KR101854655B1 - 시트 첩부 장치 및 첩부 방법 - Google Patents

시트 첩부 장치 및 첩부 방법 Download PDF

Info

Publication number
KR101854655B1
KR101854655B1 KR1020110088771A KR20110088771A KR101854655B1 KR 101854655 B1 KR101854655 B1 KR 101854655B1 KR 1020110088771 A KR1020110088771 A KR 1020110088771A KR 20110088771 A KR20110088771 A KR 20110088771A KR 101854655 B1 KR101854655 B1 KR 101854655B1
Authority
KR
South Korea
Prior art keywords
adhesive sheet
sheet
adherend
concave portion
wafer
Prior art date
Application number
KR1020110088771A
Other languages
English (en)
Korean (ko)
Other versions
KR20120026450A (ko
Inventor
코이치 야마구치
요타 아오키
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20120026450A publication Critical patent/KR20120026450A/ko
Application granted granted Critical
Publication of KR101854655B1 publication Critical patent/KR101854655B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020110088771A 2010-09-09 2011-09-02 시트 첩부 장치 및 첩부 방법 KR101854655B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010201863A JP5572045B2 (ja) 2010-09-09 2010-09-09 シート貼付装置及び貼付方法
JPJP-P-2010-201863 2010-09-09

Publications (2)

Publication Number Publication Date
KR20120026450A KR20120026450A (ko) 2012-03-19
KR101854655B1 true KR101854655B1 (ko) 2018-05-04

Family

ID=45885282

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110088771A KR101854655B1 (ko) 2010-09-09 2011-09-02 시트 첩부 장치 및 첩부 방법

Country Status (4)

Country Link
JP (1) JP5572045B2 (zh)
KR (1) KR101854655B1 (zh)
CN (1) CN102403196B (zh)
TW (1) TWI517291B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5557352B2 (ja) * 2012-04-20 2014-07-23 Ｎｅｃエンジニアリング株式会社 シート切断装置、チップ製造装置、シート切断方法、チップ製造方法及びシート切断プログラム
JP5918025B2 (ja) * 2012-05-22 2016-05-18 株式会社ディスコ 保護部材および保護テープ貼着方法
JP6045817B2 (ja) * 2012-05-28 2016-12-14 株式会社ディスコ 貼着方法
JP6145331B2 (ja) * 2013-06-19 2017-06-07 リンテック株式会社 シート貼付装置および貼付方法
JP6219197B2 (ja) * 2014-02-26 2017-10-25 リンテック株式会社 シート貼付装置および貼付方法
JP6543152B2 (ja) * 2015-09-30 2019-07-10 リンテック株式会社 シート貼付装置および貼付方法並びに接着シート原反
JP6550501B1 (ja) * 2018-05-08 2019-07-24 リンテック株式会社 シート貼付装置およびシート貼付方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257898A (ja) 2002-03-07 2003-09-12 Nitto Denko Corp 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法
JP2006352054A (ja) 2005-05-19 2006-12-28 Lintec Corp 貼付装置
JP2009246196A (ja) 2008-03-31 2009-10-22 Lintec Corp シート貼付装置及び貼付方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4447280B2 (ja) * 2003-10-16 2010-04-07 リンテック株式会社 表面保護用シートおよび半導体ウエハの研削方法
CN100547752C (zh) * 2005-05-19 2009-10-07 琳得科株式会社 粘附装置
JP4452691B2 (ja) * 2005-08-04 2010-04-21 リンテック株式会社 シート切断装置及び切断方法
JP2007288010A (ja) * 2006-04-19 2007-11-01 Lintec Corp シート切断装置及び切断方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257898A (ja) 2002-03-07 2003-09-12 Nitto Denko Corp 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法
JP2006352054A (ja) 2005-05-19 2006-12-28 Lintec Corp 貼付装置
JP2009246196A (ja) 2008-03-31 2009-10-22 Lintec Corp シート貼付装置及び貼付方法

Also Published As

Publication number Publication date
CN102403196A (zh) 2012-04-04
TWI517291B (zh) 2016-01-11
JP2012059928A (ja) 2012-03-22
CN102403196B (zh) 2016-05-11
JP5572045B2 (ja) 2014-08-13
KR20120026450A (ko) 2012-03-19
TW201216402A (en) 2012-04-16

Similar Documents

Publication Publication Date Title
KR101854655B1 (ko) 시트 첩부 장치 및 첩부 방법
JP2008078287A (ja) 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置
JP4971841B2 (ja) シート貼付装置及び貼付方法
JP2007019240A (ja) シート貼付装置
JP5695466B2 (ja) シート貼付装置および貼付方法
JP5586093B2 (ja) シート貼付装置及び貼付方法
JP5501062B2 (ja) シート貼付装置および貼付方法
JP2012004290A (ja) シート剥離装置及び剥離方法
JP2012059930A (ja) シート貼付ローラ及びこれを用いたシート貼付装置並びにシート貼付方法
KR102064727B1 (ko) 시트 부착 장치 및 장치의 대형화 방지 방법
JP5554100B2 (ja) シート切断方法およびシート切断装置
JP5570271B2 (ja) マウント装置およびマウント方法
JP4746012B2 (ja) 貼付装置及び貼付方法
JP6145330B2 (ja) シート貼付装置および貼付方法
JP5113600B2 (ja) シート貼付装置及び貼付方法
JP4963692B2 (ja) 半導体ウエハ処理装置及び処理方法
JP6069005B2 (ja) シート貼付装置および貼付方法
JP3186062U (ja) シート剥離装置
JP3225184U (ja) 支持装置
JP6030909B2 (ja) シート貼付装置およびシート貼付方法
JP3225183U (ja) 支持装置
JP7149775B2 (ja) シート貼付装置およびシート貼付方法
JP2011073872A (ja) シート剥離装置及び剥離方法
JP2017216343A (ja) シート貼付装置および貼付方法
JP6145331B2 (ja) シート貼付装置および貼付方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right