JP5615604B2 - チップｌｅｄ検査装置 - Google Patents

チップｌｅｄ検査装置 Download PDF

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Publication number
JP5615604B2
JP5615604B2 JP2010148551A JP2010148551A JP5615604B2 JP 5615604 B2 JP5615604 B2 JP 5615604B2 JP 2010148551 A JP2010148551 A JP 2010148551A JP 2010148551 A JP2010148551 A JP 2010148551A JP 5615604 B2 JP5615604 B2 JP 5615604B2
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JP
Japan
Prior art keywords
light
chip led
illumination
support member
camera
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JP2010148551A
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English (en)
Japanese (ja)
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JP2012013474A (ja
Inventor
晋也 松田
晋也 松田
浩一 佐々木
浩一 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daiichi Jitsugyo Viswill Co Ltd
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Daiichi Jitsugyo Viswill Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiichi Jitsugyo Viswill Co Ltd filed Critical Daiichi Jitsugyo Viswill Co Ltd
Priority to JP2010148551A priority Critical patent/JP5615604B2/ja
Priority to TW100114700A priority patent/TWI525316B/zh
Priority to KR1020110053452A priority patent/KR20120002429A/ko
Priority to CN201110165533.1A priority patent/CN102313750B/zh
Publication of JP2012013474A publication Critical patent/JP2012013474A/ja
Application granted granted Critical
Publication of JP5615604B2 publication Critical patent/JP5615604B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Led Device Packages (AREA)
JP2010148551A 2010-06-30 2010-06-30 チップｌｅｄ検査装置 Active JP5615604B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010148551A JP5615604B2 (ja) 2010-06-30 2010-06-30 チップｌｅｄ検査装置
TW100114700A TWI525316B (zh) 2010-06-30 2011-04-27 晶片型ｌｅｄ檢測設備
KR1020110053452A KR20120002429A (ko) 2010-06-30 2011-06-02 Ｌｅｄ칩 검사 장치
CN201110165533.1A CN102313750B (zh) 2010-06-30 2011-06-20 晶片式led检查装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010148551A JP5615604B2 (ja) 2010-06-30 2010-06-30 チップｌｅｄ検査装置

Publications (2)

Publication Number Publication Date
JP2012013474A JP2012013474A (ja) 2012-01-19
JP5615604B2 true JP5615604B2 (ja) 2014-10-29

Family

ID=45427101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010148551A Active JP5615604B2 (ja) 2010-06-30 2010-06-30 チップｌｅｄ検査装置

Country Status (4)

Country Link
JP (1) JP5615604B2 (zh)
KR (1) KR20120002429A (zh)
CN (1) CN102313750B (zh)
TW (1) TWI525316B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103424072A (zh) * 2012-05-23 2013-12-04 珠海格力电器股份有限公司 视觉检测单元和视觉检测系统
US9477316B2 (en) 2014-03-24 2016-10-25 Intel Corporation Interaction with a computing device via movement of a portion of a user interface
WO2016125234A1 (ja) * 2015-02-02 2016-08-11 株式会社イクス 発光装置、校正係数の算出方法及び検査対象物の撮像画像の校正方法
CN105988071B (zh) * 2015-02-04 2020-04-21 中芯国际集成电路制造(上海)有限公司 一种半导体测试设备及方法
CN106153630A (zh) * 2015-04-27 2016-11-23 昆山市和博电子科技有限公司 晶片电阻检测装置
JP6393667B2 (ja) * 2015-09-09 2018-09-19 株式会社東芝 外観検査装置および外観検査方法
JP6862155B2 (ja) * 2016-11-24 2021-04-21 第一実業ビスウィル株式会社 外観検査装置
CN106439524A (zh) * 2016-11-28 2017-02-22 北京慧眼智行科技有限公司 一种隐形信息采集的照明装置
CN109386276B (zh) * 2017-08-09 2022-04-12 中国石油化工股份有限公司 可视化渗流实验的装置及方法
CN109819150B (zh) * 2019-02-20 2022-03-15 深圳劲嘉集团股份有限公司 一种多通道图像采集装置以及采集多通道图像的方法
IT201900005534A1 (it) * 2019-04-10 2020-10-10 Doss Visual Solution S R L Illuminatore per un gruppo di visione di una macchina di ispezione ottica per il controllo qualità di pezzi
TWI732506B (zh) * 2019-04-22 2021-07-01 日商新川股份有限公司 線形狀測量裝置、線三維圖像產生方法以及線形狀測量方法
JP6996699B2 (ja) * 2020-01-14 2022-01-17 トヨタ自動車株式会社 バルブ当たり面の検査方法及び検査装置
KR102532544B1 (ko) * 2020-11-12 2023-05-15 주식회사 에스엔디솔루션 라인 레이저와 3차원 카메라를 이용한 피검사체의 외형 검사장치
CN113218946B (zh) * 2021-05-07 2023-05-16 宁波市芯能微电子科技有限公司 芯片led数量自动检测系统
CN113720858B (zh) * 2021-08-31 2023-03-31 北京航空航天大学 一种基于穹顶光源及其暗场的钢球表面缺陷检测方法
TWI832136B (zh) * 2022-01-10 2024-02-11 致茂電子股份有限公司 含金屬鍍膜半導體元件的檢測系統

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921529A (ja) * 1982-07-27 1984-02-03 Toda Kogyo Corp 磁気記録材料用磁性酸化鉄粒子粉末の製造法
US5461417A (en) * 1993-02-16 1995-10-24 Northeast Robotics, Inc. Continuous diffuse illumination method and apparatus
JPH10232114A (ja) * 1996-12-20 1998-09-02 Komatsu Ltd 半導体パッケージの端子検査装置
JP2001210873A (ja) * 2000-01-21 2001-08-03 Rohm Co Ltd チップ型ｌｅｄ
JP3614776B2 (ja) * 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
JP2006003095A (ja) * 2004-06-15 2006-01-05 Nec Compound Semiconductor Devices Ltd 外観検査装置およびその検査方法
JP2006133052A (ja) * 2004-11-05 2006-05-25 Ishizuka Glass Co Ltd 異物検査方法及び装置
JP2006162427A (ja) * 2004-12-07 2006-06-22 Toshiba Corp Ｌｅｄチップの検査方法及びｌｅｄチップの検査装置
JP2007101309A (ja) * 2005-10-03 2007-04-19 Kyoto Denkiki Kk リング状照明装置
JP2007263671A (ja) * 2006-03-28 2007-10-11 Tateyama Machine Kk コーティング検査装置
JP2007292576A (ja) * 2006-04-25 2007-11-08 Matsushita Electric Ind Co Ltd 電子部品の外観検査装置
JP2008002848A (ja) * 2006-06-20 2008-01-10 Tateyama Machine Kk 棒状回転工具の欠陥検査装置と欠陥検査方法
JP2008051694A (ja) * 2006-08-25 2008-03-06 Matsushita Electric Works Ltd 実装基板の外観検査方法及び外観検査システム
JP5181321B2 (ja) * 2006-10-20 2013-04-10 シーシーエス株式会社 光照射装置
JP4493048B2 (ja) * 2007-08-03 2010-06-30 第一実業ビスウィル株式会社 検査装置
KR20090024944A (ko) * 2007-09-05 2009-03-10 아주하이텍(주) 자동 광학 검사 장치 및 방법
JP5422896B2 (ja) * 2008-02-26 2014-02-19 凸版印刷株式会社 金属基板表面の検査方法及び検査装置
JP2009236648A (ja) * 2008-03-27 2009-10-15 Daido Steel Co Ltd 外観検査装置
JP2009288050A (ja) * 2008-05-29 2009-12-10 Toppan Printing Co Ltd 撮像装置及び検査装置
JP5320967B2 (ja) * 2008-10-14 2013-10-23 日立化成株式会社 配線検査装置及び配線検査方法

Also Published As

Publication number Publication date
CN102313750A (zh) 2012-01-11
CN102313750B (zh) 2015-08-12
TW201200864A (en) 2012-01-01
KR20120002429A (ko) 2012-01-05
JP2012013474A (ja) 2012-01-19
TWI525316B (zh) 2016-03-11

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