JPH1076783A - Pc card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To radiate efficiently heat emitted from mounted parts by a method wherein a length of a PC card is made a length wherein its rear end is protruded from a card slot of a personal computer or the like, the mounted parts of a substrate is arranged at a rear end part, and the mounted parts are intensively bonded to a card box body with a heat conductive component. SOLUTION: A length of a PC card, when charged in a card slot 8 of a personal computer or the like, is a length wherein its rear end part 9 is protruded therefrom. Then, semiconductor elements 2 or the like are loaded intensively on a substrate 1 at the rear end part 9. A heat conductive sheet 7 consistinq of high heat conductivity material is made to lie between the semiconductor 2 and an inner face of the card box body 5 at the rear end part 9. Therefore heat generated in the mounted parts such as the semiconductor 2 or the like is transmitted to the rear end part 9 with the heat conductive sheet 7. Since the rear end part 9 is protruded from the card slot 8 when the PC card is charged in the card slot 8, its heat radiation to outside is efficiently carried out, and does not give an influence by radiation of heat on an inside of the personal computer or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PC card used for information equipment such as a personal computer and other electronic equipment, and more particularly to a PC card having a heat radiating means for a mounted component that generates heat.

[0002]

2. Description of the Related Art Generally, a PC card used in information equipment such as a personal computer and other electronic equipment has a heat dissipation structure because electronic parts such as semiconductor elements which generate heat are mounted thereon.

FIG. 3 is a cross-sectional view showing a state in which a conventional example of a PC card is loaded. This PC card has a substrate 1 on which heat-generating components such as a semiconductor element 2 are mounted.
A part of the GND pattern 3 made of a material having a high thermal conductivity is provided between the semiconductor device 2 and a component such as the semiconductor element 2.
An ND terminal 4 is provided. And this GND terminal 4
Are brought into contact with a card housing 5 that houses the above-mentioned respective constituent members.

The PC card having the above-described configuration is used by being loaded into a card slot 8 (storage area for a PC card) of a personal computer or the like. The heat is transmitted to the card housing 5 via the GND terminal 4 and is radiated.

FIG. 4 shows another example of a conventional PC card having a heat dissipation structure. This PC card has a substrate 1 on which heat-generating components such as a semiconductor element 2 are mounted. A heat-conducting adhesive 6 is filled between a heat-generating component and a card housing 5 for accommodating the components.

The PC card having the above configuration is also used by being loaded into a card slot 8 of a personal computer or the like.
The heat is transmitted to the card housing 5 and is radiated.

[0007]

However, in the heat dissipation structure of the PC card shown in FIG. 3, the space between the component such as the semiconductor element 2 and the GND pattern 3 and between the GND pattern 3 and the GND
There is a problem that heat conduction loss occurs with the D terminal 4 and the temperature inside the PC card rises.

In the heat radiation structure of a PC card shown in FIG. 4, a heat-conducting adhesive 6 is filled without gap between a heat-generating component such as the semiconductor element 2 and a card housing 5 accommodating each of the above-mentioned components. It is difficult, and after filling the heat conductive adhesive 6,
There were problems such as disassembling and reassembling the card.

In addition, since the PC card shown in FIGS. 3 and 4 is inserted into a card slot 8 built in a personal computer or the like from its form, the heat radiated from the card housing 5 is used for the personal computer or the like. There were problems such as raising the internal temperature of the main body.

The present invention pays attention to the above-mentioned conventional problems, and efficiently radiates heat from components such as mounted semiconductor elements.
Moreover, it is an object of the present invention to provide a PC card which can radiate heat to the outside of a main body of a personal computer or the like to prevent a temperature rise in the main body of the personal computer or the like.

[0011]

In order to achieve the above object, the present invention provides a PC card in which components including heat-generating components such as semiconductor elements are mounted on a board and accommodated in a card housing. The length of the card is such that the rear end protrudes from the card slot of a personal computer or the like, the component is located at the rear end, and the component is thermally coupled to the card housing by a heat conducting member.

According to the present invention, the heat emitted from the mounted components such as semiconductor elements is efficiently radiated, and the heat is radiated outside the main body of the personal computer or the like, and the temperature rise in the main body of the personal computer or the like due to the heat radiation is prevented. it can.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention comprises a substrate, mounting components including heat-generating components such as semiconductor elements, and a card housing accommodating these components. The PC card has a length protruding from a card slot of a personal computer or the like, and at least heat-generating mounting components are collectively located at the rear end, and the heat-generating mounting components are thermally coupled to a card housing by a heat conductive member. Since the mounted components that generate heat are located behind the PC card that protrudes from the card slot of a personal computer or the like, heat can be efficiently radiated to the outside, and the mounted components are thermally coupled to the card housing with a heat conducting member. Therefore, it has an effect that heat conduction loss is small.

According to a second aspect of the present invention, in the PC card according to the first aspect, the mounted component includes a plurality of components having different heights, and corresponds to the top surface of each component of the card housing. The face plate is formed in an uneven shape so as to correspond to the height of each mounted component, the heat conductive member is made of a heat conductive sheet of uniform thickness, and the top surface of each component is a card case with the one heat conductive sheet. The structure is thermally coupled to the uneven surface plate of the body, so that the heat generated by the mounted components can be efficiently radiated to the outside, as well as a single heat conductive sheet when multiple mounted components have different heights Has the effect of being able to conduct heat to the card housing.

An embodiment of a PC card according to the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 is a sectional view showing a loaded state of a PC card according to Embodiment 1 of the present invention. The same components as those of the conventional example are denoted by the same reference numerals as those of the conventional example.

As shown in FIG. 1, a PC card is
And a semiconductor element 2 that is a mounting component that generates heat, and a card housing 5 that accommodates these constituent members.
The length of the PC card is such that the rear end 9 protrudes when the PC card is loaded into the card slot 8 of a personal computer or the like. The semiconductor elements 2 and the like, which are the mounting components that generate heat, are collectively mounted on the substrate 1 at the rear end 9. A heat conductive sheet 7 made of a material having a high thermal conductivity is interposed between the semiconductor element 2 which is the mounting component that generates heat and the inner surface of the card housing 5 at the rear end portion 9.
The heat generated in the semiconductor element 2 and the like is conducted by the heat conductive sheet 7 to the card housing 5 at the rear end 9.

In the card case 5, the thickness of the portion at the rear end 9 is made larger than that of the other portions in accordance with the height of the heat-generating mounting components such as the semiconductor element 2. The rear end has a larger surface area than the other parts.

In the above configuration, the heat generated by the heat-generating mounting components such as the semiconductor element 2 is transmitted to the rear end of the card housing 5 by the heat conductive sheet 7. The rear end of the card case 5 protrudes from the card slot 8 when a PC card is inserted into the card slot 8, and therefore the heat is efficiently dissipated to the outside, and the heat dissipated inside the personal computer or the like. Do not give.

It is needless to say that as the material of the card housing 5, a material having a low specific heat, such as a sheet metal or an aluminum die cast, and having a high heat radiation effect is preferable. Even if the semiconductor elements 2 generating a large amount of heat cannot be collected due to the arrangement of parts, the card housing 5 may be connected to the rear end 9 so as to easily conduct heat (integration of a sheet metal cover). , Integrated with an aluminum die-cast frame.

(Embodiment 2) FIG. 2 is a sectional view showing the rear end of a PC card according to Embodiment 2 of the present invention. The PC card according to the second embodiment has a configuration corresponding to a case where a plurality of heat-generating components 2a and 2b having different mounting heights are mounted at the rear end thereof. The face plates corresponding to the plurality of different heat-generating components 2a and 2b are formed in an uneven shape according to the height of the mounted components 2a and 2b, and the heat conductive sheet 7 having a uniform thickness allows the components 2a and 2b to have a uniform thickness. The top surface of 2b is thermally coupled to the uneven face plate of the card housing 5 by the one heat conductive sheet 7.

In the above configuration, the heat generated by the heat-generating components 2a and 2b having different mounting heights is transmitted to the rear of the card case 5 by the heat conductive sheet 7, and the rear of the card case 5 Since it protrudes from the slot 8, the heat is radiated efficiently to the outside.

With respect to heat conduction to the card case 5, the face plate corresponding to the top surface of the plurality of heat-generating components 2a and 2b having different mounting heights at the rear end of the card case 5 is mounted and generates heat. Since the parts 2a and 2b are formed in an uneven shape in accordance with the height of the parts, the gap between the top surface of the mounted parts 2a and 2b that generate heat and the inner surface of the card housing 5 is constant, and one heat The conductive sheet 7 enhances the adhesiveness to increase the thermal conductivity, and can sufficiently conduct heat to the card housing 5.

If the heat conductive sheet 7 is made of a silicon material, the heat conductive sheet is pressed and pressed with a certain load so that the heat conductive sheet 7 is sufficiently adhered and sufficiently heat-conductive, so that the card housing 5 can be easily disassembled and reassembled. .

[0024]

As is apparent from the above description, in the PC card of the present invention, the heat generated by the heat-generating mounting components such as semiconductor elements is transmitted to the rear end of the card housing by the heat conductive member. Since the rear end of the housing protrudes from the card slot when the PC card is inserted into the card slot, the heat is efficiently dissipated to the outside and does not affect the inside of the personal computer or the like.

In the case where a plurality of heat-generating components having different mounting heights are mounted, the face plate corresponding to the top surface of each heat-generating component in the card housing may correspond to the height of the mounted component. Since the gap between the top surface of each component that generates heat and the inner surface of the card housing is constant, the heat conductivity is improved by increasing the adhesion with a single heat conductive sheet, and the card can be effectively used. This has the effect that heat can be conducted to the housing.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a loaded state of a PC card according to a first embodiment of the present invention;

FIG. 2 is a sectional view showing a rear end portion of the PC card according to the second embodiment of the present invention;

FIG. 3 is a cross-sectional view showing a loaded state of a conventional PC card;

FIG. 4 is a cross-sectional view showing a loaded state of another conventional PC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Semiconductor element 5 Card case 7 Thermal conductive sheet 8 Card slot 9 Rear end

Claims (2)

[Claims] 1. A board comprising a board, mounting components including heat-generating components such as semiconductor elements, and a card housing accommodating these components, and having a rear end protruding from a card slot of a personal computer or the like. Wherein the mounted components to be heated are collectively located at the rear end, and the mounted components that generate heat are thermally coupled to the card housing by a heat conducting member.
C card. 2. The mounting component comprises a plurality of components having different heights, and a face plate corresponding to the top surface of each component of the card housing is formed in an uneven shape corresponding to the height of each mounted component. 2. The conductive member is made of a heat conductive sheet having a uniform thickness, and a top surface of each component is thermally connected to the concave and convex face plate of the card housing by the one heat conductive sheet. PC card as described.