JP5618340B1 - エッチング液、補給液及び銅配線の形成方法 - Google Patents

エッチング液、補給液及び銅配線の形成方法 Download PDF

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Publication number
JP5618340B1
JP5618340B1 JP2013252799A JP2013252799A JP5618340B1 JP 5618340 B1 JP5618340 B1 JP 5618340B1 JP 2013252799 A JP2013252799 A JP 2013252799A JP 2013252799 A JP2013252799 A JP 2013252799A JP 5618340 B1 JP5618340 B1 JP 5618340B1
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JP
Japan
Prior art keywords
etching
aliphatic heterocyclic
compound
etching solution
ring
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JP2013252799A
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English (en)
Japanese (ja)
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JP2014224303A (ja
Inventor
大輔 片山
大輔 片山
育代 逢坂
育代 逢坂
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MEC Co Ltd
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MEC Co Ltd
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Publication date
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Priority to JP2013252799A priority Critical patent/JP5618340B1/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2013252799A 2013-04-15 2013-12-06 エッチング液、補給液及び銅配線の形成方法 Active JP5618340B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013252799A JP5618340B1 (ja) 2013-04-15 2013-12-06 エッチング液、補給液及び銅配線の形成方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013085062 2013-04-15
JP2013085062 2013-04-15
JP2013252799A JP5618340B1 (ja) 2013-04-15 2013-12-06 エッチング液、補給液及び銅配線の形成方法

Publications (2)

Publication Number Publication Date
JP5618340B1 true JP5618340B1 (ja) 2014-11-05
JP2014224303A JP2014224303A (ja) 2014-12-04

Family

ID=51731001

Family Applications (1)

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JP2013252799A Active JP5618340B1 (ja) 2013-04-15 2013-12-06 エッチング液、補給液及び銅配線の形成方法

Country Status (5)

Country Link
JP (1) JP5618340B1 (zh)
KR (1) KR101714453B1 (zh)
CN (1) CN104955985B (zh)
TW (1) TWI542735B (zh)
WO (1) WO2014171034A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6000420B1 (ja) * 2015-08-31 2016-09-28 メック株式会社 エッチング液、補給液及び銅配線の形成方法
JP2017048462A (ja) * 2016-08-30 2017-03-09 メック株式会社 エッチング液、補給液及び銅配線の形成方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6218000B2 (ja) * 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6736088B2 (ja) * 2017-05-22 2020-08-05 メック株式会社 エッチング液、補給液および銅配線の形成方法
JP6333455B1 (ja) * 2017-08-23 2018-05-30 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP7129711B2 (ja) * 2020-01-24 2022-09-02 メック株式会社 エッチング液、補給液および銅配線の形成方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000282265A (ja) * 1999-03-31 2000-10-10 Mec Kk 銅または銅合金のマイクロエッチング剤およびそれを用いる表面処理法
JP2006111953A (ja) * 2004-10-18 2006-04-27 Mec Kk 銅又は銅合金のエッチング剤、その製造法、補給液及び配線基板の製造法
JP2007332430A (ja) * 2006-06-16 2007-12-27 Asahi Kagaku Kogyo Co Ltd エッチング組成液
JP2011233769A (ja) * 2010-04-28 2011-11-17 Mec Co Ltd 銅配線パターンの形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI480360B (zh) * 2009-04-03 2015-04-11 Du Pont 蝕刻劑組成物及方法
JP2013104104A (ja) * 2011-11-14 2013-05-30 Mec Kk エッチング液、補給液及び銅配線の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000282265A (ja) * 1999-03-31 2000-10-10 Mec Kk 銅または銅合金のマイクロエッチング剤およびそれを用いる表面処理法
JP2006111953A (ja) * 2004-10-18 2006-04-27 Mec Kk 銅又は銅合金のエッチング剤、その製造法、補給液及び配線基板の製造法
JP2007332430A (ja) * 2006-06-16 2007-12-27 Asahi Kagaku Kogyo Co Ltd エッチング組成液
JP2011233769A (ja) * 2010-04-28 2011-11-17 Mec Co Ltd 銅配線パターンの形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6000420B1 (ja) * 2015-08-31 2016-09-28 メック株式会社 エッチング液、補給液及び銅配線の形成方法
KR101729459B1 (ko) 2015-08-31 2017-04-21 멕크 가부시키가이샤 에칭액, 보급액 및 구리 배선의 형성방법
US10174428B2 (en) 2015-08-31 2019-01-08 Mec Company Ltd. Etchant, replenishment solution and method for forming copper wiring
JP2017048462A (ja) * 2016-08-30 2017-03-09 メック株式会社 エッチング液、補給液及び銅配線の形成方法

Also Published As

Publication number Publication date
WO2014171034A1 (ja) 2014-10-23
TW201447044A (zh) 2014-12-16
JP2014224303A (ja) 2014-12-04
KR20150103056A (ko) 2015-09-09
KR101714453B1 (ko) 2017-03-22
CN104955985A (zh) 2015-09-30
CN104955985B (zh) 2018-07-20
TWI542735B (zh) 2016-07-21

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