JP5712315B2 - Electronic unit - Google Patents

Description

  The present invention relates to an electronic unit capable of efficiently dissipating heat in a case housing a unit main body.

  As a conventional electronic unit, there exists a thing of the structure described in patent documents 1-3. The electronic unit described in Patent Document 1 has a structure that suppresses heat radiation to peripheral components of a semiconductor chip by isolating a heat-generating component such as a semiconductor chip and peripheral components with a heat shield.

  In the electronic unit described in Patent Document 2, a heat generating component such as a semiconductor module is disposed on a heat sink (heat dissipating member), a plurality of fins are provided on the heat sink, and the fin is disposed so as to face the air inlet of the case. The heat is transferred to the fins for cooling.

  The electronic unit described in Patent Document 3 has a structure in which a heat-generating component such as a semiconductor chip is attached to a heat sink, the heat sink is disposed so as to face a substrate on which a low heat-resistant component such as a capacitor is disposed, and these are accommodated in a case. Yes. In this structure, the heat of the heat generating component is transferred to the heat sink, thereby reducing the thermal influence on the low heat resistant component on the substrate.

  By combining the above conventional technologies, a substrate on which heat-generating components such as semiconductor chips and low heat-resistant components such as capacitors are arranged, and a heat sink that dissipates heat from the heat-generating components are arranged inside the case, and the heat sink is opened in the case. An electronic unit having a structure facing the air hole is obtained.

  8 and 9 show a conventional electronic unit 100 having such a structure. In the electronic unit 100, as shown in FIG. 8, a heat radiating air hole 115 is formed in one case side wall 111 of the case 110, and the unit main body 160 is accommodated in the case 110.

  As shown in FIG. 9, in the unit main body 160, a heat generating component 130 such as a lead component and a low heat resistant component 140 such as an aluminum electrolytic capacitor are disposed on the substrate 120. A plurality of heat radiating members 150 made of a heat sink are arranged on the substrate 120. The heat dissipating member 150 is disposed on the substrate 120 so as to be located on one case side wall 111 side, that is, on the heat dissipating air hole 115 side, whereby heat of the heat generating component 130 is dissipated through the heat dissipating member 150. Heat is radiated from the air holes 115.

JP 2008-60430 A JP 2007-115844 A JP 2008-130879 A

  However, in the conventional electronic unit 100, the heat radiating member 150 only faces the heat radiating air hole 115, and the heat of the heat radiating member spreads to the surroundings. Therefore, the heat of the heat radiating member 150 is efficiently radiated from the heat radiating air hole 115. There is a limit to this, and there is a problem in that the air inside the case warms and heats the low heat resistant component 140. In particular, in an electronic unit having a small internal volume, the entire air inside the case is likely to be warmed, so that the heat effect on the low heat resistant component 140 is likely to occur.

  Further, in the conventional electronic unit 100, there is a problem that dust or dust entering the inside of the case 110 from the heat radiating air hole 115 adheres to the substrate 120 and causes a short circuit failure or malfunction.

  Therefore, the present invention provides an electronic unit that can efficiently dissipate the heat of the heat radiating member from the heat radiating air hole of the case, and can prevent dust and dirt entering from the heat radiating air hole from adhering to the substrate. The purpose is to do.

The invention according to claim 1 is a unit in which a substrate is provided with a box-shaped case in which air holes for heat dissipation are provided on at least one wall, a heat generating component, a low heat resistance component, and a heat dissipation member that dissipates heat from the heat generating component. and a main body, said unit an electronic unit in which the said heat generating component together with the substrate and the heat radiating member and the low heat-resistance components housed within the case body, disposed between the heat radiation member and the substrate a heat radiation member mounting plate which is, form a heat radiation space together the heat dissipation member and the casing inner wall including a heat radiation member mounting plate and said one wall in which the radiator air holes are formed is surrounded within said casing and partition walls, and having a comprising shielding dusts partition plate from.

  Invention of Claim 2 is the electronic unit of Claim 1, Comprising: The said partition wall has a heat shield which divides the said low heat-resistant component and the other electronic component on the said board | substrate, It is characterized by the above-mentioned. To do.

  The invention according to claim 3 is the electronic unit according to claim 1 or claim 2, wherein the partition wall abuts against the case inner wall forming the heat radiation space and supports the case inner wall. A rib is formed.

  According to the first aspect of the present invention, the heat radiating space surrounding the heat radiating member is formed inside the case by the heat radiating member mounting plate and the partition wall, and the heat radiating space faces the heat radiating air hole. Heat does not spread to the surroundings, and heat can be efficiently radiated from the heat radiating air holes. For this reason, even if it is the internal volume of an electronic unit, favorable heat dissipation can be performed. Further, since the heat radiating member mounting plate is disposed between the substrate and the heat radiating member, dust and dust that have entered the case from the heat radiating air hole do not adhere to the substrate, and the dust and dust are attached. Short failure and malfunction can be prevented.

  According to the invention described in claim 2, in addition to the effect of the invention described in claim 1, since the heat shielding plate partitions the low heat-resistant component from other electronic components such as the heat generating component, the heat of the heat generating component is blocked. It is possible to reduce the thermal influence on the low heat resistant parts.

  According to the third aspect of the invention, in addition to the effects of the first to third aspects of the invention, the supporting ribs formed on the partition wall abut against and support the case inner wall. Even if the hole is formed, the case can be prevented from being bent, and the electronic components inside the case can be protected.

It is the perspective view which saw through the inside of the electronic unit which concerns on 1st Embodiment of this invention. It is a perspective view which shows the state which fractured | ruptured FIG. 1 vertically. It is a perspective view of a unit main body. It is a top view of a unit main body. It is a longitudinal cross-sectional view of a unit main body. It is a perspective view which shows a unit main body from another angle. It is a perspective view of the electronic unit which concerns on 2nd Embodiment of this invention. It is a perspective view which shows the conventional electronic unit. It is a perspective view which shows the state which fractured | ruptured the conventional electronic unit vertically.

  Hereinafter, the present invention will be described in detail with reference to embodiments illustrated in the drawings. In addition, in each embodiment, the same code | symbol is attached | subjected and corresponded to the same member.

[First Embodiment]
1 to 6 show an electronic unit 1 according to a first embodiment of the present invention. FIG. 1 is a perspective view of the interior, FIG. 2 is a perspective view of FIG. FIG. 4 is a plan view of the unit body 2, FIG. 5 is a longitudinal sectional view of the unit body 2, and FIG. 6 is a perspective view showing the unit body 2 from another angle.

  The electronic unit 1 includes a case 3 and a unit main body 2 accommodated in the case 3.

  The case 3 is formed in a box shape by a rectangular case bottom wall 31, four case side walls 32, 32 a, 32 b rising from the periphery of the case bottom wall 31, and a case top wall 33 covering the upper surface. A heat radiating air hole 34 is formed in at least one of the four case side walls (one wall; for example, one case side wall 32a). The heat radiating air hole 34 is formed in a horizontally long shape so as to cross the case side wall 32, and releases the air in the case 1 to the outside and introduces the outside air into the case 1. Thereby, the heat in the case 1 can be radiated to the outside from the heat radiation air hole 34.

  The unit body 2 has a substrate 21. On the front surface side (lower surface side) of the substrate 21, a semiconductor element 22 composed of a semiconductor switching element as one heat generating component is disposed (see FIG. 2). As shown in FIGS. 3 to 6, a lead component 23 such as a coil, an aluminum electrolytic capacitor 24, a heat sink 25, and other electronic components 26 are disposed on the back surface (upper surface) of the substrate 21. The electronic unit 1 performs a predetermined function by connecting the lead component 23, the aluminum electrolytic capacitor 24, and other electronic components 26 by a wiring pattern formed on the substrate 21.

  The lead component 23 is a component that generates heat at a high temperature. Hereinafter, the lead component 23 is referred to as a heat generating component 23. The aluminum electrolytic capacitor 24 is a component having low heat resistance, and the aluminum electrolytic capacitor 24 is hereinafter referred to as a low heat resistant component 24.

  As shown in FIG. 1, the heat sink 25 is arranged on the side of one case side wall 32 a in which a heat radiating air hole 34 is formed. The heat sink 25 has a flat plate shape, and a plurality of the heat sinks 25 are provided in parallel to the direction of air flow from the heat radiation air holes 34. The heat sink 25 is a heat radiating member that radiates heat generated by the heat generating component 23, and hereinafter, the heat sink 25 is referred to as a heat radiating member 25. In this embodiment, the low heat resistant component 24 described above is provided on the substrate 21 so as to be adjacent to the heat radiating member 25 and to be adjacent to the heat generating component 23.

Inside the casing 3, shielding dust partition plate 11 is provided. Shield dust barrier plate 11, the heat radiation member mounting plate 12, it is formed by the partition wall 13.

  As shown in FIGS. 1 and 3, the heat dissipating member mounting plate 12 is mounted on a substrate 21. The heat dissipating member mounting plate 12 includes a flat plate-like main body portion 12a and leg portions 12b extending from the lower surface of the main body portion 12a toward the substrate 21. The leg portions 12b are inserted into the slits of the substrate 21, thereby mounting the heat dissipating member. The mounting plate 12 is fixed to the substrate 21. The main body 12a is provided so as to cover the arrangement area of the heat dissipation member 25 on the substrate 21, and a plurality of heat dissipation members 25 are erected on the upper surface of the main body 12a in parallel. That is, the heat dissipation member mounting plate 12 is disposed between the substrate 21 and the heat dissipation member 25.

  The partition wall 13 is formed integrally with the heat dissipation member mounting plate 12 so as to rise from the heat dissipation member mounting plate 12. The partition wall 13 has a first wall portion 14 and a second wall portion 15.

  The first wall portion 14 rises from the heat radiating member mounting plate 12 so as to extend along the direction in which the plurality of heat radiating members 25 are arranged, and the second wall portion 15 is perpendicular to the end of the first wall portion 14. It stands up from the heat radiation member mounting plate 12 in a bent state.

  The first wall portion 14 of the partition wall 13 is provided so as to sandwich the heat radiating member 25 between the case side wall 32a in which the heat radiating air holes 34 are formed. That is, the first wall portion 14 is provided so as to sandwich the heat radiating member 25 between the case inner wall 35 (see FIGS. 2 and 4) of the one case side wall 32a in which the heat radiating air holes 34 are formed. It is.

The first wall portion 14 is provided between the heat radiating member 25, the heat generating component 23 and the low heat resistant component 24, and isolates the heat radiating member 25 from the heat generating component 23 and the low heat resistant component 24. . The first wall portion 14 isolates the low heat resistant component 24 from the heat radiating member 25, so that the heat from the heat radiating member 25 to the low heat resistant component 24 is provided even if the low heat resistant component 24 is disposed adjacent to the heat radiating member 25. The influence can be reduced.

  The second wall portion 15 is formed to be parallel to the other case side wall 32b while being bent at a right angle from the end portion of the first wall portion. The other case side wall 32b is a side wall to which the unit main body 2 is attached. The unit main body 2 is inserted into the case 3 and functions as a lid member that closes the case 3 after the unit main body 2 is inserted. The 2nd wall part 15 isolates the other side wall 32b and the heat radiating member 25 in the state parallel to the other case side wall 32b.

  The partition wall 13 having the first wall portion 14 and the second wall portion 15 described above forms the heat radiation space 4 surrounding the heat radiation member 25 inside the case 3. In this case, the partition wall 13 is erected on the heat radiating member mounting plate 12 in the region where the heat radiating member 25 is disposed, and the first wall portion 14 of the partition wall 13 is sandwiched between the case inner wall 35 and the heat radiating member 25. Since the second wall portion 15 is provided so as to isolate the heat radiating member 25 and the other case side wall 32b, the heat radiating space 4 is formed by the heat radiating member mounting plate 12 and the heat radiating air hole 34. The heat dissipation member 25 is enclosed with the case inner wall 35 formed.

In the structure in which the heat radiating space 4 surrounding the heat radiating member 25 is formed on the case inner wall 35 side where the heat radiating air hole 34 is formed, the heat from the heat radiating member 25 can be efficiently radiated from the heat radiating air hole 34. Further, in this heat radiation space 4 , since the heat radiation member mounting plate 12 covers the substrate 21, even if dust or dust enters from the heat radiation air hole 34, it does not adhere to the substrate 21. Accordingly, it is possible to prevent a short circuit failure or malfunction due to dust or dust adhesion.

  As shown in FIGS. 1, 3, and 6, the partition wall 13 has a heat shield plate 16. The heat shield plate 16 is erected from the substrate 21 in a state orthogonal to the first wall portion 14 so as to extend in a direction away from the heat radiating member 25 by inserting one end face into the first wall portion 14. . The heat shield plate 16 is disposed so as to partition the low heat resistant component 24 from the heat generating component 23 and other electronic components 26. Since the heat shield plate 16 has a structure in which the low heat resistant component 24 is partitioned from the heat generating component 23 and the like, the heat of the heat generating component 23 is cut off, so that the heat influence on the low heat resistant component 24 may be reduced. it can. For this reason, operation | movement of the low heat-resistant component 24 is securable.

  In this embodiment, as shown in FIGS. 5 and 6, the heat dissipating member mounting plate 12 is formed with an extending portion 11 a extending in the arrangement area of the heat generating component 23, and a base 17 is formed on the extending portion 11 a. Is placed. The pedestal 17 forms part of the partition wall 13, and the above-described heat shield plate 16 is erected integrally on one side of the pedestal 17. On the pedestal 17, a heat generating component 23 made of a lead component is installed. Thus, by extending the partition wall 13 and forming the pedestal 17 on which the heat generating component 23 is installed, a pedestal member for installing the heat generating component 23 becomes unnecessary, and the cost can be reduced. Moreover, since the height of the pedestal 17 can be adjusted and a small surface-mounted component can be arranged in the space below the heat generating component 23, the overall size of the electronic unit 1 can be reduced.

[Second Embodiment]
FIG. 7 shows an electronic unit 41 according to the second embodiment of the present invention. Also in this embodiment, a heat radiating air hole 34 is formed in at least one case side wall (one wall; for example, one case side wall 32a) in the box-shaped case 1, and the unit main body 2 is accommodated in the case 1. The

  The unit body 2 is formed by arranging a heat generating component 23 such as a lead component, a low heat resistant component 24 such as an aluminum electrolytic capacitor, and a plurality of heat radiating members 25 on a substrate 21. The plurality of heat dissipating members 25 are located on the heat dissipating air hole 34 side and are provided so as to be parallel to the air flow direction from the heat dissipating air hole 34.

Further, a dust- shielding partition plate 11 including a heat radiating member mounting plate 12 and a partition wall 13 is provided. The heat radiating member mounting plate 12 is disposed between the substrate 21 and the heat radiating member 25 as in the first embodiment. The heat radiating member mounting plate 12 covers the arrangement area of the heat radiating member 25 on the substrate 21, and the heat radiating member 25 is placed thereon.

  The partition wall 13 has a first wall portion 14 that extends along the direction in which the heat radiating members 25 are arranged, and a second wall portion 15 that extends in the orthogonal direction from the terminal end of the first wall portion 14. The first wall portion 14 is provided so as to sandwich the heat radiating member 25 with the one side wall 32 a in which the heat radiating air holes 34 are formed, and the heat radiating member 25 is separated from the heat generating component 23 and the low heat resistant component 24. It is provided to isolate.

  The partition wall 13 having the first wall portion 14 and the second wall portion 15 forms the heat radiation space 4 surrounding the heat radiation member 25 inside the case 3 as in the first embodiment. As in the first embodiment, the heat radiating space 4 has a structure that surrounds the heat radiating member 25 between the heat radiating member mounting plate 12 and the case inner wall 35 in which the heat radiating air holes 34 are formed. Therefore, the heat from the heat radiating member 25 can be efficiently radiated from the heat radiating air hole 34. In this heat radiating space 34, the heat radiating member mounting plate 12 covers the substrate 21, so even if dust or dust enters from the heat radiating air hole 34, it does not adhere to the substrate 21.

  The partition wall 13 is formed with a heat shield plate 16 extending in a direction away from the heat radiating member 25 in a state orthogonal to the first wall portion 14. The heat shield plate 16 partitions the low heat resistant component 24 from the heat generating component 23 and other electronic components 26. Since heat of the heat generating component 23 is blocked by the heat shield plate 16, heat to the low heat resistant component 24 is obtained. The influence can be reduced.

  In this embodiment, support ribs 18 are formed on the partition wall 13. The support rib 18 is bent at a right angle from the first wall portion 14 so as to extend in the direction of the one case side wall 32a in which the heat radiating air holes 34 are formed. The supporting rib 18 is formed in a frame shape capable of coming into contact with the case inner wall 35 of one case side wall 32a in which the heat radiating air holes 34 are formed. By being formed in a frame shape, the supporting rib 18 is in a penetrating state in the thickness direction. A plurality of supporting ribs 18 are formed in the length direction of the first wall portion 14, and each of them is inserted between the heat radiating members 25. Since the supporting rib 18 has a penetrating frame shape, even if the supporting rib 18 is inserted between the heat radiating members 25, the heat radiating members 25 adjacent on both sides of the supporting rib 18 are blocked by the supporting ribs 18. Absent. For this reason, the heat radiation function of the heat radiation member 25 is not affected.

  When the unit main body 2 is accommodated in the case 3, such support ribs 18 abut against the case inner wall 35 of one case side wall 32 a in which the heat radiating air holes 34 are formed to support the case inner wall 35. For this reason, even if the heat radiating air holes 34 are formed in the case side wall 32a, the supporting ribs 18 support from the inside, so that the bending of the case 3 can be prevented. Since the bending of the case 3 can be prevented, components such as the heat generating component 23 and the low heat resistant component 24 of the unit main body 2 can be protected.

  The present invention is not limited to the above embodiments, and various modifications can be made. For example, the heat radiating air holes 34 may be formed not only in the one side wall 34 a but also in the arrangement region of the heat radiating member 25 in the case top wall 33.

1,41 electronic unit 2 housing 3 Case 4 radiating space 11 shielding the dust barrier plate 12 radiation member mounting plate 13 partition wall 16 the heat shield plate 17 pedestal 18 supporting ribs 21 the substrate 23 heat generating component 24 low heat part 25 radiating member 32a One side wall 34 Heat release air hole

Claims (3)

A box-shaped case provided with at least one air hole for heat dissipation;
And a unit main body and the heat radiating member is provided on the substrate for radiating the heat generating component and the low heat-resistance components of the heat generating component of the heat, the said heat-generating component along with the substrate of the unit body with low heat-resistance component and the heat radiating member An electronic unit housed in the case,
A heat radiation member mounting plate disposed between the heat radiation member and the substrate, both the heat dissipation member and the casing inner wall including a heat radiation member mounting plate and said one wall in which the radiator air hole is formed electronic unit, characterized in that it comprises a partition wall forming the heat dissipation space inside the casing surrounded, the composed shielding dusts partition plate from. The electronic unit according to claim 1,
The electronic unit according to claim 1, wherein the partition wall includes a heat shield plate that partitions the low heat resistant component and another electronic component on the substrate. An electronic unit according to claim 1 or claim 2 ,
2. The electronic unit according to claim 1, wherein the partition wall is formed with a support rib that contacts the inner wall of the case forming the heat radiation space and supports the inner wall of the case.

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