JP5538697B2 - 半導体装置のテスト方法 - Google Patents

半導体装置のテスト方法 Download PDF

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Publication number
JP5538697B2
JP5538697B2 JP2008231892A JP2008231892A JP5538697B2 JP 5538697 B2 JP5538697 B2 JP 5538697B2 JP 2008231892 A JP2008231892 A JP 2008231892A JP 2008231892 A JP2008231892 A JP 2008231892A JP 5538697 B2 JP5538697 B2 JP 5538697B2
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burn
semiconductor device
board
socket
main surface
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JP2008231892A
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Japanese (ja)
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JP2010066091A5 (enExample
JP2010066091A (ja
Inventor
彰 清藤
朋洋 西水
浩治 佐藤
繁 高田
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Renesas Electronics Corp
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Renesas Electronics Corp
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Priority to JP2008231892A priority Critical patent/JP5538697B2/ja
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  • Testing Of Individual Semiconductor Devices (AREA)
JP2008231892A 2008-09-10 2008-09-10 半導体装置のテスト方法 Expired - Fee Related JP5538697B2 (ja)

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JP2008231892A JP5538697B2 (ja) 2008-09-10 2008-09-10 半導体装置のテスト方法

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Application Number Priority Date Filing Date Title
JP2008231892A JP5538697B2 (ja) 2008-09-10 2008-09-10 半導体装置のテスト方法

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JP2010066091A JP2010066091A (ja) 2010-03-25
JP2010066091A5 JP2010066091A5 (enExample) 2011-10-27
JP5538697B2 true JP5538697B2 (ja) 2014-07-02

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JP2008231892A Expired - Fee Related JP5538697B2 (ja) 2008-09-10 2008-09-10 半導体装置のテスト方法

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
KR102842851B1 (ko) 2016-01-08 2025-08-05 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
KR20250126857A (ko) * 2017-03-03 2025-08-25 에어 테스트 시스템즈 카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법
JP6961632B2 (ja) 2019-01-21 2021-11-05 株式会社アドバンテスト バーンインボード及びバーンイン装置
JP7667260B2 (ja) 2020-10-07 2025-04-22 エイアー テスト システムズ 電子試験器
CN121114724A (zh) 2022-12-30 2025-12-12 雅赫测试系统公司 电子测试器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06317630A (ja) * 1993-05-06 1994-11-15 Mitsubishi Electric Corp 半導体恒温加速試験装置用基板
JPH11102756A (ja) * 1997-09-25 1999-04-13 Nippon Avionics Co Ltd Ｉｃソケットの取付装置
JP2003084030A (ja) * 2001-09-14 2003-03-19 Hitachi Ltd 半導体装置の製造方法

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JP2010066091A (ja) 2010-03-25

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