JP5689891B2 - 平坦なワークピースを両面加工する装置および方法 - Google Patents

平坦なワークピースを両面加工する装置および方法 Download PDF

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Publication number
JP5689891B2
JP5689891B2 JP2012535678A JP2012535678A JP5689891B2 JP 5689891 B2 JP5689891 B2 JP 5689891B2 JP 2012535678 A JP2012535678 A JP 2012535678A JP 2012535678 A JP2012535678 A JP 2012535678A JP 5689891 B2 JP5689891 B2 JP 5689891B2
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Prior art keywords
working
torque
pressure
holes
workpiece
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JP2012535678A
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Japanese (ja)
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JP2013510007A (ja
Inventor
ハンスペーター ボラー
ハンスペーター ボラー
マーク ライヒマン
マーク ライヒマン
Original Assignee
ピーター ヴォルターズ ゲーエムベーハー
ピーター ヴォルターズ ゲーエムベーハー
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2012535678A 2009-11-05 2010-10-28 平坦なワークピースを両面加工する装置および方法 Active JP5689891B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009052070A DE102009052070A1 (de) 2009-11-05 2009-11-05 Vorrichtung und Verfahren zur Doppelseitenbearbeitung flacher Werkstücke
DE102009052070.8 2009-11-05
PCT/EP2010/006602 WO2011054481A1 (fr) 2009-11-05 2010-10-28 Dispositif et procédé d'usinage bilatéral de pièces plates présentant une alimentation en fluide de travail optimisée

Publications (2)

Publication Number Publication Date
JP2013510007A JP2013510007A (ja) 2013-03-21
JP5689891B2 true JP5689891B2 (ja) 2015-03-25

Family

ID=43589852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012535678A Active JP5689891B2 (ja) 2009-11-05 2010-10-28 平坦なワークピースを両面加工する装置および方法

Country Status (7)

Country Link
US (1) US20120220197A1 (fr)
EP (1) EP2496384A1 (fr)
JP (1) JP5689891B2 (fr)
KR (1) KR101824564B1 (fr)
CN (1) CN102666015A (fr)
DE (1) DE102009052070A1 (fr)
WO (1) WO2011054481A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5671735B2 (ja) * 2011-01-18 2015-02-18 不二越機械工業株式会社 両面研磨装置
DE102012221484A1 (de) 2012-11-23 2014-05-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Maschinenbaugruppe, Fertigungsmaschine mit Maschinenbaugruppe sowie Verwendung und Verfahren zur Fertigung von Rotationsbauteilen
JP6197598B2 (ja) * 2013-11-18 2017-09-20 株式会社Sumco ワークの両面研磨装置及び両面研磨方法
DE102014116598A1 (de) * 2014-11-13 2016-05-19 Vorwerk & Co. Interholding Gesellschaft mit beschränkter Haftung Vorrichtung, Verwendung einer Vorrichtung und Verfahren zur Oberflächenbearbeitung
DE102018202059A1 (de) * 2018-02-09 2019-08-14 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919257U (ja) * 1982-07-30 1984-02-06 ホ−ヤ株式会社 両面加工装置
US4549917A (en) * 1983-02-01 1985-10-29 Adolph Coors Company Die cut window laminating device
JP4308344B2 (ja) * 1998-07-24 2009-08-05 不二越機械工業株式会社 両面研磨装置
DE10007390B4 (de) 1999-03-13 2008-11-13 Peter Wolters Gmbh Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern
US6299514B1 (en) * 1999-03-13 2001-10-09 Peter Wolters Werkzeugmachinen Gmbh Double-disk polishing machine, particularly for tooling semiconductor wafers
JP2000271857A (ja) * 1999-03-25 2000-10-03 Super Silicon Kenkyusho:Kk 大口径ウェーハの両面加工方法及び装置
DE19937784B4 (de) * 1999-08-10 2006-02-16 Peter Wolters Werkzeugmaschinen Gmbh Zweischeiben-Feinschleifmaschine
JP2002187062A (ja) * 2000-12-22 2002-07-02 Toshiba Mach Co Ltd 平面研磨装置、平面研磨方法及びそれに使用される砥石
US6641462B2 (en) * 2001-06-27 2003-11-04 Speedfam-Ipec Corporation Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing
JP4163485B2 (ja) * 2002-10-25 2008-10-08 不二越機械工業株式会社 両面研磨装置およびこれを用いた研磨加工方法
JP2004216541A (ja) * 2002-11-21 2004-08-05 Toshiba Ceramics Co Ltd ラッピング装置
CN101306512A (zh) * 2002-12-27 2008-11-19 株式会社荏原制作所 基片抛光设备
AU2003250921A1 (en) * 2003-07-09 2005-01-28 Peter Wolters Surface Technologies Gmbh And Co. Kg Holder for flat workpieces, in particular semiconductor wafers for mechanochemical polishing
US7040958B2 (en) * 2004-05-21 2006-05-09 Mosel Vitelic, Inc. Torque-based end point detection methods for chemical mechanical polishing tool which uses ceria-based CMP slurry to polish to protective pad layer
JP4673137B2 (ja) * 2005-06-13 2011-04-20 リバーエレテック株式会社 平面ラップ盤
JP2007021680A (ja) * 2005-07-19 2007-02-01 Shin Etsu Handotai Co Ltd ウエーハの両面研磨方法
JP2007123523A (ja) * 2005-10-27 2007-05-17 Ebara Corp 研磨方法及び研磨装置、並びに電解研磨装置
JP2007152499A (ja) * 2005-12-06 2007-06-21 Fujikoshi Mach Corp ワーク研磨方法

Also Published As

Publication number Publication date
CN102666015A (zh) 2012-09-12
EP2496384A1 (fr) 2012-09-12
WO2011054481A1 (fr) 2011-05-12
KR20120101371A (ko) 2012-09-13
KR101824564B1 (ko) 2018-02-01
DE102009052070A1 (de) 2011-05-12
US20120220197A1 (en) 2012-08-30
JP2013510007A (ja) 2013-03-21

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