JP5524154B2 - 液処理装置及び液処理方法 - Google Patents
液処理装置及び液処理方法 Download PDFInfo
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- JP5524154B2 JP5524154B2 JP2011196685A JP2011196685A JP5524154B2 JP 5524154 B2 JP5524154 B2 JP 5524154B2 JP 2011196685 A JP2011196685 A JP 2011196685A JP 2011196685 A JP2011196685 A JP 2011196685A JP 5524154 B2 JP5524154 B2 JP 5524154B2
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- tank
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- processing liquid
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- 239000007788 liquid Substances 0.000 title claims description 249
- 238000012545 processing Methods 0.000 title claims description 201
- 238000003672 processing method Methods 0.000 title claims description 12
- 238000003860 storage Methods 0.000 claims description 141
- 238000000034 method Methods 0.000 claims description 96
- 238000001914 filtration Methods 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 16
- 238000007599 discharging Methods 0.000 claims description 10
- 238000007872 degassing Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 47
- 238000010129 solution processing Methods 0.000 description 23
- 238000012546 transfer Methods 0.000 description 15
- 238000001514 detection method Methods 0.000 description 14
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 10
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011196685A JP5524154B2 (ja) | 2011-09-09 | 2011-09-09 | 液処理装置及び液処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011196685A JP5524154B2 (ja) | 2011-09-09 | 2011-09-09 | 液処理装置及び液処理方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013058655A JP2013058655A (ja) | 2013-03-28 |
JP2013058655A5 JP2013058655A5 (ko) | 2013-10-17 |
JP5524154B2 true JP5524154B2 (ja) | 2014-06-18 |
Family
ID=48134262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011196685A Active JP5524154B2 (ja) | 2011-09-09 | 2011-09-09 | 液処理装置及び液処理方法 |
Country Status (1)
Country | Link |
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JP (1) | JP5524154B2 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5698638B2 (ja) * | 2011-09-27 | 2015-04-08 | 富士フイルム株式会社 | 液体付与装置及びインクジェット記録装置 |
JP2014216471A (ja) * | 2013-04-25 | 2014-11-17 | 大日本印刷株式会社 | インプリント装置及びインプリント方法 |
JP5967045B2 (ja) * | 2013-10-02 | 2016-08-10 | 東京エレクトロン株式会社 | 処理液供給装置及び処理液供給方法 |
JP6436634B2 (ja) * | 2014-03-11 | 2018-12-12 | 住友重機械工業株式会社 | 液状の膜材料の吐出装置 |
JP6425669B2 (ja) * | 2015-03-31 | 2018-11-21 | 東京エレクトロン株式会社 | 処理液供給方法、読み取り可能なコンピュータ記憶媒体及び処理液供給装置 |
US10121685B2 (en) * | 2015-03-31 | 2018-11-06 | Tokyo Electron Limited | Treatment solution supply method, non-transitory computer-readable storage medium, and treatment solution supply apparatus |
JP7161955B2 (ja) * | 2019-02-20 | 2022-10-27 | 東京エレクトロン株式会社 | フィルタウェッティング方法及び処理液供給装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04267981A (ja) * | 1991-02-22 | 1992-09-24 | Hitachi Ltd | 乾燥装置 |
JPH0964010A (ja) * | 1995-08-25 | 1997-03-07 | M Setetsuku Kk | リンス機用温洗浄液供給装置 |
JPH09131555A (ja) * | 1995-11-09 | 1997-05-20 | Nkk Corp | ロールコーター塗装装置 |
JP3340394B2 (ja) * | 1998-10-08 | 2002-11-05 | 東京エレクトロン株式会社 | 薬液供給システムおよび基板処理システムおよび基板処理方法 |
JP2002055460A (ja) * | 2000-08-08 | 2002-02-20 | Mecha Enji:Kk | レジスト液の気泡除去装置 |
JP4617586B2 (ja) * | 2001-03-22 | 2011-01-26 | 株式会社Ihi | 気泡除去装置 |
JP4196372B2 (ja) * | 2002-12-04 | 2008-12-17 | 株式会社メカ・エンジ | 粘性流体の気泡除去装置 |
TWI362059B (en) * | 2004-11-25 | 2012-04-11 | Az Electronic Mat Ip Japan Kk | Photoresist coating solution supply system and method for supplying photoresist coating solution using thereof, and photoresist coating system using thereof |
JP4879253B2 (ja) * | 2008-12-04 | 2012-02-22 | 東京エレクトロン株式会社 | 処理液供給装置 |
JP5038378B2 (ja) * | 2009-11-11 | 2012-10-03 | 株式会社コガネイ | 薬液供給装置および薬液供給方法 |
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2011
- 2011-09-09 JP JP2011196685A patent/JP5524154B2/ja active Active
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Publication number | Publication date |
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JP2013058655A (ja) | 2013-03-28 |
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