JP5717619B2 - 電子機器ユニット - Google Patents

電子機器ユニット Download PDF

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Publication number
JP5717619B2
JP5717619B2 JP2011276654A JP2011276654A JP5717619B2 JP 5717619 B2 JP5717619 B2 JP 5717619B2 JP 2011276654 A JP2011276654 A JP 2011276654A JP 2011276654 A JP2011276654 A JP 2011276654A JP 5717619 B2 JP5717619 B2 JP 5717619B2
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JP
Japan
Prior art keywords
heat
unit
heat radiating
circuit board
electronic device
Prior art date
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Expired - Fee Related
Application number
JP2011276654A
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English (en)
Japanese (ja)
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JP2013128027A (ja
JP2013128027A5 (enExample
Inventor
武士 坂本
坂本　　武士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2011276654A priority Critical patent/JP5717619B2/ja
Publication of JP2013128027A publication Critical patent/JP2013128027A/ja
Publication of JP2013128027A5 publication Critical patent/JP2013128027A5/ja
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Publication of JP5717619B2 publication Critical patent/JP5717619B2/ja
Expired - Fee Related legal-status Critical Current
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2011276654A 2011-12-19 2011-12-19 電子機器ユニット Expired - Fee Related JP5717619B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011276654A JP5717619B2 (ja) 2011-12-19 2011-12-19 電子機器ユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011276654A JP5717619B2 (ja) 2011-12-19 2011-12-19 電子機器ユニット

Publications (3)

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JP2013128027A JP2013128027A (ja) 2013-06-27
JP2013128027A5 JP2013128027A5 (enExample) 2014-03-27
JP5717619B2 true JP5717619B2 (ja) 2015-05-13

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ID=48778406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011276654A Expired - Fee Related JP5717619B2 (ja) 2011-12-19 2011-12-19 電子機器ユニット

Country Status (1)

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JP (1) JP5717619B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6588253B2 (ja) * 2015-06-30 2019-10-09 Ｎｅｃプラットフォームズ株式会社 筐体構造体およびこれを用いた電子機器
JP6631581B2 (ja) * 2017-04-17 2020-01-15 株式会社デンソー 電子装置
JP7363610B2 (ja) * 2020-03-12 2023-10-18 オムロン株式会社 電源ユニット
CN115855345B (zh) * 2022-11-25 2025-06-06 浙江双友物流器械股份有限公司 一种绑带预紧力监测仪的抽拉式壳体结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121191U (enExample) * 1981-01-21 1982-07-28
JPH0534153Y2 (enExample) * 1989-10-12 1993-08-30
JPH0923082A (ja) * 1995-07-07 1997-01-21 Oki Electric Ind Co Ltd 電子回路ユニットの冷却構造
FR2752661B1 (fr) * 1996-08-23 1998-10-30 Giat Ind Sa Procede de fabrication d'un dispositif de dissipation de l'energie thermique produite par des composants electroniques implantes sur une carte a circuits imprimes, et dispositif ainsi obtenu
JP2002324993A (ja) * 2001-04-24 2002-11-08 Toshiba Corp 電子機器装置
JP2005142349A (ja) * 2003-11-06 2005-06-02 Hitachi Cable Ltd 電子部品の放熱構造
JP2009016605A (ja) * 2007-07-05 2009-01-22 Nec Saitama Ltd 放熱構造体、その製造方法及び放熱構造体を用いた屋内用基地局装置

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Publication number Publication date
JP2013128027A (ja) 2013-06-27

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