JP5647012B2 - ケイ素含有硬化性樹脂組成物 - Google Patents

ケイ素含有硬化性樹脂組成物 Download PDF

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Publication number
JP5647012B2
JP5647012B2 JP2011006116A JP2011006116A JP5647012B2 JP 5647012 B2 JP5647012 B2 JP 5647012B2 JP 2011006116 A JP2011006116 A JP 2011006116A JP 2011006116 A JP2011006116 A JP 2011006116A JP 5647012 B2 JP5647012 B2 JP 5647012B2
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epoxy
general formula
group
compound
component
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JP2011006116A
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Japanese (ja)
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JP2012144678A5 (https=
JP2012144678A (ja
Inventor
孝 末吉
孝 末吉
斎藤　誠一
誠一 斎藤
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Adeka Corp
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Adeka Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
JP2011006116A 2011-01-14 2011-01-14 ケイ素含有硬化性樹脂組成物 Expired - Fee Related JP5647012B2 (ja)

Priority Applications (1)

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JP2011006116A JP5647012B2 (ja) 2011-01-14 2011-01-14 ケイ素含有硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011006116A JP5647012B2 (ja) 2011-01-14 2011-01-14 ケイ素含有硬化性樹脂組成物

Publications (3)

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JP2012144678A JP2012144678A (ja) 2012-08-02
JP2012144678A5 JP2012144678A5 (https=) 2013-12-26
JP5647012B2 true JP5647012B2 (ja) 2014-12-24

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ID=46788578

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JP2011006116A Expired - Fee Related JP5647012B2 (ja) 2011-01-14 2011-01-14 ケイ素含有硬化性樹脂組成物

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JP (1) JP5647012B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6143359B2 (ja) * 2013-11-19 2017-06-07 日本化薬株式会社 シリコーン変性エポキシ樹脂およびその組成物
JP6404110B2 (ja) 2014-12-18 2018-10-10 信越化学工業株式会社 シリコーン変性エポキシ樹脂と多価カルボン酸化合物を含有するエポキシ樹脂およびその硬化物
JP7771933B2 (ja) 2022-11-24 2025-11-18 信越化学工業株式会社 エポキシ基含有環状オルガノポリシロキサン、それを含む硬化性組成物およびその硬化物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001040066A (ja) * 1999-07-30 2001-02-13 Dow Corning Toray Silicone Co Ltd 紫外線硬化性組成物
JP2006249400A (ja) * 2005-02-10 2006-09-21 Sanyo Chem Ind Ltd エポキシ樹脂組成物
JP5248034B2 (ja) * 2007-04-23 2013-07-31 株式会社Ａｄｅｋａ ケイ素含有化合物、硬化性組成物及び硬化物
JP4707729B2 (ja) * 2008-03-31 2011-06-22 信越化学工業株式会社 剥離紙用低粘度紫外線硬化型シリコーン組成物
JP5251668B2 (ja) * 2009-03-27 2013-07-31 日油株式会社 熱硬化性樹脂組成物
WO2011065365A1 (ja) * 2009-11-30 2011-06-03 ナミックス株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP5734629B2 (ja) * 2010-11-25 2015-06-17 株式会社Adeka ポジ型感光性樹脂組成物及び永久レジスト
WO2013140601A1 (ja) * 2012-03-23 2013-09-26 株式会社Adeka ケイ素含有硬化性樹脂組成物

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JP2012144678A (ja) 2012-08-02

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