JP5606182B2 - 固体撮像装置 - Google Patents

固体撮像装置 Download PDF

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Publication number
JP5606182B2
JP5606182B2 JP2010149477A JP2010149477A JP5606182B2 JP 5606182 B2 JP5606182 B2 JP 5606182B2 JP 2010149477 A JP2010149477 A JP 2010149477A JP 2010149477 A JP2010149477 A JP 2010149477A JP 5606182 B2 JP5606182 B2 JP 5606182B2
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Japan
Prior art keywords
substrate
pixel
solid
state imaging
imaging device
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JP2010149477A
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English (en)
Japanese (ja)
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JP2012015275A5 (enExample
JP2012015275A (ja
Inventor
峰生 下津佐
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Canon Inc
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Canon Inc
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Publication date
Priority to JP2010149477A priority Critical patent/JP5606182B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Priority to CN201180032170.2A priority patent/CN102959706B/zh
Priority to PCT/JP2011/003594 priority patent/WO2012001923A1/en
Priority to KR1020137001697A priority patent/KR101421904B1/ko
Priority to US13/806,999 priority patent/US9196643B2/en
Priority to EP11800394.6A priority patent/EP2589081B1/en
Publication of JP2012015275A publication Critical patent/JP2012015275A/ja
Publication of JP2012015275A5 publication Critical patent/JP2012015275A5/ja
Application granted granted Critical
Publication of JP5606182B2 publication Critical patent/JP5606182B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/766—Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2010149477A 2010-06-30 2010-06-30 固体撮像装置 Active JP5606182B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2010149477A JP5606182B2 (ja) 2010-06-30 2010-06-30 固体撮像装置
PCT/JP2011/003594 WO2012001923A1 (en) 2010-06-30 2011-06-23 Solid-state imaging device
KR1020137001697A KR101421904B1 (ko) 2010-06-30 2011-06-23 고체 촬상 디바이스
US13/806,999 US9196643B2 (en) 2010-06-30 2011-06-23 Solid-state imaging device having photoelectric conversion units on a first substrate and a plurality of circuits on a second substrate
CN201180032170.2A CN102959706B (zh) 2010-06-30 2011-06-23 固态成像装置
EP11800394.6A EP2589081B1 (en) 2010-06-30 2011-06-23 Solid-state imaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010149477A JP5606182B2 (ja) 2010-06-30 2010-06-30 固体撮像装置

Publications (3)

Publication Number Publication Date
JP2012015275A JP2012015275A (ja) 2012-01-19
JP2012015275A5 JP2012015275A5 (enExample) 2013-08-15
JP5606182B2 true JP5606182B2 (ja) 2014-10-15

Family

ID=45401666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010149477A Active JP5606182B2 (ja) 2010-06-30 2010-06-30 固体撮像装置

Country Status (6)

Country Link
US (1) US9196643B2 (enExample)
EP (1) EP2589081B1 (enExample)
JP (1) JP5606182B2 (enExample)
KR (1) KR101421904B1 (enExample)
CN (1) CN102959706B (enExample)
WO (1) WO2012001923A1 (enExample)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
US12463076B2 (en) * 2010-12-16 2025-11-04 Monolithic 3D Inc. 3D semiconductor device and structure
JP6016434B2 (ja) 2012-04-23 2016-10-26 キヤノン株式会社 固体撮像装置、その製造方法、及びカメラ
US8766387B2 (en) 2012-05-18 2014-07-01 Taiwan Semiconductor Manufacturing Company, Ltd. Vertically integrated image sensor chips and methods for forming the same
US9406711B2 (en) * 2012-06-15 2016-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for backside illuminated image sensors
JP2014022561A (ja) * 2012-07-18 2014-02-03 Sony Corp 固体撮像装置、及び、電子機器
CN109285825B (zh) * 2017-07-21 2021-02-05 联华电子股份有限公司 芯片堆叠结构及管芯堆叠结构的制造方法
DE102019109844B4 (de) 2018-11-21 2025-03-20 Taiwan Semiconductor Manufacturing Co., Ltd. Bondstruktur von dies mit hängenden bonds und verfahren zu deren herstellung
US10861808B2 (en) * 2018-11-21 2020-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Bonding structure of dies with dangling bonds
JP6775206B2 (ja) * 2019-02-27 2020-10-28 パナソニックＩｐマネジメント株式会社 撮像装置
US11062679B2 (en) * 2019-09-06 2021-07-13 Sony Semiconductor Solutions Corporations Imaging devices and imaging apparatuses, and methods for the same
CN114930807A (zh) * 2020-01-31 2022-08-19 索尼半导体解决方案公司 摄像装置和摄像方法
US11251210B2 (en) * 2020-02-07 2022-02-15 Sensors Unlimited, Inc. Pin diodes with over-current protection

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2911519B2 (ja) * 1990-02-06 1999-06-23 キヤノン株式会社 光電変換装置
JP4035194B2 (ja) * 1996-03-13 2008-01-16 キヤノン株式会社 Ｘ線検出装置及びｘ線検出システム
US6635970B2 (en) * 2002-02-06 2003-10-21 International Business Machines Corporation Power distribution design method for stacked flip-chip packages
KR100610481B1 (ko) * 2004-12-30 2006-08-08 매그나칩 반도체 유한회사 수광영역을 넓힌 이미지센서 및 그 제조 방법
KR100782463B1 (ko) 2005-04-13 2007-12-05 (주)실리콘화일 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법
TWI429066B (zh) * 2005-06-02 2014-03-01 新力股份有限公司 Semiconductor image sensor module and manufacturing method thereof
JP4529834B2 (ja) 2005-07-29 2010-08-25 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および撮像装置
JP4723994B2 (ja) * 2005-12-19 2011-07-13 株式会社東芝 固体撮像装置
JP2007228460A (ja) * 2006-02-27 2007-09-06 Mitsumasa Koyanagi 集積センサを搭載した積層型半導体装置
US20070236590A1 (en) * 2006-03-31 2007-10-11 Cypress Semiconductor Corporation Output auto-zero for CMOS active pixel sensors
KR100801447B1 (ko) 2006-06-19 2008-02-11 (주)실리콘화일 배면 광 포토다이오드를 이용한 이미지센서 및 그 제조방법
US7361989B1 (en) * 2006-09-26 2008-04-22 International Business Machines Corporation Stacked imager package
US8049256B2 (en) 2006-10-05 2011-11-01 Omnivision Technologies, Inc. Active pixel sensor having a sensor wafer connected to a support circuit wafer
JP5223343B2 (ja) * 2008-01-10 2013-06-26 株式会社ニコン 固体撮像素子
JP5006281B2 (ja) * 2008-07-24 2012-08-22 パナソニック株式会社 固体撮像装置、カメラ
JP4799594B2 (ja) * 2008-08-19 2011-10-26 株式会社東芝 固体撮像装置およびその製造方法
JP4835710B2 (ja) * 2009-03-17 2011-12-14 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器
JP5853351B2 (ja) * 2010-03-25 2016-02-09 ソニー株式会社 半導体装置、半導体装置の製造方法、及び電子機器

Also Published As

Publication number Publication date
US9196643B2 (en) 2015-11-24
CN102959706B (zh) 2015-08-05
EP2589081B1 (en) 2015-10-07
WO2012001923A1 (en) 2012-01-05
KR20130020844A (ko) 2013-02-28
JP2012015275A (ja) 2012-01-19
CN102959706A (zh) 2013-03-06
EP2589081A4 (en) 2013-11-20
KR101421904B1 (ko) 2014-07-22
US20130112854A1 (en) 2013-05-09
EP2589081A1 (en) 2013-05-08

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