JP5717619B2 - Electronic equipment unit - Google Patents

Description

  The present invention relates to an electronic device unit having a plug-in structure, and more particularly to a heat dissipation structure for a circuit board.

  In the conventional electronic device unit, the heat generating IC mounted on one surface of the circuit board is disposed so as to contact the inner bottom surface of the unit housing via the heat radiating member, and the heat generated from the heat generating IC is transmitted from the bottom surface of the unit housing. It was the structure which dissipates heat.

  In addition, as another conventional electronic device, a circuit board attached in parallel to one surface of a metal plate via a metal plate having an L-shaped cross section erected on a main body and an insulating sheet attached to the metal plate An example in which a heat sink is attached to the back surface of a metal plate is shown (Patent Document 1).

Further, as another conventional semiconductor package module, a vertically mounted semiconductor device is shown, and a semiconductor device is arranged on both surfaces of a vertically arranged heat transfer plate via a metal plate, and an upper surface of a package including the semiconductor device. Shows an example in which heat radiation fins are arranged in contact with a heat transfer plate (Patent Document 2).

  As another conventional electronic device heat dissipation structure, a plurality of electronic device units are housed in a shelf, and the back side of each unit is formed from a heat transfer plate having a flat outer surface, and an electronic device that requires heat dissipation. An example is shown in which components are attached to the inside of the unit of the heat transfer plate, and the heat transfer plate of each unit is fixed to the flat surface of the radiating fin common to each unit so that its outer surface is in close contact (Patent) Reference 3).

JP 2003-008262 A Japanese Unexamined Patent Publication No. 07-094669 Japanese Unexamined Patent Publication No. 03-036793

  In a conventional electronic device unit, the heat generating IC on the circuit board needs to be brought into contact with the bottom surface of the unit housing via a heat radiating member. Had to be inserted from. Therefore, there has been a problem that the conventional heat dissipation structure cannot be applied to an electronic device unit having a plug-in structure in which a circuit board is inserted into an assembled unit housing from an opening. Further, when the circuit board is replaced, the heat dissipating member is damaged along with the removal of the circuit board, which makes it difficult to replace the circuit board.

  The present invention has been made to solve the above-described problems, and provides an electronic device unit heat dissipation structure in which a circuit board to be mounted can be easily replaced in an electronic device unit having a plug-in structure. Objective.

The electronic device unit according to the present invention includes a unit housing having a front surface opened, a circuit board inserted from the front surface of the unit housing to the inside, a heat generating IC mounted on the circuit substrate, and the heat generating IC. A first heat dissipating surface part contacting via a heat dissipating member, and a second heat dissipating surface part extending to the first heat dissipating surface part and exposed at a back opening provided on the back part of the unit housing. The unit housing has a shape with an open bottom surface, and the first heat radiating surface portion of the heat radiating plate shields the bottom surface portion of the unit housing .

  In the electronic device unit of the present invention, the heat generated from the heat generating IC can be dissipated from the heat sink protruding outside the rear surface of the unit housing via the heat radiating plate. It is possible to realize a structure for plugging in from the front, and the circuit board can be easily replaced. Moreover, since the heat sink protrudes outside from the rear surface of the unit housing, the heat can be efficiently radiated using the outside air of the unit.

It is a disassembled perspective view of the electronic device unit of Embodiment 1 of this invention. It is principal part sectional side view of the electronic device unit of Embodiment 1 of this invention. It is a principal part sectional side view of the electronic device unit of Embodiment 2 of this invention. It is a disassembled perspective view of the electronic device unit of Embodiment 3 of this invention. It is a disassembled perspective view of the electronic device unit of Embodiment 4 of this invention. It is a disassembled perspective view of the electronic device unit of Embodiment 5 of this invention. It is a disassembled perspective view of the electronic device unit which is a comparative example. It is a principal part cross-sectional side view of the electronic device unit which is a comparative example.

Embodiment 1 FIG.
First, as a comparative example, the configuration of an electronic device unit that does not have a front plug-in structure will be described with reference to the exploded perspective view of FIG. 7 and the cross-sectional side view of the main part of FIG.
7 and 8, the unit sheet metal 18 serving as a unit housing has an integral structure that covers the upper surface portion, the back surface portion, and both side surface portions of the box-type unit. The unit sheet metal 19 is configured to cover the front and bottom portions of the box-type unit. A unit housing is constituted by the unit metal plates 18 and 19. A heat generating IC 4 is mounted on the bottom surface side of the circuit board 3 disposed inside the unit housing, and the heat generating IC 4 is in contact with the bottom surface portion on the inner side of the unit sheet metal 19 via a heat radiation rubber (heat radiation member) 8. .
When the electronic device unit as shown in FIGS. 7 and 8 is configured, the heat generated in the heat generating IC 4 is transmitted to the unit metal plate 19 through the heat radiating rubber 8 and is radiated from the bottom surface of the unit casing.

In the heat dissipation structure of the comparative example described above, the heat generating IC 4 on the circuit board 3 must be brought into contact with the bottom surface of the unit sheet metal 19 via the heat dissipating rubber 8, and when the circuit board 3 is mounted on the unit housing, The circuit board 3 must be inserted from the upper side of the unit sheet metal 19. Therefore, there is a problem that this heat dissipation structure cannot be applied to an electronic device unit having a plug-in structure from the front side of the unit housing. Further, when the circuit board 3 is replaced, the circuit board 3 is integrated with the unit sheet metal 19 via the heat radiating rubber 8. Therefore, it is necessary to separate the circuit board 3 and the unit sheet metal 19. There was also a problem of separation accompanied by damage.
In view of this, the present invention proposes a heat dissipation structure for an electronic device unit in which the circuit board to be mounted can be easily replaced in the electronic device unit having a plug-in structure.

Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is an exploded perspective view of an electronic device unit showing Embodiment 1 of the present invention, and FIG. 2 is a side view of the electronic device unit. In FIG. 1, a unit housing (unit sheet metal) 1 has a box shape, and is made of, for example, aluminum. A part of the back surface is opened to provide a back surface opening 1a, and a front surface is It is a shape that is open and has a front opening 1b. The front panel 2 is configured separately from the unit casing 1 so as to close the front opening 1b opened in the unit casing 1. In the unit casing 1, the circuit board 3 supported by the fixing bracket 7 on the front panel 2 is mounted from the front opening 1 b side opened in the unit casing 1. Such a structure in which the circuit board 3 is inserted into the unit housing 1 from the front opening 1b and mounted is called a front plug-in structure.

  A heat generating IC 4 is mounted on the circuit board 3. A heat radiating rubber (corresponding to a heat radiating member. The material is silicone, for example) 8 is brought into close contact with the heat generating IC 4, and an L-shaped heat radiating plate (corresponding to a heat radiating plate. The material is aluminum, for example. The surface parallel to the circuit board 3 (first heat radiating surface portion 5a) is closely attached. Another surface (second heat radiating surface portion 5 b) extending to the first heat radiating surface portion 5 a of the L-shaped heat radiating plate 5 is in close contact with the heat radiating rubber (heat radiating member) 9. The heat dissipating rubber 9 is in close contact with the heat sink 6, and the heat sink 6 protrudes to the outside of the unit casing 1 from the back opening 1 a that is opened at the back of the unit casing 1. In FIG. 1, the heat radiation rubbers 8 and 9 are abbreviated.

  That is, the electronic device unit of the present invention includes a unit housing 1 having a front surface opened, a circuit board 3 inserted into the inside from the front surface of the unit housing 1, a heat generating IC 4 mounted on the circuit substrate 3, a heat generating A first heat dissipating surface part 5a that contacts the IC 4 via the heat dissipating rubber 8, and a second part that extends to the first heat dissipating surface part 5a and is exposed to the back opening 1a provided on the back part of the unit housing 1. The L-shaped heat radiation plate 5 including the heat radiation surface portion 5b is provided.

The L-shaped heat radiating plate 5 has a shape in which a single flat plate is bent at a right angle, and has a first heat radiating surface portion 5a arranged in parallel to the circuit board 3 and an end portion orthogonal to the first heat radiating surface portion 5a. It is the structure including the L-shaped part which consists of the 2nd heat radiating surface part 5b which stood | started up perpendicularly from the top, and block | closed a part of back surface opening part 1a of the unit housing | casing 1. FIG. If there is no problem in heat dissipation, the angle formed by the two heat dissipation surface portions (5a, 5b) may be an angle other than a right angle.
Further, a heat sink 6 is attached to the second heat radiating surface portion 5b of the L-shaped heat radiating plate 5 so as to protrude outward from the rear opening 1a of the unit housing 1, and the heat sink 6 is exposed to an external air current. Become.
A connector for connecting the circuit board 3 is mounted on the inner side of the back surface of the unit housing 1, and the circuit board 3 is also fixed on the back surface of the unit. It will be in the state hold | maintained so that it might become parallel with respect to a bottom face.

As described above, the heat dissipation structure of the electronic device unit of the present invention conducts heat generated from the heat generating IC 4 to the heat sink 6 through the heat dissipation rubbers 8 and 9 and the L-shaped heat dissipation plate 5, so that the rear surface of the unit housing 1. Heat can be efficiently radiated from the side. Further, since the circuit board 3, the heat radiation rubbers 8 and 9, the L-shaped heat radiation plate 5 and the heat sink 6 are integrated, the circuit board 3 can be plugged in from the front opening 1 b of the unit housing 1. is there.
The first embodiment of the present invention can be variously modified without departing from the gist, and can also be used in combination with another embodiment to be described later. For example, although FIG. 2 shows an example in which the heat generating IC 4 is mounted on the lower surface side of the circuit board 3, the heat generating IC 4 may be mounted on the upper surface side of the circuit board 3. Moreover, you may use the adhesive agent which has sufficient thermal conductivity as a thermal radiation member instead of the thermal radiation rubber | gum 8 and 9. FIG.

Embodiment 2. FIG.
FIG. 3 is a cross-sectional side view of an essential part showing an electronic device unit according to Embodiment 2 of the present invention. In the second embodiment, as in the example of the first embodiment, the heat generating IC 4 is mounted on the back surface side of the circuit board 3, and in addition, another heat generating IC 10 is mounted on the upper surface side of the same circuit board 3. Has been.
A heat radiating rubber 11 is in close contact with the upper surface of the heat generating IC 10, and a surface (first heat radiating surface portion 12 a) parallel to the circuit board 3 of the L-shaped heat radiating plate 12 is in close contact with the heat radiating rubber 11. Another surface of the L-shaped heat radiating plate 12 folded (second heat radiating surface portion 12b; orthogonal to the first heat radiating surface portion 12a) is the second surface of the L-shaped heat radiating plate 5 shown in the first embodiment. It arrange | positions in the position adjacent on the same surface as the thermal radiation surface part 5b, these two 2nd thermal radiation surface parts 5b and 12b contact | adhere to the thermal radiation rubber 9, and the heat sink 6 adheres to this thermal radiation rubber 9. Therefore, the heat sink 6 can radiate the heat of the heat generating ICs 4 and 10 from the back side of the unit housing 1 to the outside.

As described above, the electronic device unit according to the second embodiment has a configuration in which the L-shaped heat radiation plates 5 and 12 are respectively disposed on the back surface side and the top surface side of the circuit board 3, and the second heat radiation surface portions 5b and 12b. Is in contact with the heat sink 6 via the heat radiating rubber 9, it is possible to radiate heat from the plurality of L-shaped heat radiating plates 5, 12 with one heat sink 6. Therefore, the heat sink quantity can be reduced and the cost can be reduced.
Note that the present invention can be variously modified without departing from the gist, and can be used in combination with other embodiments. For example, the present invention can be applied to a case where three or more heat generating ICs, a heat radiating rubber, and an L-shaped heat radiating plate are mounted.

Embodiment 3 FIG.
FIG. 4 is an exploded perspective view of the electronic device unit according to Embodiment 3 of the present invention. The unit housing 13 includes an upper surface portion, a rear surface portion, and a side surface portion of a box-type unit. Like the first and second embodiments, the rear surface opening portion 1a in which a part on the rear surface side is opened and the front surface side are opened. The front surface opening 1b is provided, and the bottom surface is opened to provide the bottom surface opening 1c. The L-shaped heat radiating plate 14 has a dimension that spreads over the entire bottom surface of the unit housing 1 so that a surface parallel to the circuit board 3 (first heat radiating surface portion 14a) shields the unit bottom surface side of the circuit board 3. The structure is formed, and the second heat radiating surface portion 14b is folded from the end portion.

With this configuration, the heat dissipation structure of the electronic device unit according to the second embodiment of the present invention protects the circuit board 3 by the L-shaped heat dissipation plate 14 shielding the bottom opening 1c of the unit housing 13. Therefore, the bottom plate of the unit housing 13 is not necessary, and the cost can be reduced. Note that the present invention can be variously modified without departing from the gist, and can be used in combination with other embodiments.

Embodiment 4 FIG.
FIG. 5 is an exploded perspective view of the electronic device unit according to Embodiment 4 of the present invention. In the fourth embodiment, the unit housing 1 has a shape provided with a rear opening 1a and a front opening 1b. The heat radiating plate is a U-shaped heat radiating plate 15 having a U-shaped cross section, and the U-shaped heat radiating plate 15 includes a first heat radiating surface portion 15a that is a surface on the bottom surface side of the circuit board 3. The second heat radiating surface portion 15b, which is a surface that rises vertically from the rear end portion of the first heat radiating surface portion 15a and is exposed to the back surface opening portion 1a of the unit housing 1, and the front surface of the first heat radiating surface portion 15a. The front panel portion 15c, which is a unit front surface that rises vertically from the other end of the unit, is integrated, and the front panel portion 15c shields the front opening 1b of the unit housing 1.

  Thus, since the U-shaped heat radiating plate 15 includes the front panel portion 15c that extends to the first heat radiating surface portion 15a and closes the front surface portion of the unit housing 1, the front panel 2 of the unit housing 1 is included. There is no need to prepare a separate and cost reduction is possible. Further, since the front panel 15c serving as a heat radiating plate is provided on the front surface of the unit casing 1, heat can be efficiently radiated using outside air in the vicinity of the front surface of the unit. Note that the present invention can be variously modified without departing from the gist, and can be used in combination with other embodiments.

Embodiment 5 FIG.
FIG. 6 is an exploded perspective view of an electronic device unit according to Embodiment 5 of the present invention. The unit housing 13 used in the fifth embodiment has a shape in which the front surface and the bottom surface are opened as in the third embodiment. The heat radiation plate is an L-shaped heat radiation plate 16. A first heat radiating surface portion 16a disposed so as to cover the bottom surface opening 1c of the housing 13 and a second heat radiating that rises vertically from an end portion of the surface portion and is exposed from the back surface opening 1a of the unit housing 13. The surface portion 16a is included. In the example of FIG. 6, the front panel 2 is provided as a separate body from the heat sink, and the circuit board 3 and the front panel 2 are fixed by the fixing bracket 7.

  Guide rails 17 are provided on both sides of the lower side of the inner side surface of the unit housing 13, and both end portions of the first heat radiating surface portion 16 a are fitted into the grooves of the guide rail 17, so The circuit board 3 can be easily exchanged by sliding it when the L-shaped heat radiation plate 16 is stored and pulled out to the front side. The circuit board 3 is attached to the L-shaped heat radiation plate 16 via a heat radiation rubber 8 and a heat generation IC 4 (not shown). The circuit board 3 is indirectly held by the unit housing 13 by the guide rail 17. Become. The L-shaped heat radiating plate 16 has a structure in which the lateral width of the surface parallel to the circuit board 3 matches the mounting width of the guide rail 17.

As described above, the first heat radiating surface portion 16a of the L-shaped heat radiating plate 16 is fitted to and held by the guide rails 17 of the unit housing 13, whereby the holding strength of the circuit board 3 can be increased. Since the guide rail 17 serves as a guide when the circuit board 3 is inserted and plug-in is facilitated, the circuit board 3 can be easily replaced.
In the above-described example, an example in which the L-shaped heat sink is used and the front panel 2 is separated is shown. However, as in the case of the fourth embodiment, the U including the heat sink and the front panel portion 15c. It can also be formed in a letter shape. Needless to say, the present invention can be variously modified without departing from the scope of the invention, and can be used in combination with other embodiments.

1, 13 Unit housing (unit sheet metal)
DESCRIPTION OF SYMBOLS 1a Back opening 1b Front opening 1c Bottom opening 2 Front panel 3 Circuit board 4, 10 Heat generation IC
5, 12, 14, 16 L-shaped heat sink (heat sink)
5a, 12a, 14a, 15a, 16a First heat dissipating surface 5b, 12b, 14b, 15b, 16b Second heat dissipating surface 6 Heat sink 7 Fixing bracket 8, 9, 11 Heat dissipating rubber (heat dissipating member)
15 U-shaped heat sink (heat sink)
15c Front panel part 17 Guide rail 18, 19 Unit sheet metal.

Claims (6)

A unit housing having an open front surface, a circuit board inserted from the front surface of the unit housing to the inside, a heat generating IC mounted on the circuit substrate, and a first contacting the heat generating IC via a heat dissipation member A heat radiating plate, and a heat radiating plate that extends to the first heat radiating surface portion and is exposed to a back opening provided on the back surface of the unit housing. The electronic device unit , wherein the body has a shape in which a bottom surface portion is opened, and the first heat radiation surface portion of the heat radiating plate shields the bottom surface portion of the unit casing .   The heat radiating plate includes the first heat radiating surface portion arranged in parallel with the circuit board and the second heat radiating surface portion orthogonal to the first heat radiating surface portion and blocking a part of the rear opening of the unit housing. The electronic device unit according to claim 1, further comprising an L-shaped portion.   3. The electronic device according to claim 1, wherein a heat sink is attached to the second heat radiating surface portion of the heat radiating plate so as to protrude outward from a rear opening portion of the unit housing. unit. The heat dissipation plate, the electronics unit according to one of the upper surface side of the circuit board, from claim 1, characterized in that arranged on each of the back side 3. The heat dissipation plate, said extending in a first radiating surface, the electronics unit according to any one claim from claim 1, wherein 4 comprises a front panel portion which closes the front portion of the unit housing . The end of the first heat radiating surface is fitted to a guide rail provided on the lower end of the inner side surface of the unit housing, and the circuit board is held on the unit housing via the heat radiating plate. 6. The electronic device unit according to claim 1 , wherein the electronic device unit is characterized in that:

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