201237987 六、發明說明： 【發明所屬之技術領域】 本發明是有關處理顯示面板用的基板之基板處理系統 、及該基板處理系統的基板搬送方法。 【先前技術】 在使用於平板顯示器等的玻璃基板中，爲了在該玻璃 基板上構成微細的配線等，而施以電漿蝕刻處理。通常， 對玻璃基板的電漿蝕刻處理是以基板處理系統來進行。 對第6代的平板顯示器所使用的玻璃基板實施電漿蝕 刻處理的基板處理系統是具備製程腔室（處理室）及進行 往該製程腔室的玻璃基板的搬出入之裝載鎖定模組。在此 基板處理系統是利用使用第2升降銷的基板更換方式，該 第2升降銷是有別於在製程腔室內在基板載置台上使玻璃 基板上昇或下降的第1升降銷，由於第2升降銷是在數處 保持玻璃基板的端而使該玻璃基板上昇或下降，因此可使 進行玻璃基板的搬出入的裝載鎖定模組內的搬送臂的構造 簡素化，具體而言，可成爲單臂型.無上下旋轉軸型的省 空間且簡單的構造’進而可兼顧裝置的製造成本及平板顯 示器的生產性。 可是’對第7代以後的平板顯示器實施電漿飩刻處理 的基板處理系統’因爲玻璃基板的尺寸大型化，在使用基 板支撐位置被限制的第2升降銷的基板更換時，第2升降 銷無法保持玻璃基板的適當處，玻璃基板的彎曲會形成過 -5- 201237987 大而基板破裂，因而有不能搬送的情形。於是，對應於此 ，現狀是廢除第2升降銷，採用雙臂型的搬送臂作爲裝載 鎖定模組內的搬送臂，藉由該搬送臂來進行基板更換，藉 此防止玻璃基板的彎曲。 圖1 1是槪略顯示對第7代以後的平板顯示器實施電 漿蝕刻處理的基板處理系統的構成立體圖。 在圖11中，此基板處理系統110是具備：將被收容 於卡匣113的未處理的玻璃基板予以經由大氣系搬送臂 114來往傳送模組112搬送的裝載鎖定模組115。該裝載 鎖定模組1 1 5是將處理完成玻璃基板從傳送模組1 1 2經由 大氣系搬送臂114來往卡匣116搬送。製程腔室111或傳 送模組112的內部狀態是幾乎被維持於真空，因此裝載鎖 定模組π 5是構成可將內部狀態切換成大氣/真空（例如 參照專利文獻1 )。 並且，在基板處理系統110的傳送模組112的內部配 置有作爲基板搬送單元的Scalar型或直動型的搬送臂（未 圖示），該搬送臂是在傳送模組112的內部維持載置玻璃 基板下旋轉》因此，需要擴大傳送模組112的內部容積。 近年來，開始被製造的第10代的平板顯示器所使用 的玻璃基板是呈一邊約爲3 m弱的長方形，因此需要使傳 送模組1 1 2的內部容積更大，其結果，傳送模組1 1 2會巨 大化。並且，基板處理系統110是在傳送模組112及裝載 鎖定模組1 1 5之間配置有可真空斷絕的閘閥1 1 7，該閘閥 1 1 7亦隨著傳送模組1 1 2的巨大化而巨大化，因此會產生 -6- 201237987 傳送模組1 1 2或閘閥1 1 7的製造成本上昇的問題。 就未來開始被製造的第11代的平板顯示器所使用的 玻璃基板（呈一邊約爲超過3tn的長方形）而言，上述傳 送模組112等的製造成本的上昇會更顯著。於是，爲了削 減傳送模組1 1 2等的製造成本，如圖1 2所示那樣，具備1 個製程腔室121及被連接至該製程腔室121的1個裝載鎖 定模組1 22之具有與處理第6代的平板顯示器所使用的玻 璃基板的基板處理系統相似的構成之基板處理系統120被 檢討。 可是，基板處理系統120是只具備1個的製程腔室 121，因此裝載鎖定模組122在進行玻璃基板的搬出入的 期間，無法對其他的玻璃基板實施電漿蝕刻處理。因此， 爲了使平板顯示器的製造效率提升，需要短時間進行裝載 鎖卑模組I22之玻璃基板的搬出入。 〔先行技術文獻〕 〔專利文獻〕 〔專利文獻1〕日本特開2007-208235號公報 【發明內容】 (發明所欲解決的課題） 然而，裝載鎖定模組122所具備的基板搬送單元爲使 用一般的Scalar型或直動式的雙臂型的搬送臂時，因爲需 要在裝載鎖定模組122的內部確保該搬送臂的可動作區域 ，需要擴大裝載鎖定模組122的內部容積。另一方面，因 201237987 爲裝載鎖定模組1 22需要構成可將內部狀態切換成大氣/ 真空，所以一旦裝載鎖定模組122的內部容積大，則玻璃 基板的搬出入時的內部狀態的大氣/真空的切換需要時間 ，結果會有無法使平板顯示器的製造效率提升的問題。 本發明的目的是在於提供一種可使基板的處理效率提 升的基板處理系統及基板搬送方法。 (甩以解決課題的手段） 爲了達成上述目的，請求項1記載的基板處理系統係 具備= 1個的基板處理裝置，其係於真空狀態下對基板實施 處理； 第1基板搬送裝置，其係被連接至該基板處理裝置， 將內部狀態切換成大氣/真空；及 第2基板搬送裝置，其係被連接至該第1基板搬送裝 置，配置成隔著前述第1基板搬送裝置來與前述基板處理 裝置對向， 前述第2基板搬送裝置係於大氣狀態中進行對前述第 1基板搬送裝置之前述基板的搬出入，前述第1基板搬送 裝置係進行對前述基板處理裝置之前述基板的搬出入，其 特徵爲： 前述第1基板搬送裝置係具有：在.該第1基板搬送裝 置的內部配置成上下重疊且彼此獨立上下作動的上部基板 搬送機構及下部基板搬送裝置， -8- 201237987 前述上部基板搬送機構係具有： 第1基部，其係配有彼此平行且朝向前述基板處理裝 置延伸的複數個第1導件； 複數個細長狀的第1中間滑動構件，其係對應於各前 述第1導件而設，朝向前述基板處理裝置來對前述第1導 件相對性地滑動：及 複數個細長狀的第1上部滑動構件，其係對應於各前 述第1中間滑動構件而設，朝向前述基板處理裝置來對前 述第1中間滑動構件相對性地滑動， 前述下部基板搬送機構係具有： 第2基部，其係配有彼此平行且朝向前述基板處理裝 置延伸的複數個第2導件； 複數個細長狀的第2中間滑動構件，其係對應於各前 述第2導件而設，朝向前述基板處理裝置來對前述第2導 件相對性地滑動；及 複數個細長狀的第2上部滑動構件，其係對應於各前 述第2中間滑動構件而設，朝向前述基板處理裝置來對前 述第2中間滑動構件相對性地滑動， 複數的前述第1上部滑動構件及複數的前述第2上部 滑動構件係分別載置前述基板。 請求項2記載的基板處理系統，係於請求項i記載的 基板處理系統中，具備：在前述第1基板搬送裝置的內部 從下方朝向上方突出自如的複數個銷狀構件。 請求項3記載的基板處理系統，係於請求項1或2記 -9 - 201237987 載的基板處理系統中，前述基板係呈矩形，一邊的長度爲 1 . 8m以上。 請求項4記載的基板處理系統，係於請求項i乃至3 中的任一項所記載的基板處理系統中， 在則述上部基板搬送機構中各前述第1中間搰·動構件 與各前述第1上部滑動構件係同步滑動， 在前述下部基板搬送機構中各前述第2中間滑動構件 與各前述第2上部滑動構件係同步滑動。 請求項5記載的基板處理系統，係於請求項丨乃至4 中的任一項所記載的基板處理系統中， 在前述上部基板搬送機構中各前述第1中間滑動構件 係未被互相連結，在前述下部基板搬送機構中各前述第2 中間滑動構件係未被互相連結。 請求項6記載的基板處理系統，係於請求項〗乃至4 中的任一項所記載的基板處理系統中，在前述上部基板搬 送機構中各前述第1上部滑動構件係未被互相連結，在前 述下部基板搬送機構中各前述第2上部滑動構件係未被互 相連結。 爲了達成上述目的，請求項7記載的基板搬送方法， 係基板處理系統的基板搬送方法，該基板處理系統係具備 1個的基板處理裝置，其係於真空狀態下對基板實施 處理； 第1基板搬送裝置’其係被連接至該基板處理裝置， -10- 201237987 將內部狀態切換成大氣/真空：及 第2基板搬送裝置，其係被連接至該第1基板搬送裝 置，配置成隔著前述第1基板搬送裝置來與前述基板處理 裝置對向， 前述第2基板搬送裝置係於大氣狀態中進行對前述第 1基板搬送裝置之前述基板的搬出入，前述第1基板搬送 裝置係進行對前述基板處理裝置之前述基板的搬出入， 前述第1基板搬送裝置係具有：在該第1基板搬送裝 置的內部配置成上下重疊且彼此獨立上下作動的上部基板 搬送機構及下部基板搬送裝置，以及在前述第1基板搬送 裝置的內部從下方朝向上方突出自如的複數個銷狀構件 前述上部基板搬送機構係具有： 第1基部’其係配有彼此平行且朝向前述基板處理裝 置延伸的複數個第1導件； 複數個細長狀的第1中間滑動構件，其係對應於各前 述第1導件而設，朝向前述基板處理裝置來對前述第1導 件相對性地滑動；及 複數個細長狀的第1上部滑動構件，其係對應於各前 述第1中間滑動構件而設，朝向前述基板處理裝置來對前 述第1中間滑動構件相對性地滑動， 前述下部基板搬送機構係具有： 第2基部’其係配有彼此平行且朝向前述基板處理裝 置延伸的複數個第2導件； 複數個細長狀的第2中間滑動構件，其係對應於各前 -11 - 201237987 述第2導件而設，朝向前述基板處理裝置來對前述第2導 件相對性地滑動；及 複數個細長狀的第2上部滑動構件，其係對應於各前 述第2中間滑動構件而設，朝向前述基板處理裝置來對前 述第2中間滑動構件相對性地滑動， 複數的前述第1上部滑動構件及複數的前述第2上部 滑動構件係分別載置前述基板， 其特徵爲具有： 第1接收步驟，其係前述上部基板搬送機構會接收前 述第2基板搬送裝置所搬入之未處理的基板； 第1上昇步驟，其係使前述上部基板搬送機構及前述 下部基板搬送機構上昇； 搬出步驟，其係前述下部基板搬送機構會使前述第2 中間滑動構件及前述第2上部滑動構件滑動來將處理完成 的基板從前述基板處理裝置搬出； 下降步驟，其係使前述上部基板搬送機構及前述下部 基板搬送機構下降； 搬入步驟，其係前述上部基板搬送機構會使前述第1 中間滑動構件及前述第1上部滑動構件滑動來將前述未處 理的基板搬入至前述基板處理裝置； 第2上昇步驟，其係僅前述上部基板搬送機構會上昇 } 第3上昇步驟，其係前述複數個銷狀構件會突出而使 前述處理完成的基板離開前述下部基板搬送機構而上昇； -12- 201237987 及 第2接收步驟’其係前述第2基板搬送裝置會接收前 述上昇之前述處理完成的基板。 〔發明的效果〕 若根據本發明’則因爲第1基板搬送裝置的上部基板 搬送機構是具有：對第1導件相對性地滑動的複數個細長 狀的第1中間滑動構件、及對第1中間滑動構件相對性地 滑動的複數個細長狀的第1上部滑動構件，所以除了對基 板處理裝置搬出入基板時以外，可藉由重疊第1導件、第 1中間滑動構件及第1上部滑動構件來縮小上部基板搬送 機構。又，由於第1基板搬送裝置的下部基板搬送機構是 具有：對第2導件相對性滑動的複數個細長狀的第2中間 滑動構件、及對第2中間滑動構件相對性滑動的複數個細 長狀的第2上部滑動構件，因此除了對基板處理裝置搬出 入基板時以外，可藉由重疊第2導件、第2中間滑動構件 及第2上部滑動構件來縮小下部基板搬送機構。 又，由於第1基板搬送裝置是只被連接至1個的基板 處理裝置，因此第1基板搬送裝置是只要進行對1個的基 板處理裝置之基板的搬出入即可。 並且，藉由上部基板搬送機構上昇，不會有妨礙下部 基板搬送機構之基板的搬出入或交接的情形，藉由下部基 板搬送機構下降，不會有妨礙上部基板搬送機構之基板的 搬出入或交接的情形。因此，上部基板搬送機構及下部基 -13- 201237987 板搬送機構不需要旋轉，可使上部基板搬送機構及下部基 板搬送機構的構成簡素化，可更縮小上部基板搬送機構及 下部基板搬送機構。 其結果，可縮小第1基板搬送裝置的內部容積，進而 第1基板搬送裝置的內部狀態的大氣/真空的切換不需要 花時間。藉此，可使基板的處理效率提升。 【實施方式】 以下，一邊參照圖面一邊詳細說明有關本發明的實施 形態。 圖1是槪略顯示本發明的實施形態的基板處理系統的 構成平面圖。此基板處理系統是對一邊的長度爲1.8m以 上的矩形玻璃基板、特別是使用於第1 1代以後的平板顯 示器的玻璃基板單片實施電漿蝕刻處理。另外，在圖1中 ，爲了使基板處理系統的構成容易理解，後述的裝載鎖定 模組1 3或製程腔室1 1是利用水平剖面圖來顯示。 在圖1中，基板處理系統1〇是具備： 框體狀的製程腔室11 (基板處理裝置）； 框體狀的裝載鎖定模組13(第1基板搬送裝置），其 係經由閘閥1 2來與該製程腔室1 1連接； 大氣系搬送裝置14(第2基板搬送裝置），其係被連 接至該裝載鎖定模組1 3，配置成隔著裝載鎖定模組1 3來 與製程腔室11對向；及 卡匣15 (基板供給裝置）及卡匣16(基板收容裝置 -14- 201237987 )，其係與該大氣系搬送裝置14連接，針對該大氣系搬 送裝置1 4配置於圖中自裝載鎖定模組1 3順時針及逆時針 旋轉移動約90°的位置。 並且，在裝載鎖定模組13之與大氣系搬送裝置14對 向的側面設有閘閥1 7。 製程腔室11是在被維持於真空的內部收容玻璃基板 G，利用在該內部中產生的電漿來對玻璃基板G實施電漿 蝕刻處理。並且，製程腔室11具有用以在內部載置玻璃 基板G的基板載置台18。 裝載鎖定模組1 3是在內部具有後述的上部基板搬送 機構22及下部基板搬送機·構23,構成可藉由未圖示的排 氣裝置及壓力控制閥來將內部狀態切換成大氣/真空。 卡匣15是由儲存複數個未處理的玻璃基板G的框體 所構成，在卡匣15中，複數個未處理的玻璃基板G是彼 此平行且保持預定的間隔而重疊。又，卡匣16是由儲存 複數個處理完成的玻璃基板G的框體所構成，在卡匣16 中，複數個處理完成的玻璃基板G是彼此平行且保持預定 的間隔而重疊。 大氣系搬送裝置14是具有搬送臂機構19。該搬送臂 機構19是暴露於大氣，具有：載置玻璃基板G的梳子狀 的拾取器20、及支撐該拾取器20且伸縮自如的Scalar臂 (未圖示）、及支撐該Scalar臂且旋轉自如的旋轉底座 21。搬送臂機構19是藉由伸縮Scalar臂，使旋轉底座21 旋轉，來將未處理的玻璃基板G從卡匣15搬出，而交給 -15- 201237987 裝載鎖定模組13的上部基板搬送機構22 ’且將處理完成 的玻璃基板G從裝載鎖定模組1 3的下部基板搬送機構2 3 接收而往卡匣1 6收容。 閘閥12是在利用製程腔室11之玻璃基板G的電漿蝕 刻處理時關閉，隔開製程腔室1 1的內部及裝載鎖定模組 13的內部，且在利用上部基板搬送機構22之未處理的玻 璃基板G往製程腔室11的搬入時或利用下部基板搬送機 構2 3之處理完成的玻璃基板G從製程腔室1 1搬出時開啓 ，使製程腔室1 1的內部及裝載鎖定模組1 3的內部連通。 並且，閘閥1 7是當裝載鎖定模組1 3的內部狀態爲大氣時 開啓，以搬送臂機構19的拾取器20能夠進入該內部的方 式，在裝載鎖定模組1 3的側面形成開口部，且當裝載鎖 定模組1 3的內部狀態爲真空時關閉，自外部隔開裝載鎖 定模組1 3的內部。 可是，在以往的基板處理系統所使用的基板搬送單元 200，如圖2所示，具備：被旋轉軸（未圖示）支撐的大 致長方體的滑動底座201、及被安裝於該滑動底座201， 可滑動於滑動底座201的長度方向（以下簡稱「長度方向 」）的下部拾取器底座202、及被安裝於滑動底座201， 可滑動於滑動底座201的長度方向的上部拾取器底座203 。4個長棒狀的拾取器204，205會分別從下部拾取器底座 202及上部拾取器底座203來延伸於長度方向，藉由下部 拾取器底座202或上部拾取器底座203滑動，使各拾取器 2 04，2 05往製程腔室的內部進入而搬送玻璃基板G。 -16- 201237987 此基板搬送單元200爲了確保下部拾取器底座202或 上部拾取器底座203對各拾取器204，205的滑動底座201 的安裝剛性，而構成上下方向厚。 在以往的基板處理系統中將基板搬送單元200配置於 裝載鎖定模組時，即使閘閥在製程腔室的側面形成開口部 而使製程腔室的內部及裝載鎖定模組的內部連通，還是會 因爲基板搬送單元2 0 0的下部拾取器底座2 02或上部拾取 器底座203構成厚，所以該下部拾取器底座2〇2或上部拾 取器底座2 03無法通過開口部，無法往製程腔室的內部進 入。因此，需要構成儘可能增長各拾取器204，205的長 度，藉此來爭取玻璃基板G的可搬送距離。 越是增長各拾取器204，205的長度，在玻璃基板G 的搬送時各拾取器204，205的振動會越大，且各拾取器 204，2 05的重量也會變重。因此，爲了防止各拾取器204 ，2〇5的振動，安定地支撐各拾取器204，2 05，需要更提 高各拾取器204，205對滑動底座201的安裝剛性。爲了 更提高各拾取器204，205的安裝剛性，不僅下部拾取器 底座202或上部拾取器底座203的靜的剛性，亦需要提高 滑動底座201的靜的剛性，因此滑動底座201的厚度也需 要增大。 並且，在基板搬送單兀200是藉由滑動底座201旋轉 來使該基板搬送單元200全體旋轉，但爲了防止旋轉時滑 動底座201因爲慣性力而彎曲，需要更提高滑動底座2〇1 的靜的剛性，其結果，需要更增大滑動底座201的厚度。 -17- 201237987 可是，一旦增大滑動底座201的厚度，則基板搬送單 元200會大型化。又，如上述般，由於基板搬送單元200 是構成儘可能增長各拾取器204，2 05，因此在收容各拾取 器204，205時，亦即將各拾取器204，205重疊至滑動底 座201時，基板搬送單元200並不會那麼小。因此，結果 基板搬送單元2 00會大型化。藉此，需要增大裝載鎖定模 組的內部容積。 而且，基板搬送單元2 00爲了旋轉，需要在裝載鎖定 模組13的內部確保可旋轉的區域，需要更增大裝載鎖定 模組的內部容積。 一旦裝載鎖定模組的內部容積變大，則內部狀態的大 氣/真空的切換需要時間，無法使平板顯示器的製造效率 提升。 本實施形態是因應於此，而使基板搬送單元小型化， 且不要基板搬送單元的旋轉。具體而言，使上部基板搬送 機構及下部基板搬送機構小型化，且使上部基板搬送機構 及下部基板搬送機構只在一方向搬送玻璃基板G便可實行 裝載鎖定模組及製程腔室之間的玻璃基板G的更換，構成 基板搬送單元。 圖3是有關圖1的線1A-A的剖面圖，槪略顯示作爲本 實施形態的基板處理系統的第1基板搬送裝置之裝載鎖定 模組的構成剖面圖。 在圖3中，裝載鎖定模組13是具備：在該裝載鎖定 模組13的內部配置成重疊於圖中上下的上部基板搬送機 -18- 201237987 構22及下部基板搬送機構23，且具備：在裝載鎖定模組 13的內部S (以下簡稱「內部S」）從底部往圖中上方突 出，上下作動自如的複數個緩衝銷24 (銷狀構件）、及將 裝載鎖定模組13的內部狀態切換成大氣/真空的排氣裝置 、壓力控制閥（未圖示）。 上部基板搬送機構22及下部基板搬送機構23是彼此 獨立上下作動。具體而言， 上部基板搬送機構22是昇降於：從搬送臂機構19的 拾取器20接收未處理的玻璃基板G的位置、或將未處理 的玻璃基板G往製程腔室Π搬入的位置亦即基板交接位 置、與下部基板搬送機構23進行玻璃基板G的交接時爲 了確保下部基板搬送機構23的作業空間而上部基板搬送 機構22所退避的退避去處亦即上部退避位置之間。在內 部S中上部退避位置是位於比基板交接位置更上方。 又，下部基板搬送機構23是昇降於：將處理完成的 玻璃基板G從製程腔室11搬出的位置、或往搬送臂機構 19的拾取器20交接處理完成的玻璃基板G的位置亦即基 板交接位置、與上部基板搬送機構22進行玻璃基板G的 交接時爲了確保上部基板搬送機構22的作業空間而下部 基板搬送機構23所退避的退避去處亦即下部退避空間之 間。在內部S中下部退避位置是位於比基板交接位置更下 方。另外，上部基板搬送機構22的基板交接位置與下部 基板搬送機構23的基板交接位置是相同.。 圖4是槪略顯示圖3的上部基板搬送機構的構成圖， -19- 201237987 圖4(A)是用以說明上部基板搬送機構的構成及動作的 剖面圖，圖4 ( B )是有關圖4 ( A )的線B-B的剖面圖。 在圖4(A)及圖4(B)中，上部基板搬送機構22是 具有： 板狀的昇降底座26(第1基部），其係配有彼此平行 且往製程腔室11 (往圖中右方）延伸的4個導軌25(第1 導件）； 導臂27 (第1中間滑動構件），其係對應於各導軌 25而設，呈細長的方柱狀；及 拾取器28(第1上部滑動構件），其細對應於各導臂 27而設，由細長的薄板體所構成。 在上部基板搬送機構22是4個的拾取器28會一起作 用來載置1片未處理的玻璃基板G。 如圖5所示，上部基板搬送機構22是在昇降底座26 由下方依序重疊導軌25、導臂27及拾取器28。導臂27 是具有跨越全長設於下面的導溝27a，經由該導溝27a來 與導軌25遊嵌。並且，拾取器28是將薄板體折彎成剖面 U字狀，在以U字狀所形成的內部空間收容導臂27，藉 此與導臂27滑嵌。 上部基板搬送機構22是具有未圖示的驅動源，藉由 該驅動源所給予的驅動力，導臂2 7會朝向製程腔室1 1來 對導軌25相對性地滑動，且拾取器28會朝向製程腔室1 1 來對導臂27相對性地滑動。此時，4個的導臂27是一面 維持彼此的相對位置關係，一面滑動，4個的拾取器28也 -20- 201237987 是一面維持彼此的相對位置關係，一面滑動。並且，各 臂27與各拾取器28是同步滑動，因此可防止在導臂 及拾取器28的任一方的滑動中另一方停止而在上部基 搬送機構22中發生衝撃。藉此，可防止發生被載置於 取器28的未處理的玻璃基板G的位移，可將未處理的 璃基板G正確地載置於製程腔室11的基板載置台18的 定的位置。 • 上部基板搬送機構22是以導臂27及拾取器28朝 程腔室1 1側最大限度滑動時（圖4 ( A )及圖4 ( B )所 的狀態）被載置於拾取器28的未處理的玻璃基板G可 達基板載置台18的上方之方式設定導臂27及拾取器 的長度、以及可滑動範圍。 並且，在上部基板搬送機構22，朝製程腔室11側 大限度滑動的導臂27及拾取器28是藉由驅動源所給予 驅動力來朝向大氣系搬送裝置14滑動，與昇降底座26 疊（圖3所示的狀態）。 以下，將導臂2 7及拾取器2 8朝製程腔室]1側最 限度滑動時（圖4(A)及圖4(B)所示的狀態）稱爲 伸長狀態」，將導臂2 7及拾取器2 8朝大氣系搬送裝置 側最大限度滑動時（圖3所示的狀態）稱爲「縮短狀態 。另外’上部基板搬送機構22是僅位於基板交接位置 ’可從縮短狀態往伸長狀態遷移、及從伸長狀態往縮短 態遷移，位於上部退避位置時是維持縮短狀態。 圖6是槪略顯示圖3的下部基板搬送機構的構成圖 導 27 板 拾 玻 預 製 示 到 28 最 的 重 大 厂 14 J 時 狀 -21 - 201237987 圖6(A)是用以說明下部基板搬送機構的構成及動作的 剖面圖’圖6 ( B )是有關圖6 ( A )的線C - C的剖面圖。 在圖6(A)及圖6(B)中，下部基板搬送機構23是 具有： 板狀的昇降底座30 (第2基部），其係配有彼此平行 且往製程腔室11 (往圖中右方）延伸的4個導軌29(第2 導件）； 導臂31(第2中間滑動構件），其係對應於各導軌 29而設，呈細長的方柱狀；及 拾取器32(第2上部滑動構件），其係對應於各導臂 31而設，由細長的薄板體所構成。 在下部基板瘢送機構23是4個的拾取器32會一起作 用來載置1片處理完成的玻璃基板G。 如圖5所示，下部基板搬送機構23是在昇降底座30 由下方依序重疊導軌29、導臂31及拾取器32。導臂31 是具有跨越全長設於下面的導溝31a，經由該導溝31a來 與導軌29滑嵌。並且，拾取器32是將薄板體折彎成剖面 U字狀，在以U字狀所形成的內部空間收容導臂31，藉 此與導臂3 1滑嵌。 下部基板搬送機構23是具有未圖示的驅動源，藉由 該驅動源所給予的驅動力，導臂3 1會朝向製程腔室1 1來 對導軌29相對性地滑動，且拾取器32會朝向製程腔室1 1 來對導臂31相對性地滑動。此時，4個的導臂31是一面 維持彼此的相對位置關係，一面滑動，4個的拾取器32也 -22- 201237987 是一面維持彼此的相對位置關係，一面滑動。又’由於各 導臂31與各拾取器32是同步滑動，因此可防止在導臂31 及拾取器32的任一方的滑動中另一方停止而在下部基板 搬送機構2 3發生衝撃。藉此，可防止發生被載置於拾取 器32的處理完成的玻璃基板G的位移。 下部基板搬送機構23是以導臂31及拾取器32朝製 程腔室1 1側最大限度滑動時（圖6 ( A )及圖6 ( B )所示 的狀態）拾取器3 2可到達基板載置台1 8的上方之方式設 定導臂31及拾取器32的長度、以及可滑動範圍。 並且，在下部基板搬送機構23，朝製程腔室1 1側最 大限度滑動的導臂31及拾取器32是藉由驅動源所給予的 驅動力來朝向大氣系搬送裝置14滑動’與昇降底座30重 疊（圖3所示的狀態）。 以下，將導臂3 1及拾取器32朝製程腔室1 1側最大 限度滑動時（圖6(A)及圖6(B)所示的狀態）稱爲「 伸長狀態」，將導臂3 1及拾取器3 2朝大氣系搬送裝置i 4 側最大限度滑動時（圖3所示的狀態）稱爲「縮短狀態」 。另外，下部基板搬送機構23是僅位於基板交接位置時 ，可從縮短狀態往伸長狀態遷移、及從伸長狀態往縮短狀 態遷移，位於下部退避位置時維持縮短狀態· 上部基板搬送機構22是在昇降底座26中對應於複數 個緩衝銷24的位置設有貫通孔（未圖示），各緩衝銷24 是與各貫通孔滑嵌。又，下部基板搬送機構23是在昇降 底座30中對應於複數個緩衝銷24的位置設有貫通孔（未 -23- 201237987 圖示），各緩衝銷24是與各貫通孔滑嵌。因此，無論是 上部基板搬送機構22的位置或下部基板搬送機構23的位 置，複數的緩衝銷24是可上下作動自如。並且，複數個 緩衝銷24是藉由來自驅動源（未圖示）的驅動力，同步 上下作動，因此複數個緩衝銷24 —起作用來一邊支撐玻 璃基板G —邊上下作動時，所被支撐的玻璃基板G是不 會有傾斜的情形。其結果，可防止玻璃基板G的位移發生 〇 又，由於上部基板搬送機構22及下部基板搬送機構 23是如後述般不需要旋轉，因此不會有旋轉所產生的慣性 力作用於各構成構件的情形，不需要爲了防止彎曲而確保 各構成構件的安裝剛性像以往的基板搬送單元200的上部 基板搬送機*構2 03及下部基板搬送機構204的各構成構件 的安裝剛性那樣。因此，在上部基板搬送機構22及下部 基板搬送機構23，各導臂27不需要互相連結，各導臂31 也不需要互相連結。而且，各拾取器28不需要互相連結 ，各拾取器32也不需要互相連結。因此，不需要像以往 的基板搬送單元200的拾取器底座207那樣的連結構件。 若根據本實施形態的基板處理系統1 〇，則因爲裝載鎖 定模組13的上部基板搬送機構22具有：對昇降底座26 的導軌2 5相對性地滑動的4個導臂2 7、及對導臂2 7相對 性地滑動的4個拾取器2 8，所以可藉由在縮短狀態下重疊 昇降底座26、導臂27及拾取器28來縮小上部基板搬送機 構22。又，由於裝載鎖定模組13的下部基板搬送機構23 -24- 201237987 是具有：對昇降底座3 0的導軌2 9相對性地滑動的4個導 臂3 1、及對導臂3 1相對性地滑動的4個拾取器3 2，因此 可藉由在縮短狀態下重疊昇降底座30、導臂31及拾取器 32來縮小下部基板搬送機構23。其結果，可縮小裝載鎖 定模組1 3的內部容積，進而裝載鎖定模組1 3的內部狀態 的大氣/真空的切換不需要花時間。藉此，可使玻璃基板G 的處理效率提升。 就上述的基板處理系統10而言，在上部基板搬送機 構22中各導臂27是未被互相連結，且各拾取器28也未 被互相連結。並且，在下部基板搬送機構2 3中各導臂3 1 是未被互相連結，且各拾取器32也未被互相連結。藉此 ，不需要導臂27、拾取器28、導臂31及拾取器32的連 結構件，可更縮小上部基板搬送機構22及下部基板搬送 機構23。 另外，在上述的實施形態中是說明有關基板處理系統 的基板搬送單元爲各具備4個的導軌、導臂及拾取器時， 但導軌、導臂及拾取器的數量只要可支撐及搬送玻璃基板 <3的數量即可，並無特別加以限制。 其次，說明有關本實施形態的基板搬送方法。 圖7及圖8是用以說明作爲本實施形態的基板搬送方 法的搬送順序的工程圖。本搬送順序是以基板處理系統i 〇 的裝載鎖定模組1 3爲主來實行。另外，圖7 ( A )、圖7 (C)、圖 7(E)、圖 7(G)、圖 8(A)、圖 8(C)、 圖8 ( E )及圖8 ( G )是有關圖1的線A-A的剖面圖，圖 -25- 201237987 7(B)、圖 7(D)、圖 7(F)、圖 7(H)、圖 8(B) 、圖8(D)、圖8(F)及圖8(H)是有關圖1的線A-A 的剖面圖。 首先，上部基板搬送機構22會位於基板交接位置， 下部基板搬送機構23會位於下部退避位置。並且，複數 的緩衝銷24會通過昇降底座30的各貫通孔而上昇，在預. 定的位置待機。然後，閘閥1 7 (未圖示）會開啓，載置未 處理的玻璃基板G的拾取器20會進入至內部S，將玻璃 基板G搬送至上部基板搬送機構22的正上方（圖7(A) 、圖 7 ( B ))。 其次，拾取器20會下降，使玻璃基板G的下面接觸 於各緩衝銷24，然後，拾取器20更下降。藉此，玻璃基 板G從拾取器20離開，各緩衝銷24支撐玻璃基板G。（ 圖 7(C)、圖 7(D))。 其次，拾取器20從內部S退出，閘閥17關閉，排氣 裝置、壓力控制閥會將裝載鎖定模組1 3的內部狀態切換 成真空。而且、2個的定位器（positioner) 33會抵接於 未處理的玻璃基板G的緣部、藉此調整未處理的玻璃基板 G的位置（圖7(E)、圖7(F))。 另外，有關導臂27，31或拾取器28，32的滑動方向 (玻璃基板G的搬送方向）之玻璃基板G的位置補正， 是例如在玻璃基板G被保持於搬送臂機構19的拾取器20 之狀態中以另外設置的偏差量感測器（未圖示）來檢測出 玻璃基板G的伸縮方向的偏差，根據該被檢測出的偏差， -26- 201237987 以支撐拾取器20的Scalar臂來進行位置補正，藉此亦可 不使定位器33接觸於玻璃基板G來進行位置補正。 其次，上部基板搬送機構22上昇，拾取器28抵接於 玻璃基板G的下面後，上部基板搬送機構22還上昇至上 部退避位置（第1上昇步驟）。藉此，上部基板搬送機構 22接收未處理的玻璃基板G。然後，複數的緩衝銷24下 降，下部基板搬送機構23上昇至基板交接位置（第1上 昇步驟），閘閥12開啓。 其次，下部基板搬送機構23使導臂31及拾取器32 朝製程腔室1 1側最大限度滑動，從製程腔室1 1的基板載 置台18藉由複數的推銷（未圖示）來將被舉起之處理完 成的玻璃基板G往拾取器32接收（圖7(G)、圖7(H ))，且使導臂3 1及拾取器32朝大氣系搬送裝置14側 最大限度滑動，將處理完成的玻璃基板G從製程腔室11 搬出，搬送至下部基板搬送機構23的正上方（搬出步驟 )° 其次，載置處理完成的玻璃基板G的下部基板搬送機 構23會下降至下部退避位置，上部基板搬送機構22會下 降至基板交接位置（下降步驟）。然後，上部基板搬送機 構22使導臂27及拾取器28朝製程腔室1 1側最大限度滑 動，往從製程腔室11的基板載置台18突出的複數個推銷 (未圖示）交接未處理的玻璃基板G (圖8(A)、圖8( B))(搬入步驟）。 其次，上部基板搬送機構22使導臂27及拾取器28 -27- 201237987 遷數 態複 狀， 短後 縮然 往。 而 ; , 驟 動步 滑昇 度上 限 2 大第 最 C 側置 4 位 1避 置退 裝部 送上 搬至 系昇 氣上 大’ 朝移 的緩衝銷24上昇，使被載置於下部基板搬送機構23的拾 取器32之處理完成的玻璃基板G從拾取器32離開後也繼 續上昇，使處理完成的玻璃基板G上昇至預定的位置（第 3上昇步驟）。而且，2個的定位器33會抵接於處理完成 的玻璃基板G的緣部，藉此調整處理完成的玻璃基板G 的位置（圖8(C)、圖8(D))。 另外，有關玻璃基板G的搬送方向的位置補正，是與 前述從大氣系搬送裝置14往裝載鎖定模組13搬入玻璃基 板G時（圖7 ( A )〜圖7 ( F ))同樣，例如以支撐拾取 器2 0的Scalar臂來進行位置補正，藉此亦可不使定位器 3 3接觸於玻璃基板G來進行位置補正。 其次，閘閥1 2會關閉，排氣裝置、壓力控制閥會將 裝載鎖定模組1 3的內部狀態往大氣切換。然後，閘閥1 7 會開啓，拾取器20會進入至內部S，而位於處理完成的 玻璃基板G的正下方（圖8(E)、圖8(F))。 其次，拾取器20會上昇，抵接於處理完成的玻璃基 板G的下面之後還上昇至預定的位置，而使處理完成的玻 璃基板G從複數的緩衝銷24離開。藉此，拾取器20接收 處理完成的玻璃基板G (圖8(G)、圖8(H))(第2 接收步驟）。 其次，載置處理完成的玻璃基板G的拾取器20會從 內部S退出，完成本搬送順序。 -28- 201237987 若根據作爲本實施形態的基板搬送方法的搬送順序， 則由於裝載鎖定模組13是只被連接至1個的製程腔室11 ，因此裝載鎖定模組1 3是只要進行對1個的製程腔室1 1 之玻璃基板G的搬出入即可。並且，藉由上部基扳搬送機 構22上昇，不會有妨礙下部基板搬送機構23之玻璃基板 G的搬出入或交接的情形，藉由下部基板搬送機構23下 降，不會有妨礙上部基板搬送機構22之玻璃基板G的搬 出入或交接的情形。因此，上部基板搬送機構22及下部 基板搬送機構23不需要旋轉。 若上部基板搬送機構22及下部基板搬送機構23不旋 轉，則不會有旋轉所產生的慣性力作用於上部基板搬送機 構22及下部基板搬送機構23的各構成構件的情形，不需 要爲了防止慣性力所造成的彎曲而確保各構成構件的靜的 剛性像以往的基板搬送單元200的上部基板搬送機構203 及下部基板搬送機構204的各構成構件的靜的剛性那樣高 。其結果，可將昇降底座26，30、導臂27，31或拾取器 2 8，3 2薄薄地構成，例如厚度1 0 0mm以下，可更縮小上 部基板搬送機構22及下部基板搬送機構23。 又，因爲可薄薄地構成導臂2 7，3 1，所以在伸長狀態 中導臂27，3 1可通過製程腔室1 1的側面的開口部。其結 果，即使不那麼長地構成拾取器2 8，3 2，還是可將玻璃基 板G的可搬送距離確保在所望値以上。亦即，可縮短構成 拾取器28，32，因此不需要爲了防止拾取器28，32的振 動而提高拾取器28，32的安裝剛性。其結果，不需要提 -29- 201237987 高安裝有拾取器28，32的導臂27，31或安裝有該導臂27 ，31的昇降底座26，30的靜的剛性，藉此，，可更薄地構 成導臂27，31或昇降底座26，30。其結果，可更縮小上 部基板搬送機構22及下部基板搬送機構23。 以上，可縮小裝載鎖定模組1 3的內部容積，進而裝 載鎖定模組13的內部狀態的大氣/真空的切換不需要花時 間。藉此，可使玻璃基板G的處理效率提升。 在上述的基板處理系統10中，各導臂27、各拾取器 28、各導臂31、及各拾取器32是分別未被互相連結，但 亦可藉由連結構件來互相連結。例如，亦可如圖9(A) 及圖9(B)所示，各導臂27藉由作爲連結構件的臂底座 34來互相連結，各導臂31藉由臂底座35來連結。 在上述的基板處理系統10中，拾取器28或拾取器32 是將薄板體折彎成剖面U字狀來形成，但亦可如圖1 〇所 示，僅是藉由細長薄板體所形成。此情況，在導臂27，3 1 的上面設置縫隙，在拾取器28，32的下面設置銷等的導 件，使銷滑嵌於縫隙爲理想。 並且，在上述的基板處理系統10中，上部基板搬送 機構22搬送未處理的玻璃基板G，下部基板搬送機構23 搬送處理完成的玻璃基板G，但亦可爲上部基板搬送機構 22搬送處理完成的玻璃基板G，下部基板搬送機構23搬 送未處理的玻璃基板G。 又，上述基板處理系統10是在緩衝銷24及拾取器20 之間進行玻璃基板G的交接時，拾取器20昇降來進行交 •30- 201237987 接，但亦可緩衝銷24昇降來進行交接。 以上，有關本發明是利用上述實施形態來說明，但本 發明並非限於上述實施形態。 【圖式簡單說明】 圖1是槪略顯示本發明的實施形態的基板處理系統的 構成平面圖。 圖2是槪略顯示在以往的基板處理系統所使用的基板 搬送單元的構成立體圖。 圖3是有關圖1的線A-A的剖面圖。 圖4是槪略顯示圖3的上部基板搬送機構的構成圖， 圖4(A)是用以說明上部基板搬送機構的構成及動作的 剖面圖，圖4 ( B )是有關圖4 ( A )的線B-B的剖面圖。 圖5是用以說明導軌、導臂及拾取器的位置關係的擴 大剖面圖。 圖6是槪略顯示圖3的下部基板搬送機構的構成圖’ 圖6(A)是用以說明下部基板搬送機構的構成及動作的 剖面圖，圖6 ( B )是有關圖6 ( A )的線C-C的剖面圖。 圖7是用以說明作爲本實施形態的基板搬送方法的搬 送順序的工程圖。 圖8是用以說明作爲本實施形態的基板搬送方法的搬 送順序的工程圖。 圖9是表示上部基板搬送機構及下部基板搬送機構的 變形例的圖，圖9 ( A)是水平剖面圖’圖9 ( B )是縱剖 -31 - 201237987 面圖。 圖ι〇是表示上部基板搬送機構及下部基板搬送機構 的拾取器的變形例的擴大剖面圖。 圖11是槪略顯示對第7代以後的平板顯示器實施電 漿蝕刻處理的基板處理系統的構成立體圖。 圖12是槪略顯示對第11代的平板顯示器實施電漿蝕 刻處理的基板處理系統的構成立體圖。 【主要元件符號說明】 G :玻璃基板 1 〇 :基板處理系統 1 1 :製程腔室 1 3 :裝載鎖定模組 22:上部基板搬送機構 23:下部基板搬送機構 24 :緩衝銷 25，29 :導軌 26，30 :昇降底座 27，31 :導臂 2 8，3 2 :拾取器 -32-201237987 6. TECHNOLOGICAL FIELD OF THE INVENTION The present invention relates to a substrate processing system for processing a substrate for a display panel, and a substrate transfer method for the substrate processing system. [Prior Art] In a glass substrate used for a flat panel display or the like, a plasma etching treatment is applied to form fine wiring or the like on the glass substrate. Generally, the plasma etching treatment of the glass substrate is performed by a substrate processing system. The substrate processing system for performing plasma etching on the glass substrate used in the sixth-generation flat panel display is a load lock module including a processing chamber (processing chamber) and a glass substrate for carrying in and out of the processing chamber. In the substrate processing system, a substrate replacement method using a second lift pin is used. The second lift pin is different from the first lift pin that raises or lowers the glass substrate on the substrate stage in the process chamber. Since the lift pin holds the end of the glass substrate at a plurality of places and raises or lowers the glass substrate, the structure of the transfer arm in the load lock module for carrying in and out of the glass substrate can be simplified, and specifically, it can be a single The arm type. The space-saving and simple structure without the up-and-down rotary shaft type can further balance the manufacturing cost of the device and the productivity of the flat panel display. However, in the substrate processing system that performs the plasma etching process on the flat panel display after the seventh generation, the size of the glass substrate is increased, and the second lift pin is replaced when the substrate of the second lift pin whose substrate support position is restricted is replaced. It is impossible to maintain the proper position of the glass substrate, and the bending of the glass substrate may be over--5-201237987 and the substrate may be broken, so that it may not be transported. Therefore, in response to this, the second lift pin is abolished, and the double-arm type transfer arm is used as the transfer arm in the load lock module, and the transfer arm performs substrate replacement, thereby preventing the glass substrate from being bent. Fig. 11 is a perspective view showing a configuration of a substrate processing system for performing plasma etching treatment on a flat panel display of the seventh generation or later. In Fig. 11, the substrate processing system 110 is provided with a load lock module 115 for transporting an unprocessed glass substrate accommodated in the cassette 113 to the transfer module 112 via the atmospheric transfer arm 114. The load lock module 1 15 transfers the processed glass substrate from the transport module 1 1 2 to the cassette 116 via the atmosphere transport arm 114. The internal state of the process chamber 111 or the transfer module 112 is almost maintained at a vacuum, so that the load lock module π 5 is configured to switch the internal state to atmospheric/vacuum (for example, refer to Patent Document 1). Further, a Scalar type or a direct-acting type transfer arm (not shown) as a substrate transfer unit is disposed inside the transfer module 112 of the substrate processing system 110, and the transfer arm is held inside the transfer module 112. Rotation under the glass substrate" Therefore, it is necessary to enlarge the internal volume of the transfer module 112. In recent years, the glass substrate used in the 10th generation flat panel display that has been manufactured has a rectangular shape with a side of about 3 m. Therefore, it is necessary to make the internal volume of the transport module 1 1 2 larger. As a result, the transfer module 1 1 2 will be huge. Further, in the substrate processing system 110, a vacuum-breakable gate valve 1 1 7 is disposed between the transfer module 112 and the load lock module 1 15 , and the gate valve 1 1 7 is also enlarged with the transfer module 1 1 2 . The problem is that the manufacturing cost of the -6-201237987 transmission module 1 1 2 or the gate valve 1 1 7 is increased. As for the glass substrate (a rectangle having a side of more than 3 tn) used for the 11th generation flat panel display to be manufactured in the future, the increase in the manufacturing cost of the transfer module 112 and the like is more remarkable. Therefore, in order to reduce the manufacturing cost of the transfer module 1 1 2 and the like, as shown in FIG. 12, one process chamber 121 and one load lock module 1 22 connected to the process chamber 121 are provided. The substrate processing system 120 having a configuration similar to the substrate processing system for processing the glass substrate used in the sixth generation flat panel display is reviewed. However, since the substrate processing system 120 is provided with only one processing chamber 121, the load lock module 122 cannot perform plasma etching treatment on other glass substrates while the glass substrate is being carried in and out. Therefore, in order to improve the manufacturing efficiency of the flat panel display, it is necessary to carry out the loading and unloading of the glass substrate on which the lock module I22 is loaded for a short time. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] JP-A-2007-208235 SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) However, the substrate transfer unit included in the load lock module 122 is generally used. In the Scalar type or the direct-acting type of double-arm type transfer arm, since it is necessary to secure the movable area of the transfer arm inside the load lock module 122, it is necessary to enlarge the internal volume of the load lock module 122. On the other hand, since 201237987 is a load lock module 1 22, it is necessary to configure the internal state to be switched to the atmosphere/vacuum. Therefore, when the internal volume of the load lock module 122 is large, the atmosphere of the internal state of the glass substrate when it is carried in and out is/ The switching of the vacuum takes time, and as a result, there is a problem that the manufacturing efficiency of the flat panel display cannot be improved. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing system and a substrate transfer method which can improve the processing efficiency of a substrate. In order to achieve the above object, the substrate processing system according to the first aspect of the invention includes one substrate processing apparatus that performs processing on a substrate in a vacuum state, and a first substrate transfer apparatus. Connected to the substrate processing apparatus, the internal state is switched to the atmosphere/vacuum; and the second substrate transfer apparatus is connected to the first substrate transfer apparatus, and is disposed to be interposed between the substrate via the first substrate transfer apparatus In the second substrate transfer device, the second substrate transfer device performs the loading and unloading of the substrate on the first substrate transfer device, and the first substrate transfer device performs the loading and unloading of the substrate on the substrate processing device. In the first substrate transfer device, the upper substrate transfer mechanism and the lower substrate transfer device are disposed so as to be vertically overlapped and vertically moved inside the first substrate transfer device, -8-201237987 The substrate transfer mechanism has: a first base portion that is disposed parallel to each other and extends toward the substrate processing apparatus a plurality of first guides extending; a plurality of elongated first intermediate slide members are provided corresponding to the first guides, and relatively slid toward the first guide toward the substrate processing apparatus: And a plurality of elongated first upper sliding members that are provided corresponding to the first intermediate sliding members, and that relatively slide the first intermediate sliding member toward the substrate processing apparatus, wherein the lower substrate conveying mechanism is The second base portion is provided with a plurality of second guide members that are parallel to each other and extend toward the substrate processing apparatus, and a plurality of elongated second intermediate sliding members that are provided corresponding to the respective second guide members. And sliding the second guide relative to the substrate processing device; and a plurality of elongated second upper sliding members are provided corresponding to the second intermediate sliding members, and facing the substrate processing apparatus The second intermediate sliding member is relatively slid, and the plurality of first upper sliding members and the plurality of second upper sliding members are placed on the substrate. The substrate processing system according to claim 2, wherein the substrate processing system according to claim 1 includes a plurality of pin-shaped members that protrude upward from the lower side inside the first substrate transfer device. The substrate processing system according to claim 3, wherein the substrate is rectangular in shape and has a length of one side of 1.8 m or more. The substrate processing system according to any one of claims 1 to 3, wherein each of the first intermediate/moving members and each of the first The upper sliding member slides in synchronization, and each of the second intermediate sliding members slides in synchronization with each of the second upper sliding members in the lower substrate conveying mechanism. The substrate processing system according to any one of the preceding claims, wherein the first intermediate sliding member is not connected to each other in the substrate processing system according to any one of the preceding claims Each of the second intermediate sliding members in the lower substrate conveying mechanism is not connected to each other. The substrate processing system according to any one of the preceding claims, wherein the first upper sliding member is not connected to each other in the substrate processing system according to any one of the preceding claims. Each of the second upper sliding members in the lower substrate conveying mechanism is not connected to each other. In order to achieve the above object, the substrate transfer method according to claim 7 is a substrate transfer method of the substrate processing system, wherein the substrate processing system includes one substrate processing device that performs processing on the substrate in a vacuum state; the first substrate The transfer device is connected to the substrate processing device, and -10-201237987 switches the internal state to the atmosphere/vacuum: and the second substrate transfer device, which is connected to the first substrate transfer device, and is disposed so as to be interposed therebetween. The first substrate transfer device is opposed to the substrate processing device, and the second substrate transfer device performs the loading and unloading of the substrate on the first substrate transfer device in an air state, and the first substrate transfer device performs the aforementioned In the first substrate transfer device, the first substrate transfer device is provided with an upper substrate transfer mechanism and a lower substrate transfer device that are vertically overlapped and vertically operated, and are disposed in the first substrate transfer device, and a plurality of pin shapes protruding from the lower side toward the upper side of the first substrate transfer device The upper substrate transfer mechanism has a plurality of first guides that are parallel to each other and extend toward the substrate processing apparatus, and a plurality of elongated first intermediate slide members corresponding to each The first guide member is provided to relatively slide the first guide member toward the substrate processing device, and a plurality of elongated first upper sliding members are provided corresponding to the respective first intermediate sliding members. The first intermediate sliding member is relatively slid toward the substrate processing apparatus, and the lower substrate conveying mechanism has a second base portion that is provided with a plurality of second guides that are parallel to each other and extend toward the substrate processing apparatus a plurality of elongated second intermediate sliding members, which are provided corresponding to the second guides of the above-mentioned -11 - 201237987, and relatively slid to the second guide toward the substrate processing apparatus; and plural Each of the elongated second upper sliding members is provided corresponding to each of the second intermediate sliding members, and is oriented toward the second intermediate sliding toward the substrate processing apparatus The member is relatively slid, and the plurality of first upper sliding members and the plurality of second upper sliding members are respectively placed on the substrate, and the first receiving step is configured to receive the The unprocessed substrate carried in the second substrate transfer device; the first rising step of raising the upper substrate transfer mechanism and the lower substrate transfer mechanism; and the carrying out step of the lower substrate transfer mechanism causing the second intermediate The sliding member and the second upper sliding member slide to remove the processed substrate from the substrate processing apparatus; the lowering step lowers the upper substrate transfer mechanism and the lower substrate transfer mechanism; and the loading step is the upper substrate The transport mechanism slides the first intermediate sliding member and the first upper sliding member to carry the unprocessed substrate into the substrate processing apparatus, and the second rising step is that only the upper substrate transport mechanism rises. a rising step, wherein the plurality of pin-shaped members protrude The substrate subjected to the above-described processing is lifted away from the lower substrate transfer mechanism; -12-201237987 and the second receiving step', wherein the second substrate transfer device receives the substrate which has been processed as described above. According to the present invention, the upper substrate transfer mechanism of the first substrate transfer device has a plurality of elongated first intermediate slide members that relatively slide the first guide member, and the first Since the intermediate sliding member relatively slides the plurality of elongated first sliding members, the first guide, the first intermediate sliding member, and the first upper sliding member can be overlapped except when the substrate processing apparatus is carried into and out of the substrate. The member is used to reduce the upper substrate transfer mechanism. In addition, the lower substrate transfer mechanism of the first substrate transfer device includes a plurality of elongated second intermediate slide members that relatively slide the second guide member, and a plurality of elongated slides that relatively slide the second intermediate slide member In addition to the second upper sliding member, the lower substrate transfer mechanism can be reduced by superposing the second guide, the second intermediate sliding member, and the second upper sliding member in addition to the substrate processing apparatus. In addition, since the first substrate transfer device is connected to only one substrate processing device, the first substrate transfer device may be carried out by moving the substrate of one substrate processing device. In addition, when the upper substrate transfer mechanism is raised, there is no case where the substrate of the lower substrate transfer mechanism is prevented from being carried in or out, and the lower substrate transfer mechanism is lowered, so that the substrate of the upper substrate transfer mechanism is prevented from being carried in or out. The situation of handover. Therefore, the upper substrate transfer mechanism and the lower base -13-201237987 plate transport mechanism do not need to be rotated, and the configuration of the upper substrate transfer mechanism and the lower substrate transfer mechanism can be simplified, and the upper substrate transfer mechanism and the lower substrate transfer mechanism can be further reduced. As a result, the internal volume of the first substrate transfer device can be reduced, and the switching of the atmosphere/vacuum in the internal state of the first substrate transfer device does not require time. Thereby, the processing efficiency of the substrate can be improved. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view showing the structure of a substrate processing system according to an embodiment of the present invention. This substrate processing system performs a plasma etching treatment on a rectangular glass substrate having a length of 1.8 m or more on one side, in particular, a glass substrate of a flat panel display used in the first and subsequent generations. Further, in Fig. 1, in order to facilitate understanding of the configuration of the substrate processing system, the load lock module 13 or the process chamber 11 to be described later is displayed by a horizontal sectional view. In FIG. 1, the substrate processing system 1A includes a frame-shaped process chamber 11 (substrate processing device) and a frame-shaped load lock module 13 (first substrate transfer device) via a gate valve 1 2 . Connected to the processing chamber 1 1; an atmospheric conveying device 14 (second substrate conveying device) connected to the load lock module 13 and disposed to be coupled to the process chamber via the load lock module 13 The chamber 11 is opposed to each other; and the cassette 15 (substrate supply device) and the cassette 16 (substrate storage device-14-201237987) are connected to the atmospheric system transfer device 14, and the atmospheric system transfer device 14 is disposed in the drawing. The middle self-loading locking module 13 moves clockwise and counterclockwise to a position of about 90°. Further, a gate valve 17 is provided on a side surface of the load lock module 13 facing the atmosphere transport device 14. The process chamber 11 accommodates the glass substrate G inside the vacuum chamber, and plasma-etches the glass substrate G by the plasma generated in the inside. Further, the process chamber 11 has a substrate stage 18 on which the glass substrate G is placed. The load lock module 13 has an upper substrate transfer mechanism 22 and a lower substrate transfer mechanism 23 which will be described later, and can be configured to switch the internal state to atmospheric/vacuum by an exhaust device and a pressure control valve (not shown). . The cassette 15 is constituted by a housing that stores a plurality of unprocessed glass substrates G. In the cassette 15, a plurality of unprocessed glass substrates G are stacked in parallel with each other at a predetermined interval. Further, the cassette 16 is constituted by a housing that stores a plurality of processed glass substrates G. In the cassette 16, a plurality of processed glass substrates G are stacked in parallel with each other and at a predetermined interval. The atmospheric conveying device 14 has a transfer arm mechanism 19. The transfer arm mechanism 19 is exposed to the atmosphere, and includes a comb-shaped pickup 20 on which the glass substrate G is placed, a Scalar arm (not shown) that supports the pickup 20 and that is expandable and contractible, and a rotation that supports the Scalar arm. Rotating the base 21 freely. The transfer arm mechanism 19 rotates the rotary base 21 by rotating the Scalar arm to carry out the unprocessed glass substrate G from the cassette 15, and delivers it to the upper substrate transfer mechanism 22 of the load lock module 13 of -15-201237987. The glass substrate G that has been processed is received from the lower substrate transport mechanism 2 3 of the load lock module 13 and stored in the cassette 16. The gate valve 12 is closed during the plasma etching process using the glass substrate G of the process chamber 11, partitioning the inside of the process chamber 11 and the inside of the load lock module 13, and is not processed by the upper substrate transfer mechanism 22. When the glass substrate G is loaded into the process chamber 11 or when the glass substrate G completed by the processing of the lower substrate transfer mechanism 23 is lifted out of the process chamber 1 1 , the inside of the process chamber 1 1 and the load lock module are opened. Internal connection of 1 3 . Further, the gate valve 17 is opened when the internal state of the load lock module 13 is atmospheric, and the pickup 20 of the transfer arm mechanism 19 can enter the inside, and an opening is formed in the side surface of the load lock module 13 . And when the internal state of the load lock module 13 is vacuum, it is closed, and the inside of the load lock module 13 is separated from the outside. As shown in FIG. 2, the substrate transfer unit 200 used in the conventional substrate processing system includes a substantially rectangular parallelepiped slide base 201 supported by a rotating shaft (not shown), and is attached to the slide base 201. The lower pickup base 202 that is slidable in the longitudinal direction of the slide base 201 (hereinafter referred to as "longitudinal direction") and the upper pickup base 203 that is attached to the slide base 201 and slidable in the longitudinal direction of the slide base 201. The four long rod-shaped pickers 204, 205 extend from the lower picker base 202 and the upper picker base 203 in the longitudinal direction, respectively, and are slid by the lower picker base 202 or the upper picker base 203 to make the pickers 2 04, 2 05 enters the inside of the process chamber and transports the glass substrate G. -16-201237987 The substrate transfer unit 200 is configured to have a thickness in the vertical direction in order to secure the mounting rigidity of the lower pickup base 202 or the upper pickup base 203 to the slide base 201 of each of the pickups 204 and 205. In the conventional substrate processing system, when the substrate transfer unit 200 is placed in the load lock module, even if the gate valve is formed in the side surface of the process chamber to open the inside of the process chamber and the inside of the load lock module, it is because The lower pickup base 022 or the upper pickup base 203 of the substrate transport unit 200 is thick, so that the lower pickup base 2〇2 or the upper pickup base 203 cannot pass through the opening and cannot be inside the processing chamber. enter. Therefore, it is necessary to form the length of each of the pickups 204, 205 as much as possible, thereby obtaining the transportable distance of the glass substrate G. As the length of each of the pickups 204, 205 is increased, the vibration of each of the pickups 204, 205 increases as the glass substrate G is conveyed, and the weight of each of the pickups 204, 205 becomes heavier. Therefore, in order to prevent the vibration of each of the pickups 204, 2, 5, and stably support the respective pickers 204, 205, it is necessary to further improve the mounting rigidity of each of the pickups 204, 205 to the slide base 201. In order to further improve the mounting rigidity of each of the pickers 204, 205, not only the static rigidity of the lower pickup base 202 or the upper pickup base 203, but also the static rigidity of the sliding base 201 is required, so the thickness of the sliding base 201 also needs to be increased. Big. Further, in the substrate transport unit 200, the substrate transport unit 200 is rotated by the rotation of the slide base 201. However, in order to prevent the slide base 201 from being bent due to the inertial force during the rotation, it is necessary to further improve the static movement of the slide base 2〇1. Rigidity, as a result, it is necessary to increase the thickness of the sliding base 201 more. -17-201237987 However, when the thickness of the slide base 201 is increased, the substrate transport unit 200 is increased in size. Further, as described above, since the substrate transport unit 200 is configured to grow the respective pickers 204 and 205 as much as possible, when the pickers 204 and 205 are housed, that is, when the pickers 204 and 205 are superposed on the slide base 201, The substrate transport unit 200 is not so small. Therefore, as a result, the substrate transfer unit 200 is enlarged. Thereby, it is necessary to increase the internal volume of the load lock module. Further, in order to rotate, the substrate transport unit 200 needs to secure a rotatable area inside the load lock module 13, and it is necessary to further increase the internal volume of the load lock module. Once the internal volume of the load lock module becomes large, the switching of the atmospheric/vacuum in the internal state takes time, and the manufacturing efficiency of the flat panel display cannot be improved. In the present embodiment, the substrate transfer unit is downsized and the rotation of the substrate transfer unit is not required. Specifically, the upper substrate transport mechanism and the lower substrate transport mechanism are miniaturized, and the upper substrate transport mechanism and the lower substrate transport mechanism transport the glass substrate G in only one direction to perform the loading lock module and the process chamber. The replacement of the glass substrate G constitutes a substrate transfer unit. Fig. 3 is a cross-sectional view showing a line 1A-A of Fig. 1 and a cross-sectional view showing a configuration of a load lock module of a first substrate transfer apparatus as a substrate processing system according to the present embodiment. In FIG. 3, the load lock module 13 is provided with an upper substrate transporter -18-201237987 structure 22 and a lower substrate transport mechanism 23 which are disposed inside the load lock module 13 so as to overlap the upper and lower sides of the figure, and include: The inside of the load lock module 13 (hereinafter referred to as "internal S") protrudes from the bottom toward the upper side in the drawing, and a plurality of cushion pins 24 (pin-shaped members) that move up and down freely, and the internal state of the load lock module 13 Switch to atmospheric/vacuum exhaust and pressure control valve (not shown). The upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23 are independently operated up and down. Specifically, the upper substrate transfer mechanism 22 is raised and lowered at a position where the unprocessed glass substrate G is received from the pickup 20 of the transfer arm mechanism 19 or a position where the unprocessed glass substrate G is carried into the process chamber. When the substrate transfer position and the lower substrate transfer mechanism 23 are transferred to the glass substrate G, in order to secure the work space of the lower substrate transfer mechanism 23, the upper substrate transfer mechanism 22 retracts from the upper retracted position. The upper retracted position in the inner portion S is located above the substrate transfer position. Further, the lower substrate transfer mechanism 23 is lifted and lowered at a position where the processed glass substrate G is carried out from the processing chamber 11, or the position of the glass substrate G to which the pickup 20 of the transfer arm mechanism 19 is transferred and processed, that is, the substrate transfer When the upper substrate transfer mechanism 22 performs the transfer of the glass substrate G, the space between the lower retreat spaces, which is the retreat of the lower substrate transport mechanism 23, is removed in order to secure the working space of the upper substrate transport mechanism 22. In the inner S, the lower retracted position is located below the substrate transfer position. Further, the substrate transfer position of the upper substrate transfer mechanism 22 is the same as the substrate transfer position of the lower substrate transfer mechanism 23. 4 is a schematic view showing a configuration of an upper substrate transfer mechanism of FIG. 3, -19-201237987. FIG. 4(A) is a cross-sectional view for explaining the configuration and operation of the upper substrate transfer mechanism, and FIG. 4(B) is a related view. Sectional view of line BB of 4 (A). In FIGS. 4(A) and 4(B), the upper substrate transfer mechanism 22 has a plate-shaped lifting base 26 (first base portion) which is disposed parallel to each other and to the process chamber 11 (toward the drawing) 4 rails 25 (first guide) extending in the right direction; guide arm 27 (first intermediate sliding member), which is provided corresponding to each rail 25, and has an elongated square column shape; and a pickup 28 (first An upper sliding member is provided in correspondence with each of the guide arms 27, and is formed of an elongated thin plate body. In the upper substrate transfer mechanism 22, four pickers 28 are used together to mount one unprocessed glass substrate G. As shown in FIG. 5, the upper substrate transfer mechanism 22 overlaps the guide rail 25, the guide arm 27, and the pickup 28 in this order from the lower side of the lift base 26. The guide arm 27 has a guide groove 27a provided on the lower surface over the entire length, and is guided to the guide rail 25 via the guide groove 27a. Further, the pickup 28 bends the thin plate body into a U-shaped cross section, and accommodates the guide arm 27 in the internal space formed in a U shape, thereby being slidably fitted to the guide arm 27. The upper substrate transfer mechanism 22 has a drive source (not shown), and the guide arm 27 relatively slides toward the guide rail 25 toward the process chamber 1 by the driving force given by the drive source, and the pickup 28 will The guide arm 27 is relatively slid toward the process chamber 1 1 . At this time, the four guide arms 27 are slid while maintaining the relative positional relationship between the four guide arms 27, and the four pickers 28 are also oscillating while maintaining their relative positional relationship. Further, since each arm 27 slides in synchronization with each of the pickups 28, it is possible to prevent the other of the slides and the pickup 28 from being stopped and the upper base transfer mechanism 22 to be flushed. Thereby, displacement of the unprocessed glass substrate G placed on the extractor 28 can be prevented, and the unprocessed glass substrate G can be accurately placed at a predetermined position on the substrate stage 18 of the process chamber 11. • The upper substrate transfer mechanism 22 is placed on the pickup 28 when the guide arm 27 and the pickup 28 slide to the maximum extent toward the process chamber 1 1 (the state shown in FIGS. 4(A) and 4(B)). The length of the arm 27 and the pickup and the slidable range are set so that the untreated glass substrate G can reach the upper side of the substrate stage 18. In the upper substrate transfer mechanism 22, the guide arm 27 and the pickup 28 that largely slide toward the processing chamber 11 are slid toward the atmospheric transport device 14 by the driving force given by the drive source, and are stacked on the lift base 26 ( The state shown in Figure 3). Hereinafter, when the guide arm 27 and the pickup 28 are most slid toward the processing chamber 1 side (the state shown in FIGS. 4(A) and 4(B)), the arm 2 is referred to as an extended state. 7 and the pickup device 28 are slid to the maximum extent on the atmospheric transport device side (the state shown in Fig. 3), which is referred to as "shortened state. In addition, the upper substrate transfer mechanism 22 is located only at the substrate transfer position" and can be extended from the shortened state. The state transition and the transition from the extended state to the shortened state are maintained in the shortened state at the upper retracted position. Fig. 6 is a schematic view showing the structure of the lower substrate transport mechanism of Fig. 3. The pre-fabrication of the board is shown to be 28 Factory 14 J Time 21 - 201237987 Fig. 6 (A) is a cross-sectional view for explaining the configuration and operation of the lower substrate transfer mechanism. Fig. 6 (B) is a cross-sectional view taken along line C - C of Fig. 6 (A) In FIGS. 6(A) and 6(B), the lower substrate transfer mechanism 23 has a plate-shaped lifting base 30 (second base) which is disposed parallel to each other and to the process chamber 11 (toward) 4 guide rails 29 (second guide) extending in the middle right side; guide arm 31 (second intermediate sliding member) The guide rails 29 are provided in an elongated square column shape, and the pickup 32 (second upper sliding member) is provided corresponding to each of the guide arms 31, and is formed of an elongated thin plate body. The substrate feeding mechanism 23 has four pickups 32 that act together to mount one processed glass substrate G. As shown in Fig. 5, the lower substrate conveying mechanism 23 sequentially overlaps the guide rails 29 from the lower side of the lifting base 30. The guide arm 31 and the pickup 32. The guide arm 31 has a guide groove 31a provided on the lower surface over the entire length, and is guided to the guide rail 29 via the guide groove 31a. Further, the pickup 32 bends the thin plate body into a section U. In the shape of a word, the guide arm 31 is accommodated in the internal space formed in a U shape, and the guide arm 31 is slidably fitted. The lower substrate transfer mechanism 23 has a drive source (not shown) and is given by the drive source. The driving force, the guide arm 31 will slide relative to the guide rail 29 toward the process chamber 11, and the pickup 32 will relatively slide the guide arm 31 toward the process chamber 11. At this time, four The guide arm 31 is a slider that is slid on one side while maintaining a relative positional relationship with each other. -22- 201237987 is to slide while sliding to maintain the relative positional relationship with each other. In addition, since each of the guide arms 31 and the respective pickups 32 slide synchronously, it is possible to prevent the sliding of either one of the guide arm 31 and the pickup 32. When one is stopped, the lower substrate transfer mechanism 23 is flushed. This prevents displacement of the glass substrate G that has been processed by the pickup 32. The lower substrate transfer mechanism 23 is the guide arm 31 and the pickup 32. When the maximum length of the process chamber 1 1 is slid (the state shown in FIGS. 6(A) and 6(B)), the pickup 32 can reach the upper side of the substrate stage 18, and the guide arm 31 and the pickup are set. The length of 32, as well as the slidable range. Further, in the lower substrate transfer mechanism 23, the guide arm 31 and the pickup 32 that slide to the maximum extent toward the processing chamber 1 1 are slid toward the atmospheric conveying device 14 by the driving force given by the driving source, and the lifting base 30 Overlap (state shown in Figure 3). Hereinafter, when the arm 3 1 and the pickup 32 are maximally slid toward the processing chamber 1 1 side (the state shown in FIGS. 6A and 6B ), the arm 3 is referred to as an "extended state". 1 and the pickup 3 2 are slid to the maximum extent on the side of the atmosphere transporting device i 4 (the state shown in FIG. 3). Further, when the lower substrate transfer mechanism 23 is located only at the substrate transfer position, it can be moved from the shortened state to the extended state, and from the extended state to the shortened state, and is maintained at the lower retracted position. The upper substrate transfer mechanism 22 is raised and lowered. A through hole (not shown) is provided in the base 26 at a position corresponding to the plurality of cushion pins 24, and each of the cushion pins 24 is slide-fitted to each of the through holes. Further, the lower substrate transfer mechanism 23 is provided with a through hole at a position corresponding to the plurality of buffer pins 24 in the lift base 30 (not shown in -23-201237987), and each of the buffer pins 24 is slide-fitted to each of the through holes. Therefore, regardless of the position of the upper substrate transfer mechanism 22 or the position of the lower substrate transfer mechanism 23, the plurality of buffer pins 24 can be moved up and down. Further, since the plurality of cushion pins 24 are actuated in synchronization up and down by the driving force from a driving source (not shown), the plurality of cushion pins 24 act to support the glass substrate G while supporting the glass substrate G. The glass substrate G is not inclined. As a result, it is possible to prevent the displacement of the glass substrate G from occurring, and the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23 do not need to rotate as will be described later. Therefore, inertial forces generated by the rotation do not act on the respective constituent members. In other cases, it is not necessary to ensure the mounting rigidity of each constituent member in order to prevent the bending of the constituent members of the conventional substrate transfer unit 200 from the conventional substrate transfer unit 200 and the lower substrate transfer mechanism 204. Therefore, in the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23, the respective guide arms 27 need not be connected to each other, and the respective guide arms 31 do not need to be connected to each other. Further, each of the pickups 28 does not need to be coupled to each other, and each of the pickups 32 does not need to be coupled to each other. Therefore, a connecting member such as the pickup base 207 of the conventional substrate transfer unit 200 is not required. According to the substrate processing system 1 of the present embodiment, the upper substrate transfer mechanism 22 of the load lock module 13 has four guide arms 27 that slide relative to the guide rails 25 of the lift base 26, and a guide The four pickers 2 8 that are relatively slidably moved by the arm 2 7 can reduce the upper substrate transport mechanism 22 by overlapping the lift base 26, the guide arm 27, and the pickup 28 in a shortened state. Further, the lower substrate transport mechanism 23-24-201237987 of the load lock module 13 has four guide arms 3 1 that relatively slide the guide rails 29 of the lift base 30, and the relatives of the guide arms 31 Since the four pickups 3 2 are slid, the lower substrate transfer mechanism 23 can be reduced by overlapping the lift base 30, the guide arm 31, and the pickup 32 in the shortened state. As a result, the internal volume of the load lock module 13 can be reduced, and the atmospheric/vacuum switching of the internal state of the load lock module 13 does not require time. Thereby, the processing efficiency of the glass substrate G can be improved. In the substrate processing system 10 described above, the guide arms 27 are not connected to each other in the upper substrate transfer mechanism 22, and the pickups 28 are not connected to each other. Further, in the lower substrate conveying mechanism 2 3, the respective guide arms 3 1 are not connected to each other, and the pickups 32 are not connected to each other. Thereby, the connecting members of the arm 27, the pickup 28, the arm 31, and the pickup 32 are not required, and the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23 can be further reduced. Further, in the above-described embodiment, when the substrate transfer unit for the substrate processing system includes four guide rails, a guide arm, and a pickup, the number of the guide rail, the guide arm, and the pickup can support and transport the glass substrate. The number of <3 is not particularly limited. Next, a substrate transfer method according to the present embodiment will be described. Figs. 7 and 8 are views for explaining the transfer order of the substrate transfer method of the embodiment. This transfer sequence is mainly performed by the load lock module 13 of the substrate processing system i 。. In addition, Fig. 7 (A), Fig. 7 (C), Fig. 7 (E), Fig. 7 (G), Fig. 8 (A), Fig. 8 (C), Fig. 8 (E), and Fig. 8 (G) are A cross-sectional view of line AA of Fig. 1, Fig.-25-201237987 7(B), Fig. 7(D), Fig. 7(F), Fig. 7(H), Fig. 8(B), Fig. 8(D), 8(F) and 8(H) are cross-sectional views taken along line AA of Fig. 1. First, the upper substrate transfer mechanism 22 is positioned at the substrate transfer position, and the lower substrate transfer mechanism 23 is positioned at the lower retracted position. Further, the plurality of cushion pins 24 are raised by the respective through holes of the lift base 30, and are placed at a predetermined position. Then, the gate valve 17 (not shown) is opened, and the pickup 20 on which the unprocessed glass substrate G is placed enters the inside S, and the glass substrate G is conveyed directly above the upper substrate transfer mechanism 22 (FIG. 7 (A) ), Figure 7 (B)). Next, the pickup 20 is lowered so that the lower surface of the glass substrate G contacts the respective buffer pins 24, and then the pickup 20 is lowered. Thereby, the glass substrate G is separated from the pickup 20, and each of the buffer pins 24 supports the glass substrate G. (Fig. 7(C), Fig. 7(D)). Next, the pickup 20 is withdrawn from the internal S, the gate valve 17 is closed, and the exhaust device and the pressure control valve switch the internal state of the load lock module 13 to a vacuum. Further, two positioners 33 abut against the edge of the untreated glass substrate G, thereby adjusting the position of the untreated glass substrate G (Fig. 7(E), Fig. 7(F)). In addition, the position of the glass substrate G in the sliding direction of the guide arms 27 and 31 or the pickups 28 and 32 (the conveyance direction of the glass substrate G) is corrected, for example, the pickup 20 of the glass substrate G held by the transfer arm mechanism 19. In the state, the deviation amount of the glass substrate G is detected by a separately provided deviation amount sensor (not shown), and based on the detected deviation, -26-201237987 is performed by the Scalar arm supporting the pickup 20. The position correction can also be used to correct the position without contacting the positioner 33 with the glass substrate G. Then, the upper substrate transfer mechanism 22 is raised, and the pickup 28 is brought into contact with the lower surface of the glass substrate G, and the upper substrate transfer mechanism 22 is further raised to the upper retracted position (first rising step). Thereby, the upper substrate transfer mechanism 22 receives the unprocessed glass substrate G. Then, the plurality of buffer pins 24 are lowered, the lower substrate transfer mechanism 23 is raised to the substrate transfer position (first rising step), and the gate valve 12 is opened. Next, the lower substrate transfer mechanism 23 slides the guide arm 31 and the pickup 32 to the maximum extent toward the processing chamber 1 1 side, and the substrate mounting table 18 of the processing chamber 11 is driven by a plurality of push pins (not shown). The glass substrate G that has been lifted up and processed is received by the pickup 32 (Fig. 7(G), Fig. 7(H)), and the guide arm 31 and the pickup 32 are slid to the maximum extent toward the atmosphere transport device 14 side. The processed glass substrate G is carried out from the processing chamber 11 and transported to the upper side of the lower substrate transfer mechanism 23 (the carrying-out step). Next, the lower substrate transfer mechanism 23 of the glass substrate G on which the processing is completed is lowered to the lower retracted position. The upper substrate transfer mechanism 22 is lowered to the substrate transfer position (down step). Then, the upper substrate transfer mechanism 22 slides the guide arm 27 and the pickup 28 to the maximum side of the processing chamber 1 1 side, and delivers a plurality of push pins (not shown) protruding from the substrate mounting table 18 of the process chamber 11 to the unprocessed Glass substrate G (Fig. 8 (A), Fig. 8 (B)) (loading step). Next, the upper substrate transfer mechanism 22 retracts the arm 27 and the pickup 28-27-201237987, and then retracts. And;, the upper limit of the step-up lift 2 is the second most C-side 4-position 1 avoidance and unloading part is sent to the lift-up of the large lift-up buffer pin 24, so that it is placed on the lower substrate The glass substrate G which has been processed by the pickup 32 of the conveyance mechanism 23 continues to rise after being separated from the pickup 32, and the glass substrate G which has been processed is raised to a predetermined position (third rising step). Further, the two positioners 33 abut against the edge portion of the processed glass substrate G, thereby adjusting the position of the processed glass substrate G (Fig. 8(C), Fig. 8(D)). In addition, the position correction of the glass substrate G in the transport direction is the same as the case where the loading mechanism 13 is carried into the glass substrate G from the atmospheric transport device 14 (FIG. 7(A) to FIG. 7(F)), for example, The positional correction is performed by supporting the Scalar arm of the pickup 20, whereby the positioner 3 3 may be brought into contact with the glass substrate G to perform position correction. Next, the gate valve 12 is closed, and the exhaust and pressure control valves switch the internal state of the load lock module 13 to the atmosphere. Then, the gate valve 17 is opened, and the pickup 20 enters the inside S and is located directly below the glass substrate G which has been processed (Fig. 8(E), Fig. 8(F)). Next, the pickup 20 is raised to abut against the underside of the processed glass substrate G and then raised to a predetermined position, and the processed glass substrate G is separated from the plurality of buffer pins 24. Thereby, the pickup 20 receives the processed glass substrate G (Fig. 8 (G), Fig. 8 (H)) (second receiving step). Next, the pickup 20 of the glass substrate G on which the processing has been completed is ejected from the inside S to complete the transfer sequence. -28-201237987 According to the transfer order of the substrate transfer method of the present embodiment, since the load lock module 13 is connected to only one process chamber 11, the load lock module 13 is only required to be paired. It is sufficient that the glass substrate G of the process chamber 1 1 is carried in and out. Further, the upper base plate transport mechanism 22 is lifted, and the glass substrate G of the lower substrate transport mechanism 23 is prevented from being carried in or out, and the lower substrate transport mechanism 23 is lowered, so that the upper substrate transport mechanism is not hindered. The case where the glass substrate G of 22 is carried in or out. Therefore, the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23 do not need to be rotated. When the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23 are not rotated, the inertial force generated by the rotation does not act on the respective constituent members of the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23, and it is not necessary to prevent inertia. The bending caused by the force ensures that the static rigidity of each of the constituent members is as high as the static rigidity of each of the constituent members of the upper substrate transport mechanism 203 and the lower substrate transport mechanism 204 of the conventional substrate transport unit 200. As a result, the lift bases 26, 30, the guide arms 27, 31 or the pickups 28, 3 2 can be made thin, for example, the thickness of 100 mm or less, and the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23 can be further reduced. Further, since the arms 27, 3, 1 can be formed thinly, the arms 27, 31 can pass through the opening of the side surface of the process chamber 1 1 in the extended state. As a result, even if the pickups 2, 3 2 are not formed so long, the transportable distance of the glass substrate G can be secured. That is, the pickups 28, 32 can be shortened, so that it is not necessary to improve the mounting rigidity of the pickups 28, 32 in order to prevent the vibration of the pickups 28, 32. As a result, it is not necessary to mention the static rigidity of the guide arms 27, 31 of the pickups 28, 32 or the lifting bases 26, 30 to which the guide arms 27, 31 are mounted, and thereby, more The arms 27, 31 or the lifting bases 26, 30 are formed thinly. As a result, the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23 can be further reduced. As described above, the internal volume of the load lock module 13 can be reduced, and thus the atmospheric/vacuum switching of the internal state of the load lock module 13 does not require time. Thereby, the processing efficiency of the glass substrate G can be improved. In the above-described substrate processing system 10, each of the guide arms 27, the pickups 28, the respective guide arms 31, and the pickups 32 are not connected to each other, but they may be connected to each other by a connecting member. For example, as shown in Figs. 9(A) and 9(B), each of the guide arms 27 is coupled to each other by an arm base 34 as a connecting member, and each of the guide arms 31 is coupled by the arm base 35. In the above-described substrate processing system 10, the pickup 28 or the pickup 32 is formed by bending a thin plate body into a U-shaped cross section, but it may be formed only by an elongated thin plate as shown in Fig. 1 . In this case, a slit is provided on the upper surface of the guide arms 27, 31, and a guide such as a pin is provided under the pickups 28, 32, so that it is preferable to slide the pin into the slit. Further, in the above-described substrate processing system 10, the upper substrate transfer mechanism 22 transports the unprocessed glass substrate G, and the lower substrate transfer mechanism 23 transports the processed glass substrate G. However, the upper substrate transfer mechanism 22 may be transported and processed. The glass substrate G and the lower substrate transfer mechanism 23 transport the unprocessed glass substrate G. Further, in the substrate processing system 10, when the glass substrate G is transferred between the buffer pin 24 and the pickup 20, the pickup 20 is lifted and lowered to perform the transfer, but the buffer pin 24 can be lifted and lowered for delivery. As described above, the present invention has been described using the above embodiments, but the present invention is not limited to the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a configuration of a substrate processing system according to an embodiment of the present invention. Fig. 2 is a perspective view showing a configuration of a substrate transport unit used in a conventional substrate processing system. Figure 3 is a cross-sectional view taken along line A-A of Figure 1. 4 is a schematic view showing the configuration of the upper substrate transfer mechanism of FIG. 3, and FIG. 4(A) is a cross-sectional view for explaining the configuration and operation of the upper substrate transfer mechanism, and FIG. 4(B) is related to FIG. 4(A). A cross-sectional view of the line BB. Fig. 5 is an enlarged cross-sectional view for explaining the positional relationship of the guide rail, the guide arm, and the pickup. Fig. 6 is a cross-sectional view showing a configuration of a lower substrate transport mechanism of Fig. 3, and Fig. 6(B) is a cross-sectional view for explaining a configuration and an operation of a lower substrate transport mechanism. Fig. 6(B) is related to Fig. 6(A) A cross-sectional view of the line CC. Fig. 7 is a structural view for explaining a transfer procedure as a substrate transfer method of the embodiment. Fig. 8 is a structural view for explaining a transfer procedure as a substrate transfer method of the embodiment. Fig. 9 is a view showing a modification of the upper substrate transfer mechanism and the lower substrate transfer mechanism, and Fig. 9(A) is a horizontal sectional view. Fig. 9(B) is a longitudinal sectional view -31 - 201237987. Fig. 1 is an enlarged cross-sectional view showing a modification of the pickup of the upper substrate transfer mechanism and the lower substrate transfer mechanism. Fig. 11 is a perspective view showing a configuration of a substrate processing system for performing plasma etching treatment on a flat panel display of the seventh and subsequent generations. Fig. 12 is a perspective view showing the configuration of a substrate processing system for performing plasma etching treatment on the 11th generation flat panel display. [Description of main component symbols] G: Glass substrate 1 基板: Substrate processing system 1 1 : Process chamber 1 3 : Load lock module 22: Upper substrate transfer mechanism 23: Lower substrate transfer mechanism 24: Buffer pins 25, 29: Guide rail 26,30: lifting base 27, 31: guide arm 2 8,3 2 : pickup -32-