KR20120038380A - Substrate processing system and substrate transferring method - Google Patents

Abstract

PURPOSE: A substrate processing system and a substrate transfer method are provided to improve substrate processing efficiency by reducing the internal capacity of a load lock module. CONSTITUTION: An upper substrate transfer device(22) and a lower substrate transfer device(23) are vertically and independently transferred inside of a load lock module(13). Four guide arms are relatively slid toward a process chamber with respect to four guide rails arranged on a lift base of the upper substrate transfer device. Four picks are relatively slid towards the process chamber. The four guide arms are relatively slid toward the process chamber with respect to the four guide rails arranged on the lift base(30) of the lower substrate transfer device.

Description

Substrate Processing System and Substrate Transfer Method {SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE TRANSFERRING METHOD}

This invention relates to the substrate processing system which processes the board | substrate for display panels, and the board | substrate conveyance method in the said substrate processing system.

A plasma etching process is performed to the glass substrate used for a flat panel display etc. in order to comprise fine wiring etc. on the said glass substrate. Usually, plasma etching processing to a glass substrate is performed with a substrate processing system.

The substrate processing system which applies a plasma etching process to the glass substrate used for the 6th generation flat panel display is provided with the process chamber (process chamber) and the load lock module which carries out the carrying out of the glass substrate to the said process chamber. In this substrate processing system, a substrate replacement method using a second lifter pin separate from the first lifter pin that raises or lowers the glass substrate on the substrate mount in the process chamber is used, and the second lifter pin is a glass substrate. Since the end of is held in several places and this glass substrate is raised or lowered, the structure of the conveyance arm in the loadlock module which carries out the carrying out of a glass substrate is simplified, specifically, a single arm type | shaftless and shaftless shaft The space saving of the mold can be achieved with a simple structure, and the production cost of the device and the productivity of the flat panel display can be compatible.

By the way, in the substrate processing system which performs a plasma etching process to the flat panel display after 7th generation, when replacing a board | substrate using the 2nd lifter pin whose board | substrate support position is restrict | limited by the enlargement of the size of a glass substrate, a 2nd lifter Since a fin cannot hold | maintain a suitable location of a glass substrate, the curvature of a glass substrate may become large too much and conveyance may become impossible by board | substrate division. Thus, in response to this, the second lifter pin is now abolished, and a double arm type transfer arm is employed as the transfer arm in the loadlock module, and the substrate replacement is performed by the transfer arm, thereby preventing warpage of the glass substrate. It is prevented from occurring.

FIG. 11 is a perspective view schematically showing the configuration of a substrate processing system that performs a plasma etching process on a flat panel display after the seventh generation.

In FIG. 11, this substrate processing system 110 carries a load lock module 115 for conveying an untreated glass substrate housed in a cassette 113 to a transfer module 112 via an atmospheric transfer arm 114. It is provided. The load lock module 115 conveys the processed glass substrate from the transfer module 112 to the cassette 116 via the atmospheric transfer arm 114. Since the internal state of the process chamber 111 or the transfer module 112 is almost maintained in a vacuum, the load lock module 115 is configured to be capable of switching the internal state to atmospheric / vacuum (for example, the patent literature 1).

In addition, a scalar type or a linear transfer arm (not shown) as a substrate transfer unit is disposed inside the transfer module 112 of the substrate processing system 110, and the transfer arm is disposed inside the transfer module 112. It rotates with a glass substrate mounted. Therefore, the internal volume of the transfer module 112 needs to be increased.

In recent years, since the glass substrate used for the 10th generation flat panel display in which manufacture is started shows a rectangle whose side is about 3 m or less, it is necessary to make the transfer module 112 larger in volume, and as a result, transfer Module 112 is huge. In addition, in the substrate processing system 110, a vacuum disconnectable gate valve 117 is disposed between the transfer module 112 and the load lock module 115, but the gate valve 117 is also enlarged in the transfer module 112. In order to enlarge with this, the problem that the manufacturing price of the transfer module 112 and the gate valve 117 rose.

In the glass substrate used for the 11th generation flat panel display which manufacture is started in the near future (one side shows the rectangle of about 3 m or more), the manufacturing price of the above-mentioned transfer module 112 etc. will become more remarkable. Therefore, in order to reduce the manufacturing price of the transfer module 112 and the like, one process chamber 121 and one load lock module 122 connected to the process chamber 121 as shown in FIG. The substrate processing system 120 which has a structure similar to the substrate processing system which processes the glass substrate used for the 6th generation flat panel display provided is examined.

However, since the substrate processing system 120 includes only one process chamber 121, the plasma etching process may be installed on another glass substrate while the load lock module 122 performs loading and unloading of the glass substrate. none. Therefore, in order to improve the manufacturing efficiency of a flat panel display, it is necessary to carry out the carrying out of the glass substrate by the load lock module 122 in a short time.

Japanese Patent Publication No. 2007-208235

However, when a general scalar type or linear double arm type transfer arm is used as the substrate transfer unit included in the load lock module 122, the operable region of the transfer arm is placed inside the load lock module 122. Since it is necessary to ensure, it is necessary to enlarge the internal volume of the load lock module 122. On the other hand, since the load lock module 122 needs to be configured such that the internal state can be switched to atmospheric / vacuum, if the internal volume of the load lock module 122 is large, the atmospheric / vacuum of the internal state at the time of carrying in and out of the glass substrate There is a problem that the time is required for the conversion, and as a result, the manufacturing efficiency of the flat panel display cannot be improved.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing system and a substrate transfer method capable of improving the processing efficiency of a substrate.

In order to achieve the above object, the substrate processing system according to claim 1 includes one substrate processing apparatus for processing a substrate in a vacuum state, and an internal state connected to the substrate processing apparatus in an atmosphere / vacuum. And a second substrate transfer device connected to the first substrate transfer device to be switched, and arranged to face each other with the substrate processing device and the first substrate transfer device interposed therebetween, wherein the second substrate is provided. In the substrate processing system in which a conveying apparatus performs carrying in and out of the said board | substrate with respect to the said 1st board | substrate conveying apparatus, and a said 1st board | substrate conveying apparatus performs carrying in / out of the said board | substrate with respect to the said substrate processing apparatus, The said The 1st board | substrate conveying apparatus is arrange | positioned so that it may overlap up and down inside the said 1st board | substrate conveying apparatus, and is independent of each other. An upper substrate conveyance mechanism and a lower substrate conveyance mechanism, wherein the upper substrate conveyance mechanism includes a first base on which a plurality of first guides arranged in parallel with each other and extending toward the substrate processing apparatus, and the respective first guides And a plurality of elongate first intermediate sliding members, which are provided corresponding to the plurality of elongated shapes, and which slide relative to the first guide toward the substrate processing apparatus, and corresponding to the respective first intermediate sliding members. And a plurality of elongate first upper sliding members that slide relative to the first intermediate sliding member toward the substrate processing apparatus, wherein the lower substrate conveying mechanisms are parallel to each other and the substrate processing apparatus. A second base having a plurality of second guides extending toward the second base, and corresponding to each of the second guides; And a plurality of elongate second intermediate sliding members that slide relative to the second guide toward the substrate processing apparatus, and corresponding to the second intermediate sliding members, respectively. A plurality of elongated second upper sliding members that slide relative to the second intermediate sliding member toward the device, wherein the plurality of first upper sliding members and the plurality of second upper sliding members Each is characterized by mounting the substrate.

The substrate processing system according to claim 2, wherein the substrate processing system according to claim 1 includes a plurality of pin-shaped members that can protrude from below to above in the first substrate transfer device. .

In the substrate processing system of Claim 3, the substrate processing system of Claim 1 or 2 WHEREIN: The said board | substrate shows a rectangle and the length of one side is 1.8 m or more, It is characterized by the above-mentioned.

The substrate processing system according to claim 4 is the substrate processing system according to claim 1, wherein the first intermediate sliding member and the first upper sliding member are respectively formed in the upper substrate transfer mechanism. It is synchronously sliding, and each said 2nd middle sliding member and said 2nd upper sliding member are synchronously sliding in the said lower substrate conveyance mechanism, It is characterized by the above-mentioned.

The substrate processing system according to claim 5 is the substrate processing system according to claim 1, wherein in the upper substrate conveying mechanism, the respective first intermediate sliding members are not connected to each other, and the lower substrate conveying is performed. In the instrument, each of the second intermediate sliding members is not connected to each other.

In the substrate processing system of Claim 1 or 2, the substrate processing system of Claim 1 or 2 WHEREIN: Each said 1st upper sliding member is not connected with each other in the said upper substrate conveyance mechanism, and the said lower substrate conveyance is carried out. Each of the second upper sliding members in the mechanism is not connected to each other.

In order to achieve the said objective, the board | substrate conveyance method of Claim 7 consists of one board | substrate processing apparatus which processes a board | substrate in a vacuum state, and the agent which is connected to the said substrate processing apparatus and switches an internal state to air | vacuum / vacuum. And a second substrate transfer apparatus connected to the first substrate transfer apparatus and the first substrate transfer apparatus, and arranged to face each other with the substrate processing apparatus and the first substrate transfer apparatus interposed therebetween. Carrying out the said board | substrate with respect to the said 1st board | substrate conveyance apparatus in a standby state, The said 1st board | substrate conveyance apparatus is a board | substrate processing system which performs the carrying out of the said board | substrate with respect to the said substrate processing apparatus, Comprising: 1st board | substrate conveyance The upper part which arrange | positions so that it may overlap up and down inside the said 1st board | substrate conveyance apparatus, and moves up and down independently of each other The board | substrate conveyance mechanism, the lower board | substrate conveyance mechanism, and the inside of the said 1st board | substrate conveyance apparatus have several fin-shaped member which can protrude upward from below, The said upper substrate conveyance mechanism is mutually parallel, and the said substrate processing apparatus A first base having a plurality of first guides extending toward the first base, and a plurality of elongated articles provided corresponding to each of the first guides and sliding relative to the first guide toward the substrate processing apparatus. A plurality of elongate first upper slides, which are provided corresponding to the first intermediate sliding member and the respective first intermediate sliding members, and which slide relative to the first intermediate sliding member toward the substrate processing apparatus. It has a movement member, and the said lower board | substrate conveyance mechanism is mutually parallel and the said substrate process A second base having a plurality of second guides extending toward the teeth, and a plurality of elongated shapes which are provided corresponding to each of the second guides and which slide relative to the second guide toward the substrate processing apparatus. A plurality of elongated second upper portions provided corresponding to the second intermediate sliding members and the respective second intermediate sliding members and sliding relative to the second intermediate sliding members toward the substrate processing apparatus. In the substrate conveyance method in the said substrate processing system, The said 2nd board | substrate which has a sliding member, and each of the said plurality of 1st upper sliding member and the said some 2nd upper sliding member mounts the said board | substrate. A first receiving step in which the upper substrate conveying mechanism receives an unprocessed substrate carried by a conveying apparatus; and A first raising step of raising the sub-substrate conveyance mechanism and the lower substrate conveyance mechanism; and the lower substrate conveyance mechanism sliding the second intermediate sliding member and the second upper sliding member, thereby removing the processed substrate. A carrying out step of carrying out from the substrate processing apparatus; a lowering step of lowering the upper substrate carrying mechanism and the lower substrate carrying mechanism; and the upper substrate carrying mechanism for the first intermediate sliding member and the first upper sliding member. A carrying-in step of sliding the unprocessed substrate to the substrate processing apparatus by sliding, a second raising step of raising only the upper substrate transfer mechanism, and the plurality of pin-shaped members protruding from the substrate to complete the processing; A third ascending step of spaced apart from the lower substrate carrying mechanism and the second substrate; Characterized in that the transmitting device having a second receiving step for receiving the substrate in the elevated above processing has been completed.

According to this invention, the upper board | substrate conveyance mechanism in a 1st board | substrate conveying apparatus is provided with respect to the several elongate 1st intermediate sliding member and the 1st intermediate sliding member which slide relatively with respect to a 1st guide. Since it has a plurality of elongate first upper sliding members that slide relatively, the first guide, the first intermediate sliding member, and the first upper sliding member are moved, except when carrying the substrate in and out of the substrate processing apparatus. By superimposing, the upper board | substrate conveyance mechanism can be made small. Moreover, the lower board | substrate conveyance mechanism in a 1st board | substrate conveying apparatus slides relatively with respect to the several elongate 2nd intermediate sliding member and the 2nd intermediate sliding member which slide relatively with respect to a 2nd guide. Since it has a plurality of elongate second upper sliding members that move, the second guide, the second intermediate sliding member, and the second upper sliding member are overlapped with each other except when carrying the substrate in and out of the substrate processing apparatus. The lower substrate transfer mechanism can be made smaller.

In addition, since only a single substrate processing apparatus is connected to the first substrate transfer apparatus, the first substrate transfer apparatus may carry out the carrying out of the substrate to one substrate processing apparatus. In addition, when the upper substrate conveyance mechanism is raised, the carrying out and receiving of the substrate by the lower substrate conveyance mechanism are not impeded, and the lower substrate conveyance mechanism is lowered, thereby inhibiting the carrying in and out of the substrate by the upper substrate conveyance mechanism. none. Therefore, the upper substrate conveyance mechanism and the lower substrate conveyance mechanism do not need to rotate, the structure of the upper substrate conveyance mechanism and the lower substrate conveyance mechanism can be simplified, and the upper substrate conveyance mechanism and the lower substrate conveyance mechanism can be made smaller. .

As a result, the internal volume of a 1st board | substrate conveying apparatus can be made small, and it does not need time for switching of air | atmosphere / vacuum of the internal state of a 1st substrate conveying apparatus. Thereby, the processing efficiency of a board | substrate can be improved.

1 is a plan view schematically showing the configuration of a substrate processing system according to an embodiment of the present invention;
2 is a perspective view schematically showing the configuration of a substrate transfer unit used in a conventional substrate processing system;
3 is a cross-sectional view of a line A-A in FIG. 1;
FIG. 4 is a diagram schematically showing the configuration of the upper substrate conveyance mechanism in FIG. 3, FIG. 4A is a cross-sectional view for explaining the structure and operation of the upper substrate conveyance mechanism, and FIG. 4B. Is a sectional view of the line B-B in FIG. 4 (A),
5 is an enlarged cross sectional view for explaining a positional relationship between a guide rail, a guide arm, and a pick;
FIG. 6: is a figure which shows schematically the structure of the lower board | substrate conveyance mechanism in FIG. 3, FIG. 6 (A) is sectional drawing for demonstrating the structure and operation | movement of a lower board | substrate conveyance mechanism, FIG. Is sectional drawing about the line C-C in FIG.
7 is a flowchart for explaining a conveyance procedure as a substrate conveyance method according to the present embodiment.
8 is a flowchart for explaining a conveyance procedure as a substrate conveyance method according to the present embodiment.
FIG. 9: is a figure which shows the modified example of an upper board | substrate conveyance mechanism and a lower board | substrate conveyance mechanism, FIG. 9A is a horizontal cross section, and FIG. 9B is a longitudinal cross-sectional view.
10 is an enlarged cross-sectional view illustrating a modification of the pick in the upper substrate transfer mechanism and the lower substrate transfer mechanism.
11 is a perspective view schematically showing the configuration of a substrate processing system that performs a plasma etching process on a flat panel display after the seventh generation.
12 is a perspective view schematically showing the configuration of a substrate processing system that performs a plasma etching process on an eleventh generation flat panel display.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail, referring drawings.

1 is a plan view schematically showing the configuration of a substrate processing system according to an embodiment of the present invention. This substrate processing system is equipped with a plasma etching process sheet by sheet on a glass substrate of one side of 1.8 m or more in length, especially a glass substrate used for flat panel displays after the 11th generation. In addition, in FIG. 1, in order to make understanding of the structure of a substrate processing system easy, the load lock module 13 and the process chamber 11 mentioned later are shown using the horizontal cross section.

In FIG. 1, the substrate processing system 10 is a housing-shaped load lock module connected via a housing-shaped process chamber 11 (substrate processing apparatus) and the process chamber 11 and the gate valve 12. (13) (1st board | substrate conveyance apparatus) and the atmospheric system conveyance apparatus 14 connected to the said load lock module 13, and arrange | positioned so that it may oppose the process chamber 11 and the load lock module 13 between them ( 2nd board | substrate conveying apparatus) and the said atmospheric system conveying apparatus 14, and are rotated about 90 degrees with respect to the said atmospheric system conveying apparatus 14 from the load lock module 13 in clockwise and counterclockwise directions in a figure. The cassette 15 (substrate supply apparatus) and the cassette 16 (substrate accommodation apparatus) arrange | positioned at one position are provided. Moreover, the gate valve 17 is provided in the side surface which opposes the atmospheric system conveyance apparatus 14 of the load lock module 13.

The process chamber 11 accommodates the glass substrate G in the inside maintained by vacuum, and performs the plasma etching process on the glass substrate G using the plasma generate | occur | produced in the inside. Moreover, the process chamber 11 has the board | substrate mounting base 18 which mounts glass substrate G inside.

The load lock module 13 has an upper substrate conveyance mechanism 22 and a lower substrate conveyance mechanism 23 described later inside, and can switch the internal state to atmospheric / vacuum by an exhaust device or a pressure control valve (not shown). Consists of.

The cassette 15 is composed of a frame body that stocks a plurality of unprocessed glass substrates G. In the cassette 15, the plurality of unprocessed glass substrates G are parallel to each other and maintain a predetermined interval. To overlap. Moreover, the cassette 16 consists of a frame which stocks the several processed glass substrate G, and in the cassette 16, the several processed glass substrate G is parallel with each other, and has predetermined space | interval. Keep overlapping.

The atmospheric system conveying apparatus 14 has the conveying arm mechanism 19. The conveying arm mechanism 19 is exposed to the atmosphere to support a comb-shaped pick 20 on which the glass substrate G is mounted, and the pick 20, and also a scalable scalar arm (not shown). And a rotating base 21 supporting the scalar arm and being rotatable. The conveyance arm mechanism 19 carries out the unprocessed glass substrate G from the cassette 15 by expanding and contracting the scalar arm, and rotating the rotation base 21 to convey the upper substrate conveyance mechanism of the load lock module 13. It turns over to (22), the processed glass substrate G is received from the lower board | substrate conveyance mechanism 23 of the load lock module 13, and is accommodated in the cassette 16. As shown in FIG.

The gate valve 12 is closed at the time of the plasma etching process of the glass substrate G by the process chamber 11, and divides the inside of the process chamber 11 and the inside of the load lock module 13, and conveys an upper board | substrate. At the time of carrying in the process chamber 11 of the unprocessed glass substrate G by the mechanism 22, and at the time of carrying out from the process chamber 11 of the processed glass substrate G by the lower board | substrate conveyance mechanism 23 at the time of carrying out. Open to communicate the interior of the process chamber 11 and the interior of the loadlock module 13. In addition, when the internal state of the load lock module 13 is atmospheric, the gate valve 17 is opened so that the pick 20 of the transfer arm mechanism 19 can enter the inside of the load lock module 13. An opening is formed laterally, and when the internal state of the load lock module 13 is vacuum, it closes and divides the inside of the load lock module 13 from the outside.

By the way, as shown in FIG. 2, the board | substrate conveyance unit 200 used by the conventional substrate processing system is a substantially rectangular parallelepiped slide base 201 and the said slide base 201 supported by the rotating shaft (not shown). A lower pick base 202 and a slide base 201 mounted on the slide base 201 and slidable in a longitudinal direction of the slide base 201 (hereinafter, simply referred to as a “length direction”) and slide in the longitudinal direction of the slide base 201. Possible upper pick base 203. In the lower pick base 202 and the upper pick base 203, four long rod-shaped picks 204 and 205 extend in the longitudinal direction, respectively, and the lower pick base 202 and the upper pick base 203. ) Slides, each pick 204 and 205 enters a process chamber, and conveys the glass substrate G. As shown in FIG.

In this board | substrate conveying unit 200, the lower pick base 202 and the upper pick base 203 are thickened in the up-down direction, in order to ensure the installation rigidity with respect to the slide base 201 of each pick 204,205. do.

In the conventional substrate processing system, when the substrate conveying unit 200 is disposed in the load lock module, even if the gate valve forms an opening at the side of the process chamber, the substrate conveys the inside of the process chamber and the load lock module. Since the lower pick base 202 or the upper pick base 203 of the unit 200 is made thicker, the lower pick base 202 or the upper pick base 203 does not pass through the opening, and thus into the process chamber. You cannot enter. Therefore, it is necessary to increase the conveyable distance of glass substrate G by making the length of each pick 204 and 205 as long as possible.

The longer the length of each pick 204, 205, the greater the shaking of each pick 204, 205 during conveyance of the glass substrate G, and the heavier the weight of each pick 204, 205 becomes. . Therefore, in order to prevent the shaking of each pick 204 and 205 and to stably support each pick 204 and 205, it is necessary to make mounting stiffness to the slide base 201 of each pick 204 and 205 higher. There is. In order to make the installation stiffness of each pick 204 and 205 higher, not only the static stiffness of the lower pick base 202 or the upper pick base 203 but also the static stiffness of the slide base 201 need to be increased. It is also necessary to increase the thickness of the base 201.

Moreover, in the board | substrate conveyance unit 200, although the said board | substrate conveyance unit 200 whole rotates by rotating the slide base 201, in order to prevent the slide base 201 from bending by the inertia force at the time of rotation, it slides. It is necessary to make the static rigidity of the base 201 higher, and as a result, the thickness of the slide base 201 needs to be made larger.

By the way, when the thickness of the slide base 201 is made large, the board | substrate conveyance unit 200 will enlarge. In addition, as described above, since the picks 204 and 205 are configured to be as long as possible in the substrate transfer unit 200, the picks 204 and 205 are accommodated when the picks 204 and 205 are accommodated. Even when superimposed on the slide base 201, the substrate transfer unit 200 does not become very small. Therefore, as a result, the board | substrate conveyance unit 200 becomes large. As a result, the internal volume of the loadlock module needs to be increased.

Moreover, since the board | substrate conveyance unit 200 rotates, it is necessary to ensure the area | region which can be rotated inside the load lock module 13, and it is necessary to enlarge the internal volume of a load lock module more.

As the internal volume of the loadlock module increases, time is required for switching to the internal state of the air / vacuum, so that the manufacturing efficiency of the flat panel display cannot be improved.

In this embodiment, corresponding to this, the board | substrate conveyance unit is downsized and rotation of a board | substrate conveyance unit is unnecessary. Specifically, the size of the upper substrate conveyance mechanism and the lower substrate conveyance mechanism is reduced in size, and the upper substrate conveyance mechanism and the lower substrate conveyance mechanism are only conveyed the glass substrate G in only one direction. The board | substrate conveyance unit is comprised so that the replacement of the glass substrate G of this can be performed.

FIG. 3 is a cross-sectional view of a line A-A in FIG. 1, which is a cross-sectional view schematically showing the configuration of a load lock module as a first substrate transfer device in the substrate processing system according to the present embodiment.

3, the load lock module 13 is provided with the upper board | substrate conveyance mechanism 22 and the lower board | substrate conveyance mechanism 23 arrange | positioned so that it may overlap up and down in the figure inside the said load lock module 13, A plurality of buffer pins 24 (pin-shaped) protruding upward from the bottom toward the upper side in the drawing in the interior S of the load lock module 13 (hereinafter, simply referred to as "internal S"). Member) and an exhaust device or a pressure control valve (not shown) for switching the internal state of the load lock module 13 to atmosphere / vacuum.

The upper substrate conveyance mechanism 22 and the lower substrate conveyance mechanism 23 move up and down independently of each other. Specifically, the upper substrate conveyance mechanism 22 receives the unprocessed glass substrate G from the pick 20 of the conveyance arm mechanism 19, or the unprocessed glass substrate G through the process chamber 11. In order to secure the working space of the lower board | substrate conveyance mechanism 23, when the board | substrate handing-off position which is a position to carry in into and) and the lower board | substrate conveyance mechanism 23 carry out delivery of the glass substrate G, the upper board | substrate conveyance mechanism 22 ) Is moved up and down between the upper retreat position, which is the retreat destination. In the inside S, the upper retreat position is located above the substrate delivery position.

In addition, the lower board | substrate conveyance mechanism 23 carries out the processed glass substrate G to the position which carries out the processed glass substrate G from the process chamber 11, or to the pick 20 of the conveyance arm mechanism 19. FIG. The lower substrate conveyance mechanism 23 in order to ensure the working space of the upper substrate conveyance mechanism 22 when the board | substrate delivery position and the upper board | substrate conveyance mechanism 22 which carry out the transfer of the glass substrate G carry out. Moves up and down the lower retreat space, which is the retreat. In the inside S, the lower evacuation position is located below the substrate delivery position. In addition, the board | substrate delivery position of the upper board | substrate conveyance mechanism 22 and the board | substrate delivery position of the lower board | substrate conveyance mechanism 23 are the same.

FIG. 4: is a figure which shows roughly the structure of the upper board | substrate conveyance mechanism in FIG. 3, FIG. 4 (A) is sectional drawing for demonstrating the structure and operation | movement of an upper board | substrate conveyance mechanism, FIG. ) Is a sectional view of the line BB in FIG. 4A.

In FIGS. 4A and 4B, the upper substrate conveyance mechanisms 22 are four guide rails 25 parallel to each other and extending toward the process chamber 11 (on the right side in the drawing). A guide arm 27 (first middle) that shows a plate-shaped lifting base 26 (first base) on which (first guide) is arranged, and an elongated prismatic shape provided in correspondence with each guide rail 25. And a pick 28 (first upper sliding member) made of a thin plate body provided in correspondence with each guide arm 27. In the upper substrate conveyance mechanism 22, four picks 28 cooperate and mount one unprocessed glass substrate G.

In the upper board | substrate conveyance mechanism 22, as shown in FIG. 5, in the lifting base 26, it overlaps in order of the guide rail 25, the guide arm 27, and the pick 28 from below. The guide arm 27 has the guide groove 27a provided in the lower surface over the whole length, and it fits so that it can flow with the guide rail 25 via the said guide groove 27a. In addition, the pick 28 is formed by bending the thin plate into a U-shaped cross section so as to receive the guide arm 27 in the inner space formed by the U-shape so as to be fluidly fitted with the guide arm 27.

The upper substrate conveyance mechanism 22 has a drive source (not shown), and the guide arm 27 slides relatively with respect to the guide rail 25 toward the process chamber 11 by the driving force imparted by the drive source. The pick 28 also slides relative to the guide arm 27 towards the process chamber 11. At this time, the four guide arms 27 slide while maintaining the relative positional relationship with each other, and the four picks 28 also slide while maintaining the relative positional relationship with each other. Moreover, since each guide arm 27 and each pick 28 are slid in synchronization, the other side stops during either sliding movement of the guide arm 27 and the pick 28, and the upper substrate conveyance mechanism In (22), the occurrence of an impact can be prevented. Thereby, the positional deviation of the unprocessed glass substrate G mounted in the pick 28 can be prevented, and the unprocessed glass substrate G is mounted to the board | substrate mounting table 18 of the process chamber 11. It can be mounted correctly in a predetermined position in the.

In the upper substrate conveyance mechanism 22, when the guide arm 27 and the pick 28 are slid as far as possible toward the process chamber 11 side (states shown in FIGS. 4A and 4B). The length and the slidable range of the guide arm 27 and the pick 28 are set so that the unprocessed glass substrate G mounted on the pick 28 reaches the upper side of the substrate mounting table 18.

Moreover, in the upper board | substrate conveyance mechanism 22, the guide arm 27 and the pick 28 which slid as far as possible to the process chamber 11 side slide toward the atmospheric conveyance apparatus 14 by the drive force which a drive source gives. It moves and overlaps with the lifting base 26 (state shown in FIG. 3).

Hereinafter, when the guide arm 27 and the pick 28 slide to the process chamber 11 side as much as possible (state shown to FIG. 4 (A) and FIG. 4 (B)), it is called "extension state." When the guide arm 27 and the pick 28 slide as far as possible to the atmospheric conveyance apparatus 14 side (state shown in FIG. 3), it is called "shortened state." In addition, the upper substrate conveyance mechanism 22 can be shifted from the shortened state to the shortened state from the shortened state and the shortened state only when the upper substrate conveyance mechanism 22 is positioned at the substrate receiving position. .

FIG. 6: is a figure which shows roughly the structure of the lower board | substrate conveyance mechanism in FIG. 3, FIG. 6 (A) is sectional drawing for demonstrating the structure and operation | movement of a lower board | substrate conveyance mechanism, FIG. ) Is a sectional view of the line C-C in FIG. 6A.

In FIGS. 6A and 6B, the lower substrate transfer mechanisms 23 are parallel to each other and four guide rails extending toward the process chamber 11 (on the right side in the drawing). A guide arm 31 (second intermediate sliding motion) showing a plate-shaped lifting base 30 (second base) on which a (second guide) is disposed and an elongated prismatic shape provided corresponding to each guide rail 29. Member) and a pick 32 (second upper sliding member) consisting of three thin plates provided corresponding to the guide arms 31. In the lower board | substrate conveyance mechanism 23, four picks 32 cooperate and mount one processed glass substrate G.

In the lower board | substrate conveyance mechanism 23, as shown in FIG. 5, in the lifting base 30, the guide rail 29, the guide arm 31, and the pick 32 are overlapped in order from the bottom. The guide arm 31 has the guide groove 31a provided in the lower surface over the whole length, and it fits so that it can flow with the guide rail 29 via the said guide groove 31a. The pick 32 is formed by bending a thin plate into a U-shaped cross section, and fits the guide arm 31 in a flowable manner by accommodating the guide arm 31 in an inner space formed by a U-shape.

The lower board | substrate conveyance mechanism 23 has the drive source which is not shown in figure, The guide arm 31 slides with respect to the guide rail 29 toward the process chamber 11 by the drive force which this drive source gives, The pick 32 also slides relative to the guide arm 31 towards the process chamber 11. At this time, the four guide arms 31 slide while maintaining the relative positional relationship with each other, and the four picks 32 also slide while maintaining the relative positional relationship with each other. In addition, since each guide arm 31 and each pick 32 are slid in synchronization, the other side stops during the sliding movement of either the guide arm 31 and the pick 32 so that the lower substrate transfer mechanism 23 ) Can be prevented from occurring. Thereby, generation | occurrence | production of the positional deviation of the processed glass substrate G mounted in the pick 32 can be prevented.

In the lower board | substrate conveyance mechanism 23, when the guide arm 31 and the pick 32 were slid to the process chamber 11 side as much as possible (state shown to FIG. 6 (A) and FIG. 6 (B)). The length and the slidable range of the guide arm 31 and the pick 32 are set so that the pick 32 reaches above the substrate mount 18.

Moreover, in the lower substrate conveyance mechanism 23, the guide arm 31 and the pick 32 which slid as far as possible to the process chamber 11 side slide toward the atmospheric conveyance apparatus 14 by the drive force which a drive source gives. It moves and overlaps with the lifting base 30 (state shown in FIG. 3).

Hereinafter, when the guide arm 31 and the pick 32 slide to the process chamber 11 side as much as possible (the state shown to FIG. 6 (A) and FIG. 6 (B)), it is called "extension state." When the guide arm 31 and the pick 32 slide as far as possible to the atmospheric conveyance device 14 side (state shown in FIG. 3), it is called "shortened state." Moreover, only when it is located in a board | substrate receiving position, the lower board | substrate conveyance mechanism 23 can make a transition from a shortened state to a shortened state from an extended state and an extended state, and when it is located in a lower retracted position, it remains in a shortened state.

In the upper board | substrate conveyance mechanism 22, the through hole (not shown) is provided in the position corresponding to the several buffer pins 24 with respect to the lifting base 26, and each buffer pin 24 flows with each through hole. Fit it as much as possible. Further, in the lower substrate transfer mechanism 23, through holes (not shown) are provided at positions corresponding to the plurality of buffer pins 24 with respect to the lifting base 30, and each buffer pin 24 is provided with each through hole. Fit it in a flexible way. Therefore, regardless of the position of the upper substrate conveyance mechanism 22 or the position of the lower substrate conveyance mechanism 23, the plurality of buffer pins 24 can be vertically moved up and down. In addition, since the plurality of buffer pins 24 move up and down synchronously by a driving force from a driving source (not shown), when the plurality of buffer pins 24 move up and down while cooperatively supporting the glass substrate G, The supported glass substrate G does not incline. As a result, occurrence of the positional deviation of the glass substrate G can be prevented.

In addition, since the upper board | substrate conveyance mechanism 22 and the lower board | substrate conveyance mechanism 23 do not need to rotate as mentioned later, the inertial force by rotation does not act on each structural member, and in order to prevent curvature, It is not necessary to ensure the mounting rigidity of the constituent members as much as the stiffness of each constituent member of the upper substrate conveyance mechanism 203 and the lower substrate conveyance mechanism 204 in the conventional substrate conveyance unit 200. Therefore, in the upper board | substrate conveyance mechanism 22 and the lower board | substrate conveyance mechanism 23, each guide arm 27 does not need to connect with each other, and each guide arm 31 does not need to connect with each other. In addition, each pick 28 need not be connected to each other, and each pick 32 does not need to be connected to each other. Therefore, a connection member such as pick bases 202 and 203 in the conventional substrate transfer unit 200 is not necessary.

According to the substrate processing system 10 which concerns on this embodiment, the upper board | substrate conveyance mechanism 22 in the load lock module 13 makes it slide relatively with respect to the guide rail 25 of the lifting base 26. As shown in FIG. Since it has four guide arms 27 and four picks 28 sliding relatively with respect to the guide arm 27, the lifting base 26, guide arm 27, and pick 28 in the shortened state are provided. The upper substrate conveyance mechanism 22 can be made small by overlapping. In addition, the lower board | substrate conveyance mechanism 23 in the load lock module 13 has four guide arms 31 and guide arms 31 which slide relatively with respect to the guide rail 29 of the lifting base 30. Since it has four picks 32 which slide relative to), the lower board | substrate conveyance mechanism 23 is superimposed by overlapping the lifting base 30, the guide arm 31, and the pick 32 with respect to a short axis state. It can be made small. As a result, since the internal volume of the load lock module 13 can be reduced, there is no need for time to switch between standby / vacuum switching of the internal state of the load lock module 13. Thereby, the processing efficiency of glass substrate G can be improved.

In the substrate processing system 10 mentioned above, in the upper substrate conveyance mechanism 22, each guide arm 27 is not connected with each other, and each pick 28 is also not connected with each other. In addition, with respect to the lower board | substrate conveyance mechanism 23, each guide arm 31 is not connected with each other, while each pick 32 is also not connected with each other. Thereby, the connection member of the guide arm 27, the pick 28, the guide arm 31, and the pick 32 becomes unnecessary, and the upper board | substrate conveyance mechanism 22 and the lower board | substrate conveyance mechanism 23 are seen. It can be made small.

In addition, in the said embodiment, although the case where the board | substrate conveyance unit of the substrate processing system is equipped with four guide rails, the guide arm, and the pick, respectively was demonstrated, the number of the guide rail, the guide arm, and the pick is a glass substrate (G). The number is not particularly limited as long as the number can support and return.

Next, the board | substrate conveyance method which concerns on this embodiment is demonstrated.

7-8 is process drawing for demonstrating the conveyance procedure as the board | substrate conveyance method which concerns on this embodiment. This conveyance sequence is mainly performed by the load lock module 13 in the substrate processing system 10. 7 (A), 7 (C), 7 (E), 7 (G), 8 (A), 8 (C) and 8 (E). And (G) of FIG. 8 is sectional drawing about the line D-D in FIG. 1, FIG.7 (B), FIG.7 (D), FIG.7 (F), FIG.7 (H), FIG. 8B, FIG. 8D, FIG. 8F, and FIG. 8H are cross-sectional views taken along the line A-A in FIG. 1.

First, the upper board | substrate conveyance mechanism 22 is located in a board | substrate delivery position, and the lower board | substrate conveyance mechanism 23 is located in a lower retreat position. In addition, the plurality of buffer pins 24 rise through each of the through holes of the lifting base 30, and stand by at a predetermined position. Thereafter, the gate valve 17 (not shown) opens, and the pick 20 on which the unprocessed glass substrate G is mounted enters the interior S, and the glass substrate G is transferred to the upper substrate transfer mechanism 22. Is conveyed to the upper part of () (FIG. 7 (A), FIG. 7 (B)).

The pick 20 is then lowered to bring the lower surface of the glass substrate G into contact with each buffer pin 24, and then the pick 20 is further lowered. Thereby, the glass substrate G is spaced apart from the pick 20, and each buffer pin 24 supports the glass substrate G. (FIG. 7C, FIG. 7D).

Subsequently, the pick 20 exits from the inside S, and the gate valve 17 closes, and the exhaust device or the pressure control valve switches the internal state of the load lock module 13 to vacuum. In addition, two positioners 33 contact the edges of the untreated glass substrate G to adjust the position of the untreated glass substrate G (FIG. 7E and FIG. 7F). .

In addition, about position correction of the glass substrate G regarding the sliding direction (the conveyance direction of the glass substrate G) of the guide arms 27 and 31 and the picks 28 and 32, for example, a glass substrate ( Deviation in the stretching direction of the glass substrate G is detected by the deviation amount sensor (not shown) provided separately in the state where G) is hold | maintained in the pick 20 of the conveyance arm mechanism 19, and the detected deviation By performing position correction with the scalar arm which supports the pick 20 on the basis of this, position correction can also be performed without contacting the positioner 33 to glass substrate G. As shown in FIG.

Subsequently, the upper substrate conveyance mechanism 22 rises, and even after the pick 28 contacts the lower surface of the glass substrate G, the upper substrate conveyance mechanism 22 rises to an upper retreat position (first raising step). Thereby, the upper substrate conveyance mechanism 22 receives the unprocessed glass substrate G. As shown in FIG. Thereafter, the plurality of buffer pins 24 descend, the lower substrate transfer mechanism 23 rises to the substrate receiving position (first raising step), and the gate valve 12 opens.

Subsequently, the lower substrate conveyance mechanism 23 slides the guide arm 31 and the pick 32 to the process chamber 11 side as much as possible, and the plurality of pusher pins is removed from the substrate mounting table 18 of the process chamber 11. The processed glass substrate G lifted by (not shown) is received by the pick 32 ((G) of FIG. 7, (H) of FIG. 7), and also the guide arm 31 and The pick 32 is slid as far as possible to the atmospheric conveyance apparatus 14 side, and the processed glass substrate G is carried out from the process chamber 11, and it is conveyed to just above the lower substrate conveyance mechanism 23 (carrying out) step).

Next, the lower substrate conveyance mechanism 23 on which the processed glass substrate G is mounted descends to the lower retreat position, and the upper substrate conveyance mechanism 22 descends to the substrate delivery position (falling step). Thereafter, the upper substrate transfer mechanism 22 slides the guide arm 27 and the pick 28 to the process chamber 11 side as much as possible, and protrudes from the substrate mounting table 18 of the process chamber 11. The unprocessed glass substrate G is received by the pusher pin (not shown) of (FIG. 8A, FIG. 8B) (import step).

Subsequently, the upper substrate conveyance mechanism 22 slides the guide arm 27 and the pick 28 toward the atmospheric conveyance device 14 as much as possible, transitions to the shortened state, and ascends to the upper retreat position (second raising step). ). Thereafter, the plurality of buffer pins 24 are raised and continue to rise even after separating the processed glass substrate G mounted on the pick 32 of the lower substrate transfer mechanism 23 from the pick 32. The glass substrate G of the process completion is raised to a predetermined position (3rd raising step). Moreover, the two positioners 33 adjust the position of the processed glass substrate G by contacting the edge of the processed glass substrate G (FIG. 8C, FIG. 8D). .

In addition, about the position correction regarding the conveyance direction of glass substrate G, when glass substrate G is carried in to the load lock module 13 from the above-mentioned atmospheric system conveyance apparatus 14 (FIG.7 (A)). 7B, the position correction is performed without contacting the positioner 33 to the glass substrate G, for example, by performing the position correction with the scalar arm supporting the pick 20. FIG. It may be.

Subsequently, the gate valve 12 is closed, and the exhaust device or the pressure control valve switches the internal state of the load lock module 13 to the atmosphere. Thereafter, the gate valve 17 is opened, and the pick 20 enters the interior S and is located immediately below the processed glass substrate G (FIG. 8E, FIG. 8 ( F)).

Subsequently, the pick 20 is raised to rise to a predetermined position even after contacting the bottom surface of the processed glass substrate G to separate the processed glass substrate G from the plurality of buffer pins 24. Thereby, the pick 20 receives the processed glass substrate G (FIG. 8G, FIG. 8H) (2nd receiving step).

Next, the pick 20 on which the processed glass substrate G is mounted is withdrawn from the inside S, and this conveyance procedure is complete | finished.

According to the conveyance procedure as the board | substrate conveyance method which concerns on this embodiment, since the load lock module 13 is connected only to one process chamber 11, the load lock module 13 is provided with respect to one process chamber 11 What is necessary is just to carry in and out of glass substrate G. Moreover, the upper board | substrate conveyance mechanism 22 does not inhibit carrying in and out of the glass substrate G by the lower board | substrate conveyance mechanism 23 by raising, and lower board | substrate conveyance mechanism 23 lowers, and upper board | substrate conveyance is carried out. The carrying in and out of the glass substrate G by the mechanism 22 are not impaired. Therefore, the upper substrate conveyance mechanism 22 and the lower substrate conveyance mechanism 23 do not need to rotate.

If the upper substrate conveyance mechanism 22 and the lower substrate conveyance mechanism 23 do not rotate, the inertial force by rotation does not act on each component member of the upper substrate conveyance mechanism 22 and the lower substrate conveyance mechanism 23, In order to prevent bending due to inertial force, the static stiffness of each constituent member may be made as high as the static stiffness of each constituent member of the upper substrate conveyance mechanism 203 and the lower substrate conveyance mechanism 204 in the conventional substrate conveyance unit 200. There is no need. As a result, the lifting bases 26 and 30, the guide arms 27 and 31, and the picks 28 and 32 are made thin. For example, it can be comprised with thickness 100mm or less, and the upper board | substrate conveyance mechanism 22 and the lower board | substrate conveyance mechanism 23 can be made smaller.

In addition, since the guide arms 27 and 31 can be made thin, the guide arms 27 and 31 can pass through the opening of the side surface of the process chamber 11 in an extended state. As a result, even if it does not comprise the picks 28 and 32 too long, the conveyable distance of glass substrate G can be ensured more than a desired value. That is, since the picks 28 and 32 can be configured short, it is not necessary to increase the installation rigidity of the picks 28 and 32 in order to prevent the picks 28 and 32 from shaking. As a result, there is no need to increase the static rigidity of the guide arms 27 and 31 to which the picks 28 and 32 are mounted, and the lifting bases 26 and 30 to which the guide arms 27 and 31 are mounted. By this, the guide arms 27 and 31 and the lifting bases 26 and 30 can be configured thinner. As a result, the upper substrate conveyance mechanism 22 and the lower substrate conveyance mechanism 23 can be made smaller.

As described above, since the internal volume of the load lock module 13 can be reduced, there is no need for time to switch between standby / vacuum switching of the internal state of the load lock module 13. Thereby, the processing efficiency of glass substrate G can be improved.

In the above-described substrate processing system 10, each guide arm 27, each pick 28, each guide arm 31 and each pick 32 are not connected to each other, but may be connected to each other by a connecting member. . For example, as shown in FIG. 9 (A) and FIG. 9 (B), each guide arm 27 is connected to each other by the arm base 34 as a connecting member, and each guide arm 31 is connected. It may be connected by this arm base 35.

In the substrate processing system 10 described above, the pick 28 and the pick 32 are formed by bending a thin plate into a U-shaped cross section, but may be formed by a simple thin plate as shown in FIG. 10. . In this case, it is preferable to provide a slit on the surface of the guide arms 27 and 31 to provide a guide such as a pin on the lower surface of the picks 28 and 32 so that the pin can be fitted to the slit in a flowable manner.

In addition, in the substrate processing system 10 mentioned above, although the upper substrate conveyance mechanism 22 conveyed the unprocessed glass substrate G, and the lower substrate conveyance mechanism 23 conveyed the processed glass substrate G, The upper substrate conveyance mechanism 22 may convey the processed glass substrate G, and the lower substrate conveyance mechanism 23 may convey the unprocessed glass substrate G. FIG.

Moreover, in the above-mentioned substrate processing system 10, when the pick-up and the pick-up of the glass substrate G were carried out between the buffer pin 24 and the pick 20, the pick 20 was raised and received, but the buffer ( 24) may move up and down to perform delivery.

As mentioned above, although this invention was demonstrated using the said embodiment, this invention is not limited to the said embodiment.

G: Glass Substrate 10: Substrate Processing System
11: process chamber 13: loadlock module
22 upper substrate transport mechanism 23 lower substrate transport mechanism
24: buffer pin 25, 29: guide rail
26, 30: lifting base 27, 31: guide arm
28, 32: pick

Claims (7)

One substrate processing apparatus for processing a substrate in a vacuum state, a first substrate transfer apparatus connected to the substrate processing apparatus and switching an internal state to atmospheric / vacuum, and a connection to the first substrate transfer apparatus And a second substrate conveying apparatus arranged to face each other with the substrate processing apparatus and the first substrate conveying apparatus interposed therebetween, wherein the second substrate conveying apparatus is the substrate to the first substrate conveying apparatus in a standby state. In the substrate processing system which carries out the carrying out of the said board | substrate, and the said 1st board | substrate conveying apparatus performs the carrying out of the said board | substrate with respect to the said substrate processing apparatus,
The said 1st board | substrate conveying apparatus is arrange | positioned so that it may overlap up and down inside the said 1st board | substrate conveying apparatus, and has an upper substrate conveyance mechanism and a lower substrate conveyance mechanism which move up and down independently of each other,
The upper substrate conveyance mechanism is provided in correspondence with each of the first guides and a first base on which a plurality of first guides arranged in parallel to each other and extending toward the substrate processing apparatus are disposed, and is directed toward the substrate processing apparatus. A plurality of elongate first intermediate sliding members that slide relative to the first guide, and corresponding to the respective first intermediate sliding members, the first intermediate toward the substrate processing apparatus; Has a plurality of elongate first upper sliding members that slide relative to the sliding member,
The lower substrate conveyance mechanism is provided corresponding to each of the second bases and a plurality of second bases arranged in parallel with each other and extending toward the substrate processing apparatus and each of the second guides, and toward the substrate processing apparatus. A plurality of elongated second intermediate sliding members that slide relative to the second guide, and corresponding to each of the second intermediate sliding members, the second intermediate sliding member facing the substrate processing apparatus; Has a plurality of elongate second upper sliding members relatively sliding relative to,
Each of the plurality of first upper sliding members and the plurality of second upper sliding members mounts the substrate.
Substrate processing system. The method of claim 1,
In the inside of the said 1st board | substrate conveyance apparatus, it is provided with the several pin-shaped member which can protrude toward below from above, It characterized by the above-mentioned.
Substrate processing system. The method according to claim 1 or 2,
The substrate is rectangular, and the length of one side is 1.8 m or more.
Substrate processing system. The method according to claim 1 or 2,
In the upper substrate transfer mechanism, the respective first intermediate sliding members and the first upper sliding members are slid synchronously,
In the lower substrate transfer mechanism, the respective second intermediate sliding members and the second upper sliding members are synchronously slid.
Substrate processing system. The method according to claim 1 or 2,
The first intermediate sliding members are not connected to each other in the upper substrate conveyance mechanism, and the second intermediate sliding members are not connected to each other in the lower substrate conveyance mechanism.
Substrate processing system. The method according to claim 1 or 2,
The first upper sliding members are not connected to each other in the upper substrate conveying mechanism, and the second upper sliding members are not connected to each other in the lower substrate conveying mechanism.
Substrate processing system. One substrate processing apparatus for processing a substrate in a vacuum state, a first substrate transfer apparatus connected to the substrate processing apparatus and switching an internal state to air / vacuum, and the substrate connected to the first substrate transfer apparatus And a second substrate transfer device disposed to face each other with the processing device and the first substrate transfer device interposed therebetween, wherein the second substrate transfer device is capable of carrying in and out of the substrate to and from the first substrate transfer device in a standby state. And the first substrate transfer device is a substrate processing system for carrying in and out of the substrate with respect to the substrate processing apparatus.
The said 1st board | substrate conveyance apparatus is arrange | positioned so that it may overlap up and down in the inside of the said 1st board | substrate conveyance apparatus, and it moves up and down independently of each other, and the inside of the said 1st board | substrate conveyance mechanism and the lower substrate conveyance mechanism The upper substrate conveyance mechanism has a 1st base in which the several 1st guides which are parallel and mutually extended toward the said substrate processing apparatus are arrange | positioned, A plurality of elongate first intermediate sliding members provided in correspondence with each of the first guides and sliding relative to the first guide toward the substrate processing apparatus, and corresponding to the respective first intermediate sliding members And relative to the first intermediate sliding member toward the substrate processing apparatus. A second base having a plurality of elongated first upper sliding members, the lower substrate conveying mechanism having a plurality of second guides parallel to each other and extending toward the substrate processing apparatus; A plurality of elongate second intermediate sliding members provided in correspondence with the respective second guides and sliding relative to the second guide toward the substrate processing apparatus, and corresponding to the respective second intermediate sliding members And a plurality of elongated second upper sliding members that slide relative to the second intermediate sliding member toward the substrate processing apparatus, and the plurality of first upper sliding members and the plurality of first upper sliding members. Each of the second upper sliding members of the substrate mounts the substrate. In the plate conveying method,
A first receiving step of receiving, by the upper substrate conveying mechanism, an unprocessed substrate carried by the second substrate conveying apparatus;
A first raising step of raising the upper substrate conveyance mechanism and the lower substrate conveyance mechanism;
A carrying-out step of the lower substrate conveying mechanism sliding the second intermediate sliding member and the second upper sliding member to carry out a processed substrate from the substrate processing apparatus;
A lowering step of lowering the upper substrate conveyance mechanism and the lower substrate conveyance mechanism;
An importing step in which the upper substrate conveying mechanism slides the first intermediate sliding member and the first upper sliding member to bring the unprocessed substrate into the substrate processing apparatus;
A second raising step of raising only the upper substrate carrying mechanism;
A third ascending step of causing the plurality of pin-shaped members to protrude to lift the processed substrate away from the lower substrate transfer mechanism;
The said 2nd board | substrate conveying apparatus has a 2nd receiving step which receives the said processed board | substrate of the raise, characterized by the above-mentioned.
Substrate conveying method.

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