JP5690985B2 - 支持装置およびエッチング方法 - Google Patents
支持装置およびエッチング方法 Download PDFInfo
- Publication number
- JP5690985B2 JP5690985B2 JP2009293457A JP2009293457A JP5690985B2 JP 5690985 B2 JP5690985 B2 JP 5690985B2 JP 2009293457 A JP2009293457 A JP 2009293457A JP 2009293457 A JP2009293457 A JP 2009293457A JP 5690985 B2 JP5690985 B2 JP 5690985B2
- Authority
- JP
- Japan
- Prior art keywords
- processed
- etching
- workpiece
- support
- etching solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005530 etching Methods 0.000 title claims description 159
- 238000000034 method Methods 0.000 title claims description 41
- 238000012545 processing Methods 0.000 claims description 86
- 239000007788 liquid Substances 0.000 description 20
- 238000011084 recovery Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009293457A JP5690985B2 (ja) | 2009-12-24 | 2009-12-24 | 支持装置およびエッチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009293457A JP5690985B2 (ja) | 2009-12-24 | 2009-12-24 | 支持装置およびエッチング方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011134913A JP2011134913A (ja) | 2011-07-07 |
| JP2011134913A5 JP2011134913A5 (enExample) | 2013-02-07 |
| JP5690985B2 true JP5690985B2 (ja) | 2015-04-01 |
Family
ID=44347326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009293457A Expired - Fee Related JP5690985B2 (ja) | 2009-12-24 | 2009-12-24 | 支持装置およびエッチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5690985B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014056950A (ja) * | 2012-09-13 | 2014-03-27 | Lintec Corp | 保持装置及び保持方法 |
| JP7505910B2 (ja) * | 2020-04-28 | 2024-06-25 | 株式会社ディスコ | ウェットエッチング方法、及び、ウェットエッチング装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1092712A (ja) * | 1996-09-10 | 1998-04-10 | Sharp Corp | 半導体製造装置 |
| JP2002124508A (ja) * | 2000-10-13 | 2002-04-26 | Nec Corp | 基板用スピン処理装置 |
| US6939206B2 (en) * | 2001-03-12 | 2005-09-06 | Asm Nutool, Inc. | Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| JP2007115728A (ja) * | 2005-10-18 | 2007-05-10 | Sumco Corp | ウェーハの枚葉式エッチング装置及びウェーハの枚葉式エッチング方法 |
-
2009
- 2009-12-24 JP JP2009293457A patent/JP5690985B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011134913A (ja) | 2011-07-07 |
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