JP5585982B2 - 絶縁性高分子材料組成物 - Google Patents
絶縁性高分子材料組成物 Download PDFInfo
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- JP5585982B2 JP5585982B2 JP2010053968A JP2010053968A JP5585982B2 JP 5585982 B2 JP5585982 B2 JP 5585982B2 JP 2010053968 A JP2010053968 A JP 2010053968A JP 2010053968 A JP2010053968 A JP 2010053968A JP 5585982 B2 JP5585982 B2 JP 5585982B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/548—Silicon-containing compounds containing sulfur
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
- C08L91/005—Drying oils
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L97/00—Compositions of lignin-containing materials
- C08L97/005—Lignin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/32—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes natural resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
- Epoxy Resins (AREA)
Description
本発明の実施例1に係る絶縁性高分子材料組成物は、エポキシ化亜麻仁油とピロガロールからなる植物由来の樹脂組成物に、フライアッシュ及びシランカップリング剤を添加したものである。実施例1では、エポキシ基を有するシランカップリング剤を添加した。
本発明の実施例2に係る絶縁性高分子材料組成物は、エポキシ化亜麻仁油とピロガロールからなる植物由来の樹脂組成物に、フライアッシュ及びシランカップリング剤を添加したものである。実施例2では、アミノ基を有するシランカップリング剤を添加した。
本発明の実施例3に係る絶縁性高分子材料組成物は、エポキシ化亜麻仁油とピロガロールからなる植物由来の樹脂組成物に、フライアッシュ及びシランカップリング剤を添加したものである。実施例3では、メルカプト基を有するシランカップリング剤を添加した。
Claims (6)
- エポキシ化亜麻仁油と、没食子酸誘導体またはリグニンと、を相溶させた液状エポキシ樹脂組成物に、
石炭灰と、
シランカップリング剤と、を添加し、加熱処理する
ことを特徴とする絶縁性高分子材料組成物。 - 前記シランカップリング剤はエポキシ基を有する
ことを特徴とする請求項1に記載の絶縁性高分子材料組成物。 - 前記シランカップリング剤はメルカプト基を有する
ことを特徴とする請求項1に記載の絶縁性高分子材料組成物。 - 前記シランカップリング剤は、複数種類のシランカップリング剤を組み合わせたものである
ことを特徴とする請求項1から請求項3のいずれか1項に記載の絶縁性高分子材料組成物。 - 前記没食子酸誘導体は、ピロガロール、没食子酸メチル、没食子酸エチル、没食子酸プロピル、没食子酸イソプロピル、没食子酸ペンチル、没食子酸イソペンチル、没食子酸ヘキサデシル、没食子酸ヘプタデシル、没食子酸オクタデシルのいずれか1種類以上を含有する
ことを特徴とする請求項1から請求項4のいずれか1項に記載の絶縁性高分子材料組成物。 - 請求項1から請求項5のいずれかに記載した絶縁性高分子材料組成物を、少なくとも一部に含んで構成される電力機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010053968A JP5585982B2 (ja) | 2010-03-11 | 2010-03-11 | 絶縁性高分子材料組成物 |
CN201180013320.5A CN102791761B (zh) | 2010-03-11 | 2011-03-09 | 绝缘性高分子材料组合物 |
PCT/JP2011/055461 WO2011111727A1 (ja) | 2010-03-11 | 2011-03-09 | 絶縁性高分子材料組成物 |
US13/583,813 US20130005858A1 (en) | 2010-03-11 | 2011-03-09 | Insulating polymer material composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010053968A JP5585982B2 (ja) | 2010-03-11 | 2010-03-11 | 絶縁性高分子材料組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011184645A JP2011184645A (ja) | 2011-09-22 |
JP5585982B2 true JP5585982B2 (ja) | 2014-09-10 |
Family
ID=44563527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010053968A Active JP5585982B2 (ja) | 2010-03-11 | 2010-03-11 | 絶縁性高分子材料組成物 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130005858A1 (ja) |
JP (1) | JP5585982B2 (ja) |
CN (1) | CN102791761B (ja) |
WO (1) | WO2011111727A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3056002A4 (en) * | 2013-10-07 | 2017-03-22 | LG Electronics Inc. | Method for encoding and decoding a media signal and apparatus using the same |
US9988317B2 (en) | 2016-08-16 | 2018-06-05 | Go Team CCR LLC | Structures constructed using coal combustion materials |
US9790703B1 (en) | 2016-08-16 | 2017-10-17 | Go Team CCR LLC | Methods of utilizing coal combustion residuals and structures constructed using such coal combustion residuals |
KR101915897B1 (ko) * | 2017-06-01 | 2018-11-06 | 정태혁 | 발열장치를 구비한 방열기 |
CN108948768A (zh) * | 2018-07-25 | 2018-12-07 | 河北弘之木环保科技股份有限公司 | 一种高绝缘性能的生物纤维和塑料复合材料的制备方法 |
CN110105717B (zh) * | 2019-05-31 | 2021-06-01 | 国网河南省电力公司邓州市供电公司 | 一种碳纤维复合芯导线及其制备方法 |
CN113402848B (zh) * | 2021-06-30 | 2022-05-17 | 四川大学 | 用于强韧化环氧树脂的生物基纳米组装固化剂及制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH059270A (ja) * | 1991-06-24 | 1993-01-19 | Sumitomo Bakelite Co Ltd | 樹脂組成物およびその製造方法 |
US6384152B2 (en) * | 1999-07-19 | 2002-05-07 | Siemens Westinghouse Power Corporation | Insulating resin of epoxy resin, epoxy diluent, phenolic accelerator and organotin catalyst |
JP4363077B2 (ja) * | 2002-07-12 | 2009-11-11 | 三菱化学株式会社 | 活性エネルギー線硬化性組成物及びハードコートフィルム |
JP2005105245A (ja) * | 2003-01-10 | 2005-04-21 | Nec Corp | ケナフ繊維強化樹脂組成物 |
TWI340763B (en) * | 2003-02-20 | 2011-04-21 | Nippon Kayaku Kk | Seal agent for photoelectric conversion elements and photoelectric conversion elements using such seal agent |
CA2515825A1 (en) * | 2003-02-24 | 2004-09-02 | Kaneka Corporation | Curable compositions |
CN101223207B (zh) * | 2005-07-29 | 2012-02-29 | 住友电木株式会社 | 环氧树脂组合物和半导体装置 |
JP2008257978A (ja) * | 2007-04-04 | 2008-10-23 | Meidensha Corp | 高電圧機器用絶縁性組成物 |
JP2007211252A (ja) * | 2007-04-23 | 2007-08-23 | Nitto Denko Corp | フライアッシュ粉体を用いた半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP5229787B2 (ja) * | 2008-01-15 | 2013-07-03 | 株式会社明電舎 | 絶縁性高分子材料組成物 |
JP2009292884A (ja) * | 2008-06-03 | 2009-12-17 | Hitachi Ltd | リグノフェノール系エポキシ樹脂組成物 |
JP2010031092A (ja) * | 2008-07-25 | 2010-02-12 | Panasonic Electric Works Co Ltd | 植物由来樹脂成形品 |
-
2010
- 2010-03-11 JP JP2010053968A patent/JP5585982B2/ja active Active
-
2011
- 2011-03-09 WO PCT/JP2011/055461 patent/WO2011111727A1/ja active Application Filing
- 2011-03-09 US US13/583,813 patent/US20130005858A1/en not_active Abandoned
- 2011-03-09 CN CN201180013320.5A patent/CN102791761B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102791761B (zh) | 2017-02-08 |
CN102791761A (zh) | 2012-11-21 |
WO2011111727A1 (ja) | 2011-09-15 |
US20130005858A1 (en) | 2013-01-03 |
JP2011184645A (ja) | 2011-09-22 |
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