JP5585576B2 - 電子部品の製造方法 - Google Patents
電子部品の製造方法 Download PDFInfo
- Publication number
- JP5585576B2 JP5585576B2 JP2011508278A JP2011508278A JP5585576B2 JP 5585576 B2 JP5585576 B2 JP 5585576B2 JP 2011508278 A JP2011508278 A JP 2011508278A JP 2011508278 A JP2011508278 A JP 2011508278A JP 5585576 B2 JP5585576 B2 JP 5585576B2
- Authority
- JP
- Japan
- Prior art keywords
- insulator layer
- layer
- conductor
- electronic component
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 47
- 239000004020 conductor Substances 0.000 claims description 142
- 239000012212 insulator Substances 0.000 claims description 73
- 238000000034 method Methods 0.000 claims description 42
- 238000000206 photolithography Methods 0.000 claims description 21
- 238000010304 firing Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 11
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011508278A JP5585576B2 (ja) | 2009-04-07 | 2010-03-01 | 電子部品の製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009092558 | 2009-04-07 | ||
JP2009092558 | 2009-04-07 | ||
JP2011508278A JP5585576B2 (ja) | 2009-04-07 | 2010-03-01 | 電子部品の製造方法 |
PCT/JP2010/053241 WO2010116819A1 (ja) | 2009-04-07 | 2010-03-01 | 電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010116819A1 JPWO2010116819A1 (ja) | 2012-10-18 |
JP5585576B2 true JP5585576B2 (ja) | 2014-09-10 |
Family
ID=42936107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011508278A Active JP5585576B2 (ja) | 2009-04-07 | 2010-03-01 | 電子部品の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5585576B2 (zh) |
CN (1) | CN102369583B (zh) |
WO (1) | WO2010116819A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5585740B1 (ja) * | 2013-03-18 | 2014-09-10 | 株式会社村田製作所 | 積層型インダクタ素子および通信装置 |
JP6558302B2 (ja) * | 2016-05-26 | 2019-08-14 | 株式会社村田製作所 | 電子部品 |
JP7200499B2 (ja) * | 2018-04-26 | 2023-01-10 | Tdk株式会社 | 積層コイル部品 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002305116A (ja) * | 2001-01-31 | 2002-10-18 | Matsushita Electric Ind Co Ltd | チップ型電子部品及びその製造方法 |
JP2002367833A (ja) * | 2001-06-13 | 2002-12-20 | Fdk Corp | 積層チップインダクタ |
JP2004179585A (ja) * | 2002-11-29 | 2004-06-24 | Murata Mfg Co Ltd | 積層チップ部品の製造方法 |
JP2009076719A (ja) * | 2007-09-21 | 2009-04-09 | Panasonic Corp | チップ型lc複合素子 |
JP2009260106A (ja) * | 2008-04-18 | 2009-11-05 | Panasonic Corp | 電子部品 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6798064B1 (en) * | 2000-07-12 | 2004-09-28 | Motorola, Inc. | Electronic component and method of manufacture |
JP2005250448A (ja) * | 2004-02-05 | 2005-09-15 | Sharp Corp | 電子素子、表示素子及びその製造方法 |
-
2010
- 2010-03-01 JP JP2011508278A patent/JP5585576B2/ja active Active
- 2010-03-01 CN CN201080014395.0A patent/CN102369583B/zh active Active
- 2010-03-01 WO PCT/JP2010/053241 patent/WO2010116819A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002305116A (ja) * | 2001-01-31 | 2002-10-18 | Matsushita Electric Ind Co Ltd | チップ型電子部品及びその製造方法 |
JP2002367833A (ja) * | 2001-06-13 | 2002-12-20 | Fdk Corp | 積層チップインダクタ |
JP2004179585A (ja) * | 2002-11-29 | 2004-06-24 | Murata Mfg Co Ltd | 積層チップ部品の製造方法 |
JP2009076719A (ja) * | 2007-09-21 | 2009-04-09 | Panasonic Corp | チップ型lc複合素子 |
JP2009260106A (ja) * | 2008-04-18 | 2009-11-05 | Panasonic Corp | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
CN102369583A (zh) | 2012-03-07 |
JPWO2010116819A1 (ja) | 2012-10-18 |
CN102369583B (zh) | 2013-10-23 |
WO2010116819A1 (ja) | 2010-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6047934B2 (ja) | 電子部品及びその製造方法 | |
US9653209B2 (en) | Method for producing electronic component | |
JP5807650B2 (ja) | 積層コイル及びその製造方法 | |
WO2007080680A1 (ja) | インダクタの製造方法 | |
WO2006011291A1 (ja) | 電子部品の製造方法および親基板および電子部品 | |
KR20150014390A (ko) | 적층 코일 | |
JP2009206110A (ja) | 電子部品 | |
US10847301B2 (en) | Electronic component | |
JP2007180428A (ja) | 電子部品及びその製造方法 | |
JP5585576B2 (ja) | 電子部品の製造方法 | |
JP5212309B2 (ja) | 電子部品及びその製造方法 | |
JP6911369B2 (ja) | 積層コイル部品の製造方法 | |
TWI481321B (zh) | Electronic parts and manufacturing methods thereof | |
JP5531897B2 (ja) | 電子部品の製造方法 | |
JP2012204475A (ja) | 積層電子部品 | |
JP2011198973A (ja) | 電子部品の製造方法 | |
JP2017199797A (ja) | 電子部品 | |
JP5527048B2 (ja) | セラミック多層基板 | |
JP2008010674A (ja) | 電子部品の製造方法及び電子部品 | |
JP6844333B2 (ja) | 積層コイル部品の製造方法 | |
JP2008177365A (ja) | 電子部品製造方法 | |
WO2004093105A1 (ja) | 多層配線基板形成に用いられる異材質部を有するシート形成方法および異材質部を有するシート | |
JP2022137791A (ja) | 積層コイル部品の製造方法 | |
JP2004031591A (ja) | 多層回路部品及びその製造方法 | |
JP6024826B2 (ja) | 積層型インダクタ素子とその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130806 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131002 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20131002 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140513 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140529 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140624 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140707 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5585576 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |