JP5708214B2 - 圧力センサー、センサーアレイ、センサーアレイの製造方法、及び把持装置 - Google Patents

圧力センサー、センサーアレイ、センサーアレイの製造方法、及び把持装置 Download PDF

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Publication number
JP5708214B2
JP5708214B2 JP2011104095A JP2011104095A JP5708214B2 JP 5708214 B2 JP5708214 B2 JP 5708214B2 JP 2011104095 A JP2011104095 A JP 2011104095A JP 2011104095 A JP2011104095 A JP 2011104095A JP 5708214 B2 JP5708214 B2 JP 5708214B2
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Japan
Prior art keywords
sensor
pressure
film
support
sensor array
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Japanese (ja)
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JP2012215533A (ja
JP2012215533A5 (enExample
Inventor
鈴木　博則
博則 鈴木
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2011104095A priority Critical patent/JP5708214B2/ja
Priority to US13/105,247 priority patent/US8539839B2/en
Publication of JP2012215533A publication Critical patent/JP2012215533A/ja
Priority to US13/967,867 priority patent/US9322728B2/en
Publication of JP2012215533A5 publication Critical patent/JP2012215533A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
    • G01L5/226—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/081—Touching devices, e.g. pressure-sensitive
    • B25J13/082—Grasping-force detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/02—Measuring force or stress, in general by hydraulic or pneumatic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
    • G01L11/04—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00 by acoustic means
    • G01L11/06—Ultrasonic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
    • G01L9/0022—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Manipulator (AREA)
JP2011104095A 2011-03-28 2011-05-09 圧力センサー、センサーアレイ、センサーアレイの製造方法、及び把持装置 Active JP5708214B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011104095A JP5708214B2 (ja) 2011-03-28 2011-05-09 圧力センサー、センサーアレイ、センサーアレイの製造方法、及び把持装置
US13/105,247 US8539839B2 (en) 2011-03-28 2011-05-11 Pressure sensor, sensor array, method for manufacturing sensor array, and grasping apparatus
US13/967,867 US9322728B2 (en) 2011-03-28 2013-08-15 Pressure sensor, sensor array, method for manufacturing sensor array, and grasping apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011069518 2011-03-28
JP2011069518 2011-03-28
JP2011104095A JP5708214B2 (ja) 2011-03-28 2011-05-09 圧力センサー、センサーアレイ、センサーアレイの製造方法、及び把持装置

Publications (3)

Publication Number Publication Date
JP2012215533A JP2012215533A (ja) 2012-11-08
JP2012215533A5 JP2012215533A5 (enExample) 2014-06-19
JP5708214B2 true JP5708214B2 (ja) 2015-04-30

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US (2) US8539839B2 (enExample)
JP (1) JP5708214B2 (enExample)

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KR102529611B1 (ko) * 2020-10-13 2023-05-09 주식회사 피티엠 전기차용 테스트 대상물 착탈결합장치

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JP5516548B2 (ja) * 2011-11-01 2014-06-11 株式会社デンソー 把持用センサ及びロボットハンド駆動制御装置
JP5990929B2 (ja) * 2012-02-24 2016-09-14 セイコーエプソン株式会社 超音波トランスデューサー装置およびプローブ並びに電子機器および超音波診断装置
JP6078994B2 (ja) * 2012-06-13 2017-02-15 セイコーエプソン株式会社 超音波トランスデューサー素子ユニットおよびプローブおよびプローブヘッド並びに電子機器および超音波診断装置
WO2014017169A1 (ja) * 2012-07-26 2014-01-30 株式会社村田製作所 押圧力センサ
JP6186696B2 (ja) * 2012-10-25 2017-08-30 セイコーエプソン株式会社 超音波測定装置、ヘッドユニット、プローブ及び診断装置
JP6273743B2 (ja) * 2013-09-30 2018-02-07 セイコーエプソン株式会社 超音波デバイスおよびプローブ並びに電子機器および超音波画像装置
US9772314B2 (en) 2013-12-18 2017-09-26 Seiko Epson Corporation Ultrasonic sensor and measuring method using the same, and method of manufacturing ultrasonic sensor
JP6332596B2 (ja) * 2013-12-18 2018-05-30 セイコーエプソン株式会社 超音波センサー素子及びその製造方法並びに超音波センサー
WO2016002971A1 (ja) * 2014-07-04 2016-01-07 セイコーエプソン株式会社 超音波センサー
US10466826B2 (en) * 2014-10-08 2019-11-05 Joyson Safety Systems Acquisition Llc Systems and methods for illuminating a track pad system
JP2016095284A (ja) * 2014-11-17 2016-05-26 セイコーエプソン株式会社 電子デバイス、物理量センサー、圧力センサー、高度計、電子機器および移動体
JP2016138778A (ja) * 2015-01-27 2016-08-04 セイコーエプソン株式会社 電子デバイス、圧力センサー、高度計、電子機器および移動体
JP6540125B2 (ja) * 2015-03-18 2019-07-10 株式会社リコー 発電素子及び発電装置
JP6591041B2 (ja) * 2016-03-09 2019-10-16 三井化学株式会社 積層体
US10416629B1 (en) * 2016-11-21 2019-09-17 X Development Llc Acoustic contact sensors
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JP6991791B2 (ja) 2017-08-25 2022-01-13 キヤノン株式会社 複合センサ
DE102018209024B4 (de) * 2018-06-07 2021-08-19 Infineon Technologies Ag Vorrichtung mit einer von einer Rahmenstruktur begrenzten Funktionsstruktur und Verfahren zum Herstellen derselben
WO2020015019A1 (zh) * 2018-07-20 2020-01-23 渝新智能科技（上海）有限公司 一种信号源装置、检测系统及承载体
CN109141694A (zh) * 2018-07-20 2019-01-04 渝新智能科技（上海）有限公司 一种信号源装置、检测系统及承载体
CN108709621B (zh) * 2018-08-02 2024-04-26 河北工业大学 一种基于超声阵列的异形工件检测抓取装置
JP7079704B2 (ja) * 2018-09-27 2022-06-02 住友理工株式会社 圧電センサ
KR102256241B1 (ko) * 2019-07-25 2021-05-27 한국과학기술연구원 전단 및 수직 응력 감지 센서 및 이의 제조 방법
JP7327006B2 (ja) * 2019-08-30 2023-08-16 Tdk株式会社 振動デバイス
JP7557743B2 (ja) * 2021-04-09 2024-09-30 多摩川精機株式会社 Ａｅセンサ素子構造、ａｅセンサ用音片アレイ、およびａｅセンサ
JP2022168703A (ja) * 2021-04-26 2022-11-08 セイコーエプソン株式会社 振動デバイスの製造方法
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US20120247217A1 (en) 2012-10-04
US20130331978A1 (en) 2013-12-12
JP2012215533A (ja) 2012-11-08
US8539839B2 (en) 2013-09-24
US9322728B2 (en) 2016-04-26

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