JP5641202B2 - インターポーザ、モジュールおよびこれを備えた電子機器 - Google Patents

インターポーザ、モジュールおよびこれを備えた電子機器 Download PDF

Info

Publication number
JP5641202B2
JP5641202B2 JP2010130266A JP2010130266A JP5641202B2 JP 5641202 B2 JP5641202 B2 JP 5641202B2 JP 2010130266 A JP2010130266 A JP 2010130266A JP 2010130266 A JP2010130266 A JP 2010130266A JP 5641202 B2 JP5641202 B2 JP 5641202B2
Authority
JP
Japan
Prior art keywords
substrate
interposer
wiring
semiconductor chip
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010130266A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011258654A5 (https=
JP2011258654A (ja
Inventor
朗 秋葉
朗 秋葉
伸也 盛田
伸也 盛田
池田　浩一
浩一 池田
俊 御手洗
俊 御手洗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2010130266A priority Critical patent/JP5641202B2/ja
Priority to CN201010241077XA priority patent/CN101996979B/zh
Priority to US12/847,240 priority patent/US20110032685A1/en
Priority to TW99125503A priority patent/TWI441307B/zh
Priority to EP20100008048 priority patent/EP2284888A3/en
Publication of JP2011258654A publication Critical patent/JP2011258654A/ja
Publication of JP2011258654A5 publication Critical patent/JP2011258654A5/ja
Application granted granted Critical
Publication of JP5641202B2 publication Critical patent/JP5641202B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Variable-Direction Aerials And Aerial Arrays (AREA)
JP2010130266A 2009-08-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器 Expired - Fee Related JP5641202B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010130266A JP5641202B2 (ja) 2010-06-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器
CN201010241077XA CN101996979B (zh) 2009-08-07 2010-07-30 中介层、包括该中介层的模块及电子装置
US12/847,240 US20110032685A1 (en) 2009-08-07 2010-07-30 Interposer, module, and electronics device including the same
TW99125503A TWI441307B (zh) 2009-08-07 2010-07-30 內插器、模組及包括該內插器之電子裝置
EP20100008048 EP2284888A3 (en) 2009-08-07 2010-08-02 Interposer, module and electronics device including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010130266A JP5641202B2 (ja) 2010-06-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器

Publications (3)

Publication Number Publication Date
JP2011258654A JP2011258654A (ja) 2011-12-22
JP2011258654A5 JP2011258654A5 (https=) 2013-07-11
JP5641202B2 true JP5641202B2 (ja) 2014-12-17

Family

ID=45474558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010130266A Expired - Fee Related JP5641202B2 (ja) 2009-08-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器

Country Status (1)

Country Link
JP (1) JP5641202B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6434494B2 (ja) * 2014-03-10 2018-12-05 三菱重工業株式会社 マルチチップモジュール、オンボードコンピュータ、センサインターフェース基板、及びマルチチップモジュール製造方法
WO2018057026A1 (en) 2016-09-26 2018-03-29 Nair Vijay K Die with embedded communication cavity
JP7367381B2 (ja) * 2019-08-20 2023-10-24 富士通株式会社 パッケージ基板及び電子機器
CN115298813A (zh) 2020-03-31 2022-11-04 索尼半导体解决方案公司 半导体装置
EP4307371A4 (en) * 2021-03-11 2024-08-07 Sony Semiconductor Solutions Corporation SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106956A (ja) * 1988-10-17 1990-04-19 Hitachi Ltd 半導体装置及びその製造方法
JP2002374028A (ja) * 2001-06-15 2002-12-26 Kyocera Corp 配線基板
JP2004235602A (ja) * 2002-12-06 2004-08-19 Matsushita Electric Ind Co Ltd 高周波回路とその製造方法
JP4979213B2 (ja) * 2005-08-31 2012-07-18 オンセミコンダクター・トレーディング・リミテッド 回路基板、回路基板の製造方法および回路装置

Also Published As

Publication number Publication date
JP2011258654A (ja) 2011-12-22

Similar Documents

Publication Publication Date Title
CN101996979B (zh) 中介层、包括该中介层的模块及电子装置
KR102424009B1 (ko) 고속 데이터 송신을 위한 반도체 패키지 및 그 제조 방법
KR101007460B1 (ko) 모듈 기판 장치의 제조 방법, 및 고주파 모듈과 그 제조 방법
US7741162B2 (en) Method for manufacturing high-frequency module device
US7940143B2 (en) Vertical transmission line structure that includes bump elements for flip-chip mounting
US7851918B2 (en) Three-dimensional package module
CN107204295B (zh) 电子元件封装件及制造该电子元件封装件的方法
US6917259B2 (en) High-frequency module substrate device
JP2006527499A (ja) 高周波電子装置用パッケージ
WO2003047325A1 (en) High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method
JP5641202B2 (ja) インターポーザ、モジュールおよびこれを備えた電子機器
KR20100032909A (ko) 후면 수동 디바이스 집적을 이용하는 반도체 다이
JP2003115557A (ja) 高周波モジュール基板装置
JP2014053907A (ja) 非半導体基板内に少なくとも部分的に配置された高ｑ変圧器
JP4835238B2 (ja) 共振器、共振器の製造方法および通信装置
Hoivik et al. High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques
US20170330871A1 (en) Chip package and manufacturing method thereof
JP2010239344A (ja) 無線回路モジュール
TWI892454B (zh) 半導體封裝裝置和半導體封裝裝置製造方法
JP2008112776A (ja) 半導体装置
US20240080061A1 (en) Radio-frequency module and communication device
JP2010154516A (ja) 樹脂多層デバイスおよびフリップチップ実装装置
CN119542145A (zh) 一种半导体器件及其制造方法
WO2025238841A1 (ja) 半導体装置
JP2023148255A (ja) 高周波回路基板、及び、アンテナモジュール

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130529

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130529

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140806

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140911

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141001

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141014

R151 Written notification of patent or utility model registration

Ref document number: 5641202

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees