JP5580143B2 - レーザ照射装置 - Google Patents
レーザ照射装置 Download PDFInfo
- Publication number
- JP5580143B2 JP5580143B2 JP2010188839A JP2010188839A JP5580143B2 JP 5580143 B2 JP5580143 B2 JP 5580143B2 JP 2010188839 A JP2010188839 A JP 2010188839A JP 2010188839 A JP2010188839 A JP 2010188839A JP 5580143 B2 JP5580143 B2 JP 5580143B2
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- laser
- cooling water
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- irradiation apparatus
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- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21C—NUCLEAR REACTORS
- G21C17/00—Monitoring; Testing ; Maintaining
- G21C17/017—Inspection or maintenance of pipe-lines or tubes in nuclear installations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
- B23K26/128—Laser beam path enclosures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21C—NUCLEAR REACTORS
- G21C19/00—Arrangements for treating, for handling, or for facilitating the handling of, fuel or other materials which are used within the reactor, e.g. within its pressure vessel
- G21C19/02—Details of handling arrangements
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21C—NUCLEAR REACTORS
- G21C19/00—Arrangements for treating, for handling, or for facilitating the handling of, fuel or other materials which are used within the reactor, e.g. within its pressure vessel
- G21C19/20—Arrangements for introducing objects into the pressure vessel; Arrangements for handling objects within the pressure vessel; Arrangements for removing objects from the pressure vessel
- G21C19/207—Assembling, maintenance or repair of reactor components
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21C—NUCLEAR REACTORS
- G21C17/00—Monitoring; Testing ; Maintaining
- G21C17/003—Remote inspection of vessels, e.g. pressure vessels
- G21C17/01—Inspection of the inner surfaces of vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Description
置に関する。
レーザを用いた保全・補修を行うレーザ照射装置であって、レーザ発振器を収容し水中に
配置される環境隔離容器と、レーザを集光して施工部に照射するレーザ照射ヘッドと、前
記レーザ発振器から前記レーザ照射ヘッドまでレーザを伝送する導光部と、前記レーザ発
振器に電力を供給する電源装置と、前記レーザ発振器に冷却水供給経路を介して冷却水を
供給する冷却水供給装置と、前記環境隔離容器内部を、前記レーザ発振器が配置され前記
レーザの経路を含む第1の空間と、前記第1の空間の外側に位置する第2の空間とに分離
する気室隔壁と、を備えることを特徴とする。
2 環境隔離容器
3 ミラーボックス
4 レーザ照射ヘッド
5 導光部
6 電源装置
7 レーザ発振器用ケーブル
8 冷却水供給装置
9 冷却水供給ホース
10 冷却水回収ホース
11 遠隔駆動装置
12 遠隔駆動装置制御盤
13 遠隔駆動装置用ケーブル
21 レーザ発振器
22 シャッター
23 光検出器
41 集光レンズ
42 ノズル
51 ポンピングチャンバ
52 偏光板
53 Qスイッチ
54 λ/4板
55 リアミラー
56 アウトプットカプラ
57 SHG
58 ダイクロイックミラー
59 ダンパー
61 媒質
62 斜面
63 環境保持液体
64 気室隔壁
65 レーザ発振器設置空間
66 隔離空間
67 配管
68 環境保持液体供給ホース
69 環境保持液体回収ホース
70 ポンプ
71 不純物除去装置
72 冷却水排出ホース
Claims (9)
- 水中に配置され、レーザを用いた保全・補修を行うレーザ照射装置であって、
レーザ発振器を収容し水中に配置される環境隔離容器と、
レーザを集光して施工部に照射するレーザ照射ヘッドと、
前記レーザ発振器から前記レーザ照射ヘッドまでレーザを伝送する導光部と、
前記レーザ発振器に電力を供給する電源装置と、
前記レーザ発振器に冷却水供給経路を介して冷却水を供給する冷却水供給装置と、
前記環境隔離容器内部を、前記レーザ発振器が配置され前記レーザの経路を含む第1の空
間と、前記第1の空間の外側に位置する第2の空間とに分離する気室隔壁と、を備えるこ
とを特徴とするレーザ照射装置。 - 前記環境隔離容器内の温度を計測する温度センサと、
前記冷却水供給装置から供給する前記冷却水の温度と流量の少なくとも何れかを前記温度
センサの計測結果に基づいて制御することを特徴とする請求項1記載のレーザ照射装置。 - 前記導光部内のレーザが通過する部分の少なくとも一部が透明媒質で構成されることを
特徴とする請求項1記載のレーザ照射装置。 - 前記第2の空間内が気体雰囲気または真空とされていることを特徴とする請求項1記載
のレーザ照射装置。 - 前記第2の空間内に断熱材が配置されていることを特徴とする請求項1記載のレーザ照
射装置。 - 記第2の空間と前記レーザ発振器を連絡する配管を備え、前記冷却水供給装置から供給
される前記冷却水は、前記レーザ発振器を通過した後に前記配管を介して前記第2の空間
に供給されることを特徴とする請求項1記載のレーザ照射装置。 - 前記第2の空間に注入された環境保持液体を備えることを特徴とする請求項1記載のレ
ーザ照射装置。 - 前記第2の空間と連絡し、前記第2の空間への前記環境保持液体の供給及び前記第2の
空間内の前記環境保持液体の回収を行い、前記第2の空間へ供給する前記環境保持液体の
温度を調整する温度調整機を備えることを特徴とする請求項1記載のレーザ照射装置。 - 前記冷却水供給装置は、前記環境隔離容器とともに水中に配置されるポンプと、前記ポ
ンプから前記レーザ発振器への冷却水供給経路に配置され前記冷却水中の不純物を除去す
る不純物除去装置から構成され、前記ポンプはその周囲の水を冷却水として前記レーザ発
振器に供給することを特徴とする請求項1記載のレーザ照射装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010188839A JP5580143B2 (ja) | 2009-08-25 | 2010-08-25 | レーザ照射装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009194840 | 2009-08-25 | ||
JP2009194840 | 2009-08-25 | ||
JP2010188839A JP5580143B2 (ja) | 2009-08-25 | 2010-08-25 | レーザ照射装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011067869A JP2011067869A (ja) | 2011-04-07 |
JP5580143B2 true JP5580143B2 (ja) | 2014-08-27 |
Family
ID=43627541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010188839A Active JP5580143B2 (ja) | 2009-08-25 | 2010-08-25 | レーザ照射装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9583225B2 (ja) |
EP (1) | EP2472525B1 (ja) |
JP (1) | JP5580143B2 (ja) |
KR (1) | KR101377832B1 (ja) |
WO (1) | WO2011024419A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101429601B1 (ko) * | 2012-10-05 | 2014-08-14 | 두산중공업 주식회사 | 원자로의 레이저 피닝 장치 |
JP5956360B2 (ja) * | 2013-02-15 | 2016-07-27 | 日立Geニュークリア・エナジー株式会社 | ウォータージェットピーニング方法 |
CN104480476B (zh) * | 2014-11-12 | 2017-02-22 | 江苏大学 | 一种金属损伤件激光热力组合再制造方法 |
JP6430219B2 (ja) * | 2014-11-17 | 2018-11-28 | 株式会社東芝 | レーザ加工装置及びレーザ加工方法 |
EP3228405A4 (en) * | 2014-12-30 | 2018-09-19 | Yuanmeng Precision Technology (Shenzhen) Institut | Electron beam melting and laser milling composite 3d printing apparatus |
KR20160114900A (ko) | 2015-03-25 | 2016-10-06 | 두산중공업 주식회사 | 레이저 피닝 장치 |
CN104759753B (zh) * | 2015-03-30 | 2016-08-31 | 江苏大学 | 多系统自动化协调工作提高激光诱导空化强化的方法 |
KR102224003B1 (ko) * | 2015-12-11 | 2021-03-05 | 기아자동차 주식회사 | 레이저 빔 각인 시스템 및 이를 제어하는 방법 |
CN105458501A (zh) * | 2015-12-29 | 2016-04-06 | 苏州润昇精密机械有限公司 | 具有断电保护功能的激光焊接机 |
JP6758914B2 (ja) * | 2016-05-24 | 2020-09-23 | 株式会社東芝 | レーザーピーニング装置およびレーザーピーニング方法 |
US11433476B2 (en) * | 2018-04-23 | 2022-09-06 | Lsp Technologies, Inc. | Apparatus for laser peening hidden surfaces |
CN113423532B (zh) * | 2019-02-13 | 2024-04-02 | 大学共同利用机关法人自然科学研究机构 | 激光加工装置及激光加工方法 |
CN110948107A (zh) * | 2019-12-12 | 2020-04-03 | 北京航天控制仪器研究所 | 一种原子气室熔封装置及方法 |
CN113070572B (zh) * | 2021-04-06 | 2022-03-29 | 华中科技大学 | 一种水下焊接装置及方法 |
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US3588737A (en) * | 1968-04-22 | 1971-06-28 | Electro Nuclear Lab Inc | Thermally stabilized laser |
JPS6487713A (en) * | 1987-09-29 | 1989-03-31 | Toshiba Corp | Laser control equipment |
JPH08288571A (ja) * | 1995-04-20 | 1996-11-01 | Hitachi Ltd | 原子炉炉内処理装置及び処理方法 |
JP3102322B2 (ja) * | 1995-10-31 | 2000-10-23 | 日立電線株式会社 | 炭酸ガスレーザ光を用いた基板の加工方法およびその加工装置 |
US6163012A (en) * | 1996-09-27 | 2000-12-19 | Kabushiki Kaisha Toshiba | Laser maintaining and repairing apparatus |
JP2000317661A (ja) * | 1999-05-07 | 2000-11-21 | Hitachi Engineering & Services Co Ltd | レーザビームによる切断方法および装置並びに原子炉廃炉を解体するときの黒鉛ブロックの切断方法 |
JP2000317658A (ja) * | 1999-05-10 | 2000-11-21 | Kubota Corp | レーザ加工装置 |
JP3414356B2 (ja) * | 2000-04-05 | 2003-06-09 | 東京ラヂエーター製造株式会社 | レーザー加工機 |
US20020122525A1 (en) * | 2000-07-27 | 2002-09-05 | Stefan Rosenberger | Removal and collection of particulate from water filled tanks |
JP2002045371A (ja) * | 2000-08-01 | 2002-02-12 | Nidek Co Ltd | レーザ治療装置 |
JP2003311458A (ja) * | 2002-04-19 | 2003-11-05 | Nippon Steel Corp | 光ファイバ冷却装置 |
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EP1742049B1 (en) * | 2005-07-07 | 2009-12-09 | Kabushiki Kaisha Toshiba | Laser-based maintenance apparatus |
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JP2008030098A (ja) * | 2006-07-31 | 2008-02-14 | Sunx Ltd | レーザ加工装置 |
US7532652B2 (en) * | 2007-02-20 | 2009-05-12 | The Boeing Company | Laser thermal management systems and methods |
-
2010
- 2010-08-20 WO PCT/JP2010/005142 patent/WO2011024419A1/ja active Application Filing
- 2010-08-20 EP EP10811478.6A patent/EP2472525B1/en not_active Not-in-force
- 2010-08-20 KR KR1020127007443A patent/KR101377832B1/ko active IP Right Grant
- 2010-08-25 JP JP2010188839A patent/JP5580143B2/ja active Active
-
2012
- 2012-02-24 US US13/404,608 patent/US9583225B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2472525A4 (en) | 2015-01-14 |
WO2011024419A1 (ja) | 2011-03-03 |
US20120205349A1 (en) | 2012-08-16 |
KR20120048692A (ko) | 2012-05-15 |
JP2011067869A (ja) | 2011-04-07 |
KR101377832B1 (ko) | 2014-03-26 |
EP2472525B1 (en) | 2016-06-01 |
EP2472525A1 (en) | 2012-07-04 |
US9583225B2 (en) | 2017-02-28 |
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