JP2013093378A - Electronic controller - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic controller which can be made compact and in which heat dissipation is enhanced.SOLUTION: The electronic controller includes a circuit board 2 having a wiring pattern, and at least a pair of heat-generating electronic components 5A, 5B out of a plurality of heat-generating electronic components mounted on the circuit board 2 contiguously to each other. The heat-generating electronic components 5A, 5B are constituted by extending a lead 9 for electrical and mechanical connection with the circuit board 2 to one side, and extending a metal plate 10 for heat dissipation to the other side. The pair of heat-generating electronic components 5A, 5B mounted contiguously to each other are arranged so that the lead 9 and the metal plate 10 for heat dissipation are directed in a direction intersecting the adjoining direction, and the directions of the lead 9 and the metal plate 10 are reversed from each other.

Description

The present invention relates to an electronic control device.

In recent years, the number of electronic control devices installed in automobiles tends to increase as the required functions increase. However, the space in which the electronic control device is arranged tends to decrease due to the necessity of expanding the passenger compartment space. Therefore, downsizing of the electronic control device is strongly desired. However, if the electronic control device is downsized, there is a concern about deterioration of heat dissipation due to high density of circuits.

Against this background, conventionally, for example, in FIG. 1 of Patent Document 1, when a plurality of power MOSFETs (electronic components) are mounted on a resin substrate (circuit board), the terminals are directed to the opposite sides. A structure is disclosed that is disposed facing each other in a state.
FIG. 5 of Patent Document 2 discloses a technique in which a heat conduction suppression unit is provided between adjacent MOSs to suppress thermal interference between the MOSs.

JP 2010-245174 A JP 2011-23593 A

However, in the structure described in Patent Document 1, since the power MOSFETs are arranged so as to face each other, the metal bases responsible for the heat dissipation function also extend from the power MOSFETs, and a part thereof faces each other. Therefore, there is a concern that heat released from the metal bases facing each other stays between the power MOSFETs, so that the heat dissipation performance is lowered.
Moreover, in the structure described in the said patent document 2, since the heat conduction suppression part is provided between adjacent MOS, the space for a heat conduction suppression part is needed extra, and size reduction of an electronic control apparatus is prevented. It will be a factor.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic control device that enables downsizing and improved heat dissipation.

An electronic control device of the present invention is an electronic control device comprising a circuit board having a wiring pattern and a plurality of heat generating electronic components mounted adjacent to each other on the circuit board,
The heat generating electronic component is configured by extending a lead electrically and mechanically connected to the circuit board on one side and extending a metal plate for heat dissipation on the other side,
Of the plurality of heat-generating electronic components mounted adjacent to each other, at least a pair of heat-generating electronic components have the leads and the heat-dissipating metal plate directed in a direction intersecting the adjacent directions, and the leads and the The heat dissipating metal plates are disposed so that the directions thereof are opposite to each other.

  In the electronic control device, at least a pair of heat generating electronic components among the plurality of heat generating electronic components mounted adjacent to each other includes the lead and the heat radiating metal plate in a direction perpendicular to the adjacent direction. It is preferable that it is arranged facing.

  Further, in the electronic control device, it is preferable that the plurality of heat generating electronic components are arranged at an end portion of the mounting area of the circuit board.

In the electronic control device, the circuit board is provided with a heat conduction path means that is provided on a surface of the circuit board and inside the circuit board and conducts heat generated by the heat generating electronic component. Is preferred.
The heat conduction path means preferably includes a through hole that penetrates from the front surface to the back surface of the circuit board and is connected to the wiring pattern.

According to the electronic control device of the present invention, among a plurality of heat generating electronic components mounted adjacent to each other, at least a pair of heat generating electronic components, the lead and the heat radiating metal plate are directed in a direction intersecting the adjacent direction, And it arrange | positions so that the direction to which a lead | read | reed and the metal plate for thermal radiation face may mutually become reverse. Thereby, the heat radiation area is larger than that of the leads, and therefore the central portion of the heat radiating metal plate having a large heat radiation capacity is arranged in a state shifted by a certain distance in the direction orthogonal to the adjacent direction. Therefore, the flow of heat released through the leads and the heat radiating metal plate is also shifted by a certain interval. Therefore, since the heat interference part formed by the heat emitted from the pair of heat generating electronic components can be reduced as compared with the conventional case, the heat retention is suppressed and the heat dissipation is improved.
In addition, by arranging the pair of heat generating electronic components in the opposite directions and arranging them adjacent to each other, the connection distance of the wiring patterns (not shown) on each surface including the inner layer connecting the pair of heat generating electronic components can be shortened. Since the mounting area of the substrate can be used efficiently without waste, downsizing is possible.

It is a disassembled perspective view which shows schematic structure of one Embodiment of the electronic control apparatus of this invention. It is a principal part top view of a circuit board. It is a figure which shows the circuit board which concerns on other embodiment of the electronic control apparatus of this invention, Comprising: (a) is a principal part top view which shows the state which mounted the heat generating electronic component, (b) mounts a heat generating electronic component. It is a principal part top view which shows the previous state.

Hereinafter, an electronic control device according to the present invention will be described with reference to the drawings. In the following drawings, the scale of each member is appropriately changed in order to make each member a recognizable size.
FIG. 1 is an exploded perspective view showing a schematic configuration of an embodiment of an electronic control device according to the present invention. Reference numeral 1 in FIG. 1 denotes an electronic control unit (ECU) for an automobile.
The electronic control device 1 includes a circuit board 2, a metal case 3 that accommodates and holds the circuit board 2, and a metal cover 4 that is attached to the case 3. The case 3 and the cover 4 form a housing that accommodates the circuit board 2.

  The circuit board 2 has a plurality of heat generating electronic components 5A and 5B (not shown except 5A and 5B) mounted as electronic components on the upper surface, a large electronic component 6 and a connector 7 mounted on the lower surface, and an inner layer. It is a substantially rectangular printed board in which a wiring pattern (not shown) is formed on each surface. The heat generating electronic components 5A and 5B are configured to generate a large amount of heat when a current flows, for example, a transistor or a diode. The large electronic component 6 is made larger than the heat generating electronic components 5A and 5B, such as a capacitor and a coil.

The heat generating electronic components 5A and 5B are arranged near the corner portion on the one long side 2a side of the circuit board 2, and as shown in FIG. 2, the end of a substantially rectangular mounting region 2b provided on the circuit board 2 Are arranged adjacent to each other (peripheral part). In the present embodiment, the heat generating electronic component 5A disposed on the corner portion side of the one long side 2a of the circuit board 2 is a diode, and the heat generating electronic component 5B disposed on the central portion side from this is the transistor ( MOSFET). However, the heat generating electronic components 5A and 5B arranged in this way may of course be made of heat generating electronic components other than transistors and diodes.

Each of these heat generating electronic components 5A and 5B incorporates elements constituting a diode and a transistor in a package 8 having a rectangular shape in plan view, and further extends a plurality of leads 9 on one side (one side) of the package 8, A heat radiating metal plate 10 is extended to the side (side opposite to the one side). The heat radiating metal plate 10 is a rectangular plate made of a metal such as copper, and is fixed to the bottom surface of the package 8 so that one side extends from the other side of the package 8 in a plan view. Yes.

The heat radiating metal plate 10 may be configured to be accommodated in the package 8 and a part of the metal plate 10 to be extended from the other side of the package 8. In addition, the heat radiating metal plate 10 also functions as a terminal in the present embodiment. However, it may function only as a heat sink without functioning as a terminal.

In the present embodiment, the heat generating electronic components 5A and 5B are adjacent to each other in the direction indicated by X in FIG. 2, and the lead 9 and the heat radiating metal plate 10 extending from the package 8 in the Y direction orthogonal to the X direction. It is arranged facing. Further, in the pair of heat generating electronic components 5A and 5B, the directions in which the lead 9 and the heat radiating metal plate 10 face are opposite to each other.

That is, the heat generating electronic component 5A extends the lead 9 toward the side opposite to one long side 2a of the circuit board 2 (hereinafter referred to as Y1 direction), and the heat radiating metal plate 10 is extended to one length of the circuit board 2. It extends toward the side 2a (hereinafter referred to as Y2 direction). Further, the heat generating electronic component 5B extends the lead 9 in the Y2 direction, and extends the heat radiating metal plate 10 in the Y1 direction.

  Further, circuit patterns 11A and 11B made of the wiring patterns are formed on the upper surface of the circuit board 2 on which the heat generating electronic components 5A and 5B are mounted. A heat generating electronic component 5A is connected to the circuit pattern 11A, and a heat generating electronic component 5B is connected to the circuit patterns 11A and 11B. That is, the heat generating electronic component 5 </ b> A is electrically and mechanically connected to the circuit pattern 11 </ b> A via the heat radiating metal plate 10. The lead 9 of the heat generating electronic component 5A is electrically and mechanically connected to another wiring pattern (not shown) on the circuit board 2. The heat generating electronic component 5 </ b> B is electrically and mechanically connected to the circuit pattern 11 </ b> A via the leads 9, and electrically and mechanically connected to the circuit pattern 11 </ b> B via the heat radiating metal plate 10.

As shown in FIG. 1, the large electronic component 6 is disposed at the end of the lower surface of the circuit board 2 opposite to the long side 2 a.
The connector 7 is made of, for example, a high thermal conductive resin such as PBT or PPS, and is arranged on the long side where the large electronic component 6 is arranged, from the back side to the front side of the circuit board 2. The two circuit board fixing screws are fixed to the circuit board 2 by screws.
The circuit board 2 has an outer end portion on one long side 2a side where the heat generating electronic components 5A and 5B are arranged, and a substantially central portion on the other long side side where the large electronic component 6 is arranged. A total of four screw holes 12 for fixing the circuit board 2 to the case 3 are formed.

The case 3 is made of metal such as iron or aluminum, which accommodates and holds the circuit board 2 inside. The case 3 has a substantially rectangular accommodating space that substantially coincides with the circuit board 2 in plan view, and accommodates the large electronic component 6 at a position corresponding to the large electronic component 6 in the accommodating space. A large-sized electronic component housing portion 13 is formed.
In addition, a heat radiating base 14 is formed in the case 3 adjacent to the large electronic component housing portion 13.

  The heat dissipating base 14 is formed and arranged at a corner portion (corner portion) corresponding to the heat generating electronic components 5A and 5B of the circuit board 2, and protrudes above the bottom surface of the case 3, that is, toward the circuit board 2 side. Is formed. Accordingly, a pedestal surface 14a is formed on the heat radiating base 14 at a position sufficiently higher than the bottom surface of the case so as to correspond to the heat generating electronic components 5A and 5B.

  A heat conductive material 15 is provided on the pedestal surface 14a. The heat conducting material 15 is in contact with the circuit board 2, and is thus disposed in contact with the heat generating electronic components 5 </ b> A and 5 </ b> B with the circuit board 2 interposed therebetween. As the heat conductive material 15, a conventionally known material such as a grease-like material or an elastically deformable sheet-like material is used. By contacting the heat generating electronic components 5A and 5B on the circuit board 2 through such a heat conductive material 15, the heat dissipation base 11 releases the heat generated by the heat generating electronic components 5A and 5B to the outside of the case 3. The performance deterioration due to the temperature rise of the heat generating electronic components 5A and 5B is suppressed.

Here, when a grease-like material is used as the heat conducting material 15, the heat conducting material 15 adheres well to the circuit board 2 due to its plasticity, so that the heat generating electronic components 5A and 5B on the circuit board 2 and the heat dissipating base The thermal conductivity between 14 and 14 is made better. Moreover, it can prevent that a foreign material mixes between the circuit board 2 and the base surface 14a of the base 14 for heat radiation.
Further, even when a sheet-like material is used, the heat conducting material 12 adheres well to the circuit board 2 due to its elastic deformation, so that the heat generating electronic components 5A and 5B on the circuit board 2 and the radiating base 14 are The thermal conductivity between them is made better. Further, since the circuit board 2 is elastically supported, the vibration can be absorbed and the circuit board 2 can be prevented from being deformed.

  Further, the case 3 has positions corresponding to the screw holes 12 of the circuit board 2, that is, corners at both ends of the side wall 3a on the side where the heat radiating base 14 is formed, and a side wall opposite to the side wall 3a. The circuit board holding parts 16 are formed and arranged at two locations inside the circuit board. These circuit board holding portions 16 are formed with screw holes 17 on the holding surface (upper surface) thereof so as to communicate with the screw holes 12 and through which screws are inserted.

  The cover 4 is made of a metal such as iron or aluminum and has a substantially rectangular plate shape corresponding to the plan view shape of the case 3. Screw holes 18 are also formed in the cover 4 at positions corresponding to the screw holes 12 of the circuit board 2. As a result, the cover 4 is attached to the case 3 in a state where the circuit board 2 is accommodated and held, and the screw 19 is inserted into the screw hole 18, the screw hole 12, and the screw hole 17, and is fixed to the case 3. It has come to be.

That is, the cover 4 is screwed to the case 3 to fix the circuit board 2 in the case 3 and to seal the housing space of the case 3. In this way, the circuit board 2 is accommodated and held in the case 3, and the cover 4 is attached and fixed to the case 3 in this state, whereby the electronic control device 1 of this embodiment is formed.

  In the electronic control device 1 having such a configuration, at least a pair of heat generating electronic components 5A and 5B among a plurality of heat generating electronic components mounted adjacent to each other are arranged as shown in FIG. And the heat-dissipating metal plate 10 are directed in a direction (Y direction) perpendicular to (intersect) the adjacent heat-generating electronic components 5A and 5B (X direction). When heat is generated, the heat released from these flows through the leads 9 and the heat radiating metal plate 10 to the entire circuit patterns 11A and 11B.

Here, in this electronic control device 1, among a plurality of heat-generating electronic components mounted adjacent to each other, at least a pair of heat-generating electronic components 5A and 5B is in a direction (Y direction) intersecting the adjacent direction (X direction). The lead 9 and the heat dissipating metal plate 10 are directed to each other, and the directions in which the lead 9 and the heat dissipating metal plate 10 face are opposite to each other. As a result, the heat radiation area is larger than that of the lead 9, and thus the central portion of the heat radiating metal plate 10 having a large heat radiation capacity is shifted by a certain distance in the direction (Y direction) perpendicular to the adjacent direction (X direction). In other words, the heat generating electronic component 5A is disposed in the Y2 direction and the electronic component 5B is displaced in the Y1 direction. Therefore, the flow of heat released through the lead 9 and the metal plate 10 for heat dissipation also shifts by a certain interval. Therefore, since the heat interference part H formed by the heat emitted from the pair of heat generating electronic components 5A and 5B can be reduced as compared with the conventional one, heat retention is suppressed and heat dissipation is improved.

Therefore, according to the electronic control device 1 of the present embodiment, since the heat dissipation is sufficiently high, the functions of the heat generating electronic components 5A and 5B and the large electronic component 6 are stable and good.
Further, by arranging the pair of heat generating electronic components 5A and 5B so as to be opposite to each other and arranging them adjacent to each other, connection of wiring patterns (not shown) on each surface including the inner layer connecting the pair of heat generating electronic components 5A and 5B is performed. The distance can be shortened, and the mounting area 2b of the circuit board 2 can be used efficiently without waste. Therefore, the electronic control device 1 can be downsized.

Furthermore, since the heat generating electronic components 5A and 5B are disposed at the end (outer peripheral portion) of the mounting area 2b of the circuit board 2, it is possible to easily dispose other components or the like at other parts in the mounting area 2b. Therefore, the degree of freedom in mounting layout is high, such as enabling high-density mounting. Further, since the heat generating electronic components 5A and 5B are close to the side wall of the case 3 by being arranged at the end (outer peripheral portion) of the mounting region 2b, the heat generated by the heat generating electronic components 5A and 5B is relatively fast. 3 will be released to the outside. Therefore, since heat is prevented from being accumulated in the electronic control device 1, the electronic control device 1 has high heat dissipation.

Next, another embodiment of the electronic control device of the present invention will be described.
FIGS. 3A and 3B are views for explaining another embodiment of the electronic control device and are plan views of the main part of the circuit board 2. 3A is a main part plan view showing a state in which the heat generating electronic parts 5A and 5B are mounted, and FIG. 3B is a main part plan view showing a state before the heat generating electronic parts 5A and 5B are mounted. FIG.

  The present embodiment differs from the embodiment shown in FIG. 2 in that, as shown in FIG. 3A, the heat generating electronic component 5B and the heat generating electronic component 5B are provided in the circuit patterns 11A and 11B of the circuit board 2 and the vicinity thereof. A plurality of (a plurality of) through holes (vias) 20 are formed.

As shown in FIG. 3B, the circuit pattern 11A is formed to be bent in a substantially L shape, and is connected to the heat radiating metal plate 10 of the heat generating electronic component 5A at a rectangular portion corresponding to the heat generating electronic component 5A. A first pad 21A is provided, and a second pad 22B connected to the lead 9 of the heat generating electronic component 5B is provided at an elongated rectangular portion corresponding to the heat generating electronic component 5B.
Further, the circuit pattern 11B is formed in a rectangular shape, and has a first pad 21B connected to the heat radiating metal plate 10 of the heat generating electronic component 5B. Further, in FIG. 3B, a second pad 22A connected to the lead 9 of the heat generating electronic component 5A is provided below the circuit pattern 11A and to the right of the circuit pattern 11B.
These second pads 22A and 22B are arranged such that their centers OA and OB are shifted in the Y direction shown in FIG. In the present embodiment, as shown in FIG. 3B, the second pads 22A and 22B are arranged with a shift width of α.

Then, the heat-dissipating metal plate 10 and the leads 9 corresponding to these pads are connected and fixed by solder or the like, so that the heat generating electronic components 5A and 5B are mounted on the mounting region 2b as shown in FIG. Has been. By arranging in this way, the heat interference part H is formed between the heat generating electronic components 5A and 5B.
A large number (a plurality) of through-holes 20 are formed and arranged in a state of surrounding the heat-generating electronic component 5A and the heat-generating electronic component 5B mounted in this manner.

These through holes 20 are formed so as to penetrate from the front surface (upper surface) to the rear surface (lower surface) of the circuit board 2, and a conductor (not shown) is provided by plating around the inner surface and the opening. . The conductor is connected to another wiring pattern (not shown) formed on the circuit board 2.
With such a configuration, the through hole 20 is electrically and thermally connected to the heat generating electronic components 5A and 5B via the wiring pattern (including the circuit patterns 11A and 11B). Accordingly, these through holes 20 function as heat conduction path means for conducting heat generated by the heat generating electronic components 5A and 5B.

  That is, the through hole 20 is connected to the heat generating electronic components 5A and 5B through the wiring pattern, thereby conducting the heat generated by the heat generating electronic components 5A and 5B and transmitting it to the back side of the circuit board 2, and thus Heat is dissipated to the heat conductive material 15 on the radiating base 14. In addition, the conductor is in contact with the heat generated from the heat radiating metal plates 10 and the leads 9 of the heat generating electronic components 5 </ b> A and 5 </ b> B, and further the heat flow is passed through the through hole 20. Thus, the heat is guided to the back side of the circuit board 2 and radiated to the heat conducting material 15.

Therefore, in the electronic control device 1 of the present embodiment, the heat generated by the heat generating electronic components 5A and 5B through the through holes 20 is efficiently transmitted to the back side of the circuit board 2, and the heat dissipating pedestal 14 and the top thereof. Since the heat can be efficiently discharged to the heat conductive material 15, the heat dissipation is further enhanced.
In particular, since a large number of through holes 20 are formed in a state of surrounding the heat generating electronic component 5A and the heat generating electronic component 5B, heat transfer is independent between the heat generating electronic component 5A and the heat generating electronic component 5B. Therefore, since they do not interfere with each other, the heat dissipation is sufficiently high.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
For example, in the embodiment, among the plurality of adjacent heat generating electronic components, at least the leads 9 of the pair of heat generating electronic components 5A and 5B and the metal plates 10 for heat dissipation are arranged in the direction in which the heat generating electronic components 5A and 5B are adjacent ( (X direction) is arranged so that the extending direction thereof is orthogonal to each other, but the extending direction of each lead 9 and each heat radiating metal plate 10 of the pair of heat generating electronic components 5A, 5B is the same direction (for example, FIG. 2 (Y direction in 2), these extending directions (Y direction) are not perpendicular to the adjacent directions of the heat generating electronic components 5A and 5B, but are simply crossed. May be.

That is, in FIG. 2, any one of the pair of heat generating electronic components 5A and 5B is arranged so as to be entirely displaced in the Y1 direction or the Y2 direction, and therefore the direction in which the heat generating electronic components 5A and 5B are adjacent to each other is shown in FIG. It may be inclined with respect to the X direction inside. Even in such an arrangement, the heat interference portion H formed by the heat released through the lead 9 and the heat radiating metal plate 10 can be reduced as compared with the conventional case, so that heat retention is suppressed. Increases heat dissipation.

In the above embodiment, only one pair of heat generating electronic components mounted adjacent to each other is shown. However, a plurality of pairs of heat generating electronic components having such a relationship may be provided.
Furthermore, in the said embodiment, although the electronic control apparatus of this invention was applied to the electronic control apparatus for motor vehicles, this invention is not limited to this, All the electronic control apparatuses by which heat dissipation and size reduction are requested | required It is applicable to.

DESCRIPTION OF SYMBOLS 1 ... Electronic control device, 2 ... Circuit board, 3 ... Case, 4 ... Cover, 5A, 5B ... Heat-generating electronic component, 9 ... Lead, 10 ... Metal plate for heat dissipation, 11A, 11B ... Circuit pattern, 20 ... Through hole

Claims (5)

An electronic control device comprising a circuit board having a wiring pattern, and a plurality of heat generating electronic components mounted adjacent to each other on the circuit board,
The heat generating electronic component is configured by extending a lead electrically and mechanically connected to the circuit board on one side and extending a metal plate for heat dissipation on the other side,
Of the plurality of heat-generating electronic components mounted adjacent to each other, at least a pair of heat-generating electronic components have the leads and the heat-dissipating metal plate directed in a direction intersecting the adjacent directions, and the leads and the An electronic control device, wherein the heat dissipating metal plates are disposed so that the directions of the metal plates are opposite to each other.   Of the plurality of heat-generating electronic components mounted adjacent to each other, at least a pair of heat-generating electronic components are arranged with the leads and the heat-dissipating metal plate facing the direction perpendicular to the adjacent directions. The electronic control device according to claim 1, wherein   3. The electronic control device according to claim 1, wherein the plurality of heat generating electronic components are arranged at an end portion of a mounting region of the circuit board.   2. The circuit board is provided with heat conduction path means provided on a surface of the circuit board and inside the circuit board for conducting heat generated by the heat generating electronic component. 4. The electronic control device according to any one of 3.   5. The electronic control device according to claim 4, wherein the heat conduction path means includes a through hole penetrating from the front surface to the back surface of the circuit board and connected to the wiring pattern.

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