JP5596166B2 - 真空処理装置 - Google Patents
真空処理装置 Download PDFInfo
- Publication number
- JP5596166B2 JP5596166B2 JP2012539587A JP2012539587A JP5596166B2 JP 5596166 B2 JP5596166 B2 JP 5596166B2 JP 2012539587 A JP2012539587 A JP 2012539587A JP 2012539587 A JP2012539587 A JP 2012539587A JP 5596166 B2 JP5596166 B2 JP 5596166B2
- Authority
- JP
- Japan
- Prior art keywords
- roller
- vacuum processing
- sheet
- vacuum
- drum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3325—Problems associated with coating large area
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Description
Claims (3)
- 長尺のシート状基材の一部が巻回されるドラムと、このドラムの下方に配置されて、上流側からシート状基材をドラムへと案内すると共に当該ドラムからシート状基材を下流側に送る複数のローラと、これらのローラ上方でドラムの周囲に設けられた少なくとも1個の処理ユニットとを有する真空処理室と、
ドラムの軸線方向に直交する方向を連設方向とし、真空処理室の上流側に接続管を介して連設され、シート状基材が巻回される繰出しローラと、この繰出しローラから繰り出されたシート状基材を、接続管内を通して上記真空処理室へと送る少なくとも1個のガイドローラとを有する上流側の真空補助室と、
真空処理室の下流側に接続管を介して連設され、シート状基材を巻き取る巻取りローラと、上記真空処理室から接続管内を通して送られたシート状基材を巻取りローラへと案内する少なくとも1個のローラとを備えた下流側の真空補助室と、を備え、
上記真空処理室が、床面に設置される架台上に載置されるベースプレートに、下面に開口した第1の箱体をその下面側から設置して画成され、この第1の箱体の前記軸線一側面に開口部が形成され、この開口部を覆う開閉扉が開閉自在に装着され、これら複数のローラが、軸線方向に所定間隔を存して配置される一対の支持体に夫々軸架されて一体のローラユニットとして構成され、このローラユニットを軸線方向に移動可能とする第1ガイド手段を有し、
上記上流側及び下流側の両真空補助室が、床面に設置される架台上に載置されるベースプレートに、下面に開口した第2及び第3の箱体をその下面側から夫々設置して画成されるように、構成したことを特徴とする真空処理装置。 - 請求項1記載の真空処理装置であって、前記処理ユニットがターゲットを備えたスパッタリング成膜用のカソードユニットであるものにおいて、
前記第1の箱体の一側面に対向する他側面に、カソードユニットの数に応じた複数の透孔が形成され、この透孔を通してカソードユニットがドラム周囲に挿設され、
カソードユニットの各々は、当該カソードユニットの挿設方向後側で前記他側面に密着して前記透孔を覆う支持板と、その前側に設けられる支持部材との間に軸架され、この支持部材を、ターゲットのスパッタ面がドラムに対向する姿勢でドラム周囲に案内する第2ガイド手段を更に備えることを特徴とする真空処理装置。 - 前記下流側の真空補助室にて、前記巻取りローラの上流側でシート状基材に対向させて、または前記ローラに対向させて冷却パネルを設けたことを特徴とする請求項1または請求項2記載の真空処理装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012539587A JP5596166B2 (ja) | 2010-10-20 | 2011-10-14 | 真空処理装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010235830 | 2010-10-20 | ||
JP2010235830 | 2010-10-20 | ||
JP2012539587A JP5596166B2 (ja) | 2010-10-20 | 2011-10-14 | 真空処理装置 |
PCT/JP2011/005773 WO2012053171A1 (ja) | 2010-10-20 | 2011-10-14 | 真空処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012053171A1 JPWO2012053171A1 (ja) | 2014-02-24 |
JP5596166B2 true JP5596166B2 (ja) | 2014-09-24 |
Family
ID=45974902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012539587A Active JP5596166B2 (ja) | 2010-10-20 | 2011-10-14 | 真空処理装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5596166B2 (ja) |
KR (1) | KR20130101096A (ja) |
CN (1) | CN103180484B (ja) |
TW (1) | TWI444496B (ja) |
WO (1) | WO2012053171A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6196078B2 (ja) * | 2012-10-18 | 2017-09-13 | 株式会社アルバック | 成膜装置 |
JP5849934B2 (ja) * | 2012-11-16 | 2016-02-03 | 住友金属鉱山株式会社 | 真空成膜装置と真空成膜方法 |
JP5969953B2 (ja) | 2013-05-31 | 2016-08-17 | 株式会社神戸製鋼所 | 成膜装置 |
JP6097195B2 (ja) * | 2013-10-10 | 2017-03-15 | 日東電工株式会社 | スパッタ装置およびスパッタ装置のメンテナンス方法 |
JP7027057B2 (ja) * | 2017-07-18 | 2022-03-01 | 株式会社アルバック | 基板搬送装置 |
JP6930878B2 (ja) * | 2017-08-28 | 2021-09-01 | 株式会社アルバック | 真空処理装置 |
CN112779507B (zh) * | 2019-11-11 | 2024-02-09 | 株式会社新柯隆 | 成膜装置 |
JP7305565B2 (ja) * | 2020-01-17 | 2023-07-10 | 株式会社アルバック | 真空処理装置 |
CN113862632B (zh) * | 2021-09-24 | 2023-06-30 | 北京北方华创真空技术有限公司 | 一种柔性镀膜设备的真空腔室 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11350136A (ja) * | 1998-06-11 | 1999-12-21 | Sony Corp | 真空成膜装置 |
JP2001519971A (ja) * | 1996-07-09 | 2001-10-23 | ラム リサーチ コーポレイション | 搬送室およびその製造方法 |
JP2001344750A (ja) * | 2000-06-01 | 2001-12-14 | Fuji Photo Film Co Ltd | コーティング装置 |
JP2002030430A (ja) * | 2000-07-17 | 2002-01-31 | Sony Corp | スパッタ装置 |
JP2005015830A (ja) * | 2003-06-25 | 2005-01-20 | Toppan Printing Co Ltd | 薄膜形成装置 |
JP2006322055A (ja) * | 2005-05-20 | 2006-11-30 | Kobe Steel Ltd | 連続成膜装置 |
-
2011
- 2011-10-14 JP JP2012539587A patent/JP5596166B2/ja active Active
- 2011-10-14 CN CN201180050821.0A patent/CN103180484B/zh active Active
- 2011-10-14 KR KR1020137012748A patent/KR20130101096A/ko not_active Application Discontinuation
- 2011-10-14 WO PCT/JP2011/005773 patent/WO2012053171A1/ja active Application Filing
- 2011-10-18 TW TW100137718A patent/TWI444496B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001519971A (ja) * | 1996-07-09 | 2001-10-23 | ラム リサーチ コーポレイション | 搬送室およびその製造方法 |
JPH11350136A (ja) * | 1998-06-11 | 1999-12-21 | Sony Corp | 真空成膜装置 |
JP2001344750A (ja) * | 2000-06-01 | 2001-12-14 | Fuji Photo Film Co Ltd | コーティング装置 |
JP2002030430A (ja) * | 2000-07-17 | 2002-01-31 | Sony Corp | スパッタ装置 |
JP2005015830A (ja) * | 2003-06-25 | 2005-01-20 | Toppan Printing Co Ltd | 薄膜形成装置 |
JP2006322055A (ja) * | 2005-05-20 | 2006-11-30 | Kobe Steel Ltd | 連続成膜装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI444496B (zh) | 2014-07-11 |
KR20130101096A (ko) | 2013-09-12 |
CN103180484A (zh) | 2013-06-26 |
WO2012053171A1 (ja) | 2012-04-26 |
JPWO2012053171A1 (ja) | 2014-02-24 |
CN103180484B (zh) | 2015-02-04 |
TW201250038A (en) | 2012-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5596166B2 (ja) | 真空処理装置 | |
JP6559347B2 (ja) | 保持装置 | |
JP6360882B2 (ja) | フレキシブル基板のための堆積プラットフォーム及びその操作方法 | |
JP3732250B2 (ja) | インライン式成膜装置 | |
EP2762608B1 (en) | Gas separation by adjustable separation wall | |
EP2762607B1 (en) | Deposition source with adjustable electrode | |
WO2015086168A1 (en) | A processing apparatus for processing devices, particularly devices including organic materials therein, and method for transferring an evaporation source from a processing vacuum chamber to a maintenance vacuum chamber or from the maintenance vacuum chamber to the processing vacuum chamber | |
US10648072B2 (en) | Vacuum processing system and method for mounting a processing system | |
JP2019506534A (ja) | 真空処理システム及び真空処理を行う方法 | |
EP2762609A1 (en) | Common deposition platform, processing station and method of operation thereof | |
US20160273102A1 (en) | Tape-substrate coating line having a magnetron arrangement | |
KR101790565B1 (ko) | 그래핀 필름 제조장치 | |
JP2014078601A (ja) | 成膜装置用基板搬送トレイ、及び外部開閉駆動装置 | |
TWI647743B (zh) | 用於處理基板上薄膜之設備,以及用於提供氣密製程分離壁之方法 | |
JP2014015633A (ja) | 成膜装置、及び成膜装置用搬送トレイ | |
JP2007077478A (ja) | 成膜方法及び成膜装置 | |
JP4739445B2 (ja) | 基板処理装置 | |
JP7244362B2 (ja) | 搬送室 | |
KR101288132B1 (ko) | 이송장치를 구비한 챔버 | |
JPH062954B2 (ja) | 薄膜製造装置 | |
JPS6134178A (ja) | 真空処理装置 | |
TW202334472A (zh) | 用於將材料沉積到薄膜基板上的真空處理系統、用於在真空條件下傳輸薄膜基板的設備和方法 | |
JP5908857B2 (ja) | 成膜装置 | |
EP2916350A1 (en) | Interleaf structure for a processing apparatus and processing apparatus with interleaf structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140729 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140806 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5596166 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |