JP2011134913A5 - - Google Patents

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Publication number
JP2011134913A5
JP2011134913A5 JP2009293457A JP2009293457A JP2011134913A5 JP 2011134913 A5 JP2011134913 A5 JP 2011134913A5 JP 2009293457 A JP2009293457 A JP 2009293457A JP 2009293457 A JP2009293457 A JP 2009293457A JP 2011134913 A5 JP2011134913 A5 JP 2011134913A5
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JP
Japan
Prior art keywords
processed
opening
support device
etching
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009293457A
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English (en)
Japanese (ja)
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JP2011134913A (ja
JP5690985B2 (ja
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Priority to JP2009293457A priority Critical patent/JP5690985B2/ja
Priority claimed from JP2009293457A external-priority patent/JP5690985B2/ja
Publication of JP2011134913A publication Critical patent/JP2011134913A/ja
Publication of JP2011134913A5 publication Critical patent/JP2011134913A5/ja
Application granted granted Critical
Publication of JP5690985B2 publication Critical patent/JP5690985B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009293457A 2009-12-24 2009-12-24 支持装置およびエッチング方法 Expired - Fee Related JP5690985B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009293457A JP5690985B2 (ja) 2009-12-24 2009-12-24 支持装置およびエッチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009293457A JP5690985B2 (ja) 2009-12-24 2009-12-24 支持装置およびエッチング方法

Publications (3)

Publication Number Publication Date
JP2011134913A JP2011134913A (ja) 2011-07-07
JP2011134913A5 true JP2011134913A5 (enExample) 2013-02-07
JP5690985B2 JP5690985B2 (ja) 2015-04-01

Family

ID=44347326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009293457A Expired - Fee Related JP5690985B2 (ja) 2009-12-24 2009-12-24 支持装置およびエッチング方法

Country Status (1)

Country Link
JP (1) JP5690985B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014056950A (ja) * 2012-09-13 2014-03-27 Lintec Corp 保持装置及び保持方法
JP7505910B2 (ja) * 2020-04-28 2024-06-25 株式会社ディスコ ウェットエッチング方法、及び、ウェットエッチング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092712A (ja) * 1996-09-10 1998-04-10 Sharp Corp 半導体製造装置
JP2002124508A (ja) * 2000-10-13 2002-04-26 Nec Corp 基板用スピン処理装置
US6939206B2 (en) * 2001-03-12 2005-09-06 Asm Nutool, Inc. Method and apparatus of sealing wafer backside for full-face electrochemical plating
JP2007115728A (ja) * 2005-10-18 2007-05-10 Sumco Corp ウェーハの枚葉式エッチング装置及びウェーハの枚葉式エッチング方法

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