JP6515041B2 - Electronic control unit - Google Patents

Description

  The present invention relates to an electronic control unit that electronically controls a vehicle.

  In recent vehicles, electronic control devices such as an engine control unit and a control unit for an automatic transmission are mounted, and the electronic control device performs electronic control of the vehicle. The electronic control unit accommodates a circuit board on which various electronic components are mounted in a protective space (a space where waterproofing or the like is achieved) formed in a housing formed by joining a plurality of housing members. On the circuit board, in addition to electronic components such as capacitors, heat-generating electronic components (hereinafter referred to as “heat-generating components”) that generate heat during operation such as arithmetic processing unit (CPU), semiconductor switching elements, etc. There is. If the heat generated by the heat generating components is high in the casing, it may lead to malfunction or component breakage, so a structure for radiating heat to the outside is required.

  Conventionally, in order to dissipate the heat inside the casing, there is known a structure in which the heat is conducted to the inner wall surface of the casing member to dissipate the heat from the outer wall surface of the casing member to the atmosphere.

  For example, Japanese Unexamined Patent Publication No. 2012-199451 discloses a structure in which the heat dissipation material 7 fills the space between the electronic components 2a, 2b and 2c mounted on the back surface 3b of the circuit board 3 and the case 5 without a gap. The structure in which a component made of a heat conductive material is interposed between the heat generating component and the surface facing the heat generating component on the inner wall surface side of the casing member is hereinafter referred to as a "component top surface heat dissipation structure".

  Moreover, in Unexamined-Japanese-Patent No. 2015-185755, in the surface on the back side of the mounting surface of the electronic component 10 in the circuit board 20, the structure made to contact | abut to the heat sink 30 via the thermal radiation gel 40 is disclosed. Such a structure in which a component made of a heat conductive material is interposed between the back surface of the mounting surface of the heat generating component and the inner wall surface of the casing member is hereinafter referred to as a "component lower surface heat dissipation structure".

JP, 2012-199451, A JP, 2015-185755, A

  By the way, in order to improve the heat radiation performance, it is desirable to narrow the distance between the heat generating component and the inner wall surface of the casing member as much as possible. However, the height dimension of the heat generating component varies. Due to variations, it is necessary to provide a predetermined clearance between the heat generating component and the inner wall surface of the casing member, and the above-described component top surface heat dissipation structure may not provide sufficient heat dissipation performance. was there.

  Further, in the above-described component lower surface heat dissipation structure, it is not necessary to consider the variation in height dimension of the heat generating component, and it is possible to narrow the space between the back surface of the substrate and the inner wall surface of the casing member as much as possible. In this case, since components can not be mounted on the back surface of the substrate close to the inner wall surface of the housing member, double-sided mounting can not be performed, and a large circuit board is required to mount the same number of components. Had the problem of causing

  An object of the present invention is to provide an electronic control device capable of securing a wide component mountable area of a circuit board while enhancing the heat radiation efficiency.

The present invention is an electronic control device having a circuit board on which a plurality of heat generating components are mounted, and a heat sink promoting heat release by the plurality of heat generating components, in order to achieve the above object. One of the parts is a first heat generating component, and one of the plurality of heat generating components is different from the first heat generating component is a second heat generating component, and the first heat generating component is Mounted on a first surface of the circuit board, the second heat-generating component is mounted on a second surface which is a back surface of the first surface of the circuit board, and the heat sink faces the first surface A first heat conducting member is interposed between the position of the upper surface of the first heat generating component and the heat sink opposed to the position, and the mounting of the second heat generating component on the circuit board A position on the back side of the position and the heat opposite to the position And a second heat conducting member interposed between the tank, the mounting position of the second heat-generating components on the circuit board, the end side der of the circuit board than the mounting position of the first heat-generating components The heat sink is characterized in that the heat sink has a slope closer to the circuit board from the center to the end of the circuit board on the side opposite to the side facing the circuit board .

  According to the present invention, it is possible to provide an electronic control device capable of securing a wide component mountable area of a circuit board while enhancing the heat radiation efficiency.

  Problems, configurations, and effects other than those described above will be apparent from the description of the embodiments below.

FIG. 1 is an exploded perspective view schematically showing a schematic configuration of an electronic control device according to an embodiment of the present invention. FIG. 2 is a rear exploded perspective view of the electronic control device shown in FIG. It is a figure explaining the structure which concerns on Example 1 of this invention, Comprising: (a) is a perspective view of the electronic control unit 100 shown to FIG. 1 and FIG. 2, (b) is an electronic shown to (a). FIG. 2 is a cross-sectional view of the control device 100 taken along the line A-A. It is a figure explaining the structure which concerns on Example 2 of this invention, Comprising: AA sectional drawing of the electronic control apparatus 100 shown to Fig.3 (a). It is a figure explaining the structure which concerns on Example 3 of this invention, Comprising: AA sectional drawing of the electronic control apparatus 100 shown to Fig.3 (a). It is a figure explaining the structure which concerns on Example 4 of this invention, Comprising: AA sectional drawing of the electronic control apparatus 100 shown to Fig.3 (a). It is a figure explaining the structure which concerns on Example 5 of this invention, Comprising: AA sectional drawing of the electronic control apparatus 100 shown to Fig.3 (a). It is a figure explaining the structure which concerns on Example 6 of this invention, Comprising: AA sectional drawing of the electronic control apparatus 100 shown to Fig.3 (a). It is a figure explaining the structure which concerns on Example 7 of this invention, Comprising: AA sectional drawing of the electronic control apparatus 100 shown to Fig.3 (a). It is a figure explaining the structure which concerns on Example 8 of this invention, Comprising: AA sectional drawing of the electronic control apparatus 100 shown to Fig.3 (a). It is a schematic perspective view of the electronic control unit 100 which concerns on Example 9 of this invention. FIG. 7 is a rear view showing the mounting surface of the heat generating component 2 on the circuit board 3 when the heat generating component 2 is mounted on the end side of the circuit board 3; FIG. 18 is a back view showing the mounting surface of the heat generating component 2 on the circuit board 3 in the configuration of the fifth embodiment of FIG. 7;

  Hereinafter, an electronic control unit according to an embodiment of the present invention will be described in detail using the drawings.

  FIG. 1 is an exploded perspective view schematically showing a schematic configuration of an electronic control unit according to an embodiment of the present invention.

  FIG. 2 is a rear exploded perspective view of the electronic control device shown in FIG. 1 as viewed from the rear.

  The electronic control device 100 is, for example, a device mounted on a car and used for electronic control of an engine, a transmission, a brake, etc., and is a rectangular plate-shaped circuit board on which a plurality of electronic components such as heat generating components 1 and 2 are mounted. 3, a connector 4 attached to the circuit board 3 and electrically connecting an electric circuit (not shown) on the circuit board 3 to an external device (not shown), a base 6 in which the circuit board 3 is housed, and a base A cover 5 covering the circuit board 3 housed in 6 and a position between the heat-generating component 1 and the cover 5 and a position facing the mounting position of the heat-generating component 2 and filling the space between the circuit substrate 3 and the cover 5 without a gap The heat conductive material 7 is roughly constituted. In addition to the illustrated electronic components, a plurality of various electronic components (not shown) are mounted on the circuit board 3 in practice.

  The heat-generating component 2 is mounted on the outer peripheral edge of one end (right end in FIG. 1, left end in FIG. 2) of the circuit board 3. The heat-generating component 1 is mounted at a position closer to the center of the substrate than the heat-generating component 2 at one end (right end in FIG. 1, left end in FIG. 2) of the circuit board 3.

  The heat-generating component 1 is mounted on one surface (upper surface in FIG. 1, lower surface in FIG. 2) of the circuit board 3. The heat-generating component 2 is mounted on the other surface of the circuit board 3 (the lower surface in FIG. 1, the upper surface in FIG. 2), that is, the back surface of the surface on which the heat-generating component 1 is mounted. Thus, the circuit board 3 is configured to be capable of double-sided mounting.

  Examples of the heat generating component 1 or the heat generating component 2 mounted on the circuit board 3 include an IC, a FET (field effect transistor), a MOSFET (oxide semiconductor field effect transistor), a transistor, a capacitor, a diode, a resistor and the like.

  The cover 5 and the base 6 constitute a case 8 of the electronic control unit 100, and both the cover 5 and the base 6 have a substantially rectangular plate shape. In the present embodiment, the cover 5 is deeper than the base 6, but it goes without saying that the base 6 may be deeper than the cover 5.

  As shown in FIG. 2, the outer peripheral edge of the inner wall surface of the cover 5 has a circuit board support portion 9 for supporting the circuit board 3. The outer peripheral edge of the circuit board 3 is fixed to the circuit board support 9 by a screw 10. The circuit board 3 can also be fixed to the cover 5 with an adhesive or the like.

  The cover 5 is formed of a metal material excellent in heat dissipation, such as aluminum or iron. When the circuit board 3 is fixed to the cover 5, the space between the upper surface of the heat generating component 1 and the cover 5 is filled with the heat conductive material 7, and the circuit board 3 at a position facing the mounting position of the heat generating component 2. The heat conductive material 7 is also filled between the and the cover 5. The heat transfer material 7 is formed of a heat transfer material having high heat conductivity, and for example, silicone can be used. The heat conductive material 7 may be a material other than silicone, and other high heat conductivity materials may also be used. Moreover, in order to prevent the wiring pattern on the circuit board 3 and the cover 5 from shorting, it is desirable to use an insulator as the heat conductive material 7. The heat conductive material 7 is a heat conductive member made of a material having high heat conductivity.

  The cover 5 also has a function as a heat sink for promoting the heat release by the heat-generating components 1 and 2 mounted on the circuit board 3 in addition to the function as a casing member forming the housing 8. A plurality of heat radiation fins 11 are disposed on the outer wall surface 5 (surface opposite to the surface facing the circuit board 3) to improve the heat radiation efficiency of the cover 5. In the present embodiment, the radiation fin 11 is a flat plate having a plane parallel to a straight line connecting the mounting position of the heat generating component 2 and the mounting position of the heat generating component 1 and perpendicular to the mounting surface of the circuit board 3. , And may have other shapes. Note that the heat sink that promotes the heat radiation of the heat generation components 1 and 2 may be a separate member from the cover 5.

  By configuring as described above, according to the electronic control device 100, the heat generated by the heat generating component 1 dissipates heat by the component top surface heat dissipation structure, and the heat generated by the heat emitting component 2 dissipates heat by the component bottom surface heat dissipation structure. By enabling double-sided mounting of the circuit board 3 while increasing the component size, it is possible to secure a wide component mountable area.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 3 is a diagram for explaining the configuration according to the first embodiment of the present invention, in which (a) is a perspective view of the electronic control device 100 shown in FIG. 1 and FIG. It is AA sectional drawing of the electronic control unit 100 shown to a).

  In the present embodiment, as shown in FIG. 3B, the heat generating component 2 and the heat generating component 1 are mounted in order from the end of the circuit board 3 to the center. A thermally conductive material 7 a is interposed between the position of the back surface of the mounting position of the heat generating component 2 on the circuit board 3 and the cover 5 facing the position. In addition, a thermally conductive material 7c is interposed between the position of the upper surface of the heat-generating component 1 and the cover 5 opposed to this position.

  A plurality of heat dissipating fins 11 are disposed on the outer wall surface of the cover 5, but the wind speed between the heat dissipating fins 11 decreases from the end of the circuit board 3 to the central portion. The heat transmitted to the outside of the housing 8 (the outer wall surface of the cover 5) is more likely to escape to the outside air. Therefore, among the heat generating components of the electronic control device 100, the electronic component having the largest heat generation amount (switching loss etc.) is mounted as the heat generating component 2 at a position close to the end of the circuit board 3 The heat dissipation performance can be effectively enhanced.

  Here, the effect of mounting the heat generating component 2 of the component lower surface heat radiation structure on the end portion side of the circuit board 3 will be further described. FIG. 12 is a rear view showing the mounting surface of the heat generating component 2 on the circuit board 3 when the heat generating component 2 is mounted on the end side of the circuit board 3.

  It is necessary to provide a non-mounting area, which is an area where other parts can not be mounted, around a mounting position of a part due to resist escape or the like.

  When the heat-generating component 2 is mounted on the central portion side of the circuit board 3 as indicated by a broken line in FIG. 12, non-mounting regions n of substantially the same distance exist in all directions of the heat-generating component 2.

  On the other hand, when the heat generating component 2 is mounted on the end 3 a side of the circuit board 3 as shown by the solid line in FIG. 12, there is little clearance at the end 3 a side of the heat generating component 2 and mounting is not possible The area of the region n can be reduced, and the enlargement of the circuit board 3 can be suppressed in the case of mounting the same number of components.

  FIG. 4 is a diagram for explaining the configuration according to the second embodiment of the present invention, and is a cross-sectional view of the electronic control device 100 shown in FIG.

  In the present embodiment, as shown in FIG. 4, the heat-generating component 2 and the heat-generating component 1 are mounted in order from the end of the circuit board 3 to the central portion. A thermally conductive material 7 a is interposed between the position of the back surface of the mounting position of the heat generating component 2 on the circuit board 3 and the cover 5 facing the position. In addition, a thermally conductive material 7c is interposed between the position of the upper surface of the heat-generating component 1 and the cover 5 opposed to this position.

In this embodiment, the position of the upper surface of the heat generating component 1 and the distance between the position and the cover 5 facing it, that is, the thickness of the heat conductive material 7c is t1, and the back surface of the circuit board 3 at the mounting position of the heat generating component 2. , And the distance between this position and the opposing cover 5, that is, when the thickness of the heat conductive material 7a is t2.
t1> t2
And

  The smaller the thickness t2 of the heat conductive material 7a, the smaller the thermal resistance from the heat generating component 2 to the cover 5 can be. Therefore, the heat dissipation performance of the electronic control device 100 can be further improved.

  FIG. 5 is a diagram for explaining the configuration according to the third embodiment of the present invention, and is a cross-sectional view of the electronic control device 100 shown in FIG.

  In this embodiment, the heat generating components 2 (heat generating component 2 a and heat generating component 2 b) of the plurality of component lower surface heat dissipation structures are mounted on the end side of the mounting position of the heat component 1 of the component top surface heat dissipation structure on the circuit board 3. There is.

  In the present embodiment, as shown in FIG. 5, the heat-generating component 2 a, the heat-generating component 2 b, and the heat-generating component 1 are mounted in this order from the end of the circuit board 3 to the center. A thermally conductive material 7a is interposed between the position of the back surface of the mounting position of the heat generating component 2a on the circuit board 3 and the cover 5 opposed to this position. In addition, the heat conductive material 7 b is interposed between the position of the back surface of the circuit board 3 on which the heat generating component 2 b is mounted and the cover 5 opposed to the position. Furthermore, the heat conduction material 7c is interposed between the position of the upper surface of the heat-generating component 1 and the cover 5 opposed to this position.

  A plurality of heat dissipating fins 11 are disposed on the outer wall surface of the cover 5, but the wind speed between the heat dissipating fins 11 decreases from the end of the circuit board 3 to the central portion. The heat transmitted to the outside of the housing 8 (the outer wall surface of the cover 5) is more likely to escape to the outside air. Therefore, by mounting the electronic component with the largest calorific value (switching loss etc.) among the heat generating components of the electronic control device 100 as the heat generating component 2a at a position close to the end of the circuit board 3, The heat dissipation performance can be effectively enhanced.

  In the present embodiment, the cover 5 has a protrusion 5 a protruding toward the circuit board 3 at the position of the cover 5 opposite to the position of the back surface of the circuit board 3 on which the heat generating component 2 b is mounted.

  As a result, the tip end of the projection 5 a of the cover 5 can be brought close to the circuit board 3 to enhance the heat radiation efficiency through the heat conductive material 7 b, and the freedom of the outer shape of the cover 5 can be enhanced.

  Further, a space can be secured on the upper side of the circuit board 3 in the figure between the heat-generating component 2a and the heat-generating component 2b, and the heat-generating component 2a and the heat-generating component 2a A component that does not generate heat, for example, can be mounted between the component 2 and the heat generating component 2b.

  FIG. 6 is a diagram for explaining the configuration according to the fourth embodiment of the present invention, and is a cross-sectional view of the electronic control device 100 shown in FIG.

  In the present embodiment, as shown in FIG. 6, the heat-generating component 2 a, the heat-generating component 2 b, and the heat-generating component 1 are mounted in this order from the end of the circuit board 3 to the center. A thermally conductive material 7a is interposed between the position of the back surface of the mounting position of the heat generating component 2a on the circuit board 3 and the cover 5 opposed to this position. In addition, the heat conductive material 7 b is interposed between the position of the back surface of the circuit board 3 on which the heat generating component 2 b is mounted and the cover 5 opposed to the position. Furthermore, the heat conduction material 7c is interposed between the position of the upper surface of the heat-generating component 1 and the cover 5 opposed to this position.

In this embodiment, the distance between the position on the back surface of the mounting position of the heat generating component 2b in the circuit board 3 and the cover 5 facing this position, ie, the thickness of the heat conductive material 7b is t3. When the distance between the position of the back surface of the mounting position of the component 2a and the cover 5 facing this position, that is, the thickness of the heat conductive material 7a is t4,
t3> t4
And

  The smaller the thickness t4 of the heat conductive material 7a closer to the end portion of the circuit board 3 can reduce the thermal resistance from the heat generating component 2a to the cover 5, the heat dissipation performance of the electronic control device 100 can be further improved.

  FIG. 7 is a diagram for explaining the configuration according to the fifth embodiment of the present invention, and is a cross-sectional view of the electronic control device 100 shown in FIG.

  In this embodiment, as shown in FIG. 7, the heat-generating component 2 a, the heat-generating component 2 b, and the heat-generating component 1 are mounted in this order from the end of the circuit board 3 to the center. A thermally conductive material 7a is interposed between the position of the back surface of the mounting position of the heat generating component 2a on the circuit board 3 and the cover 5 opposed to this position. In addition, the heat conductive material 7 b is interposed between the position of the back surface of the circuit board 3 on which the heat generating component 2 b is mounted and the cover 5 opposed to the position. Furthermore, the heat conduction material 7c is interposed between the position of the upper surface of the heat-generating component 1 and the cover 5 opposed to this position.

  In this embodiment, the position of the cover 5 opposed to the position of the back surface of the mounting position of the heat generating component 2 a in the circuit board 3 and the position of the cover 5 opposed to the position of the back surface of the mounting position of the heat generating component 2 b in the circuit board 3 , Are in the same plane.

  Here, the effects of this embodiment will be described. FIG. 13 is a rear view showing the mounting surface of the heat-generating component 2 on the circuit board 3 in the configuration of the fifth embodiment of FIG.

  It is necessary to provide a non-mounting area, which is an area where other parts can not be mounted, around a mounting position of a part due to resist escape or the like.

  As indicated by a broken line in FIG. 13, the cover 5 faces the back surface of the circuit board 3 at the mounting position of the heat generating component 2 a and the back surface of the circuit board 3 faces the heat mounting component 2 b. When the position 5 is not in the same plane, or when the heat generating components 2a and 2b are mounted on the central portion side of the circuit board 3, the four sides of the heat generating component 2a and the four sides of the heat generating component 2b respectively There is an unimplemented area n of the same distance.

  On the other hand, as shown by the solid line in FIG. 13, the position of the cover 5 opposite to the position of the back surface of the mounting position of the heat generating component 2 a on the circuit board 3 and the back surface of the mounting position of the heat generating component 2 b on the circuit board 3 When the heat generating components 2a and 2b are mounted on the end 3a side of the circuit board 3 when the position and the position of the cover 5 opposed to each other are on the same plane, the side of the heat generating component 2a on the end 3a side Since the cover 5 side is the same plane, the influence of variations in the component mounting position can be reduced, and the mounting positions of the heat generating components 2a and 2b can be made closer to each other. In the case of mounting the same number of parts, it is possible to suppress the increase in size of the circuit board 3.

  FIG. 8 is a diagram for explaining the configuration according to the sixth embodiment of the present invention, and is a cross-sectional view of the electronic control device 100 shown in FIG.

  In the present embodiment, as shown in FIG. 8, the heat-generating component 2 a, the heat-generating component 2 b, and the heat-generating component 1 are mounted in this order from the end of the circuit board 3 to the center. A thermally conductive material 7a is interposed between the position of the back surface of the mounting position of the heat generating component 2a on the circuit board 3 and the cover 5 opposed to this position. In addition, the heat conductive material 7 b is interposed between the position of the back surface of the circuit board 3 on which the heat generating component 2 b is mounted and the cover 5 opposed to the position. Furthermore, the heat conduction material 7c is interposed between the position of the upper surface of the heat-generating component 1 and the cover 5 opposed to this position.

In this embodiment, when the contact area of the circuit board 3 with the heat conductive material 7a is s1, and the contact area of the circuit board 3 with the heat conductive material 7b is s2,
s1> s2
And

  Since the contact area is wider at the end portion side of the circuit board 3, the thermal resistance is small, and the heat dissipation efficiency can be enhanced.

  FIG. 9 is a diagram for explaining the configuration according to the seventh embodiment of the present invention, and is a cross-sectional view of the electronic control device 100 shown in FIG.

  In this embodiment, the heat generating components 2 of the lower surface heat dissipation structure of a plurality of component lower surface heat radiation structures (heat generation closer to the end than the mounting positions of the heat generating components 1 (heat generating components 1a and 1b) of the plurality of component top surface heat dissipation structures. The component 2a and the heat generating component 2b) are mounted.

  In the present embodiment, as shown in FIG. 9, the heat-generating component 2a, the heat-generating component 2b, the heat-generating component 1a, and the heat-generating component 1b are mounted in this order from the end of the circuit board 3 to the center. A thermally conductive material 7a is interposed between the position of the back surface of the mounting position of the heat generating component 2a on the circuit board 3 and the cover 5 opposed to this position. In addition, the heat conductive material 7 b is interposed between the position of the back surface of the circuit board 3 on which the heat generating component 2 b is mounted and the cover 5 opposed to the position. In addition, a thermally conductive material 7c is interposed between the position of the upper surface of the heat generating component 1a and the cover 5 opposed to this position. Furthermore, a thermally conductive material 7d is interposed between the position of the upper surface of the heat generating component 1b and the cover 5 opposed to this position.

  A plurality of heat dissipating fins 11 are disposed on the outer wall surface of the cover 5, but the wind speed between the heat dissipating fins 11 decreases from the end of the circuit board 3 to the central portion. The heat transmitted to the outside of the housing 8 (the outer wall surface of the cover 5) is more likely to escape to the outside air. Therefore, by mounting the electronic component with the largest calorific value (switching loss etc.) among the heat generating components of the electronic control device 100 as the heat generating component 2a at a position close to the end of the circuit board 3, The heat dissipation performance can be effectively enhanced.

  FIG. 10 is a diagram for explaining the configuration according to the eighth embodiment of the present invention, and is a cross-sectional view of the electronic control device 100 shown in FIG.

  In the present embodiment, as shown in FIG. 10, the heat-generating component 2 and the heat-generating component 1 are mounted in order from the end of the circuit board 3 to the central portion. A thermally conductive material 7 is interposed between the position of the back surface of the mounting position of the heat generating component 2 on the circuit board 3 and the cover 5 facing the position. In addition, a thermally conductive material 7 is interposed between the position of the upper surface of the heat-generating component 1 and the cover 5 opposed to this position.

  In the present embodiment, the side of the cover 5 opposite to the circuit board 3 has a slope 12 which is a slope approaching the circuit board 3 from the center to the end of the circuit board 3.

  With such a configuration, the outside air can easily flow from the end side of the circuit board 3 to the center side, a decrease in wind speed can be reduced, and the heat radiation efficiency can be enhanced.

  Even when the vehicle travels on a snowy road, etc. and the snow melting agent is touched on the side opposite to the circuit board 3 in the cover 5, that is, on the outer side, the outer side is directed from the center to the end of the circuit board 3. By having a slope close to the circuit board 3, for example, salt water contained in the snow melting agent is unlikely to stay at the center and easily flow out, so, for example, the drainage property of liquid such as salt water staying between flat radiation fins 11 , And the cover 5 is less likely to rust and to be less likely to be soiled.

  FIG. 11 is a schematic perspective view of an electronic control unit 100 according to a ninth embodiment of the present invention.

  In FIG. 3A, the cover 5 of the electronic control unit 100 has a shape having a plurality of flat radiation fins 11, but in the present embodiment, the cover 5 of the electronic control unit 100 has a plurality of projecting shapes. The radiation fins 13 are provided. Each of the radiation fins 13 is a substantially cylindrical protrusion, but may be a protrusion of any shape such as a prism, a cone, or a pyramid.

  According to the present embodiment, not only the flow of the outside air in the direction parallel to the plane of the flat plate in the radiation fin 11 but the flow of the outside air in all directions can be made to flow between the plurality of radiation fins 13. The heat dissipation performance of the device 100 can be effectively enhanced.

<Supplementary Note>
The embodiment described above is
1.
An electronic control device, comprising: a circuit board on which a plurality of heat generating components are mounted; and a heat sink that promotes heat radiation of the plurality of heat generating components,
One of the plurality of heat generating components is a first heat generating component,
One of the plurality of heat generating components different from the first heat generating component is a second heat generating component,
A first thermally conductive material is interposed between the position of the upper surface of the first heat generating component and the heat sink opposite to the position;
A second thermally conductive material is interposed between the position of the back surface of the mounting position of the second heat-generating component on the circuit board and the heat sink opposed to the position.
The mounting position of the second heat generating component on the circuit board is on the end side of the circuit board with respect to the mounting position of the first heat generating component.
As an electronic control unit characterized by
An electronic control device capable of securing a wide component mountable area of the circuit board while improving the heat dissipation efficiency can be provided.
-The heat sink (for example, cover 5) of the edge part side of a circuit board can be closely approached to a circuit board more, and heat dissipation efficiency can be improved.
Electronic components can be mounted on both sides of the circuit board, and a wide component mountable area can be secured.

In the present embodiment,
2.
1. In the electronic control device described in
The distance between the position of the top surface of the first heat generating component and the heat sink opposite to the position is a first distance,
The distance between the position on the back surface of the mounting position of the second heat-generating component on the circuit board and the heat sink opposite to the position is a second distance,
The second distance is shorter than the first distance,
As an electronic control unit characterized by
The heat sink on the end side of the circuit board can be closer to the circuit board to enhance the heat dissipation efficiency.

In the present embodiment,
3.
1. In the electronic control device described in
The heat sink also serves as a casing member forming a casing of the electronic control device.
As an electronic control unit characterized by
The number of parts can be reduced as compared to the case where the casing member and the heat sink are separate members, and the heat dissipation efficiency can be further enhanced by exposing the heat sink to the outside of the casing.

In the present embodiment,
4.
1. In the electronic control device described in
The heat generating component having the largest heat generation amount among the plurality of heat generating components is mounted on the most end side of the circuit board than the other heat generating components of the plurality of heat generating components.
As an electronic control unit characterized by
The most end side of the circuit board can be more easily exposed to the outside air, and the heat generated by the heat generating component having the largest amount of heat generation can be dissipated more effectively.
5.
1. In the electronic control device described in
One of the plurality of heat generating components different from the first heat generating component and the second heat generating component is a third heat generating component,
A third thermally conductive material is interposed between the position of the back surface of the mounting position of the third heat-generating component on the circuit board and the heat sink opposed to the position.
The mounting position of the third heat generating component on the circuit board is on the end side of the circuit board relative to the mounting position of the first heat generating component.
As an electronic control unit characterized by
A plurality of heat generating components can be mounted on the end side of the circuit board with a component lower surface heat dissipation structure to further enhance the heat dissipation efficiency.

In the present embodiment,
6.
5. In the electronic control device described in
The distance between the position on the back surface of the mounting position of the second heat-generating component on the circuit board and the heat sink opposite to the position is a second distance,
The distance between the position of the back surface of the mounting position of the third heat-generating component on the circuit board and the heat sink opposite to the position is a third distance,
The mounting position of the second heat generating component on the circuit board is on the end side of the circuit board with respect to the mounting position of the third heat generating component,
The second distance is shorter than the third distance,
As an electronic control unit characterized by
The heat sink on the more end side of the circuit board can be closer to the circuit board to enhance the heat dissipation efficiency.

In the present embodiment,
7.
5. In the electronic control device described in
The contact area of the circuit board with the second heat transfer material is a second area,
The contact area of the circuit board with the third heat transfer material is a third area,
The mounting position of the second heat generating component on the circuit board is on the end side of the circuit board with respect to the mounting position of the third heat generating component,
The second area is larger than the third area,
As an electronic control unit characterized by
Since the contact area is wider on the end side of the circuit board, the thermal resistance is smaller and the heat radiation efficiency can be enhanced.

In the present embodiment,
8.
1. In the electronic control device described in
One of the plurality of heat generating components different from the first heat generating component and the second heat generating component is a fourth heat generating component,
A fourth thermally conductive material is interposed between the position of the upper surface of the fourth heat generating component and the heat sink opposite to the position;
The mounting position of the second heat generating component on the circuit board is on the end side of the circuit board with respect to the mounting position of the fourth heat generating component.
As an electronic control unit characterized by
-A plurality of heat generating components can be mounted on the central portion side of the circuit board by the component top surface heat dissipation structure, and the mountable area can be further expanded.

In the present embodiment,
9.
1. In the electronic control device described in
The heat sink has a protrusion projecting toward the circuit board at a position of the heat sink opposite to the position of the back surface of the mounting position of the second heat generating component on the circuit board.
As an electronic control unit characterized by
The tip of the protrusion of the heat sink can be brought close to the circuit board to improve the heat radiation efficiency, and the freedom of the outer shape of the heat sink can be enhanced.

In the present embodiment,
10.
1. In the electronic control device described in
The side of the heat sink opposite to the circuit board has a slope that approaches the circuit board from the center to the end of the circuit board.
As an electronic control unit characterized by
The external air can easily flow from the end side of the circuit board to the central side, and the heat radiation efficiency can be enhanced.
・ Even if the vehicle travels on a snowy road, etc., even if the snow melting agent is touched on the side opposite to the circuit board in the heat sink, that is, on the outer side, Since the salt water contained in the snow melting agent is unlikely to stay at the center and easily flow out to the outside by having an inclination to approach, the heat sink can be resistant to rust and dirt.

In the present embodiment,
11.
1. In the electronic control device described in
It has a radiation fin on the side opposite to the circuit board in the heat sink,
As an electronic control unit characterized by
・ The heat dissipation efficiency can be further improved.

  The present invention is not limited to the embodiments described above, but includes various modifications. For example, the embodiments described above are described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the configurations described. Also, part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. In addition, with respect to a part of the configuration of each embodiment, it is possible to add, delete, and replace other configurations.

  DESCRIPTION OF SYMBOLS 100 ... Electronic control apparatus, 1 ... Heating component, 2 ... Heating component, 3 ... Circuit board, 3a ... End part, 4 ... Connector, 5 ... Cover, 6 ... Base, 7 ... Thermal conduction material, 8 ... Housing | casing, 9 ... Circuit board support portion, 10 ... Screw, 11 ... Heat radiation fin, 12 ... Inclined portion, 13 ... Heat radiation fin, n ... Component mounting impossible area.

Claims (11)

An electronic control device, comprising: a circuit board on which a plurality of heat generating components are mounted; and a heat sink that promotes heat radiation of the plurality of heat generating components,
One of the plurality of heat generating components is a first heat generating component,
One of the plurality of heat generating components different from the first heat generating component is a second heat generating component,
The first heat-generating component is mounted on a first surface of the circuit board,
The second heat-generating component is mounted on a second surface which is a back surface of the first surface of the circuit board,
The heat sink is disposed opposite to the first surface,
A first heat conducting member is interposed between the position of the upper surface of the first heat generating component and the heat sink opposite to the position;
A second heat conducting member is interposed between the position of the back surface of the mounting position of the second heat-generating component on the circuit board and the heat sink opposed to the position.
Mounting position of the second heat-generating components in the circuit board, Ri end portion der of the circuit board than the mounting position of the first heat-generating components,
The heat sink has a slope which approaches the circuit board from the center to the end of the circuit board on the side opposite to the side facing the circuit board.
An electronic control unit characterized by In the electronic control unit according to claim 1,
The distance between the position of the top surface of the first heat generating component and the heat sink opposite to the position is a first distance,
The distance between the position on the back surface of the mounting position of the second heat-generating component on the circuit board and the heat sink opposite to the position is a second distance,
The second distance is shorter than the first distance,
An electronic control unit characterized by In the electronic control unit according to claim 1,
The heat sink also serves as a casing member forming a casing of the electronic control device.
An electronic control unit characterized by In the electronic control unit according to claim 1,
The heat generating component having the largest heat generation amount among the plurality of heat generating components is mounted on the most end side of the circuit board than the other heat generating components of the plurality of heat generating components.
An electronic control unit characterized by In the electronic control unit according to claim 1,
One of the plurality of heat generating components different from the first heat generating component and the second heat generating component is a third heat generating component,
A third heat conducting member is interposed between the position of the back surface of the mounting position of the third heat-generating component on the circuit board and the heat sink opposed to the position.
The mounting position of the third heat generating component on the circuit board is on the end side of the circuit board relative to the mounting position of the first heat generating component.
An electronic control unit characterized by In the electronic control unit according to claim 5,
The distance between the position on the back surface of the mounting position of the second heat-generating component on the circuit board and the heat sink opposite to the position is a second distance,
The distance between the position of the back surface of the mounting position of the third heat-generating component on the circuit board and the heat sink opposite to the position is a third distance,
The mounting position of the second heat generating component on the circuit board is on the end side of the circuit board with respect to the mounting position of the third heat generating component,
The second distance is shorter than the third distance,
An electronic control unit characterized by In the electronic control unit according to claim 5,
The contact area of the circuit board with the second heat conducting member is a second area,
The contact area of the circuit board with the third heat conducting member is a third area,
The mounting position of the second heat generating component on the circuit board is on the end side of the circuit board with respect to the mounting position of the third heat generating component,
The second area is larger than the third area,
An electronic control unit characterized by In the electronic control unit according to claim 1,
One of the plurality of heat generating components different from the first heat generating component and the second heat generating component is a fourth heat generating component,
A fourth heat conducting member is interposed between the position of the upper surface of the fourth heat generating component and the heat sink opposite to the position;
The mounting position of the second heat generating component on the circuit board is on the end side of the circuit board with respect to the mounting position of the fourth heat generating component.
An electronic control unit characterized by In the electronic control unit according to claim 1,
The heat sink has a protrusion projecting toward the circuit board at a position of the heat sink opposite to the position of the back surface of the mounting position of the second heat generating component on the circuit board.
An electronic control unit characterized by In the electronic control unit according to claim 1,
The heat sink has a radiation fin on the side opposite to the side facing the circuit board,
An electronic control unit characterized by In the electronic control unit according to claim 10,
The heat dissipating fin is a plurality of columnar protrusions.
An electronic control unit characterized by

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