JP2013128027A5 - - Google Patents

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Publication number
JP2013128027A5
JP2013128027A5 JP2011276654A JP2011276654A JP2013128027A5 JP 2013128027 A5 JP2013128027 A5 JP 2013128027A5 JP 2011276654 A JP2011276654 A JP 2011276654A JP 2011276654 A JP2011276654 A JP 2011276654A JP 2013128027 A5 JP2013128027 A5 JP 2013128027A5
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JP
Japan
Prior art keywords
heat radiating
heat
unit housing
unit
electronic device
Prior art date
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Application number
JP2011276654A
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English (en)
Japanese (ja)
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JP2013128027A (ja
JP5717619B2 (ja
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Priority to JP2011276654A priority Critical patent/JP5717619B2/ja
Priority claimed from JP2011276654A external-priority patent/JP5717619B2/ja
Publication of JP2013128027A publication Critical patent/JP2013128027A/ja
Publication of JP2013128027A5 publication Critical patent/JP2013128027A5/ja
Application granted granted Critical
Publication of JP5717619B2 publication Critical patent/JP5717619B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011276654A 2011-12-19 2011-12-19 電子機器ユニット Expired - Fee Related JP5717619B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011276654A JP5717619B2 (ja) 2011-12-19 2011-12-19 電子機器ユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011276654A JP5717619B2 (ja) 2011-12-19 2011-12-19 電子機器ユニット

Publications (3)

Publication Number Publication Date
JP2013128027A JP2013128027A (ja) 2013-06-27
JP2013128027A5 true JP2013128027A5 (enExample) 2014-03-27
JP5717619B2 JP5717619B2 (ja) 2015-05-13

Family

ID=48778406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011276654A Expired - Fee Related JP5717619B2 (ja) 2011-12-19 2011-12-19 電子機器ユニット

Country Status (1)

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JP (1) JP5717619B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6588253B2 (ja) * 2015-06-30 2019-10-09 Ｎｅｃプラットフォームズ株式会社 筐体構造体およびこれを用いた電子機器
JP6631581B2 (ja) * 2017-04-17 2020-01-15 株式会社デンソー 電子装置
JP7363610B2 (ja) * 2020-03-12 2023-10-18 オムロン株式会社 電源ユニット
CN115855345B (zh) * 2022-11-25 2025-06-06 浙江双友物流器械股份有限公司 一种绑带预紧力监测仪的抽拉式壳体结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121191U (enExample) * 1981-01-21 1982-07-28
JPH0534153Y2 (enExample) * 1989-10-12 1993-08-30
JPH0923082A (ja) * 1995-07-07 1997-01-21 Oki Electric Ind Co Ltd 電子回路ユニットの冷却構造
FR2752661B1 (fr) * 1996-08-23 1998-10-30 Giat Ind Sa Procede de fabrication d'un dispositif de dissipation de l'energie thermique produite par des composants electroniques implantes sur une carte a circuits imprimes, et dispositif ainsi obtenu
JP2002324993A (ja) * 2001-04-24 2002-11-08 Toshiba Corp 電子機器装置
JP2005142349A (ja) * 2003-11-06 2005-06-02 Hitachi Cable Ltd 電子部品の放熱構造
JP2009016605A (ja) * 2007-07-05 2009-01-22 Nec Saitama Ltd 放熱構造体、その製造方法及び放熱構造体を用いた屋内用基地局装置

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