JP2011258654A5 - - Google Patents

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Publication number
JP2011258654A5
JP2011258654A5 JP2010130266A JP2010130266A JP2011258654A5 JP 2011258654 A5 JP2011258654 A5 JP 2011258654A5 JP 2010130266 A JP2010130266 A JP 2010130266A JP 2010130266 A JP2010130266 A JP 2010130266A JP 2011258654 A5 JP2011258654 A5 JP 2011258654A5
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JP
Japan
Prior art keywords
substrate
module
interposer
semiconductor chip
signal
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Granted
Application number
JP2010130266A
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English (en)
Japanese (ja)
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JP5641202B2 (ja
JP2011258654A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2010130266A external-priority patent/JP5641202B2/ja
Priority to JP2010130266A priority Critical patent/JP5641202B2/ja
Priority to CN201010241077XA priority patent/CN101996979B/zh
Priority to US12/847,240 priority patent/US20110032685A1/en
Priority to TW99125503A priority patent/TWI441307B/zh
Priority to EP20100008048 priority patent/EP2284888A3/en
Publication of JP2011258654A publication Critical patent/JP2011258654A/ja
Publication of JP2011258654A5 publication Critical patent/JP2011258654A5/ja
Publication of JP5641202B2 publication Critical patent/JP5641202B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010130266A 2009-08-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器 Expired - Fee Related JP5641202B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010130266A JP5641202B2 (ja) 2010-06-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器
CN201010241077XA CN101996979B (zh) 2009-08-07 2010-07-30 中介层、包括该中介层的模块及电子装置
US12/847,240 US20110032685A1 (en) 2009-08-07 2010-07-30 Interposer, module, and electronics device including the same
TW99125503A TWI441307B (zh) 2009-08-07 2010-07-30 內插器、模組及包括該內插器之電子裝置
EP20100008048 EP2284888A3 (en) 2009-08-07 2010-08-02 Interposer, module and electronics device including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010130266A JP5641202B2 (ja) 2010-06-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器

Publications (3)

Publication Number Publication Date
JP2011258654A JP2011258654A (ja) 2011-12-22
JP2011258654A5 true JP2011258654A5 (https=) 2013-07-11
JP5641202B2 JP5641202B2 (ja) 2014-12-17

Family

ID=45474558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010130266A Expired - Fee Related JP5641202B2 (ja) 2009-08-07 2010-06-07 インターポーザ、モジュールおよびこれを備えた電子機器

Country Status (1)

Country Link
JP (1) JP5641202B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6434494B2 (ja) * 2014-03-10 2018-12-05 三菱重工業株式会社 マルチチップモジュール、オンボードコンピュータ、センサインターフェース基板、及びマルチチップモジュール製造方法
WO2018057026A1 (en) 2016-09-26 2018-03-29 Nair Vijay K Die with embedded communication cavity
JP7367381B2 (ja) * 2019-08-20 2023-10-24 富士通株式会社 パッケージ基板及び電子機器
CN115298813A (zh) 2020-03-31 2022-11-04 索尼半导体解决方案公司 半导体装置
EP4307371A4 (en) * 2021-03-11 2024-08-07 Sony Semiconductor Solutions Corporation SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106956A (ja) * 1988-10-17 1990-04-19 Hitachi Ltd 半導体装置及びその製造方法
JP2002374028A (ja) * 2001-06-15 2002-12-26 Kyocera Corp 配線基板
JP2004235602A (ja) * 2002-12-06 2004-08-19 Matsushita Electric Ind Co Ltd 高周波回路とその製造方法
JP4979213B2 (ja) * 2005-08-31 2012-07-18 オンセミコンダクター・トレーディング・リミテッド 回路基板、回路基板の製造方法および回路装置

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