CN111360608A - 双面减薄研削水流量的控制方法 - Google Patents
双面减薄研削水流量的控制方法 Download PDFInfo
- Publication number
- CN111360608A CN111360608A CN202010152622.1A CN202010152622A CN111360608A CN 111360608 A CN111360608 A CN 111360608A CN 202010152622 A CN202010152622 A CN 202010152622A CN 111360608 A CN111360608 A CN 111360608A
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- China
- Prior art keywords
- grinding wheel
- grinding
- length
- water
- water inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 142
- 238000000034 method Methods 0.000 title claims abstract description 60
- 230000008569 process Effects 0.000 claims abstract description 26
- 230000009467 reduction Effects 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 5
- 238000009825 accumulation Methods 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 229910052710 silicon Inorganic materials 0.000 description 19
- 239000010703 silicon Substances 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 16
- 230000003068 static effect Effects 0.000 description 10
- 230000008859 change Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 206010006514 bruxism Diseases 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/222—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding vertical surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010152622.1A CN111360608B (zh) | 2020-03-06 | 2020-03-06 | 双面减薄研削水流量的控制方法 |
US17/192,918 US11938588B2 (en) | 2020-03-06 | 2021-03-05 | Control method of grinding water flow rate during double side grinding process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010152622.1A CN111360608B (zh) | 2020-03-06 | 2020-03-06 | 双面减薄研削水流量的控制方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111360608A true CN111360608A (zh) | 2020-07-03 |
CN111360608B CN111360608B (zh) | 2021-08-27 |
Family
ID=71201170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010152622.1A Active CN111360608B (zh) | 2020-03-06 | 2020-03-06 | 双面减薄研削水流量的控制方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US11938588B2 (zh) |
CN (1) | CN111360608B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112259442A (zh) * | 2020-09-11 | 2021-01-22 | 徐州鑫晶半导体科技有限公司 | 晶圆双面减薄的方法和装置、存储介质 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006021291A (ja) * | 2004-07-09 | 2006-01-26 | Tokyo Seimitsu Co Ltd | 研削砥石、研削装置、及び研削方法 |
CN102620785A (zh) * | 2012-03-27 | 2012-08-01 | 青岛理工大学 | 磨削液有效流量率及动压力的测量装置及方法 |
CN103737439A (zh) * | 2013-12-16 | 2014-04-23 | 海宁奇晟轴承有限公司 | 一种轴承外圈端面的打磨机 |
CN104669105A (zh) * | 2013-11-26 | 2015-06-03 | 浙江上城科技有限公司 | 一种蓝宝石触摸面板的两面研磨方法 |
CN106466808A (zh) * | 2016-09-23 | 2017-03-01 | 江苏吉星新材料有限公司 | 一种双面研磨垫蓝宝石窗口片减薄加工方法 |
CN107081680A (zh) * | 2017-06-29 | 2017-08-22 | 长沙理工大学 | 一种可自动调节磨削液流量的刷式喷嘴 |
JP2018024041A (ja) * | 2016-08-09 | 2018-02-15 | 株式会社ディスコ | 研削方法 |
CN108453619A (zh) * | 2017-12-30 | 2018-08-28 | 苏州赛尔科技有限公司 | 蓝宝石衬底用减薄砂轮 |
CN110722465A (zh) * | 2019-11-06 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | 一种硅片减薄砂轮 |
CN110842762A (zh) * | 2019-11-19 | 2020-02-28 | 天津中环领先材料技术有限公司 | 一种大尺寸硅圆片减薄装置及其减薄工艺 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6672943B2 (en) * | 2001-01-26 | 2004-01-06 | Wafer Solutions, Inc. | Eccentric abrasive wheel for wafer processing |
DE102007030958B4 (de) * | 2007-07-04 | 2014-09-11 | Siltronic Ag | Verfahren zum Schleifen von Halbleiterscheiben |
-
2020
- 2020-03-06 CN CN202010152622.1A patent/CN111360608B/zh active Active
-
2021
- 2021-03-05 US US17/192,918 patent/US11938588B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006021291A (ja) * | 2004-07-09 | 2006-01-26 | Tokyo Seimitsu Co Ltd | 研削砥石、研削装置、及び研削方法 |
CN102620785A (zh) * | 2012-03-27 | 2012-08-01 | 青岛理工大学 | 磨削液有效流量率及动压力的测量装置及方法 |
CN104669105A (zh) * | 2013-11-26 | 2015-06-03 | 浙江上城科技有限公司 | 一种蓝宝石触摸面板的两面研磨方法 |
CN103737439A (zh) * | 2013-12-16 | 2014-04-23 | 海宁奇晟轴承有限公司 | 一种轴承外圈端面的打磨机 |
JP2018024041A (ja) * | 2016-08-09 | 2018-02-15 | 株式会社ディスコ | 研削方法 |
CN106466808A (zh) * | 2016-09-23 | 2017-03-01 | 江苏吉星新材料有限公司 | 一种双面研磨垫蓝宝石窗口片减薄加工方法 |
CN107081680A (zh) * | 2017-06-29 | 2017-08-22 | 长沙理工大学 | 一种可自动调节磨削液流量的刷式喷嘴 |
CN108453619A (zh) * | 2017-12-30 | 2018-08-28 | 苏州赛尔科技有限公司 | 蓝宝石衬底用减薄砂轮 |
CN110722465A (zh) * | 2019-11-06 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | 一种硅片减薄砂轮 |
CN110842762A (zh) * | 2019-11-19 | 2020-02-28 | 天津中环领先材料技术有限公司 | 一种大尺寸硅圆片减薄装置及其减薄工艺 |
Non-Patent Citations (1)
Title |
---|
《中国集成电路大全》编委会: "《集成电路封装》", 31 May 1993, 国防工业出版社 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112259442A (zh) * | 2020-09-11 | 2021-01-22 | 徐州鑫晶半导体科技有限公司 | 晶圆双面减薄的方法和装置、存储介质 |
CN112259442B (zh) * | 2020-09-11 | 2024-05-24 | 中环领先(徐州)半导体材料有限公司 | 晶圆双面减薄的方法和装置、存储介质 |
Also Published As
Publication number | Publication date |
---|---|
US20210276150A1 (en) | 2021-09-09 |
CN111360608B (zh) | 2021-08-27 |
US11938588B2 (en) | 2024-03-26 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Address before: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee before: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20230515 Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. |
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