JP5669864B2 - 耐熱性に優れた多層多孔フィルム - Google Patents
耐熱性に優れた多層多孔フィルム Download PDFInfo
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- JP5669864B2 JP5669864B2 JP2012551082A JP2012551082A JP5669864B2 JP 5669864 B2 JP5669864 B2 JP 5669864B2 JP 2012551082 A JP2012551082 A JP 2012551082A JP 2012551082 A JP2012551082 A JP 2012551082A JP 5669864 B2 JP5669864 B2 JP 5669864B2
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- layer
- porous film
- temperature
- multilayer porous
- resin
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Classifications
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Description
(a)第1層を製造するための組成物を溶融混練する段階と、
(b)第2層を製造するための組成物を溶融混練する段階と、
(c)前記(a)及び(b)で混練された溶融物を多層シートに成形する段階と、
(d)前記多層シートを延伸してフィルムに成形する段階と、
(e)前記フィルムから希釈剤(diluent)を抽出する段階と、
(f)前記フィルムを二次延伸する段階と、
(g)二次延伸されたフィルムを熱固定する段階と、を含む。
延伸過程を経て厚さが薄くなったシート、即ち、フィルムは、有機溶媒を用いて抽出及び乾燥する。本発明で使用可能な有機溶媒としては、特に限定されず、樹脂圧出に用いられた希釈剤を抽出することができるものであれば如何なる溶剤も使用可能であるが、抽出効率が高く、乾燥が早いメチルエチルケトン、メチレンクロライド、ヘキサンなどが好ましい。抽出方法としては、浸漬(immersion)法、溶剤スプレー(solvent spray)法、超音波(ultrasonic)法など、通常の全ての溶媒抽出法がそれぞれまたは複合的に用いられることができる。抽出時の残留希釈剤の含量は1重量%以下でなければならない。残留希釈剤が1重量%を超過すると、物性が低下し、フィルムの透過度が減少する。
用いられた樹脂の分子量及び分子量分布の測定は、Polymer Laboratory社の高温GPC(Gel Permeation Chromatography)で測定された。
第1層の樹脂と希釈剤は、φ=46mmの二軸コンパウンダで混練された。混練温度は180〜240℃であった。樹脂はメインホッパーに投入され、希釈剤はサイドフィーダーを用いて押出機に投入された。混練された溶融物は、3層シートの製造が可能な多層のTダイを用いて、必要な層の構成を有するように成形された。
Vr=Vp/P2*100
(1)ループステフネスは、Toyoseiki社のループステフネス測定機で測定された。試験片のサイズは150mm(長さ)x25mm(幅)で、押し速度は3.3mm/secであった。
C=(8FTV)/(πD2(P2-1))
ここで、C=Darcy透過度定数、F=流速、T=試験片の厚さ、V=気体の粘度(0.185 for N2)、D=試験片の直径、P=圧力
第1層には、重量平均分子量が3.0x105、溶融温度が134℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ30重量%、70重量%であった。第2層には、高耐熱樹脂としてメルトインデックスが9.0(260℃、5Kg)のポリメチルペンテン50体積%と、前記高耐熱樹脂と液‐液相分離されるその他の樹脂として重量平均分子量が5.7x105、溶融温度が163℃のポリプロピレン50体積%と、を用い、無機物としては平均粒子サイズが1.5μmのCaCO3を50重量%で用いた。
第1層には、重量平均分子量が3.0x105、溶融温度が134℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ30重量%、70重量%であった。第2層には、高耐熱樹脂としてメルトインデックスが9.0(260℃、5Kg)のポリメチルペンテン50体積%と、前記高耐熱樹脂と液‐液相分離されるその他の樹脂として重量平均分子量が2.5x105、溶融温度が148℃のポリプロピレン50体積%と、を用い、無機物としては平均粒子サイズが1.5μmのCaCO3を30重量%で用いた。
第1層には、重量平均分子量が3.0x105、溶融温度が134℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ30重量%、70重量%であった。第2層には、高耐熱樹脂としてメルトインデックスが9.0(260℃、5Kg)のポリメチルペンテン70体積%と、前記高耐熱樹脂と液‐液相分離されるその他の樹脂として重量平均分子量が2.3x105、溶融温度が133℃のポリエチレン30体積%と、を用いた。
第1層には、重量平均分子量が2.3x105、溶融温度が133℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ30重量%、70重量%であった。第2層には、一般耐熱樹脂として重量平均分子量が5.7x105、溶融温度が163℃のポリプロピレン100体積%と、平均粒子サイズが0.8μmのCaCO360重量%と、を用いた。
第1層には、重量平均分子量が3.0x105、溶融温度が134℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ30重量%、70重量%であった。第2層には、一般耐熱樹脂として重量平均分子量が5.7x105、溶融温度が163℃のポリプロピレン70体積%と、一般耐熱樹脂と液‐液相分離されるその他の樹脂として溶融温度が173℃のポリビニリデンフルオリド30体積%と、を用い、無機物としては平均粒子サイズが0.8μmのCaCO3を40重量%で用いた。
第1層に、重量平均分子量が3.0x105、溶融温度が134℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ35重量%、65重量%であった。
第1層には、重量平均分子量が3.0x105、溶融温度が134℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ30重量%、70重量%であった。第2層には、一般耐熱樹脂として重量平均分子量が5.7x105、溶融温度が163℃のポリプロピレン100体積%と、平均粒子サイズが0.8μmのCaCO320重量%と、を用いた。
第1層には、重量平均分子量が1.8x105、溶融温度が135℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ30重量%、70重量%であった。第2層には、高耐熱樹脂としてメルトインデックスが9.0(260℃、5Kg)のポリメチルペンテン30体積%と、前記高耐熱樹脂と液‐液相分離されるその他の樹脂として重量平均分子量が5.7x105、溶融温度が163℃のポリプロピレン70体積%と、を用い、無機物としては平均粒子サイズが1.5μmのCaCO3を70重量%で用いた。
第1層には、重量平均分子量が3.0x105、溶融温度が134℃のポリエチレンと、40℃で95cStの動粘度を有するパラフィンオイルと、を用いた。二つの成分の含量はそれぞれ30重量%、70重量%であった。第2層には、一般耐熱樹脂として重量平均分子量が5.7x105、溶融温度が163℃のポリプロピレン50体積%と、前記一般耐熱樹脂と液‐液相分離されるその他の樹脂として重量平均分子量が2.3x105、溶融温度が133℃のポリエチレン50体積%と、を用いた。
2 微多孔フィルム
3 テープ
Claims (7)
- 空隙率が30〜60%であり、気孔の平均直径が0.01〜0.1μmである第1層と、第1層に隣接した第2層を含む多層多孔フィルムであって、
前記第2層は、空隙率が50〜80%、平面平均直径が0.1〜50μmの気孔が前記第2層の気孔中に占める面積の割合が70%以上、前記第2層の厚さは、3μm以上で、多層多孔フィルム全体の厚さの30〜70%であり、
前記多層多孔フィルムは、厚さが9〜50μm、縦方向のループステフネスが0.008mg/μm以上、穿孔強度が0.15N/μm以上、透過度が1.5x10-5Darcy以上であり、シャットダウン温度が140℃以下、溶融破断温度が170℃以上、1mN/(1μmx6mm)の荷重での熱機械分析(TMA)における、横方向(TD)の最大収縮率が25%以下、メルトダウン温度(長さが120%となる温度)が160℃以上であり、
前記第1層は、溶融温度が125〜140℃であるポリエチレン又はポリエチレン混合物であり、前記第2層は、溶融温度が180℃以上の高耐熱樹脂を樹脂組成物の50〜85体積%と前記高耐熱樹脂と液−液相分離されるその他の樹脂を樹脂組成物の15〜50体積%含む、又は溶融温度が160〜180℃の一般耐熱樹脂を樹脂組成物の50体積%以上と平均粒子サイズが0.01〜5μmの無機物を30〜60重量%含む、
多層多孔フィルム。 - 第2層が、溶融温度が180℃以上の高耐熱樹脂を樹脂組成物の50〜85体積%と前記高耐熱樹脂と液−液相分離されるその他の樹脂を樹脂組成物の15〜50体積%含むことを特徴とする請求項1に記載の多層多孔フィルム。
- 第2層が、平均粒子サイズが0.01〜5μmの無機物を樹脂組成物の50重量%以下含むことを特徴とする請求項2に記載の多層多孔フィルム。
- 第2層が、溶融温度が160〜180℃の一般耐熱樹脂を樹脂組成物の50体積%以上と平均粒子サイズが0.01〜5μmの無機物を30〜60重量%含むことを特徴とする請求項1に記載の多層多孔フィルム。
- 第2層が、一般耐熱樹脂と液−液相分離されるその他の樹脂を樹脂組成物の50体積%以下含むことを特徴とする請求項4に記載の多層多孔フィルム。
- 第1層は空隙率が40〜55%、気孔の平均直径が0.01〜0.05μmであり、第2層は空隙率が60〜80%、平面平均直径が1〜50μmの気孔が前記第2層の気孔中に占める面積の割合が70%以上であり、前記第1層及び前記第2層を含む多層多孔フィルムは、厚さが12〜35μm、溶融破断温度が180℃以上である、請求項1〜5のいずれかに記載の多層多孔フィルム。
- 多層多孔フィルムは、第1層及び第2層を有する2層多孔フィルムから形成された多層多孔フィルム、第2層の両表面に第1層が形成された3層多孔フィルムから形成された多層多孔フィルム又は第1層の両表面に第2層が形成された3層多孔フィルムから形成された多層多孔フィルムである、請求項1〜6のいずれかに記載の多層多孔フィルム。
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KR1020100006447A KR101269207B1 (ko) | 2010-01-25 | 2010-01-25 | 내열성이 우수한 다층 다공막 |
KR10-2010-0006447 | 2010-01-25 | ||
PCT/KR2011/000505 WO2011090356A2 (en) | 2010-01-25 | 2011-01-25 | Porous multi-layer film with improved thermal properties |
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EP2529430B1 (en) | 2019-06-26 |
KR20110087017A (ko) | 2011-08-02 |
US8920913B2 (en) | 2014-12-30 |
CN102742045A (zh) | 2012-10-17 |
JP2013517969A (ja) | 2013-05-20 |
KR101269207B1 (ko) | 2013-05-31 |
WO2011090356A2 (en) | 2011-07-28 |
TW201203667A (en) | 2012-01-16 |
US20120301698A1 (en) | 2012-11-29 |
EP2529430A4 (en) | 2014-04-30 |
EP2529430A2 (en) | 2012-12-05 |
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CN102742045B (zh) | 2015-08-19 |
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