JP5545488B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP5545488B2
JP5545488B2 JP2010227239A JP2010227239A JP5545488B2 JP 5545488 B2 JP5545488 B2 JP 5545488B2 JP 2010227239 A JP2010227239 A JP 2010227239A JP 2010227239 A JP2010227239 A JP 2010227239A JP 5545488 B2 JP5545488 B2 JP 5545488B2
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tray
temperature
plasma processing
wafer
stage
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Japanese (ja)
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JP2012084574A5 (enrdf_load_stackoverflow
JP2012084574A (ja
Inventor
正太 前野
翔吾 津野
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Samco Inc
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Samco Inc
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2010227239A 2010-10-07 2010-10-07 プラズマ処理装置 Active JP5545488B2 (ja)

Priority Applications (1)

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JP2010227239A JP5545488B2 (ja) 2010-10-07 2010-10-07 プラズマ処理装置

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JP2010227239A JP5545488B2 (ja) 2010-10-07 2010-10-07 プラズマ処理装置

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JP2012084574A JP2012084574A (ja) 2012-04-26
JP2012084574A5 JP2012084574A5 (enrdf_load_stackoverflow) 2013-08-15
JP5545488B2 true JP5545488B2 (ja) 2014-07-09

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JP2010227239A Active JP5545488B2 (ja) 2010-10-07 2010-10-07 プラズマ処理装置

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014139980A (ja) 2013-01-21 2014-07-31 Hitachi High-Technologies Corp 試料処理装置およびその方法並びに荷電粒子線装置
JP6363927B2 (ja) * 2014-10-07 2018-07-25 大陽日酸株式会社 気相成長装置における基板搬送方法及び装置
CN106505017B (zh) * 2016-10-25 2019-06-25 通富微电子股份有限公司 用于面板级扇出表面处理的工艺系统及方法
JP6735909B2 (ja) * 2017-04-04 2020-08-05 株式会社Ｆｕｊｉ プラズマ発生システム
CN111489994A (zh) * 2019-01-25 2020-08-04 上海和辉光电有限公司 一种上料机构、邦定机和上料方法
CN114765103B (zh) * 2021-01-12 2025-07-25 等离子体成膜有限公司 等离子体处理装置
CN115692276A (zh) * 2021-07-30 2023-02-03 中微半导体设备(上海)股份有限公司 一种晶圆传送装置、气相沉积系统及使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2988167B2 (ja) * 1992-11-27 1999-12-06 安藤電気株式会社 高温槽に加熱キャリアが循環するｉｃ搬送機構
JP3404608B2 (ja) * 1994-09-28 2003-05-12 東芝機械株式会社 荷電ビーム描画装置等の試料温度調整装置及びこの装置に用いられる試料ホルダ
JP4083306B2 (ja) * 1998-08-28 2008-04-30 松下電器産業株式会社 プラズマ処理後におけるリンス方法
JP2001345313A (ja) * 2000-05-31 2001-12-14 Ebara Corp 基板処理装置
JP2007109771A (ja) * 2005-10-12 2007-04-26 Matsushita Electric Ind Co Ltd プラズマ処理装置用のトレイ
JP5145126B2 (ja) * 2008-06-11 2013-02-13 株式会社アルバック 接着装置及び接着方法
JP5417751B2 (ja) * 2008-06-30 2014-02-19 株式会社ニコン 接合装置および接合方法

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