JP5524154B2 - 液処理装置及び液処理方法 - Google Patents

液処理装置及び液処理方法 Download PDF

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JP5524154B2
JP5524154B2 JP2011196685A JP2011196685A JP5524154B2 JP 5524154 B2 JP5524154 B2 JP 5524154B2 JP 2011196685 A JP2011196685 A JP 2011196685A JP 2011196685 A JP2011196685 A JP 2011196685A JP 5524154 B2 JP5524154 B2 JP 5524154B2
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tank
liquid
temporary storage
storage container
processing liquid
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JP2013058655A5 (ko
JP2013058655A (ja
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勇一 吉田
康治 ▲高▼▲柳▼
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2011196685A 2011-09-09 2011-09-09 液処理装置及び液処理方法 Active JP5524154B2 (ja)

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JP2011196685A JP5524154B2 (ja) 2011-09-09 2011-09-09 液処理装置及び液処理方法

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JP2011196685A JP5524154B2 (ja) 2011-09-09 2011-09-09 液処理装置及び液処理方法

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JP2013058655A JP2013058655A (ja) 2013-03-28
JP2013058655A5 JP2013058655A5 (ko) 2013-10-17
JP5524154B2 true JP5524154B2 (ja) 2014-06-18

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5698638B2 (ja) * 2011-09-27 2015-04-08 富士フイルム株式会社 液体付与装置及びインクジェット記録装置
JP2014216471A (ja) * 2013-04-25 2014-11-17 大日本印刷株式会社 インプリント装置及びインプリント方法
JP5967045B2 (ja) * 2013-10-02 2016-08-10 東京エレクトロン株式会社 処理液供給装置及び処理液供給方法
JP6436634B2 (ja) * 2014-03-11 2018-12-12 住友重機械工業株式会社 液状の膜材料の吐出装置
JP6425669B2 (ja) * 2015-03-31 2018-11-21 東京エレクトロン株式会社 処理液供給方法、読み取り可能なコンピュータ記憶媒体及び処理液供給装置
US10121685B2 (en) * 2015-03-31 2018-11-06 Tokyo Electron Limited Treatment solution supply method, non-transitory computer-readable storage medium, and treatment solution supply apparatus
JP7161955B2 (ja) * 2019-02-20 2022-10-27 東京エレクトロン株式会社 フィルタウェッティング方法及び処理液供給装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04267981A (ja) * 1991-02-22 1992-09-24 Hitachi Ltd 乾燥装置
JPH0964010A (ja) * 1995-08-25 1997-03-07 M Setetsuku Kk リンス機用温洗浄液供給装置
JPH09131555A (ja) * 1995-11-09 1997-05-20 Nkk Corp ロールコーター塗装装置
JP3340394B2 (ja) * 1998-10-08 2002-11-05 東京エレクトロン株式会社 薬液供給システムおよび基板処理システムおよび基板処理方法
JP2002055460A (ja) * 2000-08-08 2002-02-20 Mecha Enji:Kk レジスト液の気泡除去装置
JP4617586B2 (ja) * 2001-03-22 2011-01-26 株式会社Ｉｈｉ 気泡除去装置
JP4196372B2 (ja) * 2002-12-04 2008-12-17 株式会社メカ・エンジ 粘性流体の気泡除去装置
TWI362059B (en) * 2004-11-25 2012-04-11 Az Electronic Mat Ip Japan Kk Photoresist coating solution supply system and method for supplying photoresist coating solution using thereof, and photoresist coating system using thereof
JP4879253B2 (ja) * 2008-12-04 2012-02-22 東京エレクトロン株式会社 処理液供給装置
JP5038378B2 (ja) * 2009-11-11 2012-10-03 株式会社コガネイ 薬液供給装置および薬液供給方法

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