JP5690352B2 - 表面修飾ナノ粒子が共有結合した導電性粒子を含む組成物及びその製造方法 - Google Patents
表面修飾ナノ粒子が共有結合した導電性粒子を含む組成物及びその製造方法 Download PDFInfo
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- JP5690352B2 JP5690352B2 JP2012540084A JP2012540084A JP5690352B2 JP 5690352 B2 JP5690352 B2 JP 5690352B2 JP 2012540084 A JP2012540084 A JP 2012540084A JP 2012540084 A JP2012540084 A JP 2012540084A JP 5690352 B2 JP5690352 B2 JP 5690352B2
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052588 hydroxylapatite Inorganic materials 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001463 metal phosphate Inorganic materials 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- AWGZKFQMWZYCHF-UHFFFAOYSA-N n-octylprop-2-enamide Chemical compound CCCCCCCCNC(=O)C=C AWGZKFQMWZYCHF-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 101150102131 smf-1 gene Proteins 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- PADYPAQRESYCQZ-UHFFFAOYSA-N triethoxy-(4-methylphenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=C(C)C=C1 PADYPAQRESYCQZ-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26293409P | 2009-11-20 | 2009-11-20 | |
| US61/262,934 | 2009-11-20 | ||
| PCT/US2010/057399 WO2011063217A2 (en) | 2009-11-20 | 2010-11-19 | Compositions comprising conductive particles with surface-modified nanoparticles covalently attached thereto, and methods of making |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013511813A JP2013511813A (ja) | 2013-04-04 |
| JP2013511813A5 JP2013511813A5 (OSRAM) | 2013-09-05 |
| JP5690352B2 true JP5690352B2 (ja) | 2015-03-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012540084A Expired - Fee Related JP5690352B2 (ja) | 2009-11-20 | 2010-11-19 | 表面修飾ナノ粒子が共有結合した導電性粒子を含む組成物及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9153354B2 (OSRAM) |
| EP (1) | EP2502239A4 (OSRAM) |
| JP (1) | JP5690352B2 (OSRAM) |
| CN (1) | CN102714071A (OSRAM) |
| WO (1) | WO2011063217A2 (OSRAM) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| PL2534199T3 (pl) | 2010-02-11 | 2019-04-30 | 3M Innovative Properties Co | System żywicy zawierający rozproszone wielomodalne nanocząstki modyfikowane powierzchniowo |
| KR20130058002A (ko) * | 2010-04-20 | 2013-06-03 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 중합체성의 표면-개질된 나노입자를 함유하는 감압 접착제 |
| DE102011118720A1 (de) * | 2011-11-16 | 2013-05-16 | Admedes Schuessler Gmbh | Ethanollöslicher, elektrisch leitender Kleber |
| GB2505035B (en) | 2012-05-29 | 2014-10-29 | Conpart As | Isotropic conductive adhesive |
| US20140170427A1 (en) * | 2012-12-13 | 2014-06-19 | Carestream Health, Inc. | Anticorrosion agents for transparent conductive film |
| JP2017066407A (ja) * | 2013-11-27 | 2017-04-06 | 日東電工株式会社 | 導電性粘着テープ、電子部材及び粘着剤 |
| JP6106148B2 (ja) * | 2013-11-27 | 2017-03-29 | 日東電工株式会社 | 導電性粘着テープ、電子部材及び粘着剤 |
| CN104951156A (zh) * | 2014-03-31 | 2015-09-30 | 宸盛光电有限公司 | 电容式触控装置 |
| EP2991079B1 (en) * | 2014-08-29 | 2017-10-04 | Heraeus Deutschland GmbH & Co. KG | Electrically conductive composition |
| US11220610B2 (en) | 2014-11-24 | 2022-01-11 | Ppg Industries Ohio, Inc. | Methods for reactive three-dimensional printing by inkjet printing |
| CN104845548B (zh) * | 2015-04-24 | 2017-05-03 | 京东方科技集团股份有限公司 | 一种导电胶组合物及其制备方法、封框胶、显示面板 |
| US10669426B2 (en) * | 2016-03-31 | 2020-06-02 | Nissan Chemical Industries, Ltd. | Inorganic oxide microparticles having amphiphilic organic silane compound bonded thereto, organic solvent dispersion thereof, and composition for film formation |
| KR102385050B1 (ko) * | 2016-03-31 | 2022-04-11 | 닛산 가가쿠 가부시키가이샤 | 피막형성용 조성물 및 그 제조방법 |
| DE102016205702B4 (de) * | 2016-04-06 | 2017-12-14 | Siemens Healthcare Gmbh | Röntgendetektor mit Schutzelement und Klebeelement |
| US10224304B2 (en) | 2016-09-22 | 2019-03-05 | Apple Inc. | Conductive adhesive film structures |
| KR20210121308A (ko) * | 2017-03-06 | 2021-10-07 | 데쿠세리아루즈 가부시키가이샤 | 수지 조성물, 수지 조성물의 제조 방법, 및 구조체 |
| US11168235B2 (en) | 2017-05-09 | 2021-11-09 | 3M Innovative Properties Company | Electrically conductive adhesive |
| US12384097B2 (en) | 2017-08-18 | 2025-08-12 | Ppg Industries Ohio, Inc. | Additive manufacturing using reactive compositions |
| US10434704B2 (en) | 2017-08-18 | 2019-10-08 | Ppg Industries Ohio, Inc. | Additive manufacturing using polyurea materials |
| MY201992A (en) * | 2018-10-02 | 2024-03-27 | Resonac Corp | Resin composition, cured product, and semiconductor component |
| WO2020167626A1 (en) | 2019-02-11 | 2020-08-20 | Ppg Industries Ohio, Inc. | Multilayer systems and methods of making multilayer systems |
| CN115943070B (zh) | 2019-02-11 | 2025-02-14 | Ppg工业俄亥俄公司 | 弹性体组合物和使用方法 |
| MX2021009603A (es) | 2019-02-11 | 2021-10-26 | Ppg Ind Ohio Inc | Impresion tridimensional de tapas de sellado. |
| AU2020221466B2 (en) | 2019-02-11 | 2022-12-15 | Ppg Industries Ohio, Inc. | Methods of making chemically resistant sealing components |
| WO2020198673A1 (en) * | 2019-03-28 | 2020-10-01 | Carbo Ceramics Inc. | Composition and process for pelletizing carbon-based materials for proppant and industrial applications |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3992160A (en) * | 1974-06-27 | 1976-11-16 | Owens-Corning Fiberglas Corporation | Combinations of particulate metal and particulate glass |
| US6586483B2 (en) * | 2001-01-08 | 2003-07-01 | 3M Innovative Properties Company | Foam including surface-modified nanoparticles |
| JP5060692B2 (ja) * | 2001-07-13 | 2012-10-31 | 株式会社日本触媒 | 異方導電性材料 |
| JP2004155957A (ja) | 2002-11-07 | 2004-06-03 | Three M Innovative Properties Co | 異方導電性接着剤及びフィルム |
| JP2004189938A (ja) | 2002-12-12 | 2004-07-08 | Nippon Sheet Glass Co Ltd | 導電性樹脂成形部品 |
| US7189768B2 (en) * | 2003-11-25 | 2007-03-13 | 3M Innovative Properties Company | Solution containing surface-modified nanoparticles |
| JP4391836B2 (ja) | 2004-01-19 | 2009-12-24 | 積水化学工業株式会社 | 被覆導電粒子、異方性導電材料及び導電接続構造体 |
| CA2573397A1 (en) * | 2004-07-19 | 2006-01-26 | Elutex Ltd. | Modified conductive surfaces having active substances attached thereto |
| JP4563110B2 (ja) * | 2004-08-20 | 2010-10-13 | 積水化学工業株式会社 | 導電性微粒子の製造方法 |
| DE102004043573B3 (de) | 2004-09-09 | 2006-04-20 | Ulrich Clauss | Lamelle für ein Sonnenschutzrollo |
| JP5231022B2 (ja) * | 2004-12-30 | 2013-07-10 | スリーエム イノベイティブ プロパティズ カンパニー | 表面改質ナノ粒子を含むポリマーブレンドおよびその製造方法 |
| US8062670B2 (en) | 2005-08-05 | 2011-11-22 | 3M Innovative Properties Company | Compositions exhibiting improved flowability |
| CN100448540C (zh) * | 2005-11-08 | 2009-01-07 | 财团法人工业技术研究院 | 金属纳米光催化剂复合材料及其制法 |
| US7531595B2 (en) | 2006-03-08 | 2009-05-12 | 3M Innovative Properties Company | Pressure-sensitive adhesive containing silica nanoparticles |
| ATE555177T1 (de) | 2006-07-24 | 2012-05-15 | 3M Innovative Properties Co | Elektrisch leitende haftklebstoffe |
| US20080085410A1 (en) * | 2006-10-06 | 2008-04-10 | General Electric Company | Composition and associated method |
| KR100882735B1 (ko) | 2007-03-19 | 2009-02-06 | 도레이새한 주식회사 | 이방성 전도필름 및 이의 접착방법 |
| CN101058418A (zh) | 2007-04-12 | 2007-10-24 | 上海交通大学 | 聚甲基丙烯酸缩水甘油酯及其衍生物修饰的碳纳米管及其制备方法 |
| DE102007044302A1 (de) * | 2007-09-17 | 2009-03-19 | Bühler PARTEC GmbH | Verfahren zur Dispergierung von feinteiligen anorganischen Pulvern in flüssigen Medien unter Verwendung von reaktiven Siloxanen |
| US20110257054A1 (en) | 2008-12-30 | 2011-10-20 | Baran Jr Jimmie R | Lubricant Composition and Method of Forming |
| US8741819B2 (en) | 2008-12-30 | 2014-06-03 | 3M Innovative Properties Company | Composite particles and method of forming |
| CN101508418A (zh) * | 2009-03-17 | 2009-08-19 | 中国科学院长春应用化学研究所 | 一种制备铂/碳纳米管杂化材料的方法 |
| US20120100373A1 (en) | 2009-06-26 | 2012-04-26 | Shinbach Madeline P | Method of milling particles with nanoparticles and milled free-flowing powder |
-
2010
- 2010-11-19 CN CN2010800614573A patent/CN102714071A/zh active Pending
- 2010-11-19 EP EP10832249.6A patent/EP2502239A4/en not_active Withdrawn
- 2010-11-19 JP JP2012540084A patent/JP5690352B2/ja not_active Expired - Fee Related
- 2010-11-19 US US13/504,651 patent/US9153354B2/en active Active
- 2010-11-19 WO PCT/US2010/057399 patent/WO2011063217A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
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| EP2502239A2 (en) | 2012-09-26 |
| WO2011063217A2 (en) | 2011-05-26 |
| US20120313056A1 (en) | 2012-12-13 |
| US9153354B2 (en) | 2015-10-06 |
| JP2013511813A (ja) | 2013-04-04 |
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| WO2011063217A3 (en) | 2011-09-29 |
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