JP5709434B2 - 電子装置とその製造方法 - Google Patents

電子装置とその製造方法 Download PDF

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Publication number
JP5709434B2
JP5709434B2 JP2010185205A JP2010185205A JP5709434B2 JP 5709434 B2 JP5709434 B2 JP 5709434B2 JP 2010185205 A JP2010185205 A JP 2010185205A JP 2010185205 A JP2010185205 A JP 2010185205A JP 5709434 B2 JP5709434 B2 JP 5709434B2
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JP
Japan
Prior art keywords
layer
conductive layer
semiconductor substrate
opening
capacitor
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Expired - Fee Related
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JP2010185205A
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English (en)
Japanese (ja)
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JP2011044716A (ja
JP2011044716A5 (enExample
Inventor
慶羽 倪
慶羽 倪
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精材科技股▲ふん▼有限公司
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Publication of JP2011044716A5 publication Critical patent/JP2011044716A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2010185205A 2009-08-20 2010-08-20 電子装置とその製造方法 Expired - Fee Related JP5709434B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23564909P 2009-08-20 2009-08-20
US61/235,649 2009-08-20

Publications (3)

Publication Number Publication Date
JP2011044716A JP2011044716A (ja) 2011-03-03
JP2011044716A5 JP2011044716A5 (enExample) 2013-10-03
JP5709434B2 true JP5709434B2 (ja) 2015-04-30

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ID=42735406

Family Applications (1)

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JP2010185205A Expired - Fee Related JP5709434B2 (ja) 2009-08-20 2010-08-20 電子装置とその製造方法

Country Status (3)

Country Link
US (1) US8766400B2 (enExample)
EP (1) EP2287892A3 (enExample)
JP (1) JP5709434B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201226347A (en) * 2010-12-21 2012-07-01 Chunghwa Picture Tubes Ltd Method of thinning glass substrate
US8624353B2 (en) * 2010-12-22 2014-01-07 Stats Chippac, Ltd. Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer
US20130241939A1 (en) * 2012-03-16 2013-09-19 Qualcomm Mems Technologies, Inc. High capacitance density metal-insulator-metal capacitors
US8896521B2 (en) 2012-04-24 2014-11-25 Qualcomm Mems Technologies, Inc. Metal-insulator-metal capacitors on glass substrates
KR101606865B1 (ko) * 2014-04-28 2016-03-28 광운대학교 산학협력단 포토레지스트 패턴을 이용하는 집적회로 소자의 제조 방법
US11348884B1 (en) * 2020-11-13 2022-05-31 Taiwan Semiconductor Manufacturing Company Limited Organic interposer including a dual-layer inductor structure and methods of forming the same
US20220375865A1 (en) * 2021-05-18 2022-11-24 Intel Corporation Microelectronic assemblies with glass substrates and magnetic core inductors

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6399997B1 (en) * 2000-08-01 2002-06-04 Megic Corporation High performance system-on-chip using post passivation process and glass substrates
JP3462166B2 (ja) * 2000-09-08 2003-11-05 富士通カンタムデバイス株式会社 化合物半導体装置
EP1411553A4 (en) 2001-07-12 2008-09-03 Hitachi Ltd ELECTRONIC CIRCUIT COMPONENT
WO2004112136A1 (en) * 2003-06-12 2004-12-23 Koninklijke Philips Electronics N.V. Electronic device
JP4549889B2 (ja) 2004-05-24 2010-09-22 三星モバイルディスプレイ株式會社 キャパシタ及びこれを利用する発光表示装置
JP4431747B2 (ja) 2004-10-22 2010-03-17 富士通株式会社 半導体装置の製造方法
JP5214443B2 (ja) * 2005-06-08 2013-06-19 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 線形可変電圧ダイオードキャパシタおよび適応整合回路網
JP4559993B2 (ja) * 2006-03-29 2010-10-13 株式会社東芝 半導体装置の製造方法
JP5288095B2 (ja) 2008-02-07 2013-09-11 ソニー株式会社 薄膜トランジスタ基板およびその欠陥修復方法、並びに表示装置

Also Published As

Publication number Publication date
JP2011044716A (ja) 2011-03-03
US8766400B2 (en) 2014-07-01
US20110042783A1 (en) 2011-02-24
EP2287892A2 (en) 2011-02-23
EP2287892A3 (en) 2012-10-10

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