JP5625915B2 - 電極接合構造及びその製造方法 - Google Patents

電極接合構造及びその製造方法 Download PDF

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Publication number
JP5625915B2
JP5625915B2 JP2010549418A JP2010549418A JP5625915B2 JP 5625915 B2 JP5625915 B2 JP 5625915B2 JP 2010549418 A JP2010549418 A JP 2010549418A JP 2010549418 A JP2010549418 A JP 2010549418A JP 5625915 B2 JP5625915 B2 JP 5625915B2
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Prior art keywords
electrode
carbon nanotubes
electrodes
bonding material
conductive bonding
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JP2010549418A
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Japanese (ja)
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JPWO2010090055A1 (ja
Inventor
木村　哲也
哲也 木村
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP2010549418A 2009-02-05 2010-01-13 電極接合構造及びその製造方法 Expired - Fee Related JP5625915B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010549418A JP5625915B2 (ja) 2009-02-05 2010-01-13 電極接合構造及びその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009024987 2009-02-05
JP2009024987 2009-02-05
PCT/JP2010/050263 WO2010090055A1 (fr) 2009-02-05 2010-01-13 Structure de connexion d'électrode et procédé de fabrication de celle-ci
JP2010549418A JP5625915B2 (ja) 2009-02-05 2010-01-13 電極接合構造及びその製造方法

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JPWO2010090055A1 JPWO2010090055A1 (ja) 2012-08-09
JP5625915B2 true JP5625915B2 (ja) 2014-11-19

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016012799A (ja) 2014-06-27 2016-01-21 Tdk株式会社 高周波伝送線路、アンテナ及び電子回路基板
JP2016012798A (ja) 2014-06-27 2016-01-21 Tdk株式会社 高周波伝送線路、アンテナ及び電子回路基板
ITUB20169865A1 (it) * 2016-01-07 2017-07-07 Osram Gmbh Procedimento per montare componenti su un substrato, substrato e dispositivo corrispondenti
US10840203B2 (en) * 2016-05-06 2020-11-17 Smoltek Ab Assembly platform

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049369A (ja) * 2004-07-30 2006-02-16 Denso Corp 電極接合構造及びその接合方法並びに導電性接着剤及びその製造方法
JP2008210954A (ja) * 2007-02-26 2008-09-11 Fujitsu Ltd カーボンナノチューブバンプ構造体とその製造方法、およびこれを用いた半導体装置
JP2008293821A (ja) * 2007-05-25 2008-12-04 Panasonic Corp 導電性ペースト、それを用いた回路基板および電子電気機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049369A (ja) * 2004-07-30 2006-02-16 Denso Corp 電極接合構造及びその接合方法並びに導電性接着剤及びその製造方法
JP2008210954A (ja) * 2007-02-26 2008-09-11 Fujitsu Ltd カーボンナノチューブバンプ構造体とその製造方法、およびこれを用いた半導体装置
JP2008293821A (ja) * 2007-05-25 2008-12-04 Panasonic Corp 導電性ペースト、それを用いた回路基板および電子電気機器

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