JP4388926B2 - 半導体装置のパッケージ構造 - Google Patents
半導体装置のパッケージ構造 Download PDFInfo
- Publication number
- JP4388926B2 JP4388926B2 JP2005336256A JP2005336256A JP4388926B2 JP 4388926 B2 JP4388926 B2 JP 4388926B2 JP 2005336256 A JP2005336256 A JP 2005336256A JP 2005336256 A JP2005336256 A JP 2005336256A JP 4388926 B2 JP4388926 B2 JP 4388926B2
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- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor chip
- electrode
- substrate
- chip
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Description
Package)技術が注目されている。例えば図13に示すように、パッケージ基板10の上に半導体ベアチップ30をマウントし、この半導体ベアチップ30の上にさらに別の半導体ベアチップ31をマウントし、これらの半導体ベアチップ30、31とパッケージ基板10との間をワイヤ60でワイヤボンディングしている(非特許文献1参照)。
日経エレクトロニクス2002,2−11 no.815 p108 「第1部 チップがダメならパッケージがある」
マウントすべき半導体ベアチップの電極端子を接続する内部電極と、半導体ベアチップマウント後の試験時に試験装置の端子が接続される試験用電極と、半導体ベアチップをマウントしたのち前記基材に実装される時に他の部品に接続される実装用電極とを設けた半導体チップマウントサブ基板と、
前記半導体チップマウントサブ基板を、前記基材に搭載した半導体ベアチップの上部に配置するスペーサと、を備え、
前記半導体チップマウントサブ基板と前記基材に搭載された半導体ベアチップを前記基材とともに樹脂封止したことを特徴としている。
20‐半導体パッケージ
21‐半導体パッケージ
22‐半導体パッケージ
30‐半導体ベアチップ
31‐半導体ベアチップ
32‐半導体ベアチップ
33‐半導体ベアチップ
34‐半導体ベアチップ
40‐電極
41‐電極
50‐半導体チップマウントサブ基板
60‐ワイヤ
61‐ワイヤ
70‐インターポーザー
80‐封止樹脂
81‐封止樹脂
90‐スペーサー
100‐半導体チップマウント封止サブ基板
110‐試験用電極
120‐実装用電極
130‐内部電極
Claims (1)
- パッケージ基板(10)と、
前記パッケージ基板(10)の表面に搭載され、ボンディングパッド部を有する第1の半導体チップ(34)と、
前記第1の半導体チップ(34)のボンディングパッド部と前記パッケージ基板(10)とを電気的に接続する第1のワイヤと、
前記第1の半導体チップ(34)の前記ボンディングパッド部がかくれないように前記第1の半導体チップ(34)の表面に配置されたスペーサー(90)と、
前記スペーサー(90)上に搭載され、前記スペーサー(90)よりも大きな半導体チップマウント封止サブ基板(100)とから構成され、
前記半導体チップマウント封止サブ基板(100)は、
a) 第2の半導体チップ(30)と
b) 上面及び下面を有し、前記下面には、前記第2の半導体チップ(30)が搭載されるとともに、第2の半導体チップ(30)と電気的に接続され第1の一辺に沿って前記第1の一辺からは距離をおきつつ前記第1の一辺に接しないように列状に配列された複数の第1の電極(130)が形成され、前記上面には、前記第2の半導体チップ(30)の電極ピッチよりも大きいピッチでアレイ状に配列された複数の第2の電極(110)と、第2の一辺に沿って前記複数の第2の電極(110)よりも小さいピッチで前記第2の一辺からは距離をおきつつ前記第2の一辺に接しないように列状に配列された複数の第3の電極(120)とが形成されたインターポーザー(70)と、
c) 前記インターポーザー(70)の下面と前記第2の半導体チップ(30)とを前記インターポーザーの前記第1の一辺に沿った側面を有するように封止する第1の樹脂とから構成され、
前記半導体チップマウント封止サブ基板(100)は、前記インターポーザー(70)の下面が前記スペーサー(90)に対向するとともに前記第1の樹脂が前記スペーサー(90)に接するように配置され、
前記第3の電極(120)と前記パッケージ基板(10)とは第2のワイヤにより電気的に接続され、
前記パッケージ基板(10)の表面と、前記第1の半導体チップ(34)と、前記第1のワイヤと、前記スペーサー(90)と、前記半導体チップマウント封止サブ基板(100)と、前記第2のワイヤとを封止する、第1の樹脂とは別に行って樹脂封止される第2の樹脂を含む
ことを特徴とする半導体パッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005336256A JP4388926B2 (ja) | 2005-11-21 | 2005-11-21 | 半導体装置のパッケージ構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005336256A JP4388926B2 (ja) | 2005-11-21 | 2005-11-21 | 半導体装置のパッケージ構造 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004164489A Division JP3842272B2 (ja) | 2004-06-02 | 2004-06-02 | インターポーザー、半導体チップマウントサブ基板および半導体パッケージ |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008157557A Division JP4303772B2 (ja) | 2008-06-17 | 2008-06-17 | 半導体パッケージ |
JP2008160559A Division JP4388989B2 (ja) | 2008-06-19 | 2008-06-19 | 半導体チップマウント封止サブ基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006080564A JP2006080564A (ja) | 2006-03-23 |
JP2006080564A5 JP2006080564A5 (ja) | 2007-07-19 |
JP4388926B2 true JP4388926B2 (ja) | 2009-12-24 |
Family
ID=36159708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005336256A Expired - Fee Related JP4388926B2 (ja) | 2005-11-21 | 2005-11-21 | 半導体装置のパッケージ構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4388926B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7545031B2 (en) * | 2005-04-11 | 2009-06-09 | Stats Chippac Ltd. | Multipackage module having stacked packages with asymmetrically arranged die and molding |
US7420206B2 (en) | 2006-07-12 | 2008-09-02 | Genusion Inc. | Interposer, semiconductor chip mounted sub-board, and semiconductor package |
US7638868B2 (en) * | 2006-08-16 | 2009-12-29 | Tessera, Inc. | Microelectronic package |
US8299626B2 (en) | 2007-08-16 | 2012-10-30 | Tessera, Inc. | Microelectronic package |
-
2005
- 2005-11-21 JP JP2005336256A patent/JP4388926B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2006080564A (ja) | 2006-03-23 |
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