JP5654288B2 - 光モジュール及び高周波モジュール - Google Patents

光モジュール及び高周波モジュール Download PDF

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JP5654288B2
JP5654288B2 JP2010187471A JP2010187471A JP5654288B2 JP 5654288 B2 JP5654288 B2 JP 5654288B2 JP 2010187471 A JP2010187471 A JP 2010187471A JP 2010187471 A JP2010187471 A JP 2010187471A JP 5654288 B2 JP5654288 B2 JP 5654288B2
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substrate
optical module
conductor pattern
conductor
signal
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Japanese (ja)
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JP2012047823A (ja
JP2012047823A5 (enExample
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坂　卓磨
卓磨 坂
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日本オクラロ株式会社
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  • Optical Communication System (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
JP2010187471A 2010-08-24 2010-08-24 光モジュール及び高周波モジュール Active JP5654288B2 (ja)

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JP2010187471A JP5654288B2 (ja) 2010-08-24 2010-08-24 光モジュール及び高周波モジュール

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JP2010187471A JP5654288B2 (ja) 2010-08-24 2010-08-24 光モジュール及び高周波モジュール

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JP2012047823A JP2012047823A (ja) 2012-03-08
JP2012047823A5 JP2012047823A5 (enExample) 2013-08-01
JP5654288B2 true JP5654288B2 (ja) 2015-01-14

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JP2010187471A Active JP5654288B2 (ja) 2010-08-24 2010-08-24 光モジュール及び高周波モジュール

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013201473A (ja) * 2012-03-23 2013-10-03 Sumitomo Electric Ind Ltd 光受信モジュール
WO2015146738A1 (ja) 2014-03-24 2015-10-01 技術研究組合光電子融合基盤技術研究所 Ｉｃチップを基板に搭載させるための基板上のパッド・アレイ構造、並びに当該パッド・アレイ構造を有する光モジュール
JP6229649B2 (ja) 2014-12-08 2017-11-15 富士通オプティカルコンポーネンツ株式会社 光モジュール
JPWO2016129277A1 (ja) * 2015-02-12 2017-11-24 古河電気工業株式会社 フレキシブル基板及び光モジュール
JP6430296B2 (ja) 2015-03-06 2018-11-28 日本オクラロ株式会社 光モジュール
JP6430312B2 (ja) * 2015-03-24 2018-11-28 日本オクラロ株式会社 光モジュール
JP6540417B2 (ja) 2015-09-18 2019-07-10 富士通オプティカルコンポーネンツ株式会社 光伝送装置及び光モジュール
JP6958098B2 (ja) * 2017-08-10 2021-11-02 住友電気工業株式会社 光モジュール
JP6939603B2 (ja) * 2018-01-26 2021-09-22 住友電気工業株式会社 光受信モジュール用パッケージ
JP7166874B2 (ja) * 2018-10-25 2022-11-08 古河電気工業株式会社 光モジュール実装基板および容器実装基板
JP7474145B2 (ja) * 2020-07-29 2024-04-24 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 光モジュール
CN114217390B (zh) * 2021-12-24 2024-02-23 苏州浪潮智能科技有限公司 光交换机设计方法、光交换机、电子设备及存储介质

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184888A (ja) * 2000-12-13 2002-06-28 Kyocera Corp 入出力端子および半導体素子収納用パッケージ
JP2003224324A (ja) * 2002-01-30 2003-08-08 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置
JP2004356340A (ja) * 2003-05-28 2004-12-16 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2005222003A (ja) * 2004-02-09 2005-08-18 Fujikura Ltd マウント、光部品、光送受信モジュール及び双方向光通信モジュール
JP2007207803A (ja) * 2006-01-31 2007-08-16 Opnext Japan Inc 光送信モジュール
JP2008166730A (ja) * 2006-12-04 2008-07-17 Nec Corp 光モジュールおよび光トランシーバ
JP2009004460A (ja) * 2007-06-19 2009-01-08 Opnext Japan Inc 光通信モジュールおよび配線パタンの形成方法

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JP2012047823A (ja) 2012-03-08

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