JP5633888B2 - 液体吐出装置上への非湿潤性コーティング - Google Patents
液体吐出装置上への非湿潤性コーティング Download PDFInfo
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- JP5633888B2 JP5633888B2 JP2012257320A JP2012257320A JP5633888B2 JP 5633888 B2 JP5633888 B2 JP 5633888B2 JP 2012257320 A JP2012257320 A JP 2012257320A JP 2012257320 A JP2012257320 A JP 2012257320A JP 5633888 B2 JP5633888 B2 JP 5633888B2
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- 239000007788 liquid Substances 0.000 title claims description 89
- 238000009736 wetting Methods 0.000 title claims description 75
- 238000000576 coating method Methods 0.000 title description 46
- 239000011248 coating agent Substances 0.000 title description 41
- 239000010410 layer Substances 0.000 claims description 98
- 239000011241 protective layer Substances 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 26
- 238000000151 deposition Methods 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 13
- 230000008021 deposition Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 239000002243 precursor Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910003910 SiCl4 Inorganic materials 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VIFIHLXNOOCGLJ-UHFFFAOYSA-N trichloro(3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl)silane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CC[Si](Cl)(Cl)Cl VIFIHLXNOOCGLJ-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 101710162828 Flavin-dependent thymidylate synthase Proteins 0.000 description 2
- 101710135409 Probable flavin-dependent thymidylate synthase Proteins 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000000560 X-ray reflectometry Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002094 self assembled monolayer Substances 0.000 description 1
- 239000013545 self-assembled monolayer Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1606—Coating the nozzle area or the ink chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
- B05D1/185—Processes for applying liquids or other fluent materials performed by dipping applying monomolecular layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Chemical Vapour Deposition (AREA)
- Nozzles (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Description
110 流路モジュール
120 ノズル層
130 下降部
140 オリフィス
165 無機シード層
170 非湿潤性コーティング
172 アクチュエータ
174,178 電極層
176 圧電層
180 マスク
190 保護層
Claims (15)
- ノズルを有するノズル層であって、該ノズル層が第1の表面と第2の表面とを含むものであり、前記第1の表面が前記ノズル層の外面、前記第2の表面が前記ノズルの内面であり、前記第2の表面と接触した液体を吐出可能にする、前記第1の表面に形成されたオリフィスを備えた前記ノズル層と、
該ノズル層の前記第1の表面と前記第2の表面とを被覆するシード層と、
少なくとも前記第1の表面上の前記シード層の複数部分を被覆する非湿潤性層と、
前記第1の表面の大部分ではなく前記第2の表面上の前記シード層の一部を被覆する保護層であって、前記非湿潤性層よりも湿潤性である前記保護層と、
を備えた液体吐出装置。 - 前記保護層の一部が前記第2の表面上の前記非湿潤性層上に直接形成されていることを特徴とする請求項1記載の液体吐出装置。
- 前記ノズル層がシリコンからなることを特徴とする請求項1または2記載の液体吐出装置。
- 前記保護層が二酸化ケイ素からなることを特徴とする請求項1〜3のいずれか1項記載の液体吐出装置。
- ノズル層を備えた液体吐出装置上に非湿潤性層を形成する方法であって、
前記液体吐出装置の第1の表面および第2の表面上に非湿潤性層を堆積させる工程であって、前記第1の表面が前記液体吐出装置の外面であり、前記第2の表面が前記液体吐出装置の内面であり、前記ノズル層内に第2の表面に接触した液体を吐出可能にするオリフィスが形成されている前記工程と、
前記第2の表面から前記非湿潤性層の一部を除去する工程と、
前記第2の表面上の前記非湿潤性層のいかなる残存部分を含む前記第2の表面上に保護層を堆積させる工程であって、前記保護層が前記非湿潤性層よりも湿潤性である前記工程と、
を有してなる方法。 - 前記第2の表面から前記非湿潤性層の少なくとも一部を除去する前に前記第1の表面にマスクを施す工程をさらに含み、該マスクを施す工程が、テープ、フォトレジスト、またはワックスの内の少なくとも1つを施す工程を含むことを特徴とする請求項5記載の方法。
- 前記保護層を堆積させた後、前記第1の表面から前記マスクを除去する工程をさらに含むことを特徴とする請求項6記載の方法。
- 前記マスクを除去する工程が、前記マスク上に堆積された保護層も除去することを特徴とする請求項7記載の方法。
- 前記保護層を堆積させる前であるが、前記第2の表面から前記非湿潤性層の少なくとも一部を除去した後に、前記第1の表面から前記マスクを除去する工程をさらに含むことを特徴とする請求項7または8記載の方法。
- 前記非湿潤性層の少なくとも一部を除去する工程が、前記液体吐出装置を酸素プラズマに曝露する工程を含むことを特徴とする請求項9記載の方法。
- 前記非湿潤性層の少なくとも一部を除去する工程が、該非湿潤性層の全ては除去しないことを特徴とする請求項8〜10のいずれか1項記載の方法。
- 前記非湿潤性層を堆積させる前に、前記第1と第2の表面上に無機層を堆積させる工程をさらに含むことを特徴とする請求項5〜11のいずれか1項記載の方法。
- 前記非湿潤性層を蒸着により堆積させることを特徴とする請求項5〜12のいずれか1項記載の方法。
- 前記保護層を堆積させる工程が、無機酸化物を堆積させる工程を含むことを特徴とする請求項5〜13のいずれか1項記載の方法。
- 前記無機酸化物が二酸化ケイ素であることを特徴とする請求項14記載の方法。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86832806P | 2006-12-01 | 2006-12-01 | |
US60/868,328 | 2006-12-01 | ||
US86853606P | 2006-12-04 | 2006-12-04 | |
US60/868,536 | 2006-12-04 | ||
US87176306P | 2006-12-22 | 2006-12-22 | |
US60/871,763 | 2006-12-22 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009539523A Division JP5357768B2 (ja) | 2006-12-01 | 2007-11-30 | 液体吐出装置上への非湿潤性コーティング |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013060017A JP2013060017A (ja) | 2013-04-04 |
JP5633888B2 true JP5633888B2 (ja) | 2014-12-03 |
Family
ID=39493010
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009539523A Active JP5357768B2 (ja) | 2006-12-01 | 2007-11-30 | 液体吐出装置上への非湿潤性コーティング |
JP2012257320A Active JP5633888B2 (ja) | 2006-12-01 | 2012-11-26 | 液体吐出装置上への非湿潤性コーティング |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009539523A Active JP5357768B2 (ja) | 2006-12-01 | 2007-11-30 | 液体吐出装置上への非湿潤性コーティング |
Country Status (6)
Country | Link |
---|---|
US (1) | US8128201B2 (ja) |
EP (1) | EP2089232B1 (ja) |
JP (2) | JP5357768B2 (ja) |
KR (1) | KR101389901B1 (ja) |
CN (2) | CN102642404B (ja) |
WO (1) | WO2008070573A2 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI500525B (zh) * | 2005-07-01 | 2015-09-21 | Fujifilm Dimatix Inc | 流體噴射器上之不受潮塗層 |
US8128201B2 (en) * | 2006-12-01 | 2012-03-06 | Fujifilm Dimatix, Inc. | Non-wetting coating on a fluid ejector |
WO2010051272A1 (en) * | 2008-10-30 | 2010-05-06 | Fujifilm Corporation | Non-wetting coating on a fluid ejector |
US20100110144A1 (en) * | 2008-10-31 | 2010-05-06 | Andreas Bibl | Applying a Layer to a Nozzle Outlet |
US8061810B2 (en) | 2009-02-27 | 2011-11-22 | Fujifilm Corporation | Mitigation of fluid leaks |
US8262200B2 (en) * | 2009-09-15 | 2012-09-11 | Fujifilm Corporation | Non-wetting coating on a fluid ejector |
US8210649B2 (en) * | 2009-11-06 | 2012-07-03 | Fujifilm Corporation | Thermal oxide coating on a fluid ejector |
US8534797B2 (en) * | 2009-12-28 | 2013-09-17 | Xerox Corporation | Superoleophobic and superhydrophobic devices and method for preparing same |
US8292404B2 (en) * | 2009-12-28 | 2012-10-23 | Xerox Corporation | Superoleophobic and superhydrophobic surfaces and method for preparing same |
US8567910B2 (en) | 2010-03-31 | 2013-10-29 | Fujifilm Corporation | Durable non-wetting coating on fluid ejector |
WO2011126493A1 (en) * | 2010-04-09 | 2011-10-13 | Hewlett Packard Development Company, L.P. | Manufacture of a print head |
JP6039259B2 (ja) * | 2011-07-25 | 2016-12-07 | キヤノン株式会社 | 液体吐出ヘッド、およびその製造方法 |
JP5323898B2 (ja) * | 2011-08-01 | 2013-10-23 | シャープ株式会社 | 液体吐出ノズル、及び液体吐出ノズルにおける撥水層の再生方法 |
JP5752816B2 (ja) | 2013-02-04 | 2015-07-22 | 富士フイルム株式会社 | 撥水膜の製造方法、ノズルプレート、インクジェットヘッド、及びインクジェット記録装置 |
JP6351274B2 (ja) * | 2014-01-21 | 2018-07-04 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
US9701119B2 (en) * | 2014-06-12 | 2017-07-11 | Funai Electric Co., Ltd. | Fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same |
JP6929517B2 (ja) * | 2016-06-28 | 2021-09-01 | セイコーエプソン株式会社 | インクジェット記録方法、インクジェット記録装置の制御方法 |
US10006564B2 (en) | 2016-08-10 | 2018-06-26 | Ckd Corporation | Corrosion resistant coating for process gas control valve |
JP6900998B2 (ja) * | 2017-03-29 | 2021-07-14 | コニカミノルタ株式会社 | 吐出用基板、液滴吐出ヘッド及び液滴吐出装置 |
JP2019107857A (ja) * | 2017-12-20 | 2019-07-04 | 東芝テック株式会社 | 薬液吐出装置及び薬液滴下装置 |
EP3999346A4 (en) * | 2019-09-06 | 2023-04-05 | Hewlett-Packard Development Company, L.P. | FLUID EJECTION FACE SELECTIVE COATING |
WO2021199731A1 (ja) * | 2020-03-30 | 2021-10-07 | 富士フイルム株式会社 | 液体吐出構造体、液体吐出ヘッド及び液体吐出装置 |
US11203202B1 (en) * | 2020-08-31 | 2021-12-21 | Xerox Corporation | System and method for attenuating ink smears on printhead faceplates during inkjet printhead maintenance |
JP7540309B2 (ja) | 2020-11-17 | 2024-08-27 | 株式会社リコー | 液体吐出ヘッド、液体吐出ヘッドの製造方法、液体吐出ユニット及び液体を吐出する装置 |
Family Cites Families (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8906379D0 (en) * | 1989-03-20 | 1989-05-04 | Am Int | Providing a surface with solvent-wettable and solvent-non wettable zones |
GB9010289D0 (en) * | 1990-05-08 | 1990-06-27 | Xaar Ltd | Drop-on-demand printing apparatus and method of manufacture |
US5341161A (en) * | 1991-06-14 | 1994-08-23 | Canon Kabushiki Kaisha | Ink recorder including a sealing member for an ink storage section |
US5434606A (en) * | 1991-07-02 | 1995-07-18 | Hewlett-Packard Corporation | Orifice plate for an ink-jet pen |
CA2272160C (en) * | 1992-07-31 | 2003-10-14 | Canon Kabushiki Kaisha | Liquid storing container for recording apparatus |
JPH07329303A (ja) * | 1994-06-09 | 1995-12-19 | Citizen Watch Co Ltd | インクジェットヘッドの表面処理方法 |
GB9417445D0 (en) * | 1994-08-30 | 1994-10-19 | Xaar Ltd | Coating, coating composition and method of forming coating |
JPH0985956A (ja) | 1995-09-21 | 1997-03-31 | Rohm Co Ltd | インクジェットノズルの形成方法 |
CA2230584A1 (en) * | 1996-06-28 | 1998-01-08 | Pelikan Produktions Ag | Hydrophobic coating for ink jet printing heads |
JPH10235858A (ja) | 1997-02-24 | 1998-09-08 | Seiko Epson Corp | インクジェットヘッド及びその製造方法 |
US6918654B2 (en) | 1997-07-15 | 2005-07-19 | Silverbrook Research Pty Ltd | Ink distribution assembly for an ink jet printhead |
US7708372B2 (en) * | 1997-07-15 | 2010-05-04 | Silverbrook Research Pty Ltd | Inkjet nozzle with ink feed channels etched from back of wafer |
CN1198728C (zh) * | 1998-01-28 | 2005-04-27 | 精工爱普生股份有限公司 | 液体喷射构造,喷墨式记录头和打印机 |
US6312103B1 (en) * | 1998-09-22 | 2001-11-06 | Hewlett-Packard Company | Self-cleaning titanium dioxide coated ink-jet printer head |
US6511149B1 (en) * | 1998-09-30 | 2003-01-28 | Xerox Corporation | Ballistic aerosol marking apparatus for marking a substrate |
US6325490B1 (en) * | 1998-12-31 | 2001-12-04 | Eastman Kodak Company | Nozzle plate with mixed self-assembled monolayer |
JP3616732B2 (ja) * | 1999-07-07 | 2005-02-02 | 東京エレクトロン株式会社 | 基板の処理方法及び処理装置 |
JP4438918B2 (ja) | 1999-11-11 | 2010-03-24 | セイコーエプソン株式会社 | インクジェットプリンタヘッド及びその製造方法、並びに多環系チオール化合物 |
US6561624B1 (en) * | 1999-11-17 | 2003-05-13 | Konica Corporation | Method of processing nozzle plate, nozzle plate, ink jet head and image forming apparatus |
AUPQ455999A0 (en) * | 1999-12-09 | 2000-01-06 | Silverbrook Research Pty Ltd | Memjet four color modular print head packaging |
US6364456B1 (en) * | 1999-12-22 | 2002-04-02 | Eastman Kodak Company | Replenishable coating for printhead nozzle plate |
ATE345934T1 (de) * | 2000-06-08 | 2006-12-15 | Illinois Tool Works | Reinigung einer flüssigkeitsstrahlvorrichtung |
US6472332B1 (en) * | 2000-11-28 | 2002-10-29 | Xerox Corporation | Surface micromachined structure fabrication methods for a fluid ejection device |
US6488357B2 (en) * | 2000-12-05 | 2002-12-03 | Xerox Corporation | Corrision resistant hydrophobic liquid level control plate for printhead of ink jet printer and process |
WO2002081588A1 (fr) * | 2001-04-02 | 2002-10-17 | Matsushita Electric Industrial Co., Ltd. | Film hydrophobe et son procede de preparation, et tete a jet d'encre et dispositif d'enregistrement du type a jet d'encre utilisant celle-ci |
US20030013863A1 (en) * | 2001-07-16 | 2003-01-16 | Buchholz Wallace G. | High resolution DNA size standards |
KR100552660B1 (ko) * | 2001-08-09 | 2006-02-20 | 삼성전자주식회사 | 버블 젯 방식의 잉크 젯 프린트 헤드 |
US6900083B2 (en) * | 2001-08-31 | 2005-05-31 | Sharp Laboratories Of America, Inc. | Method of forming multi-layers for a thin film transistor |
JP2003191476A (ja) * | 2001-12-26 | 2003-07-08 | Hitachi Ltd | インクジェットプリンタ、及びインクジェットヘッド |
US6866366B2 (en) * | 2002-04-23 | 2005-03-15 | Hitachi, Ltd. | Inkjet printer and printer head |
US6938986B2 (en) * | 2002-04-30 | 2005-09-06 | Hewlett-Packard Development Company, L.P. | Surface characteristic apparatus and method |
US7086154B2 (en) | 2002-06-26 | 2006-08-08 | Brother Kogyo Kabushiki Kaisha | Process of manufacturing nozzle plate for ink-jet print head |
CN1298537C (zh) * | 2002-06-27 | 2007-02-07 | 飞赫科技股份有限公司 | 喷孔片及其制程 |
US6972261B2 (en) | 2002-06-27 | 2005-12-06 | Xerox Corporation | Method for fabricating fine features by jet-printing and surface treatment |
US7403511B2 (en) * | 2002-08-02 | 2008-07-22 | Texas Instruments Incorporated | Low power packet detector for low power WLAN devices |
KR100468859B1 (ko) * | 2002-12-05 | 2005-01-29 | 삼성전자주식회사 | 일체형 잉크젯 프린트헤드 및 그 제조방법 |
US7658469B2 (en) | 2003-07-22 | 2010-02-09 | Canon Kabushiki Kaisha | Ink jet head and its manufacture method |
WO2005007413A1 (en) | 2003-07-22 | 2005-01-27 | Canon Kabushiki Kaisha | Ink jet head and its manufacture method |
CN100548692C (zh) | 2003-10-10 | 2009-10-14 | 富士胶卷迪马蒂克斯股份有限公司 | 具有薄膜的打印头 |
KR100561864B1 (ko) * | 2004-02-27 | 2006-03-17 | 삼성전자주식회사 | 잉크젯 프린트헤드의 노즐 플레이트 표면에 소수성코팅막을 형성하는 방법 |
JP4734979B2 (ja) * | 2004-07-06 | 2011-07-27 | リコープリンティングシステムズ株式会社 | インクジェットヘッド、インクジェットヘッドの製造方法、インクジェット記録装置及びインクジェット塗布装置 |
US7837300B2 (en) * | 2004-07-15 | 2010-11-23 | Ricoh Company, Ltd. | Liquid jet head, manufacturing method of the liquid jet head, image forming device, nozzle member of the liquid jet head, repellent ink film forming method, cartridge, and liquid jet recording device |
US7347532B2 (en) * | 2004-08-05 | 2008-03-25 | Fujifilm Dimatix, Inc. | Print head nozzle formation |
WO2006047326A1 (en) * | 2004-10-21 | 2006-05-04 | Fujifilm Dimatix, Inc. | Sacrificial substrate for etching |
TWI500525B (zh) | 2005-07-01 | 2015-09-21 | Fujifilm Dimatix Inc | 流體噴射器上之不受潮塗層 |
KR100633773B1 (ko) * | 2005-07-01 | 2006-10-13 | 삼성전자주식회사 | 버스 시스템 및 버스 중재 방법 |
KR20070055129A (ko) * | 2005-11-25 | 2007-05-30 | 삼성전자주식회사 | 잉크젯 프린트헤드의 노즐 플레이트 표면에 소수성코팅막을 형성하는 방법 |
WO2007073755A1 (en) * | 2005-12-23 | 2007-07-05 | Telecom Italia S.P.A. | Method of manufacturing an inkjet printhead |
US7854966B2 (en) * | 2006-02-06 | 2010-12-21 | Hamilton Sundstrand Corporation | Coating process for fatigue critical components |
US8128201B2 (en) * | 2006-12-01 | 2012-03-06 | Fujifilm Dimatix, Inc. | Non-wetting coating on a fluid ejector |
US8038260B2 (en) * | 2006-12-22 | 2011-10-18 | Fujifilm Dimatix, Inc. | Pattern of a non-wetting coating on a fluid ejector and apparatus |
WO2010051272A1 (en) | 2008-10-30 | 2010-05-06 | Fujifilm Corporation | Non-wetting coating on a fluid ejector |
US8262200B2 (en) * | 2009-09-15 | 2012-09-11 | Fujifilm Corporation | Non-wetting coating on a fluid ejector |
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CN101541544A (zh) | 2009-09-23 |
EP2089232A4 (en) | 2011-01-26 |
WO2008070573A2 (en) | 2008-06-12 |
EP2089232B1 (en) | 2012-08-01 |
US8128201B2 (en) | 2012-03-06 |
JP2010511533A (ja) | 2010-04-15 |
US20080136866A1 (en) | 2008-06-12 |
CN101541544B (zh) | 2012-06-20 |
KR101389901B1 (ko) | 2014-04-29 |
JP2013060017A (ja) | 2013-04-04 |
CN102642404A (zh) | 2012-08-22 |
KR20090094354A (ko) | 2009-09-04 |
EP2089232A2 (en) | 2009-08-19 |
WO2008070573A3 (en) | 2008-09-04 |
CN102642404B (zh) | 2015-10-28 |
JP5357768B2 (ja) | 2013-12-04 |
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