JP5694199B2 - 1つのパッケージ内に複数の発光素子を結合するための方法と複数の結合された発光素子を含むパッケージ - Google Patents
1つのパッケージ内に複数の発光素子を結合するための方法と複数の結合された発光素子を含むパッケージ Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
x1およびy1は区分け域1の色度の中心点の値、x2およびy2は区分け域2の色度の中心点の値である。中間的な値m1およびm2はそれぞれ区分け域1および2の中心点の光束の値Y1およびY2を、組み合わせた色度成分値に組み入れるために用いることができ、次のように定めることができる:
Claims (11)
- 発光素子パッケージ組立品を形成する方法であって、
発光素子パッケージ本体を用意する工程と、
1つの色度領域を2次元色度空間内に定義し、前記定義された色度領域を少なくとも3つの色度副領域に副分割する工程と、
前記定義された色度領域に入る1つの色度を有する光を発する複数の発光素子を提供する工程と、
前記複数の発光素子の少なくとも3つを、その3つの発光素子のそれぞれが前記色度副領域のうちの異なるものからの光を発するように選択する工程と、
前記選択された発光素子を前記発光素子パッケージ本体の上に装着する工程と
を備え、
前記定義された副領域は複数の相補副領域対を備え、
一対の相補副領域のそれぞれの副領域は前記色度領域の中心点の反対側に互いに配置され、
前記複数の発光素子の前記少なくとも3つを選択する工程は、少なくとも4つの色度副領域からの前記複数の発光素子の少なくとも4つを、相補副領域のそれぞれの対から互いに対の形で選択する工程を備え、
一対の相補副領域から一対の発光素子を選択する工程は、前記色度領域の中心点から第1の距離に位置する中心点を有する第1の副領域から、第1の光束を有する第1の発光素子を選択する工程と、前記第1の副領域に相補的であって前記色度領域の中心点から第2の距離に位置する中心点を有する第2の副領域から、第2の光束を有する第2の発光素子を選択する工程とを備え、
前記第1の距離は前記第2の距離よりも短く、前記第1の光束は前記第2の光束よりも大きい、前記方法。 - 請求項1記載の方法において、前記色度領域が第1の色度領域を備え、前記複数の発光素子が第1の複数の発光素子を備え、さらに、
第2の色度領域を2次元色度空間内に定義し、前記第2の色度領域を少なくとも3つの第2の色度副領域に副分割する工程と、
前記第2の色度副領域の少なくとも1つに入る1つの色度を有する光を発する、第2の複数の発光素子を提供する工程と、
前記第2の複数の発光素子の少なくとも3つを、前記第2の複数の発光素子のその3つの発光素子のそれぞれが前記第2の色度副領域のうちの異なるものからの光を発するように選択する工程と、
前記第2の複数の発光素子の前記選択された発光素子を前記発光素子パッケージ本体の上に装着する工程と
を備える、前記方法。 - 請求項2記載の方法において、前記第1の色度領域は、2700Kと6500Kとの間の補正済み色温度を有する黒体軌跡上の1点の10−STEPマカダム楕円内の1つの色度点を有する光を備え、前記第2の色度領域はおよそ600ナノメートルより長い支配的波長を有する光を備える、前記方法。
- 請求項2記載の方法において、さらに、
第3の色度領域を2次元色度空間内に定義し、前記第3の色度領域を少なくとも3つの第3の色度副領域に副分割する工程と、
前記第3の色度副領域の少なくとも1つに入る1つの色度を有する光を発する、第3の複数の発光素子を提供する工程と、
前記第3の複数の発光素子の少なくとも3つを、前記第3の複数の発光素子のその3つの発光素子のそれぞれが前記第3の色度副領域のうちの異なるものからの光を発するように選択する工程と、
前記第3の複数の発光素子の前記選択された発光素子を前記発光素子パッケージ本体の上に装着する工程と
を備える、前記方法。 - 請求項4記載の方法において、前記第1の色度領域は、2700Kと6500Kとの間の補正済み色温度を有する黒体軌跡上の1点の10−STEPマカダム楕円内の1つの色度点を有する光を備え、前記第2の色度領域はおよそ600ナノメートルより長い支配的波長を有する光を備え、前記第3の色度領域は、(0.32,0.40)、(0.36,0.48)、(0.43,0.45)、(0.42,0.42)、(0.36,0.38)の座標を有する点で定義された、1931 CIE色度図上の1つの領域内のx、y色座標を有する光を備える、前記方法。
- 請求項1記載の方法において、前記色度副領域のそれぞれが少なくとも2つの別の色度副領域と境界を接する、前記方法。
- 請求項1記載の方法において、前記色度領域が2次元色度空間内の定義された1つの区分け域を包含し、前記定義された区分け域が7−STEPマカダム楕円を近似する、前記方法。
- 請求項7記載の方法において、前記少なくとも3つの発光素子からの組み合わせた光が、前記定義された区分け域の部分集合である目標色度領域に入る、前記方法。
- 請求項8記載の方法において、前記定義された色度領域が前記定義された区分け域より大きくかつそれを取り囲み、前記目標色度領域が前記定義された区分け域の縁部に触れている、前記方法。
- 請求項8記載の方法において、前記目標色度領域が4−STEPマカダム楕円の大きさを近似する、前記方法。
- 請求項7記載の方法において、前記少なくとも3つの色度副領域の各々が、前記定義された区分け域と少なくとも部分的に重なり合う、前記方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15388909P | 2009-02-19 | 2009-02-19 | |
US61/153,889 | 2009-02-19 | ||
US12/425,855 | 2009-04-17 | ||
US12/425,855 US7967652B2 (en) | 2009-02-19 | 2009-04-17 | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
PCT/US2010/023327 WO2010096288A1 (en) | 2009-02-19 | 2010-02-05 | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
Publications (2)
Publication Number | Publication Date |
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JP2012518293A JP2012518293A (ja) | 2012-08-09 |
JP5694199B2 true JP5694199B2 (ja) | 2015-04-01 |
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Application Number | Title | Priority Date | Filing Date |
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JP2011551112A Active JP5694199B2 (ja) | 2009-02-19 | 2010-02-05 | 1つのパッケージ内に複数の発光素子を結合するための方法と複数の結合された発光素子を含むパッケージ |
Country Status (7)
Country | Link |
---|---|
US (1) | US7967652B2 (ja) |
EP (1) | EP2399062B1 (ja) |
JP (1) | JP5694199B2 (ja) |
KR (1) | KR20110127685A (ja) |
CN (1) | CN102405372B (ja) |
TW (1) | TW201041119A (ja) |
WO (1) | WO2010096288A1 (ja) |
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-
2009
- 2009-04-17 US US12/425,855 patent/US7967652B2/en active Active
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2010
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EP2399062A1 (en) | 2011-12-28 |
TW201041119A (en) | 2010-11-16 |
WO2010096288A1 (en) | 2010-08-26 |
JP2012518293A (ja) | 2012-08-09 |
EP2399062B1 (en) | 2016-04-20 |
CN102405372A (zh) | 2012-04-04 |
US20100140633A1 (en) | 2010-06-10 |
US7967652B2 (en) | 2011-06-28 |
CN102405372B (zh) | 2015-07-22 |
KR20110127685A (ko) | 2011-11-25 |
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