JP5694670B2 - 固体撮像装置およびその製造方法 - Google Patents

固体撮像装置およびその製造方法 Download PDF

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Publication number
JP5694670B2
JP5694670B2 JP2010024825A JP2010024825A JP5694670B2 JP 5694670 B2 JP5694670 B2 JP 5694670B2 JP 2010024825 A JP2010024825 A JP 2010024825A JP 2010024825 A JP2010024825 A JP 2010024825A JP 5694670 B2 JP5694670 B2 JP 5694670B2
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JP
Japan
Prior art keywords
solid
imaging device
state imaging
adhesive
region
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Expired - Fee Related
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JP2010024825A
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English (en)
Japanese (ja)
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JP2011165775A (ja
JP2011165775A5 (enExample
Inventor
康浩 松木
康浩 松木
幸司 都築
幸司 都築
久種 小森
久種 小森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010024825A priority Critical patent/JP5694670B2/ja
Publication of JP2011165775A publication Critical patent/JP2011165775A/ja
Publication of JP2011165775A5 publication Critical patent/JP2011165775A5/ja
Application granted granted Critical
Publication of JP5694670B2 publication Critical patent/JP5694670B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2010024825A 2010-02-05 2010-02-05 固体撮像装置およびその製造方法 Expired - Fee Related JP5694670B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010024825A JP5694670B2 (ja) 2010-02-05 2010-02-05 固体撮像装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010024825A JP5694670B2 (ja) 2010-02-05 2010-02-05 固体撮像装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2011165775A JP2011165775A (ja) 2011-08-25
JP2011165775A5 JP2011165775A5 (enExample) 2013-03-21
JP5694670B2 true JP5694670B2 (ja) 2015-04-01

Family

ID=44596129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010024825A Expired - Fee Related JP5694670B2 (ja) 2010-02-05 2010-02-05 固体撮像装置およびその製造方法

Country Status (1)

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JP (1) JP5694670B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243340A (ja) * 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法
JP6818468B2 (ja) * 2016-08-25 2021-01-20 キヤノン株式会社 光電変換装置及びカメラ
JP6968553B2 (ja) 2017-03-09 2021-11-17 キヤノン株式会社 電子部品及びその製造方法
WO2019003580A1 (ja) * 2017-06-30 2019-01-03 シャープ株式会社 カメラモジュール及びカメラモジュールの製造方法
JP2022187526A (ja) * 2021-06-08 2022-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像素子パッケージおよび電子機器
KR102832763B1 (ko) * 2023-04-20 2025-07-10 (주)에이지피 하우징 일체형 카메라 모듈 및 하우징 일체형 카메라 모듈의 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232551A (ja) * 1996-02-26 1997-09-05 Toshiba Corp 光電変換装置
JP2001250889A (ja) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd 光素子の実装構造体およびその製造方法
JP2005109092A (ja) * 2003-09-30 2005-04-21 Konica Minolta Opto Inc 固体撮像装置及び該固体撮像装置を備えた撮像装置
JP4686400B2 (ja) * 2005-07-21 2011-05-25 パナソニック株式会社 光学デバイス、光学デバイス装置、カメラモジュールおよび光学デバイスの製造方法
JP2007110594A (ja) * 2005-10-17 2007-04-26 Hitachi Maxell Ltd カメラモジュール
JP2007317719A (ja) * 2006-05-23 2007-12-06 Fujitsu Ltd 撮像装置及びその製造方法
JP5511180B2 (ja) * 2008-12-19 2014-06-04 キヤノン株式会社 固体撮像装置の製造方法及び固体撮像装置
JP5489543B2 (ja) * 2009-06-09 2014-05-14 キヤノン株式会社 固体撮像装置

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JP2011165775A (ja) 2011-08-25

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