JP5613001B2 - 基板処理システム及び基板搬送方法 - Google Patents

基板処理システム及び基板搬送方法 Download PDF

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Publication number
JP5613001B2
JP5613001B2 JP2010230467A JP2010230467A JP5613001B2 JP 5613001 B2 JP5613001 B2 JP 5613001B2 JP 2010230467 A JP2010230467 A JP 2010230467A JP 2010230467 A JP2010230467 A JP 2010230467A JP 5613001 B2 JP5613001 B2 JP 5613001B2
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JP
Japan
Prior art keywords
substrate
sliding member
substrate processing
transport mechanism
substrate transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010230467A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012084725A (ja
Inventor
健次 天野
健次 天野
健一 遠藤
健一 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2010230467A priority Critical patent/JP5613001B2/ja
Priority to KR1020110104221A priority patent/KR101386297B1/ko
Priority to TW100136986A priority patent/TWI549215B/zh
Priority to CN201110319489.5A priority patent/CN102446792B/zh
Publication of JP2012084725A publication Critical patent/JP2012084725A/ja
Priority to KR1020130164440A priority patent/KR101453222B1/ko
Application granted granted Critical
Publication of JP5613001B2 publication Critical patent/JP5613001B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0019—End effectors other than grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2010230467A 2010-10-13 2010-10-13 基板処理システム及び基板搬送方法 Expired - Fee Related JP5613001B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010230467A JP5613001B2 (ja) 2010-10-13 2010-10-13 基板処理システム及び基板搬送方法
KR1020110104221A KR101386297B1 (ko) 2010-10-13 2011-10-12 기판 처리 시스템 및 기판 반송 방법
TW100136986A TWI549215B (zh) 2010-10-13 2011-10-12 Substrate processing system and substrate transfer method
CN201110319489.5A CN102446792B (zh) 2010-10-13 2011-10-13 基板处理系统和基板输送方法
KR1020130164440A KR101453222B1 (ko) 2010-10-13 2013-12-26 기판 처리 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010230467A JP5613001B2 (ja) 2010-10-13 2010-10-13 基板処理システム及び基板搬送方法

Publications (2)

Publication Number Publication Date
JP2012084725A JP2012084725A (ja) 2012-04-26
JP5613001B2 true JP5613001B2 (ja) 2014-10-22

Family

ID=46009177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010230467A Expired - Fee Related JP5613001B2 (ja) 2010-10-13 2010-10-13 基板処理システム及び基板搬送方法

Country Status (4)

Country Link
JP (1) JP5613001B2 (ko)
KR (2) KR101386297B1 (ko)
CN (1) CN102446792B (ko)
TW (1) TWI549215B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103454799B (zh) * 2013-08-30 2015-07-29 合肥京东方光电科技有限公司 真空对盒装置及对盒方法和生产设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11129174A (ja) * 1997-10-29 1999-05-18 Seiko Seiki Co Ltd 物品の搬送装置
JPH11291184A (ja) * 1998-04-09 1999-10-26 Sprout:Kk 半導体ウエハ及びガラス基板の搬送用独立制御ロボット
JP2003229467A (ja) * 2002-02-04 2003-08-15 Seiko Instruments Inc 真空処理装置
KR100445611B1 (ko) * 2002-12-05 2004-08-25 주식회사 에이디피엔지니어링 Ｆｐｄ 제조장치
CN1217773C (zh) * 2002-12-05 2005-09-07 爱德牌工程有限公司 平板显示器制造装置
JP4023543B2 (ja) * 2003-05-29 2007-12-19 東京エレクトロン株式会社 基板搬送装置および基板搬送方法ならびに真空処理装置
KR20050095993A (ko) * 2004-03-29 2005-10-05 엘지.필립스 엘시디 주식회사 피처리기판의 공정처리장치 및 공정처리방법
JP2006016144A (ja) * 2004-07-01 2006-01-19 Daihen Corp トランスファロボット
JP2006237559A (ja) * 2005-01-28 2006-09-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007027379A (ja) * 2005-07-15 2007-02-01 Hitachi Kokusai Electric Inc 基板処理装置
JP4903027B2 (ja) * 2006-01-06 2012-03-21 東京エレクトロン株式会社 基板搬送装置および基板支持体
JP2009049232A (ja) * 2007-08-21 2009-03-05 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
KR101386297B1 (ko) 2014-04-18
JP2012084725A (ja) 2012-04-26
KR20140012926A (ko) 2014-02-04
CN102446792A (zh) 2012-05-09
TWI549215B (zh) 2016-09-11
KR20120038380A (ko) 2012-04-23
CN102446792B (zh) 2014-09-17
KR101453222B1 (ko) 2014-10-22
TW201237987A (en) 2012-09-16

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