JP2010066091A5 - - Google Patents

Download PDF

Info

Publication number
JP2010066091A5
JP2010066091A5 JP2008231892A JP2008231892A JP2010066091A5 JP 2010066091 A5 JP2010066091 A5 JP 2010066091A5 JP 2008231892 A JP2008231892 A JP 2008231892A JP 2008231892 A JP2008231892 A JP 2008231892A JP 2010066091 A5 JP2010066091 A5 JP 2010066091A5
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
socket
testing
test method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008231892A
Other languages
English (en)
Japanese (ja)
Other versions
JP5538697B2 (ja
JP2010066091A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008231892A priority Critical patent/JP5538697B2/ja
Priority claimed from JP2008231892A external-priority patent/JP5538697B2/ja
Publication of JP2010066091A publication Critical patent/JP2010066091A/ja
Publication of JP2010066091A5 publication Critical patent/JP2010066091A5/ja
Application granted granted Critical
Publication of JP5538697B2 publication Critical patent/JP5538697B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008231892A 2008-09-10 2008-09-10 半導体装置のテスト方法 Expired - Fee Related JP5538697B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008231892A JP5538697B2 (ja) 2008-09-10 2008-09-10 半導体装置のテスト方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008231892A JP5538697B2 (ja) 2008-09-10 2008-09-10 半導体装置のテスト方法

Publications (3)

Publication Number Publication Date
JP2010066091A JP2010066091A (ja) 2010-03-25
JP2010066091A5 true JP2010066091A5 (enExample) 2011-10-27
JP5538697B2 JP5538697B2 (ja) 2014-07-02

Family

ID=42191802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008231892A Expired - Fee Related JP5538697B2 (ja) 2008-09-10 2008-09-10 半導体装置のテスト方法

Country Status (1)

Country Link
JP (1) JP5538697B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
JP7045995B2 (ja) 2016-01-08 2022-04-01 エイアー テスト システムズ 電子試験装置における装置の熱制御のための方法及びシステム
KR20250124891A (ko) 2017-03-03 2025-08-20 에어 테스트 시스템즈 카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법
JP6961632B2 (ja) * 2019-01-21 2021-11-05 株式会社アドバンテスト バーンインボード及びバーンイン装置
CN116457670A (zh) 2020-10-07 2023-07-18 雅赫测试系统公司 电子测试器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06317630A (ja) * 1993-05-06 1994-11-15 Mitsubishi Electric Corp 半導体恒温加速試験装置用基板
JPH11102756A (ja) * 1997-09-25 1999-04-13 Nippon Avionics Co Ltd Ｉｃソケットの取付装置
JP2003084030A (ja) * 2001-09-14 2003-03-19 Hitachi Ltd 半導体装置の製造方法

Similar Documents

Publication Publication Date Title
JP2010066091A5 (enExample)
JP5851878B2 (ja) 半導体モジュールの製造方法
JP2011009514A5 (enExample)
CN203414568U (zh) 功率半导体器件热阻测试装置
CN102393768A (zh) 温度闭环控制装置及测试方法
JP2010287710A5 (ja) 半導体装置の製造方法
CN203773016U (zh) 一种smd-0.5封装功率半导体器件热阻测试装置
JP2009194189A5 (enExample)
CN203773017U (zh) 一种to-39封装功率半导体器件热阻测试装置
CN102163580B (zh) 一种薄型封装体及其制作方法
CN207051431U (zh) 适用于晶圆级测试的治具
JP2010287866A5 (enExample)
JP5538697B2 (ja) 半導体装置のテスト方法
CN101252099A (zh) 温度循环测试装置及利用此装置加热芯片倒装封装结构
KR101173190B1 (ko) 발열 패키지용 테스트 소켓 어셈블리
CN102707100A (zh) 倒扣电气互连衬底的裸芯片测试装置
CN104465551A (zh) 机械压合方式实现电性和散热的封装结构及工艺方法
Hsu et al. Innovative fan-out wafer level package using lamination process and adhered Si wafer on the backside
CN107132470A (zh) 适用于晶圆级测试的治具
JP2011054797A5 (ja) 半導体装置
CN204361085U (zh) 金属引线框高导热倒装片封装结构
CN103716980B (zh) 一种电源模块用正极氧化膜印刷基板
CN104465598A (zh) 金属引线框高导热倒装片封装结构及其工艺方法
CN206250176U (zh) 一种集成电路封装的抗震系统
CN206895087U (zh) 散热装置