JP5654288B2 - Optical module and high frequency module - Google Patents

Description

  The present invention relates to an optical module and a high-frequency module using a ceramic substrate, and more particularly to a technique for preventing electromagnetic wave radiation from the optical module, which is excellent in high-frequency transmission characteristics of the optical module.

  The optical communication network includes an optical fiber as a medium for propagating an optical signal and an optical module for transmitting and receiving the optical signal. An optical module is composed of a photoelectric conversion unit for converting an electrical signal into an optical signal and an optical signal into an electrical signal, and a printed circuit board on which electronic elements and electrical connectors for control are mounted. Is done. The shapes of these optical modules are often shared by vendors. For example, in the case of transmitting 10 Gbps, it is known by the MSA (Multi Source Agreement) standard called XFP, Xenpak, X2, 300 PIN. It has been commercialized by several companies.

  2. Description of the Related Art Recent optical modules include a package in which an optical element that performs photoelectric conversion such as a laser (light emitting element) and a photodiode (light receiving element) is mounted, and a flexible substrate solder-connected to a transmission line on the package. Made. This flexible board is soldered to the conductor pattern on the printed board. In general, among these optical modules, a combination of a package and a flexible substrate may be called ROSA on the light receiving side and TOSA on the transmitting side. In recent years, among these TOSA / ROSA, in the 10 Gbps transmission class, optical modules corresponding to the MSA standard called XMD have been commercialized by several companies. The TOSA and ROSA are referred to as optical modules, and the TOSA / ROSA attached to a board on which an IC is mounted may be referred to as an optical transceiver. In this patent, the optical transceiver is also a broad optical module. It will be described as being.

  High-frequency packages that transmit 10 Gbps are often hermetically sealed in order to prevent dirt and moisture from adhering to optical elements and ICs. Such packages often include internal and external packages. Packages using ceramic substrates for signal transmission are often used. As typical materials for these ceramic substrates, alumina, aluminum nitride and the like are known.

  A lead pin is fixed to a signal, ground, power supply pattern and the like on the ceramic substrate outside the package, and the lead pin is soldered to a conductor pattern on the printed circuit board or flexible substrate.

  Patent Document 1 is disclosed as an example of such an optical module.

  In Patent Document 1, a transmission path such as a high-frequency signal, a power source, and a ground is patterned on the surface layer of the multilayer ceramic substrate outside the package. On this patterning, lead pins are mounted and connected. In order to increase the connection strength of this lead pin, the side surface of the laminated ceramic end is also metallized. In other words, the solder metal used to attach the lead pin wets and spreads not only on the pattern on which the lead pin is mounted, but also on the metallization on the side surface, and has the advantage that it is difficult to peel off even when external stress is applied to the lead pin. Have.

JP 2006-135353 A

However, in the above-described optical module, the following (1) to (3) are problems.
(1) In an optical module that transmits 10 Gbps, a high-frequency signal pattern and a ground pattern are generally adjacent to each other. When a lead pin is attached to these patterns while maintaining strength, An electromagnetic capacitive coupling occurs between the signal side metallization and the ground side metallization, and the characteristic impedance is lowered. In particular, ceramics such as alumina used in a package have a large relative dielectric constant of 8 or more, so that electric lines of force are likely to be unevenly distributed in the package, resulting in increased capacitive coupling.
(2) Side metallization is at the pattern edge (ie ceramic edge). Therefore, when an attempt is made to connect a lead pin to a pattern on an external printed board or flexible board, capacitive coupling is also caused between the pattern on the board and the side metallization, and the characteristic impedance is further lowered.
(3) Due to the above characteristic impedance reduction, the high-frequency signal is reflected or radiated around the side metallization. These reflections and radiations deteriorate the high-frequency transmission performance of the optical module. The electromagnetic field radiation causes malfunction of the active electronic device (IC) on the board.

  The conventional optical module is intended for transmission of 10 Gbps or less, and at 10 GHz or less, these reflections and radiations are so small that they do not become a problem. However, in recent years, an optical module and an optical transceiver corresponding to a transmission speed of about 20 Gbps and further about 40 Gbps have been required, and the high frequency transmission characteristics of the optical module itself are improved even in a high frequency range of 10 GHz or more. There has been a need to prevent electromagnetic field radiation from.

  Therefore, the present invention has been made to solve the problems of the prior art, and an object of the present invention is to achieve excellent high frequency performance without compromising mechanical reliability such as strength, and to provide a ceramic substrate. An optical module provided in the unit and an optical transceiver to which the optical module is applied.

  The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  In the optical module of the present invention, a part of the package is constituted by a multilayer ceramic substrate, and a conductor pattern for transmitting a signal and a ground conductor are patterned inside or on the surface of the multilayer ceramic substrate. This multilayer ceramic substrate is indicated as a first substrate. These packages for optical modules generally have a box shape or a coaxial shape, but the shape may be changed according to the purpose. The conductor pattern includes not only a pattern patterned on the ceramic substrate but also a pattern in the ceramic substrate, a via and a through hole penetrating the ceramic substrate. The ground conductor is also referred to as a ground conductor or the like, and refers to a conductor pattern arranged close to the signal conductor pattern so that the characteristic impedance of the conductor pattern through which a high-frequency signal propagates is maintained. The area often has a width of several tens of times the conductor pattern through which high-frequency signals propagate. The ground conductor does not necessarily need to be electrically connected to a metal or a metal pattern that covers the outside of the package, or the casing of the optical module and the optical transceiver.

  Furthermore, in the optical module of the present invention, a second substrate having a conductive pattern of the first multilayer ceramic substrate and a conductive pattern capable of conducting through a lead pin and a conductor such as solder is attached. The optical module of the present invention indicates at least the second substrate and the package, but of course, the package, a member connected to the first and second substrates, and the like may also be indicated.

  In the optical module of the present invention, side surfaces of the conductor pattern end on the first multilayer ceramic substrate are metallized by half vias, castellations, etc. in order to increase the mounting strength of the lead pins. The first multilayer ceramic substrate itself is provided with a mechanism so that the position of the side metallization for use is shifted in the signal transmission direction.

That is, the principle on which the effect can be obtained by this configuration will be described below. In the optical module of the present invention, at least one pair of signals and ground side metallization provided at the end of the ceramic substrate are arranged without being adjacent to each other, and air having a low relative dielectric constant is provided between the signal and ground side metallization. There are many layers. Also, the distance between the signal and ground side metallization is increased. Capacitive coupling is generally considered as the capacitance between two parallel plates. Ε _s ε ₀ × S / d (ε _s : relative permittivity, ε ₀ : vacuum permittivity, S: plate area, d: distance ). The shape of the side metallization of the signal and the ground is not two parallel plates, but the effective relative dielectric constant is lowered by the presence of many air layers between the two side metallizations by the technique disclosed in the present application. The distance between the two side metallizations becomes longer.

  As described above, the capacitive coupling between the two side surface metallizations is small, and the characteristic impedance is hardly lowered. In addition, when a second substrate such as an external printed circuit board or a flexible substrate is connected to the optical module package, capacitive coupling does not occur between the side metallization of the signal and the pattern on the second substrate, Reduction in characteristic impedance is suppressed.

  According to the present invention, it is possible to provide an optical module having a high frequency transmission characteristic with less reflection and radiation of a high frequency signal. In addition, since electromagnetic field radiation from the present optical module is suppressed, there is no malfunction of the optical module and the optical transceiver itself, and performance can be improved.

It is a perspective view which shows the structure of the optical module of Example 1 of this invention. It is sectional drawing of the optical module of FIG. It is a perspective view which shows the optical module structure of Example 2 of this invention. FIG. 4 is a top view of the optical module in FIG. 3. It is a top view which shows the optical module structure of Example 3 of this invention. It is a side view of the optical module of FIG. FIG. 6 is a top view of the optical module in FIG. 5. It is a top view which shows the structure of the optical module of Example 4 of this invention. It is a side view of the optical module of FIG. It is a top view which shows the structure of the optical module of Example 5 of this invention. It is a perspective view which shows the optical module structure of Example 6 of this invention. It is a perspective view which shows the optical module structure of Example 7 of this invention. It is a top view of the optical module of FIG. It is a top view which shows the optical module structure of this invention Example 8. FIG. It is a top view which shows the optical module structure of this invention Example 9. FIG. FIG. 16 is a top view of the optical module in FIG. 15. It is a top view which shows the optical module structure of Example 10 of this invention. It is a side view of the optical module of FIG. It is a top view which shows the optical module structure of this invention Example 11. FIG. It is a side view of the optical module of FIG. It is a perspective view which shows the optical module structure of Example 11 of this invention. It is a perspective view which shows the optical module of Example 12 of this invention, and a high frequency module structure. It is a perspective view which shows the high frequency module structure of Example 13 of this invention. It is a figure which shows the relationship between a reflection loss and an input frequency.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In all the drawings for explaining the embodiments, those having the same function are not described repeatedly.
<Example 1>
FIG. 1 is a perspective view showing an optical module configuration of Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of the optical module. For convenience, the coordinate axes are set as shown in the figure, and the input / output direction of the optical signal is the Z axis. For convenience of illustration, when there are the same members, the reference numerals may be attached to the representative members. For example, in FIG. 1, the conductor pattern 0122 on the ceramic substrate 0115 and the conductor pad 0148 on the flexible substrate 0114 in FIG. The same applies to the drawings other than FIGS.

  In FIG. 1, a package housing 0101 is made of metal, and a multilayer ceramic substrate 0103 is attached to one side surface of the package housing 0101 in order to transmit a signal, a ground, and a power supply inside and outside the package. Yes. The ceramic substrate 0115 is a part of the multilayer ceramic substrate 0103. As the material of the ceramic substrate 0103, alumina, aluminum nitride or the like is known, but of course, another material may be used. Here, the multilayer ceramic substrate 0103 and the ceramic substrate 0115 are essentially the same, and the ceramic substrate 0115 is a plurality or one layer of the multilayer ceramic substrate 0103. The multilayer ceramic substrate 0103 and the ceramic substrate 0115 are formed by stacking a plurality of single-layer ceramic substrates. In general, a single-layer ceramic substrate often has an XZ plane as a main plane and a thickness of about several hundred microns. Here, on the main plane of the multilayer ceramic substrate 0115, a signal transmission conductor pattern 0106, a power supply and adjustment conductor pattern 0122, a ground conductor pattern 0136, and the like are patterned. For example, lead pins 0120 are mounted and connected on the signal conductor pattern 0106. When the lead pins 0120 are connected, they are often brazed with silver solder or the like, but other materials may be used. The same applies to other conductor patterns and lead pins. There are half vias 0104, 0107, 0108 and the like at the end of the conductor pattern on the ceramic substrate 0115. This has a half via structure in which a columnar or polygonal columnar via whose main axis is the Y axis is divided in half. For example, when the lead pin 0120 is attached to the signal conductor pattern 0106, these half vias wet not only the conductor pattern 0106 but also the half via 0107 so that the connection strength of the lead pin 0120 is increased. Of course, the shape does not necessarily need to be a half via, and the function is the same if the side surface of the ceramic substrate 0115 is metalized.

  Two signal lead pins 0120 are attached adjacent to each other, and ground lead pins 0121 are positioned on both sides of the signal lead pins 0120. That is, the signal input / output unit has a GSSG (GND-SIGNAL-SIGNAL-GND is abbreviated notation) arrangement, which indicates that the illustrated example is for differential signal transmission.

  The ceramic substrate 0115 of the present optical module is provided with a notch portion 0105, and the positions of the ground half via 0104 and the signal half via 0107 in the Z-axis direction are distance L1 (see FIG. 2). ) Is shifted in the Z-axis direction. That is, an air layer is located in a part between the half via 0104 and the half via 0107.

  Now, conductor patterns 0113, 0119 and conductor pads 0109, 0116, 0112 are patterned on one main plane on the flexible substrate 0114 of this embodiment, and a flexible substrate is formed by through holes 0117, 0118, 0110, 0111. [0114] Electrical contact is made with a conductor pattern or conductor pad (not shown) on the back side. In addition, as long as the above-mentioned conductor pattern and conductor pad are connected, they are the same, and the name is merely changed for convenience. For example, the signal transmission conductor pad 0116 and the conductor pattern 0119 have the same base material and are connected to each other.

  However, in general, a conductor pad often indicates a portion provided for connecting to another conductor by solder or the like, and the upper surface of the base material is often subjected to solder plating or gold plating. The conductor pattern extends long on the flexible substrate 0114 in order to transmit power and signals, and the upper surface of the base material is often protected from the outside by a cover layer or the like.

  A lead pin 0120 is inserted into the through hole 0118, and is provided for conducting and fixing both of them with solder or the like. Thus, a signal can be transmitted through the conductor pattern 0119 on the flexible substrate 0114 and the conductor pattern 0106 on the ceramic substrate 0115.

FIG. 2 is a cross-sectional view when the flexible substrate 0114 is fixed to the ceramic substrate 0115.
A conductor pattern 0130 and the like are patterned in the housing 0101, and a substrate 0127 on which a plate capacitor 0139, a driver IC 0132 and the like are mounted is mounted. On the substrate 0127, an optical element mounting substrate 0128 on which the optical element 0129 is mounted is mounted.

  As described above, the substrate 0127 may be mounted with various electronic elements and is often subjected to various patterning. The optical element mounting substrate 0128 may be mounted on a temperature controller or the like. Further, even if not described in this embodiment, there are various mounting methods for mounting the optical element 0129 in the housing 0101. In addition to solder and conductive adhesive, wires 0133 and the like are used for electrical continuity of the patterns and electronic elements in the housing 0101.

  A transparent window 0126 is attached to the housing 0101 so that optical signals can be propagated inside and outside the housing 0101. The optical fiber 0124 is attached to the sleeve 0125, and the sleeve 0125 is attached to the holder 0123. The sleeve 0125 is often made of ceramic such as zirconia. The holder 0123 itself is fixed to the housing 0101 by welding, soldering, an adhesive, or the like. An optical fiber connector can be attached to the holder 0123 from the outside. The lens 0146 is fixed to the lens holder 0147 and plays a role of increasing the optical coupling efficiency between the optical signal passing through the optical fiber 0124 and the optical element 0129.

  The multilayer ceramic substrate 0103 plays a role of electrical connection between the inside and outside of the housing 0101. Conductor patterns 0122, 0135, 0137, etc. are patterned on the main plane of the ceramic substrate 0134 of a layer of the multilayer ceramic substrate 0103. In particular, the conductor pattern 0137 for signal transmission is on the same main plane as the conductor pattern 0106. Often patterned. The ground conductor patterns 0135 and 0136 are connected to the ground conductor patterns patterned on the other layers in the multilayer ceramic substrate 0103 by the vias 0138 and 0145. Further, not only the ground but also the signal, power supply, and adjustment conductor patterns may be electrically connected to the conductor pattern patterned in the ceramic substrate 0103 or on the front and back surfaces by vias.

  A lead pin 0102 is inserted into a through hole 0110 provided in the flexible substrate 0114 and fixed by solder 0149, but the same applies to other through holes and lead pins. From the above, it can be seen that the position of the flexible substrate 0114 is fixed with respect to the ceramic substrate 0103.

  By arranging the notch portion 0105, the distance between the signal half via 0107 and the ground half via 0104 is increased. Furthermore, an air layer is automatically positioned between the straight lines connecting the centers of the two half vias. The relative dielectric constant of air is 1, which is low with respect to the ceramic substrate, and has the advantage that the capacitive coupling between the signal half via 0107 and the ground half via 0104 is sufficiently small. Depending on the distance L1 in the Z-axis direction, the width in the X-axis direction, and the shape of the notch 0105 provided in the ceramic substrates 0103 and 0115, the magnitude of the above capacitive coupling can be changed.

  Further, when the package having the casing 0101 and the ceramic substrate 0103 as a base material and the flexible substrate 0114 are connected, if there is no notch 0105, the signal half via 0107 and the ground conductor pad 0112 are connected. Large capacitive coupling is formed, and the characteristics are liable to deteriorate.

However, the notch portion 0105 separates the signal half via 0107 from the ground conductor pad 0112, and an air layer is interposed between them, so that capacitive coupling can be reduced. The above capacitive coupling can be changed depending on the distance L1 in the Z-axis direction, the width in the X-axis direction, and the shape of the notch 0105 provided in the ceramic substrate 0115. In particular, when a lead pin is inserted and fixed in a through hole provided in the flexible substrate 0114 as in this embodiment, the capacitive coupling between the half via 0107 and the ground conductor pad 0112 can be controlled by the distance L1. It becomes. That is, there is an advantage that the distance between the conductor pad on the flexible substrate 0114 and the half via 0106 can be defined without using another new member, and the high frequency performance can be controlled.
<Example 2>
FIG. 3 is a perspective view showing an optical module configuration according to the second embodiment of the present invention, and FIG. 4 is a top view of the optical module.

  In FIG. 3, the principal plane of the flexible substrate 0216 is approximately parallel to the principal axes of the lead pins 0203, 0204, 0205, 0212, and 0213. When the flexible substrate 0216 and the ceramic substrate 0211 are fixed, for example, the signal lead pin 0205 is generally solder-connected to the conductor pattern 0218. In addition, a conductive adhesive or the like may be used for the conductive connection method. In FIG. 3, only the conductor pattern on the front surface side of the flexible substrate 0216 is shown, but in practice, the conductor pattern is usually patterned on the back surface side. The through hole 0220 plays a role of conducting the ground-side conductor pattern 0220 on the front surface side and the conductor pattern on the back surface side. Of course, it is also possible to provide through holes in conductor patterns other than the ground conductor pattern 0220, which is a category of pattern design.

  FIG. 4 is a top view of the optical module shown in FIG. 3 when the flexible substrate 0216 is fixed to the ceramic substrates 0211 and 0202 and viewed from the positive Y-axis direction. The lead pins 0203, 0204, 0205, and 0213 are mounted on the conductor patterns 0217, 0218, 0219, and 0217 on the flexible substrate 0216, but this may be reversed depending on the method of use. The lead pin may be positioned in the negative Y-axis direction with respect to the flexible substrate 0216.

  The signal transmission lead pins 0205 on the ceramic substrate 0211 are disposed adjacent to each other, and the ground lead pins 0204 are positioned next to the signal transmission lead pins 0205. That is, the arrangement of the signal patterns on the ceramic substrate 0212 and the flexible substrate 0216 is GSSG (GND-SIGNAL-SIGNAL-GND), and the differential signal propagates through the two signal lines.

  Now, the ceramic substrate 0211 is provided with a notch 0215. Therefore, the electromagnetic coupling between the adjacent signal half via 0208 and the ground half via 0209 is reduced, and the capacitive coupling is reduced. Further, since the signal half via 0208 recedes in the positive Z-axis direction with respect to the flexible substrate 0216, the electromagnetic coupling between the signal half via 0208 and the conductor pattern on the flexible substrate is reduced.

  Therefore, the characteristic impedance of the high-frequency transmission conductor pattern does not decrease at the connection portion between the flexible substrate 0216 and the ceramic substrate 0212, and reflection loss is suppressed. Furthermore, since electromagnetic field radiation caused by this reflection is also suppressed, the optical transceiver to which the optical module of the present invention is applied is prevented from malfunctioning due to high frequency noise.

  The flexible substrate 0216 is connected to the lead pins 0205 and the like from the Y axis negative direction. That is, the flexible substrate 0216 and the ceramic substrate 0211 do not overlap, and the position of the flexible substrate 0216 is defined by the end surface of the ceramic substrate 0211. This has an advantage that the capacitive coupling between the signal half via 0208 and the conductor pattern on the flexible substrate 0216 can be controlled without using other members.

  This example was modeled and reflection calculation was performed by simulation. An simulator HFSS is used for the simulator. In the calculation, a substrate obtained by patterning a signal and ground wiring on a substrate having a thickness of 0.2 mm and a relative dielectric constant of 5.0 is arranged in the positive direction of the Z axis of a ceramic substrate used for a package, and the pattern of two substrates They were connected by wires. Moreover, as a ceramic substrate used for the package, the relative dielectric constant was 8.7, and the substrate thickness from the signal wiring pattern to the ground pattern immediately below was 0.75 mm. A lead pin having a width of 0.2 mm and a height of 0.1 mm was mounted on the conductor pattern on the ceramic substrate, and the lead pin was brought into contact with the conductor pattern on the flexible substrate. The vias provided in the ceramic substrate were cylindrical with a diameter of 0.2 mmφ (diameter). That is, when the lead pin is attached, the half via disposed at the pattern end is semicircular when viewed from the Y-axis direction. In the calculation, the height of the half via is 0.25 mm on the signal side and 0.75 mm on the ground side. The flexible substrate is obtained by patterning a conductor pattern on the upper and lower sides of a film having a thickness of 50 μm and a relative dielectric constant of about 3. Moreover, in order to protect a part of conductor pattern, the cover film is adhere | attached on a part of conductor pattern. The shape of the notch provided in the ceramic substrate used for the package is a rectangular parallelepiped, the width in the X-axis direction is 1.6 mm, and the height in the Y-axis direction is 0.75 mm.

  FIG. 24 shows a simulation result of reflection loss up to 40 GHz viewed from the flexible substrate side. In the figure, the vertical axis indicates the return loss, and the horizontal axis indicates the input frequency (Frequency). Each graph shows the relationship between the frequency and the reflection loss when the depth of the notch in the Z-axis direction (that is, L1 in FIG. 4) is changed as a parameter. For example, looking at the reflection loss at 30 GHz, the reflection loss is improved by about 13 dB when the depth L1 of the notch is 0 μm (that is, when there is no notch) and 150 μm. I understand that. However, the degradation is seen at 300 μm, but this is because the length of the signal lead pin 0205 extending in the air increases and the inductance component increases. When designed in a 50 ohm system, the characteristic impedance around the lead pin Is over 60 ohms.

  These results vary depending on the distance, shape, and size between the half vias, but considering the performance, the length of L1 is suitably 100 microns or more and 300 microns or less. It is appropriate that the upper limit is defined so that the characteristic impedance around the lead pin does not increase by more than 20% (that is, 120% or less) than the characteristic impedance of other transmission lines.

As mentioned above, the effect by this invention was confirmed. Here, the magnitude of the positional deviation in the signal propagation direction between the signal and the ground half via generated by the notch provided in the ceramic substrate (the positional deviation in the Z-axis direction in FIG. 4) is about several hundred μm. Clearly this is not to the extent caused by distortion or chipping of the ceramic substrate.
<Example 3>
FIG. 5 is a top view showing a part of the optical module configuration of Example 3 of the present invention, FIG. 6 is a side view of a part of the optical module viewed from the negative Z-axis direction, and FIG. It is the reverse view seen from the Y-axis negative direction. In the following description, parts that are the same as those described in the first embodiment, such as a package housing and lead pins, are given the reference numerals in the drawing, but the description is omitted.
In the fourth and subsequent embodiments, the same reference numerals are used in the drawings.

  On the ceramic substrate 0310, ground conductor patterns 0311 and 0305 and a signal conductor pattern 0302 are patterned as high-frequency transmission paths. In other words, the signal lines are arranged in a GSSGSG (notation of GND-SIGNAL-GND-SIGNAL-GND) configuration. The positions of the GND half vias 0315 and the signal half vias 0318 on both sides are shifted in the Z-axis direction by the cutouts 0304, and this has the effect of reducing the capacitive coupling between the half vias 0315 and the half vias 0318.

  Incidentally, the GND half via 0317 in the middle is not displaced in the Z-axis direction from the signal half via 0318. Of course, capacitive coupling is likely to occur between the GND half via 0317 and the signal half via 0318. However, when creating the cutout portion 0304 in the ceramic substrate 0310, the width of L2 (see FIG. 5) is wide. Since it can be taken, it has an advantage of excellent workability. In this way, it is not always necessary to shift the positions of all GND half vias and signal half vias in view of workability, and it is necessary to shift the positions of some GND half vias and signal half vias in view of required performance. is there.

  Incidentally, the GND half via 0315 connects the GND conductor pattern 0311 and the GND conductor pattern 0316. This has the effect of stabilizing the potential of the GND conductor pattern patterned on or inside the ceramic substrates 0309 and 0310 and preventing the optical module from malfunctioning.

In FIG. 7, the ceramic substrate 0310 is viewed from the Y-axis negative direction, but there is a portion where the GND conductor pattern 0316 near the signal lead pin 0303 is not patterned, and the ceramic substrate 0310 is exposed. This has an effect of reducing the capacitive coupling between the half via 0318 and the GND conductor pattern 0316.
<Example 4>
FIG. 8 is a top view illustrating a part of the configuration of the optical module according to the fourth embodiment of the present invention, and FIG. 9 is a side view of a part of the optical module viewed from the negative Z-axis direction.
On the ceramic substrate 0411, a ground conductor pattern 0407, a power source and adjustment terminal conductor pattern 0403, a signal conductor pattern 0409, and the like are patterned. The conductor pattern through which the high-frequency signal is transmitted has a GSSGSG (notation of GND-Signal-GND-Signal-GND) structure. It can be seen that the half via 0415 arranged at the end of the signal conductor pattern 0409 is arranged in the positive direction of the Z axis by a notch 0406 by a distance L3 (see FIG. 8) from the GND half via 0412. This prevents an increase in electromagnetic field coupling between the signal half via 0415 and the GND half via 0412.

  In this embodiment, the cutout portion 0406 has a rectangular parallelepiped shape having a width L4 (see FIG. 8) and a depth L3. However, this shape does not necessarily have to be a rectangular parallelepiped shape. The shape is not limited as long as the distance in the Z-axis direction between the half via 0415 and the half via 0412 is shifted by the distance L3.

Further, as a method of creating the notch portion 0406, before the ceramic substrates 0402 and 0411 are sintered, the ceramic substrate is preformed with a mold, and then the ceramic substrates 0402 and 0411 are sintered. is there. Therefore, the length of L3 is often 100 μm or more depending on the ease of production of the mold. When L3 is about several hundred μm, it is easier to preform the ceramic substrate if L4 has a length equal to or longer than L3.
<Example 5>
FIG. 10 is a top view illustrating a part of the configuration of the optical module according to the fifth embodiment of the present invention.

  Ground lead pins 0506 and 0508 are fixed to the ceramic substrate 0503, and a signal lead pin 0507 is fixed in the middle thereof. That is, the signal input / output unit has a GSG (notation for abbreviating GND-SIGNAL-GND) structure.

  Now, the notch part 0509 is formed in the ground side. In other words, the half via (not shown) provided at the end of the ground conductor pattern 0512 is positioned in the positive direction of the Z axis with respect to the half via (not shown) provided at the end of the signal conductor pattern 0513.

As described above, if the positions of the signal and ground half vias are shifted in the positive direction of the Z axis, the half vias provided at the signal conductor pattern ends may be shifted in the positive direction of the Z axis. The effect of reducing the capacitive coupling between the half vias is the same as in the other embodiments.
<Example 6>
FIG. 11 is a perspective view showing an optical module configuration according to the sixth embodiment of the present invention.

  A notch 0610 is provided below the Y-axis of the signal lead pin. Cutout portion 0610 is not connected to the back surface of ceramic substrate 0605. However, the positions of the half via 0608 provided at the end of the signal conductor pattern and the half via 0607 provided at the end of the ground conductor pattern by the notch 0610 are shifted in the Z-axis direction.

A lead pin 0606 for power supply and adjustment terminal and a lead pin 0603 for signal are fixed to the conductor pattern on the upper surface of the ceramic substrate 0605, respectively. Ground lead pins 0602 are fixed to the conductor pattern on the lower surface of the ceramic substrate 0605. Thus, the mounting position of the lead pin is not necessarily on the same surface of the ceramic substrate.
The ceramic substrate 0605 and the flexible substrate 0613 are fixed by inserting lead pins into through holes provided in the flexible substrate 0613 and fixing them with solder or the like. For example, the lead pin 0603 is inserted into the through hole 0611, and the lead pin 0602 is inserted into the ground through hole 0619.
<Example 7>
FIG. 12 is a perspective view showing the configuration of the optical module according to the seventh embodiment of the present invention, and FIG. 13 is a top view of the package forming the optical module from the positive direction of the Y axis.

  Ceramic substrates 0713 and 0703 are part of the ceramic substrate 0702. A signal conductor pattern 0712 is formed on the ceramic substrate 0713. On the ceramic substrate 0703, a conductor pattern for ground 0708 and a conductor pattern for power supply and adjustment terminal 0711 are patterned. The main plane of the conductor pattern 0712 is higher in the Y-axis direction than the main planes of the conductor patterns 0708 and 0711. Of course, although not shown in the drawing, the shape of the ceramic substrate 0702 may be adjusted so that the heights in the Y-axis direction of 0708 and 0711 are equal to or higher than the conductor pattern 0712. However, the characteristic impedance of the signal conductor pattern 0712 is kept substantially constant on the surface and inside of the ceramic substrate 0702.

  In the optical module configuration of this embodiment, since the ground conductor pattern 0708 is positioned below the Y-axis of the signal conductor pattern 0712, the ground conductor is directly below the Y-axis of the signal conductor pattern 0712. It is easy to construct a microstrip line structure with a pattern. In fact, in the present embodiment, there is a portion in the ceramic substrate 0702 where the ground conductor pattern 0708 is located immediately below the signal conductor pattern 0712 in the Y-axis direction.

  The position of the half via 0709 at the end of the signal conductor pattern 0712 is in the positive direction in the Z-axis direction from the position of the half via 0707 at the end of the ground conductor pattern 0708. Thereby, capacitive coupling between the half vias 0709 and 0707 is reduced.

  As is clear from FIG. 13, a part of the ground conductor pattern 0708 recedes to form a ceramic exposed portion 0724. That is, the ground conductor pattern 0708 does not come directly under the half via 0709. This plays a role of preventing capacitive coupling between the half via 0709 and the ground conductor pattern 0708.

  In this embodiment, when the flexible substrate 0723 is to be fixed to the ceramic substrates 0702, 0703, 0713, the lead pins penetrate through the through holes provided in the flexible substrate 0723, and solder, conductive adhesive, etc. The method of bonding by is generally used. For example, the signal lead pin 0706 penetrates the through hole 0715, and the lead pin and the conductor pad 0716 are conductively fixed by soldering. At that time, a gap of approximately L7 (see FIG. 13) is formed between the half via 0709 and the flexible substrate 0723 (or the conductor pattern on the flexible substrate 0723). That is, a portion where the signal lead pin 0706 extends in the air is formed between the signal conductor pattern 0712 and the conductor pad 0716. Therefore, an inductance component can be added between the conductor pattern 0712 and the conductor pad 0716 without using other members, and an increase in capacitance component due to the half via 0709 can be canceled.

Contrary to the present embodiment, the half via 0707 at the end of the ground conductor pattern 0708 can be arranged in the positive direction of the Z axis from the half via 0709. However, adding an inductance component to the ground tends to cause resonance of the ground conductor pattern, and may impair the stability of the entire optical module.
<Example 8>
FIG. 14 is a top view showing an optical module configuration according to the eighth embodiment of the present invention. The ceramic substrate 0806 is a part of the ceramic substrate 0802. On the ceramic substrate 0806, a signal conductor pattern 0807, a ground conductor pattern 0810, a power source and adjustment terminal conductor pattern 0809 are patterned. Lead pins 0804, 0805, 0808 and the like are fixed on these various conductor patterns. A flexible substrate 0816 is mounted from above the Y axis of the lead pin. A dotted line is a flexible substrate mounting position 0818. Due to the notch portion 0815, the position of the half via (not shown) at the end of the signal conductor pattern is approximately the distance L5 + L6 from the position of the half via (not shown) at the end of the ground conductor pattern. Is located.

  Therefore, the capacitive coupling between the signal half via and the ground half via is reduced, and the size can be controlled by L5 + L6. Here, the flexible substrate mounting position 0818 end overlaps the Z-axis positive direction from the ceramic substrate 0806 end by a distance L6. That is, the inductance component formed between the signal conductor pattern 0807 and the conductor pad 0819 can be controlled by the distance L5.

The optical module in this embodiment has the following advantages.
(1) The joining length of the signal transmission lead pin 0805 and the conductor pattern 0807 is L8. In general, since this junction is likely to cause variations in characteristic impedance in the manufacturing process, the length of L8 is preferably as short as possible to ensure characteristics, and is generally about several hundred microns. On the other hand, the joint length between the lead pins 0804 and 0808 and the conductor patterns 0809 and 0810 is L5 + L6 + L8, and the joint strength can be enhanced by increasing the length of L6. That is, even if L8 is shortened for the purpose of improving the performance, the lead pin is peeled off from the ceramic substrate even if stress is applied to the lead pin through the attached flexible substrate 0816 by adjusting the length of L6. There is an advantage that there is little fear of doing. In other words, an optical module configuration with excellent performance and strong connection strength is possible.
(2) The ground conductor pattern 0810 and the ground conductor pad 0814 on the flexible substrate 0816 overlap when viewed from the Y-axis direction. That is, in this connection portion, an inductance component due to the lead pin extending in the air is less likely to be added to the ground, and resonance and the like are less likely to occur.
(3) Compared with the other embodiments, the positions of the half vias (not shown) at the end of the ground conductor pattern 0810 and the half vias (not shown) at the end of the signal conductor pattern 0807 are spaced apart by L6. Yes. That is, it can be seen that the capacitive coupling between the signal and the ground half via is further suppressed.

The size, shape, and the like of the notch 0815 vary depending on the purpose. Further, the lengths of L5 and L6 vary depending on the purpose. However, the notch portion 0815 is generally formed by die cutting or the like before the ceramic substrate is sintered, and L5 + L6 is at least 100 microns or more in view of mold production accuracy.
<Example 9>
FIG. 15 is a top view illustrating a part of the configuration of the optical module according to the ninth embodiment of the present invention, and FIG. 16 is a side view thereof.

  The ceramic substrate 0903 is a part of the ceramic substrate 0902. On the ceramic substrate 0902, a conductor pattern for signal 0911, a conductor pattern for ground 0909, and a conductor pattern for power supply and adjustment terminal 0904 are patterned. In the optical module of this embodiment, castellations 0905, 0906, and 0908 are provided at the ends of the conductor patterns. The castellation is a recess formed in the ceramic substrate, and its inner wall is metallized. That is, when a lead pin (not shown) is connected to a conductor pattern by soldering, silver brazing, etc., the metal serving as the brazing material spreads on the castellation and has the merit that the mounting strength of the lead pin is increased. ing.

  In this embodiment, the notch portion 0907 is provided in the ceramic substrate 0903, so that the capacitive coupling between the signal castellation 0908 and the ground castellation 0906 is reduced.

As shown in FIG. 16, the castellation 0906 on the ground side connects the ground conductor pattern 0909 on the upper surface and the ground conductor pattern 0912 on the lower surface. This prevents the potential of the ground conductor pattern patterned on and inside the ceramic substrates 0902 and 0903 from fluctuating. In FIG. 16, the ground conductor pattern 0912 is not patterned immediately below the half via 0908. This is because the capacitive coupling between the signal half via 0908 and the conductor pattern 0912 is reduced.
<Example 10>
FIG. 17 is a top view illustrating a part of the configuration of the optical module according to the tenth embodiment of the present invention, and FIG. 18 is a side view thereof.

  In this embodiment, a half via 1011 is disposed at the end of the signal conductor pattern 1012, a half via 1007 is disposed at the end of the ground conductor pattern 1009, and a half via 1006 is disposed at the end of the conductor pattern 1004 for the power supply or adjustment terminal. The shapes of the half vias 1006, 1007, and 1011 are shapes in which a cylinder is cut in half.

A conductor pattern 1013 for ground is disposed immediately below the signal half via 1011. Although capacitive coupling is likely to occur between the half via 1011 and the conductor pattern 1013, the influence can be reduced by the thickness of the ceramic substrate 1003.
<Example 11>
FIG. 19 is a top view illustrating a part of the optical module configuration according to the eleventh embodiment of the present invention, and FIG. 20 is a side view. The ceramic substrate 1103 is a part of the ceramic substrate 1102, and conductor patterns 1104, 1106, 1107 are patterned on the ceramic substrate 1103, and metallized 1110, 1111 are formed on side surfaces of the ceramic substrate 1103 at the end of these conductor patterns. 1112 are patterned. This makes it possible to increase the connection strength when attaching lead pins (not shown).

The ceramic substrate 1103 is provided with a notch 1108, and the positions of the signal metallized surface 1112 and the ground metallized surface 1111 are shifted from each other in the Z-axis direction. This has the advantage that capacitive coupling between the metallized surface 1112 for signals and the metallized surface 1111 for ground is reduced.
<Example 12>
FIG. 21 is a perspective view showing an optical module according to Embodiment 12 of the present invention. The optical module is composed of an optical receiver module in which a casing 1216 is fixed to a printed circuit board 1212, and an optical transmitter module including a casing 1202 and a flexible substrate 1207. The optical receiver includes the optical receiver module, the optical transmitter module, the printed circuit board 1212, and members connected to the optical receiver module. However, in the present invention, the optical transceiver is included as an optical module in a broad sense. The housing 1216 of the optical receiving module is a coaxial type. A ceramic substrate 1203 is attached to the housing 1216. The ceramic substrate 1203 is provided with a notch 1204, and plays a role of reducing reflection of high-frequency signals at the connection portion between the printed circuit board 1212 and the ceramic substrate 1203.

  On the other hand, in the optical transmission module, the casing 1202 has a box shape, and the flexible substrate 1207 is fixed to the ceramic substrate 1203 via lead pins 1205. The conductor pattern on the flexible substrate 1207 is fixed to the conductor pattern on the printed circuit board 1212 with solder or the like. Now, the notch 1204 is provided in the ceramic substrate 1203, which reduces the reflection of the high-frequency signal at the connection portion between the flexible substrate 1207 and the ceramic substrate 1203.

  On the printed circuit board 1212, electronic elements 1208, 1209, 1210, 1211, 1213, 1214, 1215, etc. are mounted, and these are packaged with active elements having an amplification function, a waveform shaping function, and an adjustment function. Or passive devices represented by chip capacitors, inductors, resistors, and the like. An electrical connector 1211 is attached to the back surface of the printed circuit board 1212. This electrical connector forms an electrical interface with a board of a transmission apparatus represented by a router, a server or the like.

In the present embodiment, the notch 1204 is provided in the ceramic substrate 1203 that constitutes the optical module, thereby reducing the reflection of the high-frequency signal at the connecting portion.
The reflection of the high-frequency substrate is emitted as noise in the optical transceiver, for example, by reciprocating the signal conductor pattern of the flexible substrate 1207 and resonating. That is, high frequency reflection is caused. These noises cause malfunction of the electronic element 1209 mounted on the printed circuit board 1212, for example. That is, the provision of the notch 1204 has the advantage of improving the performance of the entire optical module shown in FIG.
<Example 13>

  In FIG. 22, the perspective view which shows the optical module and high frequency module of Example 13 of this invention is shown. An optical module 1327 configured by a housing 1301 and the like and a high-frequency module 1328 configured by a ceramic substrate 1322 and the like are connected by a flexible substrate 1315. The optical module 1327 is a transmission or reception optical module, and an optical element and an electronic element are included in the housing 1301. A fiber holder 1302 is attached to the housing, and optical signals are input and output by the optical fiber 1303. The housing 1301 is made of ceramic, and the material is alumina, aluminum nitride, LTCC, or the like. A ceramic substrate 1304 is attached to the housing 1301, and a conductor pattern is patterned on the surface or the interior. On the surface of the ceramic substrate 1304, as a signal input / output conductor pattern, one signal conductor pattern 1305 and two ground conductor patterns 1306 are patterned on both sides, and lead pins 1309 and 1310 are fixed. These lead pins are fixed to the conductor pattern on the flexible substrate 1315 by solder, conductive adhesive, and metal.

  For example, the signal conductor pattern 1314 is fixed to the lead pin 1310. The ceramic substrate 1304 is provided with a notch 1308. As a result, the positions of the half vias and the side metallization (not shown) arranged at the ends of the signal conductor pattern 1305 and the ground conductor pattern 1309 are roughly shifted in the signal transmission direction and are flexible with the ceramic substrate 1304. There is an advantage that high-frequency transmission characteristics are excellent in the connection portion with the substrate 1314.

  On the other hand, the high frequency module 1328 uses a ceramic substrate 1322 as a casing. A conductor pattern is patterned on the front and back surfaces or inside of the ceramic substrate. Furthermore, electronic elements are included in the ceramic substrate 1322 depending on the purpose. For example, in addition to active elements such as drivers, amplifier ICs, waveform shaping ICs, serial / parallel conversion ICs, control ICs, chip capacitors, chip inductors, chip resistors Passive elements such as are mounted. A conductor pattern is patterned on the surface of the ceramic substrate 1322, and lead pins are attached to connect the flexible substrate. For example, a lead pin 1316 is attached on the signal conductor pattern 1321. The ceramic substrate 1322 is provided with a notch 1320. Therefore, the positions of the half vias (not shown) provided at the end of the signal conductor pattern 1321 and the half vias (not shown) provided at the end of the ground conductor pattern 1318 are shifted from each other in the signal transmission direction.

  A conductive pattern is patterned on the lower surface of the ceramic substrate 1322, and a solder ball grid array 1323 is used for fixing and conduction with the printed circuit board 1324. Electronic elements 1325 and 1326 are mounted on the printed board 1324.

As described above, the present invention is applied to an optical module and a high-frequency module, and has an advantage of excellent high-frequency characteristics.
<Example 14>

FIG. 23 is a perspective view showing the high-frequency module according to Embodiment 14 of the present invention. The high-frequency module is composed of a ceramic substrate 1401 and encloses electronic elements therein, and a conductor pattern is patterned on the front and back surfaces and inside of the ceramic substrate.
On the back surface of the ceramic substrate, a signal conductor pattern 1405, a ground conductor pattern 1407, and a power source and control terminal conductor pattern 1406 are patterned. On these conductor patterns, lead pins 1402, 1403, 1404, 1412 and the like are fixed. In order to increase the fixing strength of these lead pins, half vias are arranged at the ends of the respective conductor patterns. For example, a half via 1408 is disposed at the pattern end of the signal conductor pattern 1405 to increase the mounting strength of the lead pin 1404. The ceramic substrate 1401 is provided with a notch 1411, and the positions of the signal half via 1408 and the ground half via 1409 are shifted in the signal transmission direction. This plays a role of improving high-frequency transmission performance.

  The printed circuit board 1413 is patterned with a signal conductor pattern 1418, a ground conductor pattern 1415, and a signal and control conductor pattern 1416. When the ceramic substrate 1401 is fixed to the printed circuit board 1413, lead pins 1402 and 1403 are formed. 1404, 1412 and the like are fixed by solder, conductive adhesive or metal.

An electronic element 1419 is mounted on the printed board 1413 using a ball grid array 1420. In addition, electronic elements 1421 and 1422 and the like are mounted on the printed board 1413 by solder or conductive adhesive.
As described above, the present invention is applied to a high-frequency module, and its high-frequency characteristics can be improved.

0101, 0201, 0301, 0401, 0501, 0601, 0701, 0801, 0901, 1001, 1101, 1202, 1301 ... casing,
0102, 0120, 0121, 0203, 0204, 0205, 0212, 0213, 0303, 0307, 0308, 0312, 0404, 0405, 0410, 0504, 0505, 0506, 0507, 0508, 0602, 0603, 0606, 0706, 0805, 0808, 1309, 1310, 1316, 1317, 1402, 1403, 1404, 1412 ... lead pins,
0103, 0115, 0134, 0202, 0309, 0310, 0402, 0411, 0502, 0503, 0604, 0605, 0702, 0703, 0713, 0802, 0902, 0903, 1002, 1003, 1102, 1103, 1203, 1205, 1304, 1322, 1401 ... ceramic substrate,
0104,0107,0108,0206,0208,0210,0211,0314,0315,0318,0413,0415,0607,0608,0609,0704,0705,0707,0710,1006,1007,1011,1408,1409,1410 ... Half beer,
0106, 0113, 0119, 0122, 0130, 0131, 0135, 0136, 0137, 0138, 0140, 0141, 0142, 0144, 0145, 0207, 0209, 0214, 0217, 0218, 0219, 0222, 0223, 0302, 0305, 0306,0311,0313,0316,0317,0403,0407,0408, 0511,0714,0811,0910,1008,1105 ... via,
0409,0412,0414,0510,0512,0513,0614,0618,0708,0709,0711,0712,0721,0722,0804,0806,0807,0809,0810,0817,0904,0909,0911,0912,1004, 1009, 1012, 1013, 1104, 1106, 1107, 1109, 1110, 1206, 1305, 1306, 1307, 1314, 1318, 1319, 1321, 1405, 1406, 1407, 1415, 1416, 1418 ... conductor pattern,
0105,0215,0304,0406,0509,0610,0815,0907,1010,1108,1204,1308,1320,1411 ... notch,
0109,0112,0116,0148,0612,0615,0617,0716,0717,0719,0813,0814,0819,1312 ... conductor pads,
0110,0111,0117,0118,0220,0611,0616,0715,0718,0720,0812,1311,1313,1414,1417 ... through hole,
0114,0216,0613,0723,0816,1207,1315 ... flexible substrate,
0123,0221,0803 ... holder,
0124, 1303 ... Optical fiber, 0149 ... Solder,
0125 ... Sleeve, 0126 ... Translucent window, 0127 ... Substrate, 0128 ... Optical element mounting substrate, 0129 ... Optical element, 0132 ... Driver IC, 0133 ... Wire, 0139 ... Flat plate capacitor, 0143 ... Chip thermistor, 0146 ... Lens, 0147 ... Lens holder,
0724 ... Ceramic exposed part, 0818 ... Flexible substrate mounting position, 0905, 0906, 0908 ... Castellation, 1111, 1112 ... Metallization, 1208, 1209, 1210, 213, 1214, 1215, 1325, 1326, 1419, 1421, 1422 ... Electronic element, 1211 ... Electric connector, 1212,1324,1413 ... Printed circuit board, 1,1216 ... Stem, 1217,1302 ... Fiber holder, 1323,1420 ... Ball grid array, 1327 ... Optical module, 1328 ... High frequency module.

Claims (23)

A package housing containing an optical element for photoelectric conversion;
A first substrate provided at one end of the package housing and configured by a laminated insulator;
A second substrate in which a conductor pattern having one end of a connection portion electrically connected to a conductor portion provided on the first substrate is provided on the main surface;
The conductor portion includes a signal conductor pattern and a ground conductor pattern provided on the main surface of the first substrate,
The first lead pin and the second lead pin fixed to each of the signal conductor pattern and the ground conductor pattern are provided so that one end thereof protrudes outside the main surface of the first substrate,
First and second conductor layers are respectively provided on the side surfaces of the first substrate located almost immediately below the protruding first and second lead pins,
There is a difference in height in a first direction along the signal conductor pattern between a side surface on which the first conductor layer is provided and a side surface on which the second conductor layer is provided. Optical module. The optical module according to claim 1,
By providing the side surface provided with the first conductor layer at a position moved in the package housing direction along the first direction, between the side surface provided with the second conductor layer. An optical module comprising a height difference in the first direction. The optical module according to claim 1,
An optical module characterized in that a side surface provided with the first conductor layer is retreated in the first direction toward the package housing by providing a notch in the side surface of the first substrate. . The optical module according to claim 3,
The optical module is characterized in that the notch is set so that the height difference is approximately 100 microns or more and 300 microns or less. The optical module according to claim 1,
The position of the side surface on which the second conductor layer is provided is arranged closer to the connection portion of the second substrate than the position of the side surface on which the first conductor layer is provided. An optical module characterized by The optical module according to claim 1,
The protruding first and second lead pins have extending portions that are not fixed to the signal conductor pattern and the grounding conductor pattern, and the length of the extending portions is the first lead. An optical module, wherein the pin and the second lead pin are different. The optical module according to claim 1,
The first and second conductor layers are layers in which a metal is applied to the side surface of the first substrate, or are a part of vias provided at side edges of the first substrate, or An optical module comprising a castellation having a conductor layer provided on a side end of the first substrate. The optical module according to claim 1,
The first substrate is made of a multilayer ceramic;
The optical module, wherein the second substrate is a flexible substrate. The optical module according to claim 1,
The second substrate is a printed board based on an organic substance, a printed board based on a ceramic, or a flexible board based on a liquid crystal polymer or a polyimide-based substance. An optical module characterized by The optical module according to claim 1,
A through hole is provided in the connection portion on the second substrate,
An optical module, wherein the first and second lead pins are inserted into the through-holes and fixed by solder, conductive adhesive or the like. The optical module according to claim 1,
The lead pin is fixed to the upper surface of the conductor pattern on the first substrate and the upper surface of the conductor pattern on the second substrate from the same direction by solder, conductive adhesive, or metal. Optical module. The optical module according to claim 1,
The first and second lead pins are arranged and fixed on the main surfaces of the signal conductor pattern and the ground conductor pattern,
The conductor module on the second substrate is arranged above the first and second lead pins, and the conductor pattern and the first and second lead pins are fixed to each other. . The optical module according to claim 1,
A part of the grounding conductor pattern of the first substrate and a part of the grounding conductor pattern of the second substrate are overlapped via the lead pins in a direction substantially perpendicular to the first direction. An optical module characterized by that. The optical module according to claim 12,
The optical module according to claim 1, wherein the first lead pin has a portion extending substantially in the first direction without being connected to the signal conductor pattern. The optical module according to claim 6,
The length of the extension is set so that the ratio of the characteristic impedance around the first and second lead pins to the impedance of the first and second conductor patterns does not exceed 120%. A featured optical module. The optical module according to claim 1,
An optical module, wherein a surface on the first substrate on which the first lead pin is provided and a surface on the first substrate on which the second lead pin is provided are different. The optical module according to claim 3,
Having two signal conductor patterns,
At least in the fixing region between the signal conductor pattern and the first lead pin, the two signal conductor patterns are juxtaposed,
The two first conductor layers connected to each of the two signal conductor patterns are provided on the side surface of the notch so as to be substantially in the same position in the first direction,
The side surface of the first substrate on which the second conductor layer is provided and the side surface of the notch portion on which the first conductor layer is provided are shifted from each other in the first direction. An optical module characterized by that. The optical module according to claim 3,
Having two signal conductor patterns,
At least in the fixed region between the signal conductor pattern and the first lead pin, the signal conductor pattern is juxtaposed on both sides of the ground conductive pattern,
Two first conductor layers connected to each of the two signal conductor patterns and the second conductor layer connected to the ground conductive pattern are formed on the side surface of the notch portion in the first direction. To be in the same position,
The side surface of the first substrate on which the second conductor layer connected to other than the grounding conductor pattern is provided and the side surface of the cutout portion are arranged so as to be shifted in the first direction. An optical module characterized by The optical module according to claim 3,
Having two signal conductor patterns,
At least in the fixed region between the signal conductor pattern and the first lead pin, the signal conductor pattern is juxtaposed on both sides of the ground conductive pattern,
A plurality of the cutouts, one of the cutouts and the other of the cutouts being juxtaposed via the side surface of the first substrate;
The first conductor layer is provided on one of the notches and the other side surface, and the second conductor layer is provided on a side surface of the first substrate. And optical module. A package housing containing an optical element for photoelectric conversion;
A first substrate provided at one end of the package housing and configured by a laminated insulator;
A second substrate in which a conductor pattern having one end of a connection portion electrically connected to a conductor portion provided on the first substrate is provided on the main surface;
The conductor portion includes a signal conductor pattern and a ground conductor pattern provided on the main surface of the first substrate,
A signal conductor pattern arrangement substrate disposed on the first substrate and arranging the signal conductor pattern;
The first lead pin fixed to the signal conductor pattern is provided so that one end of the first lead pin protrudes outside the main surface of the signal conductor pattern arrangement substrate,
The second lead pin fixed to the grounding conductor pattern is provided so that one end of the second lead pin protrudes outside the main surface of the first substrate,
A first conductor layer and a second conductor layer are respectively provided on a side surface of the signal conductor pattern placement substrate and a side surface of the first substrate located substantially immediately below the protruding first and second lead pins;
Providing a height difference in a direction perpendicular to the main surface of the first substrate between the main surface of the signal conductor pattern arrangement substrate and the main surface of the first substrate;
An optical module having a height difference between the first conductor layer and the second conductor layer in a direction perpendicular to the first direction along the signal conductor pattern. The optical module according to claim 20,
By providing the side surface of the signal conductor pattern arrangement substrate at a position retracted in the package housing direction along the first direction with respect to the side surface of the first substrate,
An optical module having a height difference between the first conductor layer and the second conductor layer in both the first direction and a direction perpendicular to the first direction. A first substrate containing an electronic element;
A conductor pattern having at one end a connection portion electrically connected to a conductor portion provided at one end of the first substrate, and a second substrate provided on the main surface;
The conductor portion includes a signal conductor pattern and a ground conductor pattern provided on the main surface of the first substrate,
The first lead pin and the second lead pin fixed to each of the signal conductor pattern and the ground conductor pattern are provided so that one end thereof protrudes outside the main surface of the first substrate,
First and second conductor layers are respectively provided on the side surfaces of the first substrate located almost immediately below the protruding first and second lead pins,
There is a difference in height in a first direction along the signal conductor pattern between a side surface on which the first conductor layer is provided and a side surface on which the second conductor layer is provided. High frequency module. The high frequency module according to claim 22,
A high-frequency module, wherein the optical module according to claim 1 is electrically connected to the optical module via the second substrate.

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