JP5572045B2 - シート貼付装置及び貼付方法 - Google Patents
シート貼付装置及び貼付方法 Download PDFInfo
- Publication number
- JP5572045B2 JP5572045B2 JP2010201863A JP2010201863A JP5572045B2 JP 5572045 B2 JP5572045 B2 JP 5572045B2 JP 2010201863 A JP2010201863 A JP 2010201863A JP 2010201863 A JP2010201863 A JP 2010201863A JP 5572045 B2 JP5572045 B2 JP 5572045B2
- Authority
- JP
- Japan
- Prior art keywords
- adherend
- adhesive sheet
- sheet
- support surface
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 12
- 239000000853 adhesive Substances 0.000 claims description 86
- 230000001070 adhesive effect Effects 0.000 claims description 86
- 238000001514 detection method Methods 0.000 claims description 42
- 238000003825 pressing Methods 0.000 claims description 16
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000004744 fabric Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010201863A JP5572045B2 (ja) | 2010-09-09 | 2010-09-09 | シート貼付装置及び貼付方法 |
TW100130499A TWI517291B (zh) | 2010-09-09 | 2011-08-25 | Sheet attachment and attachment method |
KR1020110088771A KR101854655B1 (ko) | 2010-09-09 | 2011-09-02 | 시트 첩부 장치 및 첩부 방법 |
CN201110279056.1A CN102403196B (zh) | 2010-09-09 | 2011-09-06 | 薄片粘贴装置及粘贴方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010201863A JP5572045B2 (ja) | 2010-09-09 | 2010-09-09 | シート貼付装置及び貼付方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012059928A JP2012059928A (ja) | 2012-03-22 |
JP5572045B2 true JP5572045B2 (ja) | 2014-08-13 |
Family
ID=45885282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010201863A Expired - Fee Related JP5572045B2 (ja) | 2010-09-09 | 2010-09-09 | シート貼付装置及び貼付方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5572045B2 (zh) |
KR (1) | KR101854655B1 (zh) |
CN (1) | CN102403196B (zh) |
TW (1) | TWI517291B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5557352B2 (ja) * | 2012-04-20 | 2014-07-23 | Necエンジニアリング株式会社 | シート切断装置、チップ製造装置、シート切断方法、チップ製造方法及びシート切断プログラム |
JP5918025B2 (ja) * | 2012-05-22 | 2016-05-18 | 株式会社ディスコ | 保護部材および保護テープ貼着方法 |
JP6045817B2 (ja) * | 2012-05-28 | 2016-12-14 | 株式会社ディスコ | 貼着方法 |
JP6145331B2 (ja) * | 2013-06-19 | 2017-06-07 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP6219197B2 (ja) * | 2014-02-26 | 2017-10-25 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP6543152B2 (ja) * | 2015-09-30 | 2019-07-10 | リンテック株式会社 | シート貼付装置および貼付方法並びに接着シート原反 |
JP6550501B1 (ja) * | 2018-05-08 | 2019-07-24 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4311522B2 (ja) * | 2002-03-07 | 2009-08-12 | 日東電工株式会社 | 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法 |
JP4447280B2 (ja) * | 2003-10-16 | 2010-04-07 | リンテック株式会社 | 表面保護用シートおよび半導体ウエハの研削方法 |
CN100547752C (zh) * | 2005-05-19 | 2009-10-07 | 琳得科株式会社 | 粘附装置 |
JP4795743B2 (ja) * | 2005-05-19 | 2011-10-19 | リンテック株式会社 | 貼付装置 |
JP4452691B2 (ja) * | 2005-08-04 | 2010-04-21 | リンテック株式会社 | シート切断装置及び切断方法 |
JP2007288010A (ja) * | 2006-04-19 | 2007-11-01 | Lintec Corp | シート切断装置及び切断方法 |
JP4988640B2 (ja) * | 2008-03-31 | 2012-08-01 | リンテック株式会社 | シート貼付装置及び貼付方法 |
-
2010
- 2010-09-09 JP JP2010201863A patent/JP5572045B2/ja not_active Expired - Fee Related
-
2011
- 2011-08-25 TW TW100130499A patent/TWI517291B/zh active
- 2011-09-02 KR KR1020110088771A patent/KR101854655B1/ko active IP Right Grant
- 2011-09-06 CN CN201110279056.1A patent/CN102403196B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI517291B (zh) | 2016-01-11 |
KR101854655B1 (ko) | 2018-05-04 |
CN102403196A (zh) | 2012-04-04 |
KR20120026450A (ko) | 2012-03-19 |
CN102403196B (zh) | 2016-05-11 |
TW201216402A (en) | 2012-04-16 |
JP2012059928A (ja) | 2012-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5572045B2 (ja) | シート貼付装置及び貼付方法 | |
JP4913550B2 (ja) | シート貼付装置及び貼付方法 | |
JP2007019240A (ja) | シート貼付装置 | |
JP5586093B2 (ja) | シート貼付装置及び貼付方法 | |
JP2009253083A (ja) | シート貼付装置及び貼付方法 | |
JP2012004290A (ja) | シート剥離装置及び剥離方法 | |
JP5567436B2 (ja) | シート貼付装置及びシート貼付方法 | |
JP6069020B2 (ja) | シート貼付装置および貼付方法 | |
JP2013071809A (ja) | シート貼付装置及び貼付方法、並びに、シート製造装置及び製造方法 | |
JP5554100B2 (ja) | シート切断方法およびシート切断装置 | |
JP5113646B2 (ja) | シート貼付装置及び貼付方法 | |
JP5093852B2 (ja) | シート貼付装置及び貼付方法 | |
JP5421748B2 (ja) | シート剥離装置及び剥離方法 | |
JP4963692B2 (ja) | 半導体ウエハ処理装置及び処理方法 | |
JP2007019241A (ja) | シート剥離装置及び剥離方法 | |
JP3186062U (ja) | シート剥離装置 | |
JP3225184U (ja) | 支持装置 | |
JP5564409B2 (ja) | シート剥離装置及び剥離方法 | |
JP3225183U (ja) | 支持装置 | |
JP5902033B2 (ja) | シート貼付装置および貼付方法、並びに、シート形成装置および形成方法 | |
JP5421749B2 (ja) | シート剥離装置及び剥離方法 | |
JP4913772B2 (ja) | シート貼付装置及び貼付方法 | |
JP2017216343A (ja) | シート貼付装置および貼付方法 | |
JP2012099643A (ja) | 接着シート製造装置及び製造方法、並びに、シート貼付装置及び貼付方法 | |
JP5113600B2 (ja) | シート貼付装置及び貼付方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130613 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140320 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140401 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140624 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140627 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5572045 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |