board to be produced next, Obtained by the type of part. Depending on the type of component, the supply form is set and stored as component-specific data. All the components to be mounted are supplied only by the feeder-type supply device 23, or the feeder-type supply device 23 and the tray It can be seen whether the mold is supplied by both of the mold supply devices 25. The configuration change in S21 to S23 is performed according to the combination of the component supply devices in the current state and the next production.

  First, the setup change time shortening type configuration change will be described by taking as an example the case where the feeder type supply device 23 is attached to all the mounting modules 12 and 600 of the mounting system both in the current state and in the next production. It is assumed that the mounting system is in a steady operation state after starting operation.

  As described above, the component addition type change in S21 is a change in which the feeder 20 or the tray 810 is added to each component supply unit 22 of the mounting modules 12 and 600 to add components, and thus the feeder type supply device 23 is actually changed. It is necessary that there is a space for mounting the feeder 20. Therefore, first, the number of vacant slots 780 is acquired for each of all the mounting modules 12 and 600, and it is checked whether or not the sum is equal to or greater than the number of feeders that supply unmounted components. The placement position and number of feeders 20 in each feeder supply device 23 of the mounting modules 12 and 600, the type and number of unmounted components, and the information on the configuration of the feeder-type supply device 23 at the present time and the printed circuit board to be produced next. Based on. In some cases, the parts are large, the feeder 20 is wide, and a space for a plurality of slots is required for mounting on the feeder pallet 29. In that case, one feeder 20 or a plurality of slots 780 are provided. Counted as. In addition, the number of parts supplied for each type of parts required for a series of mounting operations is also considered. This is because when the number of supplies is large, a plurality of feeders 20 and trays 810 may be required. If the number of empty slots is insufficient and it is impossible to mount all the feeders 20 that supply unmounted components, S21 is not performed and S22 is performed.

If all the feeders 20 that hold unmounted components can be mounted, first, each of the plurality of mounting modules 12 and 600 is mounted on the next production circuit board among the feeders 20 that each component supply unit 22 currently has. The cycle time in the case where the parts supplied by the feeder 20 that can be used for production are mounted on the wiring board 150 is calculated. Here, the cycle time is obtained by multiplying the time required for mounting one component by the number of components supplied (which is also the number of components mounted) in each of the mounting modules 12 and 60. The mounting time of one component is roughly calculated in the present embodiment, and is performed according to the following mounting time calculation formula.
Mounting time of one component = mounting time of one component × tray weighting factor × mounting head weighting factor

  Here, the mounting time of one component is a preset fixed value, which is an average value obtained from the past component mounting results. For example, the high-efficiency mounting head 26A removes a component from the feeder 20. It is set to the value when receiving and mounting. When the components are supplied by the tray type supply device 25, for example, the component receiving position where the mounting head 26 receives the components differs in at least one of the X-axis direction and the Y-axis direction according to the storage position of the components in the tray 810. Therefore, it takes more time to receive than when it is supplied by the feeder type supply device 23, and the tray 810 needs to be positioned at the parts supply position by raising and lowering the multi-stage rack 812, and the feeder 20 considers them. The coefficient when supplied is set to 1, and the tray weight coefficient is set to a value larger than 1. Further, when the components are mounted by the high-efficiency mounting head 26A, the high-efficiency mounting head 26A picks up, conveys, and mounts a plurality of, for example, eight components at a time. The time is short, and it takes longer when the intermediate mounting head 26B is used, and more time is required when the general mounting head 26C is used. In order to consider this difference in mounting time, the coefficient representing the mounting head weight is set to 1 in the case of the high-efficiency mounting head 26A, and the intermediate mounting head 26B and the general mounting head 26C are larger than 1, respectively. Is set to a value larger than the intermediate mounting head 26B.

Parts are assigned from the mounting modules 12 and 600 having the shortest cycle time among the plurality of mounting modules 12 and 600.
The parts are allocated according to a preset rule. For example, the parts are allocated in advance from the parts having a low dimension, for example, a low height. As described above, the mounting of the component on the wiring board 150 is often performed first from the component having a low height, and the mounting module 12 on the upstream side in the wiring board conveyance direction in the mounting system is higher in the component to be mounted. This is because it is desirable to reduce the size.

  Therefore, for example, as shown in FIG. 50, components that are not mounted and are unique to the next production circuit board are arranged in descending order and divided into a plurality of, for example, two groups. The plurality of mounting modules 12 and 600 are divided into groups equal to the number of unmounted components in the wiring board transport direction, here two groups, and the mounting modules 12 belonging to the upstream group in the wiring board transport direction. The parts belonging to the small part group are allocated to the mounting modules 12 and 600 belonging to the downstream group, and the parts belonging to the large part group are allocated.

  In this case, for example, if the mounting module with the shortest cycle time belongs to the upstream group and is located upstream in the upstream group, the smaller part in the small part group is allocated, and the upstream side If it is located downstream in the group, the larger part in the small part group is allocated. The same applies when the mounting module 12 with the shortest cycle time belongs to the downstream group. The parts are also allocated in consideration of the number of parts supplied for each type of parts.

  When parts are allocated to a plurality of mounted modules 12 and 600, unmounted parts and mounted modules may be divided into a larger number of groups.

  Each time one unmounted part is allocated, the cycle time is calculated as described above for the mounting module to which the part is allocated, and the mounting module with the shortest cycle time is obtained from all the mounting modules 12 and 600, Is allocated. The calculation of the cycle time, determination of the component allocation module, and allocation of unmounted components are repeated until there are no unmounted components. If there is no empty slot 780 in the feeder pallet 29 of the mounting module with the shortest cycle time, parts are allocated if there is an empty slot 780 in the mounting module with the next shortest cycle time. Further, if the feeder 20 cannot be mounted even if there is an empty slot 780, for example, the feeder 20 is wide and requires a space for a plurality of slots to mount the feeder 20, but a smaller number of slots 780 are required. However, even if it is not available, it is impossible to mount, and next, the cycle time is short, and a non-mounted component is allocated to a mounting module on which the feeder 20 can be mounted. Further, in one of the upstream group and the downstream group, all the installed modules belonging to the one group have no empty slot 780. If there is a part that has not been allocated to the corresponding part group, the empty slot 780 has not been assigned. The mounted parts are allocated to the mounting modules belonging to the other group.

  If all the unmounted components are allocated to the mounting modules 12 and 600, the arrangement and mounting order of the feeder 20 (also the tray 810 when the tray-type component supply device 25 is provided) holding the components for each mounting module is determined. Optimization is performed. Optimization of the arrangement of the components is already known, and detailed description thereof is omitted. In this embodiment, for example, when the components are supplied by the feeder 20, from the component suction position or the component receiving position of the mounting head 26. The total of the movement distances for each component up to the imaging position where the imaging is performed by the component imaging device 30 is performed as short as possible. Further, in the high efficiency mounting head 26A, for example, the arrangement of components is set in accordance with the arrangement of the suction nozzle 288. In the high-efficiency mounting head 26A, when holding a plurality of different types of suction nozzles 288 (for example, suction nozzles 288 having different suction tube diameters), for example, the components are the same because they are held together for each type. The feeders 20 holding the parts supplied by the kind of suction nozzle 288 are arranged together. Further, for example, the feeder 20 having a larger number of component supplies is arranged at a position closer to the component imaging device 30. The same applies to the general-purpose mounting head 26C. When the components are supplied by the tray 810, for example, the arrangement of the tray 810 in the multi-stage rack 812 is optimized so that the sum of the lifting distances of the multi-stage rack 812 is as short as possible. For example, the trays 810 holding the components that are close to the mounting position on the wiring board 150 are arranged at positions close to each other. It should be noted that here, some of the parts to be mounted at the time of the next production, and the arrangement positions of the parts common to the previous production are determined, and the feeder type supply device 23 (tray type supply device 25). Since the unused parts remain in the tray type supply device 25), the optimization is performed in consideration of them.

  In addition, after optimizing the component arrangement, the mounting order of each of the plurality of mounting modules 12 and 600 is optimized. Although optimization of the mounting order is already known and detailed description is omitted, mounting of components on the wiring board 150 is performed by reading a reference mark provided on the wiring board 150, adsorbing parts, imaging, mounting, The adsorption is performed in the order of adsorption, and at that time, the total moving distance of the mounting head 26 is performed to be the shortest. For the high-efficiency mounting head 26A, for example, the mounting order is set based on the wiring board design data so that components with close mounting positions are mounted together. However, in this case as well as the optimization of the component arrangement, the arrangement position of the common component is determined, and the optimization is performed in consideration of the remaining unused parts.

  After the optimization, the cycle time is calculated for each of the plurality of mounting modules 12 and 600, and the longest cycle time among them is set as the cycle time of the mounting system and compared with the target cycle time. Here, the component arrangement and the order of mounting are optimized, and the cycle time is calculated on the assumption that various operations are performed in the same manner as when components are actually mounted on the wiring board 150. That is, time required for horizontal and parallel movement of the mounting head 26, raising and lowering and rotation of the suction nozzle 288, time for stopping the lowering end of the suction nozzle 288 during component suction and mounting, time required for imaging and image processing, The calculation is performed including the reference mark reading time and image processing time, the time required for selecting the tray pallet 814 in the tray type supply device 25, and the like.

  If the cycle time is less than or equal to the target cycle time, the target has been achieved, and the contents of the cycle time and the setup change are stored in the storage unit such as the setup change content in association with each other, The setup change time shortening type configuration change ends. Here, the contents of the setup change are, for example, the type and number of parts held by the feeder 20 to be added, the mounting module to which the feeder 20 is added, the mounting position of the feeder 20, and the like. The configuration of the entire mounting system may also be stored.

  On the other hand, if the cycle time exceeds the target cycle time, the target has not been achieved by the component addition type change, and the unused part removal type change in S22 is performed. First, assuming that all feeders 20 that hold unused parts that are not used in the next production are removed from the feeder pallet 29, feeders 20 that hold unmounted parts are allocated to empty slots 780. It should be noted that the number of empty slots 780 is also obtained at the time of executing the non-use part removal type change, and it is determined whether or not it is sufficient to mount the non-mounted parts. Changes are performed.

  In the change of the unused part removal type, the cycle time is roughly calculated as in the case of changing the part addition type, and the non-mounted parts are allocated first from the short mounting module 12. Similarly, the allocation is performed in order from the smallest part. Each time one part is allocated, the cycle time is calculated, and the mounting module 12,600 having the short cycle time is allocated first. If parts that are not used in the next production are removed, the number and type of parts allocated to the plurality of mounting modules 12 and 600 are changed, and the cycle time is changed accordingly. When all the unmounted parts are allocated, the parts arrangement and the mounting order are optimized. Also in this case, optimization is performed based on the fact that the arrangement position of the common parts is determined in the feeder type supply device 23. Then, calculation of the cycle time based on the optimization is performed, and the cycle time of the mounting system is acquired and compared with the target cycle time. If it is less than the target cycle time, the cycle time and the contents of the setup change are stored, and the setup change time shortening type configuration change is completed.

  It is not indispensable to remove all the feeders 20 or the trays 810 holding the unused parts, and the removal may be fine and performed in multiple stages. For example, the feeder 20 and the tray 810 that hold non-used parts may be removed one by one until all the non-mounted parts are mounted. A number of unused parts may be removed at once. In this case, the number of removals may be the same for a plurality of mounting modules, or may be increased for a mounting module having a larger number of non-used parts.

  If the target cycle time cannot be achieved even if the unused part removal type is changed, the all parts removal type change in S23 is performed. In the case of changing all parts to be removed, the parts supply devices are vacant in all the mounting modules 12 and 600. First, it is checked whether or not there is an empty slot 780 sufficient to allocate all the parts. If there is a shortage of slots 780, the setup change time shortening type configuration change ends, and the configuration change routines S4 and S5 are executed. If the empty slots 780 are not short and all the components can be allocated and the printed circuit board can be produced, the components are allocated in ascending order from the mounting modules 12 and 600 on the upstream side in the wiring board conveyance direction. . After the allocation, the component placement and the mounting order are optimized for each of the plurality of mounting modules 12 and 600. In this case, the parts are allocated while the feeder type supply device 23 is empty, and optimization is performed without being influenced by the arrangement of common parts and unused parts. Then, in each of the mounting modules 12 and 600, the cycle time is calculated based on the optimization, and if it is equal to or less than the target cycle time, the cycle time and the contents of the setup change are stored, and the setup change time shortening type configuration change ends.

  If the target cycle time is not achieved even after changing all the parts removal molds, S24 is executed, and the configuration of the nozzle accommodating device 752 is changed. The nozzle accommodating device 752 accommodates the suction nozzle 288 necessary for mounting the component on the previous wiring board 150. However, if the component is allocated for the next production, the suction required for mounting will be described. The number and types of the nozzles 288 are changed, and all the suction nozzles 288 actually held by the mounting head 26 may not be used at the time of the next production. For example, the suction nozzles 288 used for mounting parts are not changed. The cycle number may be long and the cycle time may be long. Therefore, it is accommodated in the nozzle accommodating device 752 so as to obtain the suction nozzle 288 that is necessary for mounting the components allocated to each of the plurality of mounting modules 12 and 600 and can be held by the mounting head 26. The number and type of suction nozzles 288 to be set are set. The type of the suction nozzle 288 used for mounting the component is set based on, for example, the shape and size of the component. Further, the number of suction nozzles 288 is set according to the type of the mounting head 26, for example.

  Then, the mounting order of each of the plurality of mounting modules 12 is optimized. The arrangement of the parts is the same as the arrangement performed in S23, and the arrangement obtained by the optimization is used. In this case, the optimization is performed based on the configuration change of the nozzle accommodating device 752, that is, considering the change in the type and number of the suction nozzles 288 used by the mounting head 26 for mounting. After optimization, the cycle time is calculated, the cycle time of the mounting system is acquired and compared with the target cycle time, and if the target is achieved, the configuration change time shortening type configuration change ends. If the goal is achieved, the cycle time and the contents of the setup change are stored. In this case, the number and types of the suction nozzles 288 accommodated in the nozzle accommodating device 752 are stored together with the allocation of the parts to the plurality of mounting modules 12 and 600 obtained by the execution of S23. The arrangement position of the suction nozzle 288 in the nozzle accommodating device 752 is determined by grouping for each nozzle type so that the operator can easily see and understand.

  If the target cycle time is not yet achieved, S25 is executed and the mounting head 26 is changed. For example, if the mounting head 26 used in a certain mounting module is the intermediate mounting head 26B, and can be changed to the high-speed mounting head 26A, that is, any of the components allocated to the mounting module can be mounted at high speed. If the component can be mounted by the head 26A, the mounting head 26 is changed. Whether or not a component can be mounted by the high-speed mounting head 26A can be determined from, for example, the type of component, the supply form, and the like obtained from the component specific data. In addition, if the type of the mounting head 26 is changed, the configuration of the nozzle accommodating device 752 is changed accordingly if necessary. After the change of the mounting head 26, the mounting order is optimized for each of the plurality of mounting modules in consideration of the change of the mounting head 26. After optimization, the cycle time is calculated and the cycle time of the mounting system is obtained.

  If the target cycle time has been achieved by changing the mounting head 26, the cycle time and the setup change content are stored, and the setup change time shortening type configuration change ends. In this case, the type of the mounting head 26 and the configuration of the nozzle storage device 752 associated therewith are also stored as the setup change contents.

  If the cycle time does not fall below the target cycle time despite the change of the mounting head 26, the setup change time shortening type configuration change ends. Then, the determination result of S3 of the configuration change routine is YES, and S4 and S5 are executed. In the present embodiment, the target cycle time is relatively strict, that is, it is set to a size that is short and provides high mounting efficiency, and the target cycle time may not be achieved. Done.

  In the configuration change shortening type configuration change, a part of each component supply unit 22 of the plurality of mounting modules 12 and 600 is provided with a feeder type supply device 23 and the rest is provided with a tray type supply device 25 for the next production. A similar case will be described. The mounting system is configured as shown in FIG. In this case, even if the tray 810 corresponds to the feeder 20 and includes the tray-type supply device 25, S21 to S26 are executed as in the case where all the component supply devices are the feeder-type supply device 23. For parts allocation, unmounted parts (all parts for next production in the case of all parts removal type) are divided into feeder supply parts and tray supply parts, and the smaller parts in each group, the upstream mounting in the wiring board conveyance direction Modules 12 and 600 are allocated.

  In fact, when the component supply devices included in the component supply units 22 of the plurality of mounting modules 12 and 600 are all feeder-type supply devices 23 and the feeder-type supply device 23 and the tray-type supply device 25 are required in the next production. Changes the component supply device of the large mounting module 600 from the feeder-type supply device 23 to the tray-type supply device 25, and executes the setup change time shortening type configuration change.

  In this case, for example, the required number of tray type supply devices 25 is obtained from the number of parts supplied by the tray 810 during the next production, and the feeder type supply device 23 is replaced with the tray type supply device 25 as shown in FIG. change. If it is not necessary to change the type of the mounting head 26 in accordance with the change of the supply device, the steps after S21 are executed. If it is necessary to change the type of the mounting head 26, the type of the mounting head 26 is changed and the configuration of the nozzle accommodating device 752 is changed to execute the steps S21 and the subsequent steps. At this time, if the mounting module having the longest cycle time is the mounting module provided with the tray type supply device 25 as a result of the configuration change at each stage, the configuration of the mounting module cannot be changed any further. The replacement time shortening type configuration change ends. If the number of large mounting modules 600 in which the tray type supply device 25 is arranged is insufficient, the setup change time shortening type configuration change is completed.

  Then, the non-mounted parts (all parts for the next production in the case of all parts removal type) are divided into feeder supply parts and tray supply parts for allocation. This allocation is executed in the same manner as the above-described change for the feeder type supply device 23 in any of the part addition type change, the non-use part removal type change, and the all part removal type change. Since the tray 810 is newly mounted, if there are a plurality of tray type supply devices 25, small components among the tray supply components are allocated in order from the tray type supply device 25 on the upstream side. Then, optimization of component arrangement and mounting order and calculation of cycle time based on the optimization are performed, and if the target cycle time is not achieved, S24 and S25 are executed in the same manner as described above. If the type of the mounting head 26 is not changed in the mounting module 600 in which the tray type supply device 25 is arranged, the mounting module 600 having the tray type supply device 25 is the mounting module having the longest cycle time when executing S21. If so, since the arrangement of the tray 810 cannot be changed any more, S22 and S23 are not executed, and the changes after S24 are executed.

  When the supply devices included in the component supply units 22 of the plurality of mounting modules 12 and 600 are the feeder-type supply device 23 and the tray-type supply device 25, and only the feeder-type supply device 23 is necessary in the next production, for example, The component addition type change is executed only by the small mounting module 12 having the feeder type supply device 23 that actually constitutes the mounting system. If the feeder-type supply device 23 is insufficient even after all the component removal molds are changed, one of the tray-type supply devices 25 is changed to the feeder-type supply device 23, and the process is executed again from the part addition type change. To do. In this case, if there are a plurality of large mounting modules 600 having the tray type supply device 25, the tray type supply device 25 is changed to the feeder type supply device 23 first from the large mounting module 600 located on the most upstream side in the wiring board conveyance direction. To do. The feeder-type supply device 23 is a feeder-type supply device 23 for the large mounting module 600 having a large width. After changing the supply device, S21 to S23 are executed, and the supply device is changed until the feeder-type supply device 23 is not insufficient. If the target cycle time is still not achieved even when the entire tray type supply device 25 is changed to the feeder type supply device 23, the change after S24 is executed. If the feeder type supply device 23 is insufficient, the setup change time shortening type configuration change is terminated.

  If the target cycle time is achieved by the configuration change time shortening type configuration change, the determination result of S3 of the configuration change routine is YES and S10 is executed, which will be described later. Even if the target cycle time is not achieved in each stage of S21 to S25, the cycle time and the contents of the step change at that time are associated and stored in the target unachieved configuration storage unit of the computer 980.

  If the target cycle time is not achieved by execution of the configuration change time shortening type configuration change, the determination result of S3 of the configuration change routine is NO, and S4 and S5 are executed, and the mounting head selection type configuration change and the number of mounting modules are set. Type composition change is executed. In the present mounting system, there are three types of mounting heads 26 as described above. In the mounting head selection type configuration change, the types of mounting heads 26 to be used for a plurality of mounting modules are determined according to a predetermined rule. Parts are allocated when the type of the mounting head 26 is determined, and the type of the component supply device and the configuration of the nozzle accommodating device 752 are determined.

  The selection of the mounting head 26 for each of the plurality of mounting modules can be easily performed based on, for example, a ratio of time during which the mounting head 26 performs mounting. The total mounting time for each type of mounting head 26 is obtained by multiplying the time required for mounting per component by the number of components mounted by each type of mounting head 26. Based on the shape, size, and supply form of all the parts to be mounted on the wiring board 150, the parts to be mounted by the three types of mounting heads 26 are set, and the number of parts is obtained. For example, when the parts to be mounted at the time of the next production are mounted by the general-purpose mounting head 26C and the high-efficiency mounting head 26A, there are usually more small parts mounted by the high-efficiency mounting head 26A. If the total mounting time by the mounting head 26A is compared with the total mounting time by the general-purpose mounting head 26C, the former is overwhelmingly long, and the mounting heads 26 allocated to the plurality of mounting modules 12 according to the ratio of the mounting time. If the type is set, the number of mounting modules to which the high-efficiency mounting head 26A is allocated becomes larger.

  However, if the number of mounting modules to which the general mounting head 26C is allocated is small, a problem occurs. For example, a component mounted only by the general-purpose mounting head 26 </ b> C is often large, and if supplied by the feeder 20, the feeder 20 is wide. Therefore, the number of feeders 20 that can be provided in one mounting module is small, the number of feeders 20 is insufficient, and a state where production is impossible occurs.

  For this reason, the mounting head selection type configuration change is capable of producing a printed circuit board, that is, can achieve the mounting operation of components on the wiring board 150, and is highly effective for the upstream one of the plurality of mounting modules. On the condition that the efficiency mounting head 26A is mounted and the general-purpose mounting head 26C is mounted on the downstream side, a system configuration that requires the smallest number of mounting of the general-purpose mounting head 26C is performed. As described above, the basic configuration of this mounting system is that the large mounting module 600 is disposed downstream in the wiring board transport direction, the tray type supply device 25 can be mounted, and the general mounting head 26C is mounted. The mounting head 26 is selected based on this basic configuration. Further, the number of small mounting modules 12 and large mounting modules 600 constituting the mounting system is set, and mounting head selection is performed.

  In this embodiment, the mounting head selection type configuration change is performed when the target cycle time cannot be obtained by the setup change time shortening type configuration change. The number of installed modules and the number of large installed modules are set. For example, the number of small mounting modules and the number of large mounting modules that make up the mounting system expected at the time of execution of a configuration change shortening type change can be reduced, and the cycle time can be shortened and production is impossible at all. The number does not cause a state, and is set to a number smaller than the number of mounting modules owned by the user of the mounting system. This also applies to the change in the number of installed modules setting type configuration described later.

  In the mounting head selection type configuration change, first, line balance is performed in the initial state where the general-purpose mounting head 26C is mounted on all mounting modules, and the cycle time is calculated. Line balancing is performed by allocating all types of components mounted on the wiring board 150 to the plurality of mounting modules 12 and 600 in the next production. If the supply form is preset according to the parts and the parts to be mounted at the time of the next production are feeder supply parts supplied by the feeder-type supply device 23, the plurality of mounting modules 12 and 600 are sequentially installed from the upstream side. Parts with a small height are allocated. If the component includes both a feeder supply component and a tray supply component, the feeder supply component is the small mounting module 12 and is allocated in order from the upstream small mounting module 12, and the tray supply component is the large mounting module 600. Thus, the modules are allocated in order from the upstream large mounting module 600.

  From the initial state where the general-purpose mounting head 26C is selected for all of the plurality of mounting modules 12 and 600 as described above, the general-purpose mounting of one mounting module in the present embodiment is performed in order from the upstream mounting module. It is assumed that the head 26C is changed to the high efficiency mounting head 26A. If the mounting head 26 is changed, the types of components that can be mounted also change. Therefore, the components are allocated according to the selection of the mounting head 26, and whether all components can be allocated, that is, the printed circuit. It is determined whether the plate can be produced. If production is possible, that is, if all parts can be allocated to the mounting modules 12 and 600, the determination is YES, and the cycle time is calculated for each of the plurality of mounting modules 12 and 600, and the longest of them is calculated. This cycle time is the cycle time of the mounting system. Here, the cycle time is calculated in the same manner as the calculation of the cycle time performed for obtaining the mounting module for allocating the component in the component addition type change, and is calculated in consideration of the component supply form and the type of mounting head 26. It will be done. Further, it is assumed that one general-purpose mounting head 26C is changed to a high-efficiency mounting head 26A. If all the parts cannot be allocated, it is impossible to produce the product by selecting the mounting head 26 at that time.

  As shown in FIG. 53, as long as production is possible (indicated by OK in FIG. 53), the general-purpose mounting head 26C is changed to the high-efficiency mounting head 26A. If the production becomes impossible (indicated by NG in FIG. 53), it is determined whether or not the general-purpose mounting head 26C changed to the high-efficiency mounting head 26A at that time can be changed to the intermediate mounting head 26B. If possible, the cycle time is calculated. Further, regarding the mounting module in which the general-purpose mounting head 26C is set, first, it is assumed that the state is changed to the high-efficiency mounting head 26A, and if it cannot be produced, the state can be changed to the intermediate head 26B. It is determined whether or not. It is assumed that the intermediate mounting head 26B has a shorter mounting time than the general-purpose mounting head 26C, and the mounting head 26 that requires shorter mounting time is selected. When all the mounting heads 26 are assumed to be changed, whether production is possible, and calculation of the cycle time when production is possible have been completed, the cycle time is the shortest of all combinations of production heads 26 that can be produced. Is the optimum selection of the mounting head 26, and is determined as the high-efficiency system configuration, and is stored in the high-efficiency system configuration storage unit provided in the system control computer 980 together with the cycle time. If all the components to be mounted are feeder supply components, the mounting head 26 may be the high-efficiency mounting head 26A for all the mounting modules.

  The mounted module number setting type configuration change shown in S5 will be described. At the time of changing the mounting module number setting type configuration, the number of small mounting modules and the number of large mounting modules constituting the mounting system are respectively set in advance, as in the case of executing the mounting head selection type configuration change.

  FIG. 54 shows the flow of changing the number of installed modules setting type configuration. First, in S51, the components to be mounted on the wiring board 150 are classified into a plurality of types based on the type of mounting head 26 on which the components are mounted and the supply form of the components, in this embodiment, three groups. The parts mounted by the high-efficiency mounting head 26A and the parts mounted by the general-purpose mounting head 26C are divided, and the latter is further divided into a feeder supply part and a tray supply part. The feeder supply component mounted by the general mounting head 26C is mounted by the intermediate mounting head 26B, and the general mounting head 26C mounts the tray supply component. Parts mounted by the high-efficiency mounting head 26A and the intermediate mounting head 26B are referred to as high-efficiency mounting parts and intermediate mounting parts, respectively. The parts mounted by the high-efficiency mounting head 26A and the intermediate mounting head 26B are feeder supply parts, and the mounting of the parts by the high-efficiency mounting head 26A and the intermediate mounting head 26B is performed in the small mounting module 12, and by the general-purpose mounting head 26C. The component mounting is performed in the large mounting module 600.

  Next, S52 is executed, and for each of the three groups of parts, the total of the mounting times of the parts belonging to each group is calculated. The three groups of components are different in the type of mounting head 26 used for mounting, and the time required for mounting one component of each of the three types of mounting heads 26A, B, C (from the component supply unit 22 of the components) The time required from receiving the device to mounting on the wiring board 150 is actually different, but here the total mounting time is calculated using the average value of the mounting time for each head. The average mounting time is a preset fixed value, and the total mounting time for each group is calculated by multiplying this time by the number of parts belonging to each group.

  Next, S53 is executed, the number of mounting modules necessary for mounting the components belonging to the three groups is obtained, and the types of components to be mounted in the mounting modules 12 and 600 are set. The number of mounting modules for each group may be set according to the ratio of the total mounting time for each group of parts calculated in S52. However, in that case, there are few mounting modules for mounting tray supply parts, There is a possibility that the tray supply component cannot be mounted. Therefore, in S53, the minimum number of mounted modules necessary to supply all the parts of each group is calculated based on the number of each part of the three groups. Based on the supply form of each group of parts, the number of feeders and the number of trays necessary for supply are obtained, and the minimum number of installed modules is obtained therefrom. The feeder 20 varies in width depending on the dimensions of the parts, and some of the feeders 20 require a plurality of slots 780 to be mounted on the feeder pallet 29. Even in the case of the tray 810, a plurality of shelves 818 are required to accommodate the tray pallet 814 in the multistage rack 812. Some of them are required, and the number of necessary mounting modules is required in consideration of them. Since both the high-efficiency mounting component and the intermediate mounting component are supplied by the feeder 20, the number of small mounting modules 12 is required for each of the mounting modules necessary for the mounting. For the tray supply component, the number of large mounting modules 600 is required. As described above, the set number of each of the large and small mounting modules 12 and 600 is set to be relatively large, and the shortage of mounting modules is avoided here.

  Then, S54 is executed, and a value obtained by dividing the total mounting time calculated for each of the three groups in S52 by the necessary minimum number of mounting modules determined for each group in S53 is obtained. The mounting time per mounting module is calculated. Next, S55 is executed, and it is determined whether or not the number of mounted modules can be increased to the set number. In this determination, the group having the longest mounting time per mounting module calculated in S54 is obtained from the three component groups, and the total required number of mounting modules to be mounted in the group (high-speed mounting) In the case of a component group or an intermediate mounted component group, it is determined whether or not the sum of the small mounting modules 12 required for each has not reached the set number. If the set number has not been reached, the determination result in S55 is YES, S56 is executed, and the number of installed modules is increased by one for the group. If there are two groups with the longest mounting time, the mounting module is increased by one for the longer average mounting time of the mounting head 26. This situation occurs for the high-speed mounting component group and the intermediate mounting component group. The average mounting time of the mounting head 26 is the shortest for the high-efficiency mounting head 26A and the longest for the general-purpose mounting head 26C.

  Subsequently, S57 is executed, and it is determined whether or not the number of mounted modules has reached the set number in the state where the number of mounted modules is increased by one in S56. If the number of small mounting modules 12 is increased, the total required number thereof is compared with the set number. If the number of large mounting modules 600 is increased, the required number is compared with the set number. If both the large and small modules 600 and 12 are not less than the set number, the determination result in S57 is NO and the process returns to S54. In this case, the number of mounted modules is increased by 1 from the previous execution of S54, and the steps after S54 are executed based on the increased number of mounted modules. Steps S54 to S57 are repeatedly executed until the required number of installed modules or the number of installed modules used exceeds the set number. As the number of mounting modules per component group increases, the burden per mounting module is reduced. Therefore, the number of mounting modules is increased as much as possible.

  Even if the required number of one of the small mounting module 12 and the large mounting module 600 reaches the set number, if the setting number is not reached for the other, the number of mounting modules can be increased, and S54 to S57 are executed. Even if the mounting time is the longest, if the mounting module cannot be increased, the determination result in S55 is NO and S58 is executed. Further, as a result of increasing the number of mounting modules, if the required number of both large and small mounting modules 600 and 12 has reached the set number, the determination result in S57 is YES and S58 is executed. Note that when it becomes impossible to add, one of the large and small mounting modules 600 and 12 may not reach the set number. In this case, for example, the number of mounting modules constituting the mounting system Reduced.

  Thus, if the number of mounting modules is determined for each component supply form, the line configuration of the mounting system is determined. The mounting modules 12 and 600 are arranged such that mounting of high-efficiency mounting components, mounting of intermediate mounting components, and mounting of tray supply components are performed in order from the upstream side in the wiring board wiring direction. If the arrangement of the mounting modules 12 and 600 is determined based on the component classification, the type of the mounting head 26 is also determined for each mounting module, and the type of the nozzle accommodating device 752 is determined in S58.

  In S59, parts are assigned to each of the mounting modules 12 and 600. Parts belonging to the same group are allocated to upstream mounting modules in order from the parts with the smallest height, and are equally allocated. If the type of component to be mounted is determined, the type of suction nozzle 288 used for mounting is determined, and the configuration of the nozzle accommodating device 752 is set in S60. The type, number, and the like of the suction nozzle 288 accommodated in the nozzle accommodating device 752 are set. The setting of the type of the nozzle accommodating device 752 in S58 may be performed in S60.

  If the mounting module number setting type configuration change is performed in this way, the configuration change routine S6 is executed, and the placement of the feeder 20 and the tray 810 is optimized for each of the mounting modules 12 and 600. After optimizing the component arrangement, S7 is executed, and the mounting order is optimized for each of the plurality of mounting modules 12 and 600. These optimizations have been described earlier and will not be described here.

  Next, S8 is executed, and the cycle time is calculated for each of the plurality of mounting modules 12, 600. Here, the component arrangement and the order of mounting are optimized, and the cycle time is calculated on the assumption that various operations are performed in the same manner as when components are actually mounted on the wiring board 150.

  Then, the longest cycle time among the obtained cycle times is set as the cycle time of the mounting system, and it is determined in S9 whether or not the target cycle time has been achieved. In this embodiment, the target cycle time is the same as the target cycle time used in the configuration change time shortening type configuration change. If the cycle time is less than or equal to the target cycle time, the determination result in S9 is YES and S10 is executed. As shown in FIG. 55, the calculated cycle time, setup change time (required change time), setup change time. The total of the operation time and the total operating time and illustration are omitted, but the setup man-hours are displayed on the display 984, for example, the type and number of components that require replacement and arrangement, the number of installed modules, and the type (not shown). , Selected by the operator. The time required for the setup change is calculated and displayed based on the setup change man-hours. The time required for the setup change is the sum of the setup change times in each of the plurality of mounting modules 12 and 600.

  If the cycle time calculated in S8 is larger than the target cycle time, the target is achieved by adding the mounting modules 12 and 600. Therefore, S11 is performed and it is determined whether the mounting modules 12 and 600 are added. The addition of the mounting modules 12 and 600 requires the user to have extra mounting modules 12 and 600, and is added if the operator desires.

  The display 984 asks whether or not the operator wishes to add the mounting modules 12 and 600. If there are extra mounting modules 12 and 600 and the operator wishes to add them, the determination result of S11 is obtained. If YES, S12 is executed, one mounting module 12 or one mounting module 600 is added, and the processing from S4 is performed again. In this case, among the plurality of mounting modules, one mounting module of the same type as the mounting module having the longest cycle time is added, and the mounting head selection type configuration change and the mounting module number setting type configuration change are executed again. The

  Whether or not the user has extra mounting modules 12 and 600 that can be added is known from the configuration change information acquired in S1. These extra mounting modules 12 and 600 are spare components, and if they are used for configuration change, that is, if they are used for adding mounting modules, it can be determined that the mounting modules have already been installed in the system. Information is given. Therefore, a mounting module to which this information is not given can be used at the present time and can be added.

  S4 to S9, S11, and S12 are repeatedly executed until the target cycle time is achieved, or there are no more mounting modules 12 and 600 that can be added, or until the operator does not want to add mounting modules 12 and 600. . If the mounting module is not added, the determination result in S11 is NO and S10 is executed. Even if the target cycle time is not achieved, the cycle time, the setup change time, and the like are displayed on the display 984.

  In S10, the cycle time when the target cycle time is achieved in the configuration change time shortening type configuration change executed in S2 and the cycle time when the target cycle time is not achieved are also displayed and selected by the operator. It is possible. In the configuration change shortening type configuration change, as described above, the priority order is set, and the configuration change is performed so that the number of setup changes is minimized as long as the target cycle time is achieved. Even if the target cycle time is not achieved at each stage of the configuration change, a system configuration is obtained in which the number of setup changes is small. Therefore, if these are also displayed, the operator can select which of the reduction of the setup change time and the reduction of the cycle time is prioritized. For example, in the case of high-mix low-volume production, the number of printed circuit boards produced is small, so even if the cycle time is somewhat long, the total production time is not so long, and even if the target cycle time is not achieved, The operator may choose that the replacement time is short.

  The total operating time is obtained by multiplying the cycle time by the number of printed circuit boards produced. Therefore, the sum of the setup change time and the total operating time represents the total time required for the work performed for the production of one type of printed circuit board. If the operator desires a short time, the system configuration can be selected.

  If the operator selects a combination of cycle times, etc. and selects a system configuration, the system configuration for obtaining the cycle time, etc., the contents of the change, and the installation program for each installation module obtained by optimization are output. Is done. These are output to the computer 350 of each of the plurality of mounting modules 12 and 600, for example. You may make it print on a printer. Then, according to the selected system configuration, the feeder 20 and the tray 810 are changed, the parts supply devices 23 and 25 are exchanged, the nozzle accommodating device 752 is exchanged, etc. for the setup change. In the nozzle storage device 752, for example, in the work area outside the mounting system, the type and number of suction nozzles 288 set in the nozzle holding member 940 corresponding to the set configuration are stored and are actually attached to the mounting module. It is replaced with a nozzle housing device 752 that is present.

  It should be noted that the target cycle time used in the configuration change time shortening type configuration change and the target cycle time used in S9 of the configuration change routine may be set to a time that is clearly short and cannot be achieved in practice. By doing so, even if the target cycle time is not achieved, the operator can know the best system configuration, and the present mounting system has the best system configuration acquisition means.

  As is apparent from the above description, in the present embodiment, the part that executes S1 of the system control computer 980 constitutes the target input part and the current configuration information acquisition part, and the part that executes S2 is the priority order changing part. The portion for executing S12 constitutes a unit number increasing portion, the display 984 constitutes an output portion, and the portion for executing S4 constitutes a mounting head selection portion, as well as assumption means, determination means, and determination means A portion for setting the configuration of the nozzle accommodating device in accordance with the change of the mounting head 26 constitutes a head corresponding accommodating device changing unit such as S24 and S60, and executes S21 and S22. The part that forms the feeder sequential addition part, and the part that optimizes the component arrangement and mounting order of S6, S7 and S21 to S25 is a program Additional portions constitute, a portion that executes S11 and constitutes a mounting unit increase in the number determination unit. In addition, the part that executes S10 of the system control computer 980 and the input device 982 constitute an execution mounting system configuration selection unit.

  When changing the configuration of the mounting system, only the configuration change time shortening type configuration change may be performed. In that case, if the target cycle time cannot be achieved even if the type 21 of the mounting head 26 is changed by executing the step change time shortening type configuration change S21 to S25, the mounting modules 12 and 600 may be added. Good. The addition of the mounting module is performed, for example, when the user has an extra mounting module and desires to add it. Whether or not the user has an extra mounting module is checked based on the acquired configuration change information. If there are extra mounting modules 12 and 600 and addition is desired, the mounting modules 12 and 600 are added. For example, a mounting module having the longest cycle time is obtained from the plurality of mounting modules 12 and 600 when the change of the mounting head 26 is completed, and a mounting module having the same configuration as the mounting module is added. A mounting module having the same size and size of the mounting module and having the same type of mounting head 26 and nozzle accommodating device 752 is added, so that the mounting of components by the mounting module with the longest cycle time is shared. Is halved. When the added mounting module is the small mounting module 12, if necessary, a wiring board conveyor is also added so that the wiring board 150 is conveyed.

  Due to the addition of the mounting module, the cycle time of the mounting module that has been the longest in the cycle time is halved. As a result, there are no mounting modules 12,600 whose cycle times exceed the target cycle time for a plurality of mounting modules 12,600. For example, the goal has been achieved, the contents of the setup change including the addition of the mounting module and the cycle time are stored, and the setup change time shortening type configuration change is completed.

  Even if the mounting modules 12 and 600 are added, if the target is not achieved, the configuration change is performed by returning to the all parts removal type change. Parts are allocated with the number of mounted modules increased by one. Then, if the target is achieved, the setup change time shortening type configuration change ends, and if the target is not achieved, the configuration change of the nozzle accommodating device 752 is performed, and if the target is not achieved, The addition of the mounting module is further executed. By adding the mounting module, the configuration change may be made immediately after returning to the all-part removal mold change.

  If the mounting modules 12 and 600 to be added disappear or are not desired by the operator, the setup change time shortening type configuration change ends. In this case, even if the target cycle time is not achieved, a configuration of a mounting system that is possible at present is obtained, and the contents of the setup change are stored in association with the cycle time.

  In the configuration change shortening type configuration change, the parts supply device that each of all the mounting modules actually has is a feeder type supply device. When the supply device is insufficient, a large mounting module may be added. Alternatively, the mounting module may be added when the mounting module is insufficient in changing all parts removal configuration.

  When making a configuration change by shortening the setup time alone, if the goal is not achieved even after making the configuration change to the end, the configuration obtained by the last configuration change can be used as the final configuration change with the best cycle time. Often, the part of the system control computer that performs it constitutes the best configuration selector. Store all configuration changes and cycle times that could not achieve the target at each stage of the setup change time reduction type configuration change, and when it was found that the target could not be achieved with the setup change time reduction type change, the stored multiple The type having the best cycle time may be selected as the final configuration change from among the types of configuration changes. The selection may be performed automatically by a computer, or may be output and made to be performed by an operator.

  As in the above embodiment, when the changeover time shortening type configuration change is performed together with other configuration changes, the changeover time reduction type configuration change is executed to the final stage, and the configuration change and cycle even if the target is not achieved yet It can be considered that the best configuration change selection unit that selects the one having the best cycle time as the final configuration change is to store the time in association with each other.

  After the setup change time shortening type configuration change is completed, either the mounting head selection type configuration change or the mounting module number setting type configuration change may be performed. For example, one is performed based on the operator's selection.

  When changing the configuration of the mounting system, only the mounting head selection type configuration change may be performed. In this case, the number of mounting modules constituting the mounting system can be set as appropriate.

  In the mounting module number setting type configuration change, it is determined whether or not the number of mounting modules is insufficient, and if it is insufficient, the configuration may be changed by adding mounting modules. For example, after calculating the required minimum number of installed modules for each of the three component groups in S53 of the installed module number setting type configuration change, the total number of required small installed modules and the number of large installed modules are respectively compared with the set number. If the required number exceeds the set number, it is added. After the addition, the number of mounted modules for each part group is set in the same manner as in the above embodiment. When adding a mounting module, it is determined whether there is an extra mounting module to be added.

  In the above embodiment, the mounting module includes either one of the feeder-type supply device and the tray-type supply device, but may include both. For example, when the mounting module is a large mounting module, a feeder type supply device having a size for a small mounting module and a tray type supply device that can be installed together with the feeder type supply device are provided.

  The plurality of mounting modules constituting the mounting system may all be the same type of mounting module, and the same type of mounting module may be capable of selectively mounting the feeder-type supply device and the tray-type supply device. .

12: Mounting module 22: Component supply unit 23: Feeder-type supply device 25: Tray-type supply device 26A: High-efficiency mounting head 26B: Intermediate mounting head 26C: General-purpose mounting head 27: Feeder mounting unit 29: Feeder pallet 31: Parts Mounting portion 370: System control device 750: Head mounting portion 752: Nozzle storage device 754: Storage device mounting portion 810: Tray 906: Head fixing device 980: System control computer 982: Input device 984: Display

Claims (11)

A plurality of electronic circuit components each provided with a component supply unit, a circuit board holding unit, and a component mounting unit are mounted on the circuit board held by the circuit board holding unit by the component mounting unit. An electronic circuit component mounting system for mounting electronic circuit components on a single circuit board using the plurality of mounting units in series,
A plurality of types including a general-purpose mounting head and a high-efficiency mounting head that has fewer types of electronic circuit components that can be mounted than the general-purpose mounting head but has excellent mounting efficiency in each of the component mounting portions of the plurality of mounting units. A mounting head selecting unit that can be selectively mounted, and that determines the type of the mounting head used in each of the plurality of mounting units according to a predetermined rule, and the mounting head The head selection unit determines the type of the mounting head so that a printed circuit board to be produced can be produced by the plurality of mounting units , and the number of the general-purpose mounting heads is minimized. An electronic circuit component mounting system characterized by that. The component supply unit of each of the plurality of mounting units includes a plurality of component supply units, and the mounting head selection unit is a component supply unit that supplies a circuit component that can be mounted by the selected mounting head. The plurality of component supply tools are allotted to the plurality of mounting units, and depending on whether or not a component supply tool capable of supplying all types of electronic circuit components can be allocated, 2. The electronic circuit component mounting system according to claim 1 , further comprising means for determining whether or not production is possible. The mounting head selection unit is capable of producing a printed circuit board to be produced, and selects a combination having the shortest cycle time as an optimal combination from among the combinations of mounting heads for the plurality of mounting units. The electronic circuit component mounting system according to claim 1 or 2 . The mounting head selection unit is
(a) All types of electronic circuit components to be mounted on a circuit board at the time of production of a printed circuit board to be produced are placed on at least one of the plurality of mounting units in the general mounting head. A component allocating means for allocating to each of the plurality of mounting units under the assumption that
(b) When all the types of electronic circuit components can be allocated by the component allocation means, it is assumed that the printed circuit board scheduled to be produced can be produced and attached to the component mounting portion. 2. The electronic circuit component mounting system according to claim 1, further comprising: changing a predetermined set number of general-purpose mounting heads to the high-efficiency mounting head and operating the component allocation unit again. 3. . 5. The electronic circuit component mounting system according to claim 4 , wherein the component allocating unit includes a unit that allocates an electronic circuit component having a smaller height to an upstream mounting unit. The component supply part of the plurality of mounting units (a) each accommodates one type of electronic circuit component, a plurality of component feeders to be supplied from a predetermined component supply location, and the component feeder can be attached and detached A feeder type supply device including a feeder holding member for holding; (b) a tray type including a plurality of electronic circuit components each of which is one type each positioned and accommodated; and a tray holding unit for holding these trays An electronic circuit component supplied from the feeder-type supply device among all types of electronic circuit components to be mounted on a circuit board at the time of production of the printed circuit board to be produced. The electronic circuit components supplied from the tray type supply device are mounted on the mounting unit equipped with the feeder type supply device. Electronic circuit component mounting system according to claim 4 or 5 including means for allocating each unit. 7. The electronic circuit component mounting according to claim 4, wherein the mounting head selection unit starts operation from an initial state in which the general-purpose mounting head is mounted on all component mounting units of the plurality of mounting units. system. Each time the electronic circuit component is allocated by the component allocating means, the printed circuit board to be produced can be produced, including calculating means for calculating the cycle time of the electronic circuit component mounting system in each component allocation. The electronic circuit component mounting system according to any one of claims 4 to 7 , further comprising means for determining, as an optimum selection, a combination of component allocation and mounting head having the shortest calculated cycle time within the range. 2. The mounting head selecting section operates on condition that the high-efficiency mounting head is attached to an upstream side of the plurality of mounting units and the general-purpose mounting head is attached to a downstream side. The electronic circuit component mounting system according to any one of Items 8 to 8.   In addition to the condition that the mounting head selection unit can produce the printed circuit board to be produced, the first condition that the target throughput or the target cycle time of the mounting operation can be achieved, or a necessary amount of electronic 10. The electronic circuit component mounting system according to claim 1, wherein the mounting head type is selected so that a second condition that the circuit is assembled at a necessary time is satisfied. The electronic circuit component mounting system according to claim 1, wherein the mounting head selection unit is configured by a computer that performs overall control of the plurality of mounting units.

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