JPH0923082A - Cooling structure of electronic circuit unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a cooling structure of natural air cooling system of an electronic circuit unit which has a large cooling efficiency by introducing heat generated from an electric component mounted on an electronic circuit package to a back board reinforcement metal bar. SOLUTION: A reinforcement metal bar 11d is arranged on a back board 11c of an electronic circuit unit 11 having a venting hole 12 on an upper board 11b. A metal board 16 having an excellent thermal conductivity is bonded to a heat generating electric component 14 mounted on an electronic circuit package 13. A bent part is formed at the tip of the protrusion part of the metal board 16 and bonded to the metal bar 11d at the time of inserting the electronic circuit package 13 in the electronic circuit unit 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit unit cooling structure for accommodating a plurality of electronic circuit packages in a communication device, and more particularly to a natural air cooling structure.

[0002]

2. Description of the Related Art Generally, a conventional electronic circuit unit is shown in FIG.
As shown in the external perspective view of FIG. 1, the ventilation holes 2 are provided in the upper plate 1b of the frame 1a of the electronic circuit unit 1, and the heat generated by the electronic circuit package 3 housed inside by the natural convection of air is generated. Was configured to radiate heat to the outside. Reference numeral 4 is an electric component mounted on the electronic circuit package 3.

[0003]

However, in the electronic circuit unit having the above structure, the heat radiation from the electric component 4 mounted on the electronic circuit package 3 is discharged from the vent hole 2 of the upper plate 1b by natural convection of air. However, there was a limit to the cooling capacity.

On the other hand, when viewed from the shield surface and the dustproof surface,
Needless to say, it is preferable that the vent hole 2 is as small as possible. Therefore, it has been desired to realize a cooling structure in which the vent hole 2 is small and the generated heat in the electronic circuit unit 1 can be efficiently dissipated.

[0005]

In order to solve the above-mentioned problems, in the present invention, an electronic device having a vent hole in an upper plate and accommodating a number of electronic circuit packages inserted in parallel between the lower plates of the upper plate. The cooling structure of the circuit unit, the heat conductive metal plate with the main body joined and attached to the electric parts mounted in the electronic circuit package is provided, and the free end of the metal plate is inserted into the electronic circuit unit frame. The cooling structure of the electronic circuit unit is characterized in that it is capable of being thermally connected to the metal rod of the backboard when the electronic circuit unit is cooled.

[0006]

According to the cooling structure for the electronic circuit unit of the present invention, the heat generated by the electric parts mounted on the electronic circuit package is directly transferred to the main body of the heat conductive metal plate bonded and attached, It is transmitted to the metal rod for reinforcing the backboard of the electronic circuit unit through the inside of the metal plate, and is radiated from the metal rod to the outside of the electronic circuit unit frame. In addition to this, it goes without saying that there is a heat radiation effect by natural convection of air.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a main part of an embodiment of the present invention, showing a state in which an electronic circuit package is mounted on an electronic circuit unit, (a) is a side sectional view, and (b) is a perspective view. . As shown in the figure, a large number of ventilation holes 12 are provided in parallel in the upper plate 11b of the frame 11a of the electronic circuit unit 11, and the backboard 11c is reinforced by the metal rod 11d.

FIG. 2 is a perspective view showing an electronic circuit package according to the present invention. In FIGS. 1 and 2, 13 is an electronic circuit package on which a high heat generating electric component 14 is mounted. Reference numeral 15 is a connector for making an electrical connection to the electronic circuit unit 11. The protruding portion 16b of the main body 16a of the metal plate 16 having good heat conductivity joined to the electric component 14 has the connector 1
It is arranged between the No. 5 and No. 15, and the tip bent portion 16c is configured to be joined to the reinforcing metal rod 11d of the backboard 11c.

The present embodiment configured as described above performs the following heat dissipation action. FIG. 3 is a cooling schematic diagram showing a heat conduction path from the heat-generating electric component 14. As shown in FIG. 3, first, heat generated in the electric component 14 mounted on the electronic circuit package 13 is generated by the electric component 14. The metal plate 16 is deprived of heat by the joint portion 16a, and the protruding portion 16b and the bent portion 1
6c is thermally conducted and radiated to the outside of the electronic circuit unit 11 joined to the bent portion 16c. In addition to this, at the same time, natural convection from the upper ventilation hole 12 of the electronic circuit unit frame 11a causes air cooling and heat radiation.

[0010]

As described above, according to the present invention,
The following effects are obtained. Since a heat-conductive metal plate is joined and attached to the heat-generating electric parts mounted in the electronic circuit package, and the free end of this metal plate is joined to the backboard reinforcing metal rod of the electronic circuit unit, The heat generated by the electric components is radiated directly to the outside of the electronic circuit unit via the metal plate, and is also radiated by air cooling by natural convection from the upper plate ventilation hole, improving the cooling capacity of the electronic circuit unit. A very good heat dissipation effect can be obtained, and further an effect of improving the reliability of the electronic circuit package can be expected.

[Brief description of drawings]

FIG. 1 is a side sectional view and a perspective view of an essential part showing an embodiment of the present invention.

FIG. 2 is a perspective view showing an electronic circuit package of the present invention.

FIG. 3 is a schematic view of a cooling mechanism of the present invention.

FIG. 4 is an external perspective view showing a conventional electronic circuit unit and electronic circuit package.

[Explanation of symbols]

 11 Electronic Circuit Unit 12 Vent 13 Electronic Circuit Package 14 Electrical Parts 15 Connector 16 Metal Plate

Claims (2)

[Claims] 1. A cooling structure for an electronic circuit unit, comprising a plurality of electronic circuit packages arranged side by side between an upper plate and a lower plate, wherein the electric parts mounted on the electronic circuit package are heat-conductive metal plates. A cooling structure for an electronic circuit unit, comprising: 2. The heat-conductive metal plate has a main body of the heat-conductive metal plate joined to the electric component, and an end portion of the heat-conductive metal plate is used for mounting the electronic package when the package is inserted. The cooling structure for an electronic circuit unit according to claim 1, wherein the cooling structure is formed so as to be capable of contacting a backboard metal rod of the circuit unit.