JP5652381B2 - 表面加工方法及び装置 - Google Patents

表面加工方法及び装置 Download PDF

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Publication number
JP5652381B2
JP5652381B2 JP2011259902A JP2011259902A JP5652381B2 JP 5652381 B2 JP5652381 B2 JP 5652381B2 JP 2011259902 A JP2011259902 A JP 2011259902A JP 2011259902 A JP2011259902 A JP 2011259902A JP 5652381 B2 JP5652381 B2 JP 5652381B2
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Japan
Prior art keywords
workpiece
etching
nozzle
processing
supply means
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JP2011259902A
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Japanese (ja)
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JP2012064968A5 (enExample
JP2012064968A (ja
Inventor
和也 山村
和也 山村
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Tosoh Corp
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Tosoh Corp
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  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Surface Treatment Of Glass (AREA)
  • Weting (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2011259902A 2011-11-29 2011-11-29 表面加工方法及び装置 Expired - Fee Related JP5652381B2 (ja)

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JP2011259902A JP5652381B2 (ja) 2011-11-29 2011-11-29 表面加工方法及び装置

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JP2011259902A JP5652381B2 (ja) 2011-11-29 2011-11-29 表面加工方法及び装置

Related Parent Applications (1)

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JP2006014564A Division JP5039939B2 (ja) 2006-01-24 2006-01-24 表面加工方法及び装置

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JP2012064968A JP2012064968A (ja) 2012-03-29
JP2012064968A5 JP2012064968A5 (enExample) 2012-05-17
JP5652381B2 true JP5652381B2 (ja) 2015-01-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200017216A (ko) * 2018-08-08 2020-02-18 주식회사 오럼머티리얼 마스크의 패턴 형성 장치 및 마스크의 제조 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015037035A1 (ja) * 2013-09-12 2015-03-19 国立大学法人東北大学 エッチング方法
WO2015044975A1 (ja) * 2013-09-25 2015-04-02 国立大学法人東北大学 エッチング方法
JP2018049199A (ja) * 2016-09-23 2018-03-29 Hoya株式会社 局所ウェットエッチング装置及びフォトマスク用基板の製造方法
JP7505910B2 (ja) * 2020-04-28 2024-06-25 株式会社ディスコ ウェットエッチング方法、及び、ウェットエッチング装置
CN113955945B (zh) * 2021-10-20 2022-06-28 清华大学 液滴附壁化学加工的石英玻璃回转体工件的表面修饰方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319339A (ja) * 1989-06-16 1991-01-28 Nec Corp エッチング方法及びエッチング装置
JPH1145872A (ja) * 1997-07-25 1999-02-16 Shin Etsu Handotai Co Ltd 半導体基板の平坦化方法および平坦化装置
JP2001203184A (ja) * 2000-01-19 2001-07-27 Matsushita Electric Ind Co Ltd 加工装置及び加工方法
JP2003203897A (ja) * 2002-01-08 2003-07-18 Toshiba Corp ノズル、基板処理装置、基板処理方法、及び基板処理プログラム
JP3932099B2 (ja) * 2002-02-06 2007-06-20 セイコーエプソン株式会社 エッチング方法
US7293571B2 (en) * 2002-09-30 2007-11-13 Lam Research Corporation Substrate proximity processing housing and insert for generating a fluid meniscus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200017216A (ko) * 2018-08-08 2020-02-18 주식회사 오럼머티리얼 마스크의 패턴 형성 장치 및 마스크의 제조 방법
KR102325256B1 (ko) 2018-08-08 2021-11-11 주식회사 오럼머티리얼 마스크의 패턴 형성 장치 및 마스크의 제조 방법

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