JP2012084725A - Substrate processing system and substrate feeding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing system that can improve the efficiency of processing substrates.SOLUTION: A load lock module 13 of a substrate processing system 10 has an upper substrate feed mechanism 22 and a lower substrate feed mechanism 23 vertically movable independently of each other inside the load lock module 13. The upper substrate feed mechanism 22 is so constructed that four guide arms 27 slide toward a process chamber 11 relative to four guide rails 25 disposed on a vertically movable base 26, and that four picks 28 slide toward the process chamber 11 relative to the respective guide arms 27. The lower substrate feed mechanism 23 is so constructed that four guide arms 31 slide toward the process chamber 11 relative to four guide rails 29 disposed on a vertically movable base 30, and that four picks 32 slide toward the process chamber 11 relative to the respective guide arms 31.

Description

  The present invention relates to a substrate processing system for processing a substrate for a display panel, and a substrate transfer method in the substrate processing system.

  A glass substrate used for a flat panel display or the like is subjected to a plasma etching process in order to form fine wiring or the like on the glass substrate. Usually, the plasma etching process to a glass substrate is performed by a substrate processing system.

  A substrate processing system for performing a plasma etching process on a glass substrate used in a sixth generation flat panel display includes a process chamber (processing chamber) and a load lock module for carrying the glass substrate into and out of the process chamber. In this substrate processing system, a substrate replacement method using a second lifter pin different from the first lifter pin for raising or lowering the glass substrate on the substrate mounting table in the process chamber is used, and the second lifter is used. The pins hold the edges of the glass substrate at several locations to raise or lower the glass substrate, simplifying the structure of the transfer arm in the load lock module for carrying in and out of the glass substrate, specifically a single arm type -A space-saving and simple structure with no vertical rotation shaft can be achieved, thereby achieving both the manufacturing cost of the device and the productivity of the flat panel display.

  However, in the substrate processing system that performs plasma etching processing on the 7th generation or later flat panel displays, when the substrate is replaced using the second lifter pin whose substrate support position is limited due to the increase in the size of the glass substrate, The two lifter pins cannot hold an appropriate portion of the glass substrate, and the deflection of the glass substrate may become too large to be transported due to substrate cracking. Accordingly, in response to this, the second lifter pin is currently abolished, a double arm type transfer arm is adopted as the transfer arm in the load lock module, and the substrate is replaced by the transfer arm, thereby bending the glass substrate. Is prevented.

  FIG. 11 is a perspective view schematically showing a configuration of a substrate processing system that performs plasma etching processing on a flat panel display of the seventh generation or later.

  In FIG. 11, the substrate processing system 110 includes a load lock module 115 that transfers an unprocessed glass substrate accommodated in a cassette 113 to a transfer module 112 via an atmospheric transfer arm 114. The load lock module 115 conveys the processed glass substrate from the transfer module 112 to the cassette 116 via the atmospheric transfer arm 114. Since the internal state of the process chamber 111 and the transfer module 112 is maintained almost in vacuum, the load lock module 115 is configured to be able to switch the internal state to air / vacuum (see, for example, Patent Document 1).

  In addition, a scalar type or linear motion type transfer arm (not shown) as a substrate transfer unit is arranged inside the transfer module 112 of the substrate processing system 110, and the transfer arm mounts a glass substrate inside the transfer module 112. Rotate while holding. Therefore, it is necessary to increase the internal volume of the transfer module 112.

  In recent years, a glass substrate used for a 10th generation flat panel display, which has been manufactured in recent years, has a rectangular shape with a side of about 3 m or less. Therefore, the internal volume of the transfer module 112 needs to be further increased. Module 112 becomes huge. Further, in the substrate processing system 110, a gate valve 117 capable of breaking the vacuum is disposed between the transfer module 112 and the load lock module 115. However, the gate valve 117 is enlarged as the transfer module 112 is enlarged. There arises a problem that the manufacturing cost of the transfer module 112 and the gate valve 117 increases.

  In the glass substrate used for the eleventh generation flat panel display whose manufacture will be started in the near future (presenting a rectangle with a side of about 3 m or more), the increase in manufacturing cost of the transfer module 112 and the like described above becomes more remarkable. Therefore, in order to reduce the manufacturing cost of the transfer module 112 and the like, a sixth generation including one process chamber 121 and one load lock module 122 connected to the process chamber 121 as shown in FIG. A substrate processing system 120 having a configuration similar to a substrate processing system for processing a glass substrate used in a flat panel display has been studied.

  By the way, since the substrate processing system 120 includes only one process chamber 121, the other glass substrate cannot be subjected to plasma etching while the load lock module 122 carries in and out the glass substrate. Therefore, in order to improve the manufacturing efficiency of the flat panel display, it is necessary to carry in and out the glass substrate by the load lock module 122 in a short time.

JP 2007-208235 A

  However, when a general SCARA type or direct acting double arm type transfer arm is used as the substrate transfer unit provided in the load lock module 122, an operable area of the transfer arm is secured in the load lock module 122. Therefore, it is necessary to increase the internal volume of the load lock module 122. On the other hand, since the load lock module 122 needs to be configured so that the internal state can be switched to the atmosphere / vacuum, if the load lock module 122 has a large internal volume, the internal state of the air / vacuum when the glass substrate is carried in and out is reduced. Switching takes time, and as a result, there is a problem that the manufacturing efficiency of the flat panel display cannot be improved.

  An object of the present invention is to provide a substrate processing system and a substrate transfer method that can improve the processing efficiency of a substrate.

  In order to achieve the above object, a substrate processing system according to claim 1 is one substrate processing apparatus for processing a substrate in a vacuum state, and is connected to the substrate processing apparatus to switch the internal state to air / vacuum. A first substrate transfer device; and a second substrate transfer device connected to the first substrate transfer device and arranged to face the substrate processing device with the first substrate transfer device interposed therebetween. The second substrate transfer apparatus carries the substrate in and out of the first substrate transfer apparatus in the atmospheric state, and the first substrate transfer apparatus carries the substrate in and out of the substrate processing apparatus. In the system, the first substrate transport device includes an upper substrate transport mechanism and a lower substrate transport device which are arranged so as to overlap vertically inside the first substrate transport device and move up and down independently of each other. Possess The upper substrate transport mechanism is provided corresponding to each of the first guides, a first base portion on which a plurality of first guides that are parallel to each other and extended toward the substrate processing apparatus are disposed, A plurality of elongated first intermediate sliding members that slide relative to the first guide toward the substrate processing apparatus, and corresponding to the first intermediate sliding members. A plurality of elongated first upper sliding members that slide relative to the first intermediate sliding member toward the substrate processing apparatus, and the lower substrate transport mechanism includes: A second base portion in which a plurality of second guides that are parallel to each other and extended toward the substrate processing apparatus are disposed, and is provided corresponding to each of the second guides. A plurality of elongated second intermediate sliding members that slide relative to the second guide; A plurality of elongated second upper slides provided corresponding to the second intermediate sliding member and sliding relative to the second intermediate sliding member toward the substrate processing apparatus. Each of the plurality of first upper sliding members and the plurality of second upper sliding members has the substrate mounted thereon.

  The substrate processing system according to claim 2 is the substrate processing system according to claim 1, further comprising a plurality of pin-like members that can protrude upward from below within the first substrate transfer apparatus. To do.

  A substrate processing system according to a third aspect is the substrate processing system according to the first or second aspect, wherein the substrate has a rectangular shape and a length of one side is 1.8 m or more.

  The substrate processing system according to claim 4 is the substrate processing system according to any one of claims 1 to 3, wherein each of the first intermediate sliding members and each of the first upper portions in the upper substrate transfer mechanism. The second sliding member and the second upper sliding member slide in synchronization with each other in the lower substrate transport mechanism. .

  The substrate processing system according to claim 5 is the substrate processing system according to any one of claims 1 to 4, wherein the first intermediate sliding members are not connected to each other in the upper substrate transfer mechanism, In the lower substrate transport mechanism, the second intermediate sliding members are not connected to each other.

  The substrate processing system according to claim 6 is the substrate processing system according to any one of claims 1 to 4, wherein the first upper sliding members are not connected to each other in the upper substrate transport mechanism, In the lower substrate transport mechanism, the second upper sliding members are not connected to each other.

  In order to achieve the above object, according to a seventh aspect of the present invention, there is provided a substrate transfer method for processing a substrate in a vacuum state, and switching the internal state to air / vacuum connected to the substrate processing device. A first substrate transfer device; and a second substrate transfer device connected to the first substrate transfer device and arranged to face the substrate processing device with the first substrate transfer device interposed therebetween. The second substrate transfer apparatus carries the substrate in and out of the first substrate transfer apparatus in the atmospheric state, and the first substrate transfer apparatus carries the substrate in and out of the substrate processing apparatus. An upper substrate transport mechanism and a lower substrate transport device, wherein the first substrate transport device is disposed so as to overlap vertically inside the first substrate transport device and moves up and down independently of each other, And before A plurality of pin-shaped members that can protrude from the lower side to the upper side inside the first substrate transfer apparatus are provided, and the upper substrate transfer mechanism includes a plurality of first members that are parallel to each other and extended toward the substrate processing apparatus. A first base portion on which one guide is disposed, and a plurality of lengths provided corresponding to each of the first guides and sliding relative to the first guide toward the substrate processing apparatus; A narrow first intermediate sliding member and a corresponding one of the first intermediate sliding members, and slide relative to the first intermediate sliding member toward the substrate processing apparatus. A plurality of elongate first upper sliding members that move, and the lower substrate transport mechanism includes a plurality of second guides that are parallel to each other and extended toward the substrate processing apparatus. A second base portion and each second guide are provided corresponding to the substrate processing apparatus. A plurality of elongated second intermediate sliding members that slide relative to the second guide and corresponding to the second intermediate sliding members; A plurality of elongated second upper sliding members that slide relative to the second intermediate sliding member toward the apparatus, and the plurality of first upper sliding members, Each of the plurality of second upper sliding members is a substrate transfer method in a substrate processing system on which the substrate is placed, and an unprocessed substrate carried by the second substrate transfer device is transferred to the upper substrate transfer mechanism. A first receiving step, a first raising step for raising the upper substrate carrying mechanism and the lower substrate carrying mechanism, and the lower substrate carrying mechanism comprising the second intermediate sliding member and the second upper portion. Substrate processing apparatus for processing substrate processed by sliding sliding member An unloading step for unloading, a lowering step for lowering the upper substrate transfer mechanism and the lower substrate transfer mechanism, and the upper substrate transfer mechanism sliding the first intermediate sliding member and the first upper sliding member. A loading step of moving the unprocessed substrate into the substrate processing apparatus; a second lifting step in which only the upper substrate transport mechanism is lifted; and the processed substrate with the plurality of pin-shaped members protruding. And a second receiving step for receiving the raised processed substrate by the second substrate transfer device. .

  According to the present invention, the upper substrate transport mechanism in the first substrate transport apparatus includes a plurality of elongated first intermediate sliding members that slide relative to the first guide, A plurality of elongated first upper sliding members that slide relative to the intermediate sliding member, the first guide, except when the substrate is carried into and out of the substrate processing apparatus, By overlapping the first intermediate sliding member and the first upper sliding member, the upper substrate transport mechanism can be reduced. The lower substrate transfer mechanism in the first substrate transfer apparatus includes a plurality of elongated second intermediate sliding members that slide relative to the second guide, and a second intermediate sliding member. And a plurality of elongated second upper sliding members that slide relative to each other, so that the second guide and the second intermediate except when the substrate is carried in and out of the substrate processing apparatus. By overlapping the sliding member and the second upper sliding member, the lower substrate transport mechanism can be made smaller.

  Furthermore, since the first substrate transfer apparatus is connected to only one substrate processing apparatus, the first substrate transfer apparatus only needs to carry in and out the substrate with respect to one substrate processing apparatus. Also, the upper substrate transfer mechanism does not hinder the loading / unloading and delivery of the substrate by the lower substrate transfer mechanism by raising, and the lower substrate transfer mechanism is lowered to carry the substrate in / out and delivery by the upper substrate transfer mechanism There is no hindrance. Therefore, the upper substrate transport mechanism and the lower substrate transport mechanism do not need to rotate, and the configuration of the upper substrate transport mechanism and the lower substrate transport mechanism can be simplified, and the upper substrate transport mechanism and the lower substrate transport mechanism can be made smaller. be able to.

  As a result, the internal volume of the first substrate transfer apparatus can be reduced, and therefore, it does not take time to switch the atmosphere / vacuum in the internal state of the first substrate transfer apparatus. Thereby, the processing efficiency of the substrate can be improved.

1 is a plan view schematically showing a configuration of a substrate processing system according to an embodiment of the present invention. It is a perspective view which shows roughly the structure of the substrate conveyance unit used with the conventional substrate processing system. It is sectional drawing regarding line AA in FIG. 4 is a diagram schematically showing the configuration of the upper substrate transport mechanism in FIG. 3, FIG. 4 (A) is a sectional view for explaining the configuration and operation of the upper substrate transport mechanism, and FIG. 4 (B) is FIG. It is sectional drawing regarding line BB in (A). It is an expanded sectional view for demonstrating the positional relationship of a guide rail, a guide arm, and a pick. 6 is a diagram schematically showing a configuration of the lower substrate transfer mechanism in FIG. 3, FIG. 6A is a cross-sectional view for explaining the configuration and operation of the lower substrate transfer mechanism, and FIG. It is sectional drawing regarding line CC in (A). It is process drawing for demonstrating the conveyance sequence as a board | substrate conveyance method based on this Embodiment. It is process drawing for demonstrating the conveyance sequence as a board | substrate conveyance method based on this Embodiment. FIG. 9 is a view showing a modification of the upper substrate transport mechanism and the lower substrate transport mechanism, FIG. 9A is a horizontal cross-sectional view, and FIG. 9B is a vertical cross-sectional view. It is an expanded sectional view which shows the modification of the pick in an upper board | substrate conveyance mechanism and a lower board | substrate conveyance mechanism. It is a perspective view which shows roughly the structure of the substrate processing system which performs a plasma etching process on the flat panel display after 7th generation. It is a perspective view showing roughly the composition of the substrate processing system which performs the plasma etching processing on the 11th generation flat panel display.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view schematically showing the configuration of a substrate processing system according to an embodiment of the present invention. In this substrate processing system, a plasma etching process is performed on a rectangular glass substrate having a side length of 1.8 m or more, particularly a glass substrate used for an eleventh generation or later flat panel display. In FIG. 1, in order to facilitate understanding of the configuration of the substrate processing system, a later-described load lock module 13 and process chamber 11 are shown using a horizontal sectional view.

  In FIG. 1, a substrate processing system 10 includes a case-like process chamber 11 (substrate processing apparatus), and a case-like load lock module 13 (first process) connected to the process chamber 11 via a gate valve 12. A substrate transfer device), an atmospheric transfer device 14 (second substrate transfer device) connected to the load lock module 13 and arranged to face the process chamber 11 with the load lock module 13 interposed therebetween, and the atmosphere A cassette 15 (substrate supply device) and a cassette 16 which are connected to the system transport device 14 and are arranged at positions rotated about 90 ° clockwise and counterclockwise in the figure from the load lock module 13 with respect to the atmospheric system transport device 14. (Substrate accommodation apparatus). A gate valve 17 is provided on the side surface of the load lock module 13 that faces the atmospheric transfer device 14.

  The process chamber 11 accommodates the glass substrate G in an interior maintained in a vacuum, and performs a plasma etching process on the glass substrate G using plasma generated in the interior. The process chamber 11 has a substrate mounting table 18 on which a glass substrate G is mounted.

  The load lock module 13 includes an upper substrate transfer mechanism 22 and a lower substrate transfer mechanism 23, which will be described later, and is configured to be able to switch the internal state to the atmosphere / vacuum by an unillustrated exhaust device and a pressure control valve.

  The cassette 15 is composed of a frame that stocks a plurality of untreated glass substrates G. In the cassette 15, the plurality of untreated glass substrates G are stacked in parallel with each other at a predetermined interval. The cassette 16 is made of a frame that stocks a plurality of processed glass substrates G. In the cassette 16, the plurality of processed glass substrates G are stacked in parallel with each other at a predetermined interval.

  The atmospheric transfer device 14 has a transfer arm mechanism 19. The transfer arm mechanism 19 is exposed to the atmosphere and has a comb-like pick 20 on which the glass substrate G is placed, a scalar arm (not shown) that supports the pick 20 and can be expanded and contracted, and supports and rotates the scalar arm. A rotating base 21. The transfer arm mechanism 19 expands and contracts the SCARA arm and rotates the rotation base 21, thereby unloading the untreated glass substrate G from the cassette 15 and delivering it to the upper substrate transfer mechanism 22 of the load lock module 13. The substrate G is received from the lower substrate transport mechanism 23 of the load lock module 13 and stored in the cassette 16.

  The gate valve 12 is closed during the plasma etching process of the glass substrate G in the process chamber 11 to partition the inside of the process chamber 11 and the load lock module 13, and the process of the unprocessed glass substrate G by the upper substrate transfer mechanism 22. When the glass substrate G that has been processed by the lower substrate transport mechanism 23 is unloaded from the process chamber 11 during loading into the chamber 11, the valve is opened to allow communication between the inside of the process chamber 11 and the inside of the load lock module 13. The gate valve 17 is opened when the internal state of the load lock module 13 is the atmosphere, and an opening is formed on the side surface of the load lock module 13 so that the pick 20 of the transfer arm mechanism 19 can enter the inside. When the internal state of the load lock module 13 is vacuum, the valve is closed to partition the inside of the load lock module 13 from the outside.

  By the way, as shown in FIG. 2, a substrate transport unit 200 used in a conventional substrate processing system has a substantially rectangular parallelepiped slide base 201 supported by a rotation shaft (not shown), and is attached to the slide base 201 and slides. A lower pick base 202 slidable in the longitudinal direction of the base 201 (hereinafter simply referred to as “longitudinal direction”) and an upper pick base 203 attached to the slide base 201 and slidable in the longitudinal direction of the slide base 201 are provided. . Four long bar-like picks 204 and 205 extend from the lower pick base 202 and the upper pick base 203 in the longitudinal direction, respectively, and the lower pick base 202 and the upper pick base 203 slide, so that each of the picks 204 and 205 is slid. Enters the inside of the process chamber and transports the glass substrate G.

  In the substrate transport unit 200, the lower pick base 202 and the upper pick base 203 are configured to be thick in the vertical direction in order to secure the attachment rigidity of the picks 204 and 205 to the slide base 201.

  When the substrate transfer unit 200 is arranged in the load lock module in the conventional substrate processing system, the gate valve forms an opening on the side surface of the process chamber so that the inside of the process chamber and the inside of the load lock module communicate with each other. Since the lower pick base 202 and the upper pick base 203 of the transfer unit 200 are configured to be thick, the lower pick base 202 and the upper pick base 203 cannot pass through the opening and can enter the inside of the process chamber. Can not. Therefore, it is necessary to increase the distance that the glass substrate G can be conveyed by configuring each pick 204, 205 as long as possible.

  The longer the length of each pick 204, 205, the greater the swing of each pick 204, 205 during the transport of the glass substrate G, and the greater the weight of each pick 204, 205. Therefore, in order to prevent the picks 204 and 205 from swinging and stably support the picks 204 and 205, it is necessary to increase the rigidity of attachment of the picks 204 and 205 to the slide base 201. In order to increase the mounting rigidity of each of the picks 204 and 205, it is necessary to increase not only the static rigidity of the lower pick base 202 and the upper pick base 203 but also the static rigidity of the slide base 201. It is necessary to increase the thickness.

  Further, in the substrate transport unit 200, the entire substrate transport unit 200 rotates as the slide base 201 rotates. In order to prevent the slide base 201 from being bent by inertial force during the rotation, It is necessary to increase the rigidity, and as a result, it is necessary to increase the thickness of the slide base 201.

  However, when the thickness of the slide base 201 is increased, the substrate transport unit 200 is increased in size. Further, as described above, the picks 204 and 205 are configured to be as long as possible in the substrate transport unit 200. Therefore, when the picks 204 and 205 are accommodated, that is, when the picks 204 and 205 are stacked on the slide base 201. Even so, the substrate transport unit 200 is not so small. Therefore, as a result, the substrate transport unit 200 is increased in size. Accordingly, it is necessary to increase the internal volume of the load lock module.

  Furthermore, in order to rotate the board | substrate conveyance unit 200, it is necessary to ensure the area | region which can be rotated inside the load lock module 13, and it is necessary to enlarge the internal volume of a load lock module.

  When the internal volume of the load lock module is increased, it takes time to switch the air / vacuum in the internal state, and the manufacturing efficiency of the flat panel display cannot be improved.

  In the present embodiment, in response to this, the substrate transport unit is reduced in size and the rotation of the substrate transport unit is not required. Specifically, the upper substrate transfer mechanism and the lower substrate transfer mechanism are reduced in size, and the upper substrate transfer mechanism and the lower substrate transfer mechanism transfer the glass substrate G only in one direction. The substrate transport unit is configured so that the glass substrate G can be replaced.

  FIG. 3 is a cross-sectional view taken along line AA in FIG. 1 and is a cross-sectional view schematically showing a configuration of a load lock module as a first substrate transfer apparatus in the substrate processing system according to the present embodiment.

  In FIG. 3, the load lock module 13 includes an upper substrate transfer mechanism 22 and a lower substrate transfer mechanism 23 that are arranged inside the load lock module 13 so as to overlap vertically in the figure. In S (hereinafter simply referred to as “internal S”), a plurality of buffer pins 24 (pin-like members) that protrude upward from the bottom in the figure and are movable up and down, and the internal state of the load lock module 13 are the atmosphere / An exhaust device for switching to vacuum and a pressure control valve (not shown) are provided.

  The upper substrate transport mechanism 22 and the lower substrate transport mechanism 23 move up and down independently of each other. Specifically, the upper substrate transfer mechanism 22 is a position where the unprocessed glass substrate G is received from the pick 20 of the transfer arm mechanism 19 or a position where the unprocessed glass substrate G is transferred into the process chamber 11. Between the position and the upper retreat position where the upper substrate transport mechanism 22 is retracted in order to secure the work space of the lower substrate transport mechanism 23 when the lower substrate transport mechanism 23 delivers the glass substrate G. Go up and down. In the interior S, the upper retreat position is located above the substrate delivery position.

  The lower substrate transfer mechanism 23 is a position where the processed glass substrate G is carried out of the process chamber 11 or a position where the processed glass substrate G is transferred to the pick 20 of the transfer arm mechanism 19. When the upper substrate transport mechanism 22 delivers the glass substrate G, the upper substrate transport mechanism 22 moves up and down between the lower retreat space, which is a retreat destination where the lower substrate transport mechanism 23 retreats, in order to secure a work space for the upper substrate transport mechanism 22. In the interior S, the lower retreat position is located below the substrate delivery position. Note that the substrate transfer position of the upper substrate transfer mechanism 22 and the substrate transfer position of the lower substrate transfer mechanism 23 are the same.

  4 is a diagram schematically showing the configuration of the upper substrate transfer mechanism in FIG. 3, and FIG. 4A is a cross-sectional view for explaining the configuration and operation of the upper substrate transfer mechanism, and FIG. ) Is a cross-sectional view taken along line BB in FIG.

  4A and 4B, the upper substrate transport mechanism 22 includes four guide rails 25 (first guides) that are parallel to each other and extended toward the process chamber 11 (to the right in the drawing). A plate-like elevating base 26 (first base) provided with a guide arm 27 (first intermediate sliding member) having a long rectangular column shape provided corresponding to each guide rail 25; And a pick 28 (first upper sliding member) made of an elongated thin plate provided corresponding to each guide arm 27. In the upper substrate transport mechanism 22, the four picks 28 cooperate to place one unprocessed glass substrate G.

  In the upper substrate transport mechanism 22, as shown in FIG. 5, the guide rail 25, the guide arm 27, and the pick 28 are stacked in this order from the bottom on the lift base 26. The guide arm 27 has a guide groove 27a provided on the lower surface over the entire length, and is loosely fitted to the guide rail 25 via the guide groove 27a. The pick 28 is formed by bending a thin plate body into a U-shaped cross section, and the guide 28 is loosely fitted to the guide arm 27 by accommodating the guide arm 27 in an internal space formed by the U-shape.

  The upper substrate transport mechanism 22 has a driving source (not shown), and the driving force applied by the driving source causes the guide arm 27 to slide relative to the guide rail 25 toward the process chamber 11 and 28 slides relative to the guide arm 27 toward the process chamber 11. At this time, the four guide arms 27 slide while maintaining their relative positional relationship, and the four picks 28 also slide while maintaining their relative positional relationship. Further, since each guide arm 27 and each pick 28 slide in synchronism, one of the guide arm 27 and the pick 28 stops while the other stops and an impact occurs in the upper substrate transport mechanism 22. Can be prevented. Thereby, it is possible to prevent the positional deviation of the unprocessed glass substrate G placed on the pick 28 and prevent the unprocessed glass substrate G from being placed at a predetermined position on the substrate mounting table 18 of the process chamber 11. It can be placed accurately.

  In the upper substrate transport mechanism 22, when the guide arm 27 and the pick 28 slide to the maximum extent toward the process chamber 11 (the state shown in FIGS. 4A and 4B), the upper substrate transport mechanism 22 is not placed on the pick 28. The length of the guide arm 27 and the pick 28 and the slidable range are set so that the glass substrate G for processing reaches above the substrate mounting table 18.

  In the upper substrate transfer mechanism 22, the guide arm 27 and the pick 28 that have slid to the maximum extent toward the process chamber 11 slide toward the atmospheric transfer device 14 by the driving force applied by the drive source, and the lift base 26 (state shown in FIG. 3).

  Hereinafter, when the guide arm 27 and the pick 28 slide to the process chamber 11 side as much as possible (the state shown in FIGS. 4A and 4B) is referred to as an “extension state”. Is slid to the maximum extent toward the atmospheric transfer device 14 (the state shown in FIG. 3) is referred to as a “shortened state”. The upper substrate transport mechanism 22 can transition from the shortened state to the extended state and from the extended state to the shortened state only when it is located at the substrate delivery position, and remains in the shortened state when it is located at the upper retracted position.

  6 is a diagram schematically showing the configuration of the lower substrate transport mechanism in FIG. 3, and FIG. 6A is a cross-sectional view for explaining the configuration and operation of the lower substrate transport mechanism, and FIG. ) Is a cross-sectional view taken along line CC in FIG.

  6A and 6B, the lower substrate transport mechanism 23 includes four guide rails 29 (second guides) that extend parallel to each other and toward the process chamber 11 (to the right in the drawing). A plate-like lifting base 30 (second base) provided with a guide arm 31 (second intermediate sliding member) having a long and narrow prismatic shape provided corresponding to each guide rail 29; And a pick 32 (second upper sliding member) made of an elongated thin plate provided corresponding to each guide arm 31. In the lower substrate transport mechanism 23, the four picks 32 cooperate to place one processed glass substrate G.

  In the lower substrate transport mechanism 23, as shown in FIG. 5, the guide rail 29, the guide arm 31, and the pick 32 are stacked in this order from below on the lifting base 30. The guide arm 31 has a guide groove 31a provided on the lower surface over its entire length, and is loosely fitted to the guide rail 29 via the guide groove 31a. The pick 32 is formed by bending a thin plate body into a U-shaped cross section, and the guide arm 31 is loosely fitted to the guide arm 31 by accommodating the guide arm 31 in an internal space formed by the U-shape.

  The lower substrate transport mechanism 23 has a drive source (not shown), and the drive force applied by the drive source causes the guide arm 31 to slide relative to the guide rail 29 toward the process chamber 11 and 32 slides relative to the guide arm 31 toward the process chamber 11. At this time, the four guide arms 31 slide while maintaining the relative positional relationship with each other, and the four picks 32 also slide while maintaining the relative positional relationship with each other. In addition, since each guide arm 31 and each pick 32 slide synchronously, the other stops while one of the guide arm 31 and pick 32 slides, and an impact occurs in the lower substrate transport mechanism 23. Can be prevented. Thereby, it is possible to prevent the positional deviation of the processed glass substrate G placed on the pick 32 from occurring.

  In the lower substrate transport mechanism 23, when the guide arm 31 and the pick 32 slide to the maximum extent to the process chamber 11 side (the state shown in FIGS. 6A and 6B), the pick 32 is attached to the substrate mounting table 18. The length of the guide arm 31 and the pick 32 and the slidable range are set so as to reach the upper side.

  Further, in the lower substrate transfer mechanism 23, the guide arm 31 and the pick 32 that have slid to the maximum extent toward the process chamber 11 slide toward the atmospheric transfer device 14 by the driving force applied by the drive source, and the lift base 30 (state shown in FIG. 3).

  Hereinafter, when the guide arm 31 and the pick 32 slide to the process chamber 11 side as much as possible (the state shown in FIGS. 6A and 6B) is referred to as an “extension state”. Is slid to the maximum extent toward the atmospheric transfer device 14 (the state shown in FIG. 3) is referred to as a “shortened state”. Note that the lower substrate transport mechanism 23 can transition from the shortened state to the extended state and from the extended state to the shortened state only when it is located at the substrate delivery position, and remains in the shortened state when it is located at the lower retracted position.

  In the upper substrate transport mechanism 22, through holes (not shown) are provided at positions corresponding to the plurality of buffer pins 24 in the elevating base 26, and each buffer pin 24 is loosely fitted to each through hole. In the lower substrate transport mechanism 23, through holes (not shown) are provided at positions corresponding to the plurality of buffer pins 24 in the lifting base 30, and each buffer pin 24 is loosely fitted to each through hole. Therefore, regardless of the position of the upper substrate transport mechanism 22 and the position of the lower substrate transport mechanism 23, the plurality of buffer pins 24 can freely move up and down. Further, since the plurality of buffer pins 24 move up and down synchronously by a driving force from a driving source (not shown), when the plurality of buffer pins 24 move up and down while supporting the glass substrate G in cooperation, they are supported. The obtained glass substrate G does not tilt. As a result, it is possible to prevent the displacement of the glass substrate G from occurring.

  Further, since the upper substrate transport mechanism 22 and the lower substrate transport mechanism 23 do not need to rotate as will be described later, the inertial force due to the rotation does not act on each component member, and each component member prevents the deflection. It is not necessary to secure the mounting rigidity of the upper substrate transport mechanism 203 and the lower substrate transport mechanism 204 in the conventional substrate transport unit 200 as much as the mounting rigidity of each component member. Therefore, in the upper substrate transport mechanism 22 and the lower substrate transport mechanism 23, the guide arms 27 do not need to be connected to each other, and the guide arms 31 do not need to be connected to each other. Further, the picks 28 need not be connected to each other, and the picks 32 need not be connected to each other. Therefore, a connecting member such as the pick base 207 in the conventional substrate transport unit 200 is not necessary.

  According to the substrate processing system 10 according to the present embodiment, the upper substrate transport mechanism 22 in the load lock module 13 includes four guide arms 27 that slide relative to the guide rails 25 of the elevating base 26, and guides. Since the four picks 28 that slide relative to the arm 27 are provided, the upper substrate transport mechanism 22 can be reduced by overlapping the elevating base 26, the guide arm 27, and the pick 28 in the shortened state. In addition, the lower substrate transport mechanism 23 in the load lock module 13 includes four guide arms 31 that slide relative to the guide rails 29 of the elevating base 30 and 4 that slide relative to the guide arms 31. Since the two picks 32 are provided, the lower substrate transport mechanism 23 can be reduced by overlapping the elevating base 30, the guide arm 31, and the pick 32 in the shortened state. As a result, the internal volume of the load lock module 13 can be reduced, so that it does not take time to switch the atmosphere / vacuum in the internal state of the load lock module 13. Thereby, the processing efficiency of the glass substrate G can be improved.

  In the substrate processing system 10 described above, the guide arms 27 are not connected to each other in the upper substrate transport mechanism 22, and the picks 28 are not connected to each other. In the lower substrate transport mechanism 23, the guide arms 31 are not connected to each other, and the picks 32 are not connected to each other. As a result, the connecting member for the guide arm 27, the pick 28, the guide arm 31, and the pick 32 is not necessary, and the upper substrate transport mechanism 22 and the lower substrate transport mechanism 23 can be made smaller.

  In the above-described embodiment, the case where the substrate transport unit of the substrate processing system includes four guide rails, four guide arms, and four picks has been described. However, the number of guide rails, guide arms, and picks is the glass substrate G. If it is the number which can support and convey, it will not be limited in particular.

  Next, a substrate transfer method according to the present embodiment will be described.

  7 and 8 are process diagrams for explaining a transport sequence as a substrate transport method according to the present embodiment. This transfer sequence is mainly executed by the load lock module 13 in the substrate processing system 10. 7A, FIG. 7C, FIG. 7E, FIG. 7G, FIG. 8A, FIG. 8C, FIG. 8E, and FIG. FIG. 8 is a cross-sectional view taken along line AA in FIG. 1, and is a view of FIGS. 7B, 7 D, 7 F, 7 H, 8 B, 8 D, FIG. 8 (F) and FIG. 8 (H) are cross-sectional views taken along line AA in FIG.

  First, the upper substrate transport mechanism 22 is positioned at the substrate delivery position, and the lower substrate transport mechanism 23 is positioned at the lower retreat position. Further, the plurality of buffer pins 24 rise through the through holes of the elevating base 30 and wait at a predetermined position. Thereafter, the gate valve 17 (not shown) is opened, and the pick 20 on which the unprocessed glass substrate G is placed enters the inside S and transports the glass substrate G to a position directly above the upper substrate transport mechanism 22 (FIG. 7). (A) and FIG. 7 (B)).

  Next, the pick 20 is lowered to bring the lower surface of the glass substrate G into contact with each buffer pin 24, and then the pick 20 is further lowered. Thereby, the glass substrate G is separated from the pick 20, and each buffer pin 24 supports the glass substrate G. (FIGS. 7C and 7D).

  Next, the pick 20 exits from the inside S, the gate valve 17 is closed, and the exhaust device and the pressure control valve switch the internal state of the load lock module 13 to vacuum. Further, the position of the untreated glass substrate G is adjusted by the two positioners 33 coming into contact with the edge of the untreated glass substrate G (FIGS. 7E and 7F).

  For correcting the position of the glass substrate G with respect to the sliding direction of the guide arms 27 and 31 and the picks 28 and 32 (the conveyance direction of the glass substrate G), for example, the glass substrate G is held by the pick 20 of the conveyance arm mechanism 19. By detecting a shift in the expansion / contraction direction of the glass substrate G with a shift amount sensor (not shown) separately provided in the state, and correcting the position with a scalar arm that supports the pick 20 based on the detected shift, the glass Position correction can also be performed without bringing the positioner 33 into contact with the substrate G.

  Next, after the upper substrate transport mechanism 22 is lifted and the pick 28 comes into contact with the lower surface of the glass substrate G, the upper substrate transport mechanism 22 is lifted to the upper retracted position (first ascending step). As a result, the upper substrate transport mechanism 22 receives the unprocessed glass substrate G. Thereafter, the plurality of buffer pins 24 descend, the lower substrate transport mechanism 23 rises to the substrate delivery position (first ascending step), and the gate valve 12 opens.

  Next, the lower substrate transfer mechanism 23 slides the guide arm 31 and the pick 32 to the process chamber 11 side as much as possible, and has been processed by the plurality of pusher pins (not shown) from the substrate mounting table 18 of the process chamber 11. The glass substrate G is received by the pick 32 (FIGS. 7G and 7H), and the guide arm 31 and the pick 32 are further slid to the atmospheric transfer device 14 side to the maximum to be processed. G is carried out from the process chamber 11 and carried to just above the lower substrate carrying mechanism 23 (carrying out step).

  Next, the lower substrate transport mechanism 23 on which the processed glass substrate G is placed is lowered to the lower retreat position, and the upper substrate transport mechanism 22 is lowered to the substrate delivery position (lowering step). Thereafter, the upper substrate transport mechanism 22 slides the guide arm 27 and the pick 28 to the process chamber 11 side as much as possible, and performs unprocessed to a plurality of pusher pins (not shown) protruding from the substrate mounting table 18 of the process chamber 11. The glass substrate G is delivered (FIGS. 8A and 8B) (carry-in step).

  Next, the upper substrate transfer mechanism 22 slides the guide arm 27 and the pick 28 to the atmospheric transfer device 14 side as much as possible to shift to the shortened state, and ascends to the upper retracted position (second ascending step). Thereafter, the plurality of buffer pins 24 rise and continue to rise even after the processed glass substrate G placed on the pick 32 of the lower substrate transport mechanism 23 is separated from the pick 32, and the processed glass substrate G is processed. Is raised to a predetermined position (third raising step). Further, the position of the processed glass substrate G is adjusted by bringing the two positioners 33 into contact with the edges of the processed glass substrate G (FIGS. 8C and 8D).

  In addition, about the position correction | amendment regarding the conveyance direction of the glass substrate G, it is the same as the case where the glass substrate G is carried in to the load lock module 13 from the atmospheric system transfer apparatus 14 mentioned above (FIG. 7 (A)-FIG. 7 (F)). For example, position correction can be performed without bringing the positioner 33 into contact with the glass substrate G by performing position correction with a scalar arm that supports the pick 20.

  Next, the gate valve 12 is closed, and the exhaust device and the pressure control valve switch the internal state of the load lock module 13 to the atmosphere. Thereafter, the gate valve 17 is opened, and the pick 20 enters the inside S and is located immediately below the processed glass substrate G (FIGS. 8E and 8F).

  Next, even after the pick 20 is lifted and comes into contact with the lower surface of the processed glass substrate G, the pick 20 is lifted to a predetermined position to separate the processed glass substrate G from the plurality of buffer pins 24. Thereby, the pick 20 receives the processed glass substrate G (FIG. 8G, FIG. 8H) (second receiving step).

  Next, the pick 20 on which the processed glass substrate G is placed leaves the inside S, and the conveyance sequence ends.

  According to the transfer sequence as the substrate transfer method according to the present embodiment, since the load lock module 13 is connected to only one process chamber 11, the load lock module 13 is configured to transfer the glass substrate G to one process chamber 11. Carry in and out. Further, the upper substrate transport mechanism 22 does not hinder the loading / unloading and delivery of the glass substrate G by the lower substrate transport mechanism 23 by raising, and the lower substrate transport mechanism 23 is lowered to lower the glass by the upper substrate transport mechanism 22. There is no hindrance to loading and unloading and delivery of the substrate G. Therefore, the upper substrate transport mechanism 22 and the lower substrate transport mechanism 23 do not need to rotate.

  If the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23 do not rotate, the inertial force due to the rotation does not act on each component of the upper substrate transfer mechanism 22 and the lower substrate transfer mechanism 23, and the bending due to the inertial force is prevented. Therefore, it is not necessary to make the static rigidity of each component member as high as the static rigidity of each component member of the upper substrate transfer mechanism 203 and the lower substrate transfer mechanism 204 in the conventional substrate transfer unit 200. As a result, the elevating bases 26 and 30, the guide arms 27 and 31, and the picks 28 and 32 can be configured to be thin, for example, to have a thickness of 100 mm or less, and the upper substrate transport mechanism 22 and the lower substrate transport mechanism 23 can be further configured. Can be small.

  Further, since the guide arms 27 and 31 can be made thin, the guide arms 27 and 31 can pass through the opening on the side surface of the process chamber 11 in the extended state. As a result, the transportable distance of the glass substrate G can be secured to a desired value or more without configuring the picks 28 and 32 so long. That is, since the picks 28 and 32 can be configured short, it is not necessary to increase the mounting rigidity of the picks 28 and 32 in order to prevent the picks 28 and 32 from swinging. As a result, there is no need to increase the static rigidity of the guide arms 27 and 31 to which the picks 28 and 32 are attached and the elevating bases 26 and 30 to which the guide arms 27 and 31 are attached. Further, the elevating bases 26 and 30 can be made thinner. As a result, the upper substrate transport mechanism 22 and the lower substrate transport mechanism 23 can be further reduced.

  As described above, the internal volume of the load lock module 13 can be reduced, so that it does not take time to switch the atmosphere / vacuum in the internal state of the load lock module 13. Thereby, the processing efficiency of the glass substrate G can be improved.

  In the substrate processing system 10 described above, each guide arm 27, each pick 28, each guide arm 31, and each pick 32 are not connected to each other, but may be connected to each other by a connecting member. For example, as shown in FIGS. 9A and 9B, the guide arms 27 may be connected to each other by an arm base 34 as a connecting member, and the guide arms 31 may be connected to each other by an arm base 35.

  In the substrate processing system 10 described above, the pick 28 and the pick 32 are formed by bending a thin plate into a U-shaped cross section, but may be formed by a simple long thin plate as shown in FIG. In this case, it is preferable that slits are provided on the upper surfaces of the guide arms 27 and 31, guides such as pins are provided on the lower surfaces of the picks 28 and 32, and the pins are loosely fitted into the slits.

  In the substrate processing system 10 described above, the upper substrate transport mechanism 22 transports an unprocessed glass substrate G, and the lower substrate transport mechanism 23 transports a processed glass substrate G. The already-processed glass substrate G may be transferred, and the lower substrate transfer mechanism 23 may transfer the unprocessed glass substrate G.

  In the substrate processing system 10 described above, when the glass substrate G is transferred between the buffer pin 24 and the pick 20, the pick 20 moves up and down, but the buffer 24 moves up and down and transfers it. Also good.

  Although the present invention has been described using the above embodiment, the present invention is not limited to the above embodiment.

G glass substrate 10 substrate processing system 11 process chamber 13 load lock module 22 upper substrate transfer mechanism 23 lower substrate transfer mechanism 24 buffer pins 25, 29 guide rails 26, 30 lift base 27, 31 guide arms 28, 32 picks

Claims (7)

One substrate processing apparatus for processing a substrate in a vacuum state, a first substrate transport apparatus connected to the substrate processing apparatus to switch the internal state to air / vacuum, and connected to the first substrate transport apparatus And the second substrate transport device disposed so as to be opposed to the substrate processing device with the first substrate transport device interposed therebetween, and the second substrate transport device is in the atmospheric state. The substrate processing system is configured to carry the substrate in and out of the apparatus, and the first substrate transfer device carries the substrate in and out of the substrate processing apparatus,
The first substrate transport device includes an upper substrate transport mechanism and a lower substrate transport device which are arranged so as to overlap vertically inside the first substrate transport device and move up and down independently of each other,
The upper substrate transport mechanism is provided corresponding to each of the first guides, a first base portion on which a plurality of first guides that are parallel to each other and extended toward the substrate processing apparatus are disposed, A plurality of elongated first intermediate sliding members that slide relative to the first guide toward the substrate processing apparatus, and corresponding to the first intermediate sliding members. A plurality of elongated first upper sliding members that slide relative to the first intermediate sliding member toward the substrate processing apparatus;
The lower substrate transport mechanism is provided in correspondence with each of the second guides, a second base portion provided with a plurality of second guides parallel to each other and extended toward the substrate processing apparatus, A plurality of elongated second intermediate sliding members that slide relative to the second guide toward the substrate processing apparatus, and corresponding to the second intermediate sliding members. A plurality of elongated second upper sliding members that slide relative to the second intermediate sliding member toward the substrate processing apparatus,
Each of the plurality of first upper sliding members and the plurality of second upper sliding members places the substrate thereon.   The substrate processing system according to claim 1, further comprising: a plurality of pin-like members that can protrude upward from below in the first substrate transfer apparatus.   The substrate processing system according to claim 1, wherein the substrate has a rectangular shape and a length of one side is 1.8 m or more. In the upper substrate transport mechanism, each of the first intermediate sliding members and each of the first upper sliding members slide synchronously,
4. The device according to claim 1, wherein each of the second intermediate sliding members and each of the second upper sliding members slide in synchronization in the lower substrate transfer mechanism. 5. Substrate processing system.   5. The first intermediate sliding members are not connected to each other in the upper substrate transfer mechanism, and the second intermediate sliding members are not connected to each other in the lower substrate transfer mechanism. The substrate processing system according to any one of the above.   5. The first upper sliding members are not connected to each other in the upper substrate transfer mechanism, and the second upper sliding members are not connected to each other in the lower substrate transfer mechanism. The substrate processing system according to any one of the above. One substrate processing apparatus for processing a substrate in a vacuum state, a first substrate transport apparatus connected to the substrate processing apparatus to switch the internal state to air / vacuum, and connected to the first substrate transport apparatus And the second substrate transport device disposed so as to be opposed to the substrate processing device with the first substrate transport device interposed therebetween, and the second substrate transport device is in the atmospheric state. The substrate processing system is configured to carry the substrate in and out of the apparatus, and the first substrate transfer device carries the substrate in and out of the substrate processing apparatus,
The first substrate transfer device is arranged so as to overlap vertically inside the first substrate transfer device, and moves up and down independently of each other, and the first substrate transfer device and the first substrate transfer device A plurality of first guides having a plurality of pin-like members that can protrude upward from below in the substrate transfer apparatus, wherein the upper substrate transfer mechanism is parallel to each other and extended toward the substrate processing apparatus. A plurality of elongated bases which are provided corresponding to the first guides and slide relative to the first guide toward the substrate processing apparatus. A plurality of first intermediate sliding members and a plurality of first intermediate sliding members that slide relative to the first intermediate sliding member toward the substrate processing apparatus. A first upper sliding member having an elongated shape, and the lower portion The plate transport mechanism is provided corresponding to each of the second guides, a second base portion on which a plurality of second guides that are parallel to each other and extended toward the substrate processing apparatus are disposed, and the substrate processing A plurality of elongated second intermediate sliding members that slide relative to the second guide toward the apparatus, and corresponding to the second intermediate sliding members, A plurality of elongated second upper sliding members that slide relative to the second intermediate sliding member toward the substrate processing apparatus, and a plurality of the first upper sliding members. Each of the member and the plurality of second upper sliding members is a substrate transfer method in a substrate processing system on which the substrate is placed,
A first receiving step in which the upper substrate transport mechanism receives an unprocessed substrate carried by the second substrate transport device;
A first raising step for raising the upper substrate transfer mechanism and the lower substrate transfer mechanism;
An unloading step in which the lower substrate transport mechanism unloads the processed substrate from the substrate processing apparatus by sliding the second intermediate sliding member and the second upper sliding member;
A lowering step for lowering the upper substrate transport mechanism and the lower substrate transport mechanism;
A loading step in which the upper substrate transport mechanism slides the first intermediate sliding member and the first upper sliding member to carry the unprocessed substrate into the substrate processing apparatus;
A second raising step in which only the upper substrate transport mechanism is raised;
A third ascending step in which the plurality of pin-like members protrude and the processed substrate is raised away from the lower substrate transport mechanism;
A substrate transfer method comprising: a second receiving step in which the second substrate transfer device receives the raised processed substrate.

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