JP5705187B2 - パラメータ測定の歪みを小さくする方法 - Google Patents
パラメータ測定の歪みを小さくする方法 Download PDFInfo
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- JP5705187B2 JP5705187B2 JP2012214529A JP2012214529A JP5705187B2 JP 5705187 B2 JP5705187 B2 JP 5705187B2 JP 2012214529 A JP2012214529 A JP 2012214529A JP 2012214529 A JP2012214529 A JP 2012214529A JP 5705187 B2 JP5705187 B2 JP 5705187B2
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
- G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
Description
A.基板、複数のセンサ、フレキシブルプリント回路基板上に支持される情報処理のための少なくとも一個の電子構成部品、第1リボンケーブルまたは第1フレキシブル回路基板、および固定具を有するセンサ装置を提供する段階であって;前記複数のセンサは前記基板上に支持され、前記第1リボンケーブルまたは前記第1フレキシブル回路基板は、前記センサと前記少なくとも一個の電子構成部品と電気接続され;前記フレキシブルプリント回路基板を前記ロボットに取り外し可能に取り付けできるように、前記固定具が、前記フレキシブルプリント回路基板へ、または前記第1リボンケーブルもしくは前記第1フレキシブル回路基板へ接続される段階;
B.前記固定具を用いて前記回路基板を前記ロボットアームに取り付ける段階;
C.前記ロボットを用いて、前記基板を前記プロセスチャンバ内に配置する段階;
D.前記基板と前記フレキシブルプリント回路基板との間に所定の間隔を生み出すように、前記ロボットアームを位置決めする段階;
E.前記パラメータ測定のために加工条件を確立する段階;
F.前記センサで前記パラメータを測定し、少なくとも一個の電子構成部品で測定値を収集する段階;
G.前記ロボットを用いて前記プロセスチャンバから前記基板を除去する段階;および、
H.前記ロボットアームから前記回路基板を取り外す段階;
を含むことを特徴とする。
Claims (4)
- 加工品を加工するためのプロセスチャンバ内のプロセスパラメータの歪みを小さくして測定を行う方法であって、前記プロセスチャンバは、前記加工品を装填したり、外したりするためのロボットアームを有するロボットに接続され、前記方法は:
A.基板、複数のセンサ、フレキシブルプリント回路基板上に支持される情報処理のための少なくとも一個の電子構成部品、第1リボンケーブルまたは第1フレキシブル回路基板、および固定具を有するセンサ装置を提供する段階であって;前記複数のセンサは前記基板上に支持され、前記第1リボンケーブルまたは前記第1フレキシブル回路基板は、前記センサと前記少なくとも一個の電子構成部品と電気接続され;前記フレキシブルプリント回路基板を前記ロボットに取り外し可能に取り付けできるように、前記固定具が、前記フレキシブルプリント回路基板へ、または前記第1リボンケーブルもしくは前記第1フレキシブル回路基板へ接続される段階;
B.前記固定具を用いて前記回路基板を前記ロボットアームに取り付ける段階;
C.前記ロボットを用いて、前記基板を前記プロセスチャンバ内に配置する段階;
D.前記基板と前記フレキシブルプリント回路基板との間に所定の間隔を生み出すように、前記ロボットアームを位置決めする段階;
E.前記パラメータ測定のために加工条件を確立する段階;
F.前記センサで前記パラメータを測定し、少なくとも一個の電子構成部品で測定値を収集する段階;
G.前記ロボットを用いて前記プロセスチャンバから前記基板を除去する段階;および、
H.前記ロボットアームから前記回路基板を取り外す段階;
を含むことを特徴とする、方法。 - 前記段階F中に、前記ロボットアームが前記プロセスチャンバ内または前記プロセスチャンバに隣接するチャンバ内に留まることを特徴とする、請求項1記載の方法。
- 前記段階F中に、前記ロボットアームが、前記プロセスチャンバ内に留まるか、または前記プロセスチャンバから引き出されることを特徴とする、請求項1記載の方法。
- 前記プロセスチャンバがポートを有し;前記方法が前記ポートを開閉するためのゲートを提供する段階を更に含むことを特徴とする、請求項1記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58689104P | 2004-07-10 | 2004-07-10 | |
US60/586,891 | 2004-07-10 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007520584A Division JP5137573B2 (ja) | 2004-07-10 | 2005-07-08 | パラメータ測定の歪みを小さくする方法および装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013058760A JP2013058760A (ja) | 2013-03-28 |
JP5705187B2 true JP5705187B2 (ja) | 2015-04-22 |
Family
ID=35785782
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007520584A Expired - Fee Related JP5137573B2 (ja) | 2004-07-10 | 2005-07-08 | パラメータ測定の歪みを小さくする方法および装置 |
JP2012214529A Active JP5705187B2 (ja) | 2004-07-10 | 2012-09-27 | パラメータ測定の歪みを小さくする方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007520584A Expired - Fee Related JP5137573B2 (ja) | 2004-07-10 | 2005-07-08 | パラメータ測定の歪みを小さくする方法および装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7299148B2 (ja) |
JP (2) | JP5137573B2 (ja) |
KR (1) | KR101237782B1 (ja) |
TW (1) | TWI279530B (ja) |
WO (1) | WO2006010108A2 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7378834B2 (en) * | 2002-10-29 | 2008-05-27 | Finisar Corporation | Electronic assembly tester and method for optoelectronic device |
US8742944B2 (en) * | 2004-06-21 | 2014-06-03 | Siemens Energy, Inc. | Apparatus and method of monitoring operating parameters of a gas turbine |
US7545272B2 (en) | 2005-02-08 | 2009-06-09 | Therasense, Inc. | RF tag on test strips, test strip vials and boxes |
US7802917B2 (en) * | 2005-08-05 | 2010-09-28 | Lam Research Corporation | Method and apparatus for chuck thermal calibration |
GB0523667D0 (en) * | 2005-11-21 | 2005-12-28 | In2Tec Ltd | Displacement sensor |
US7498802B2 (en) | 2006-07-10 | 2009-03-03 | 3M Innovative Properties Company | Flexible inductive sensor |
US7948380B2 (en) | 2006-09-06 | 2011-05-24 | 3M Innovative Properties Company | Spatially distributed remote sensor |
US7969323B2 (en) * | 2006-09-14 | 2011-06-28 | Siemens Energy, Inc. | Instrumented component for combustion turbine engine |
US7924408B2 (en) * | 2007-02-23 | 2011-04-12 | Kla-Tencor Technologies Corporation | Temperature effects on overlay accuracy |
US8152367B2 (en) * | 2007-05-04 | 2012-04-10 | Sealed Air Corporation (Us) | Insulated container having a temperature monitoring device |
JP4735670B2 (ja) * | 2008-06-11 | 2011-07-27 | 富士ゼロックス株式会社 | プリント基板および画像処理装置 |
US7929294B2 (en) * | 2008-09-11 | 2011-04-19 | Commscope Inc. Of North Carolina | Hybrid cooling system for outdoor electronics enclosure |
JP5704129B2 (ja) * | 2012-06-22 | 2015-04-22 | 東京エレクトロン株式会社 | 基板処理装置のデータ取得方法及びセンサ用基板 |
US9514970B2 (en) * | 2013-01-24 | 2016-12-06 | Kla-Tencor Corporation | Methods of attaching a module on wafer substrate |
CN105358949B (zh) | 2013-05-30 | 2018-03-02 | 科磊股份有限公司 | 用于测量热通量的方法及系统 |
US9943232B2 (en) | 2014-02-03 | 2018-04-17 | Welch Allyn, Inc. | Thermometry heating and sensing assembly |
CN104880685A (zh) * | 2015-06-15 | 2015-09-02 | 国网上海市电力公司 | 一种计量装置二次回路运行的评价方法 |
US10216100B2 (en) | 2015-07-16 | 2019-02-26 | Asml Netherlands B.V. | Inspection substrate and an inspection method |
WO2017014380A1 (ko) * | 2015-07-20 | 2017-01-26 | 엘지이노텍 주식회사 | 무전원 체온 감지 장치 및 이에 포함된 통신장치 |
US10460966B2 (en) * | 2016-06-15 | 2019-10-29 | Kla-Tencor Corporation | Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications |
KR101897541B1 (ko) * | 2016-10-05 | 2018-09-13 | (주)코텍 | 곡면형 표시장치의 슬림 베젤 및 그 제조 장치와 방법 |
KR102078774B1 (ko) * | 2017-07-10 | 2020-02-18 | 주식회사 유뱃 | 전력 제공 장치 |
CN108120918A (zh) * | 2017-08-07 | 2018-06-05 | 鸿秦(北京)科技有限公司 | 一种芯片物理销毁效果电路板上在线检测方法和装置 |
DE202018104014U1 (de) * | 2018-07-12 | 2018-10-17 | Wema System As | Temperatursensoreinheit und Harnstoffsensor |
JP7258727B2 (ja) * | 2019-11-18 | 2023-04-17 | 株式会社Screenホールディングス | 温度測定装置、温度測定システム、および温度測定装置を用いた温度測定方法 |
JP7414664B2 (ja) * | 2020-08-12 | 2024-01-16 | 東京エレクトロン株式会社 | 温度測定ユニット、熱処理装置及び温度測定方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0693438B2 (ja) * | 1986-12-11 | 1994-11-16 | 大日本スクリ−ン製造株式会社 | 基板温度測定装置 |
JPH06310580A (ja) * | 1993-04-20 | 1994-11-04 | Nippon Steel Corp | 半導体ウエーハの温度測定方法及び温度測定手段を備える半導体ウエーハ |
US5444637A (en) | 1993-09-28 | 1995-08-22 | Advanced Micro Devices, Inc. | Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed |
US5907820A (en) | 1996-03-22 | 1999-05-25 | Applied Materials, Inc. | System for acquiring and analyzing a two-dimensional array of data |
US5967661A (en) | 1997-06-02 | 1999-10-19 | Sensarray Corporation | Temperature calibration substrate |
US5969639A (en) | 1997-07-28 | 1999-10-19 | Lockheed Martin Energy Research Corporation | Temperature measuring device |
US5970313A (en) | 1997-12-19 | 1999-10-19 | Advanced Micro Devices, Inc. | Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer |
US6244121B1 (en) * | 1998-03-06 | 2001-06-12 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
JPH11307606A (ja) * | 1998-04-20 | 1999-11-05 | Dainippon Screen Mfg Co Ltd | 基板熱処理装置の評価方法および評価装置 |
JP2002532717A (ja) * | 1998-12-11 | 2002-10-02 | サイミックス テクノロジーズ、インク | 迅速な物質特性評価のためのセンサ配列に基づくシステム及びその方法 |
JP2000241257A (ja) * | 1999-02-24 | 2000-09-08 | Hayashi Denko Kk | 絶縁性基板の温度センサ装置 |
US6190040B1 (en) * | 1999-05-10 | 2001-02-20 | Sensarray Corporation | Apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool |
US6691068B1 (en) | 2000-08-22 | 2004-02-10 | Onwafer Technologies, Inc. | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
JP4739544B2 (ja) * | 2001-02-21 | 2011-08-03 | 株式会社アルバック | インライン式熱処理装置用温度測定装置 |
US6542835B2 (en) | 2001-03-22 | 2003-04-01 | Onwafer Technologies, Inc. | Data collection methods and apparatus |
TW594455B (en) | 2001-04-19 | 2004-06-21 | Onwafer Technologies Inc | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
US6889568B2 (en) | 2002-01-24 | 2005-05-10 | Sensarray Corporation | Process condition sensing wafer and data analysis system |
US7151366B2 (en) * | 2002-12-03 | 2006-12-19 | Sensarray Corporation | Integrated process condition sensing wafer and data analysis system |
-
2005
- 2005-07-08 JP JP2007520584A patent/JP5137573B2/ja not_active Expired - Fee Related
- 2005-07-08 WO PCT/US2005/024505 patent/WO2006010108A2/en active Search and Examination
- 2005-07-08 KR KR1020077001465A patent/KR101237782B1/ko active IP Right Grant
- 2005-07-08 US US11/177,922 patent/US7299148B2/en not_active Expired - Fee Related
- 2005-07-08 TW TW094123178A patent/TWI279530B/zh not_active IP Right Cessation
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2012
- 2012-09-27 JP JP2012214529A patent/JP5705187B2/ja active Active
Also Published As
Publication number | Publication date |
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TWI279530B (en) | 2007-04-21 |
WO2006010108A3 (en) | 2007-03-22 |
JP2013058760A (ja) | 2013-03-28 |
JP2008506267A (ja) | 2008-02-28 |
TW200617363A (en) | 2006-06-01 |
KR101237782B1 (ko) | 2013-02-28 |
WO2006010108B1 (en) | 2007-05-31 |
US7299148B2 (en) | 2007-11-20 |
US20060052969A1 (en) | 2006-03-09 |
KR20070051255A (ko) | 2007-05-17 |
JP5137573B2 (ja) | 2013-02-06 |
WO2006010108A2 (en) | 2006-01-26 |
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