JP5500954B2 - 粘着材供給装置及びその製造方法 - Google Patents

粘着材供給装置及びその製造方法 Download PDF

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Publication number
JP5500954B2
JP5500954B2 JP2009264314A JP2009264314A JP5500954B2 JP 5500954 B2 JP5500954 B2 JP 5500954B2 JP 2009264314 A JP2009264314 A JP 2009264314A JP 2009264314 A JP2009264314 A JP 2009264314A JP 5500954 B2 JP5500954 B2 JP 5500954B2
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silicon
adhesive material
material supply
flux
resin layer
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Japanese (ja)
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JP2011108948A5 (enExample
JP2011108948A (ja
Inventor
秀明 坂口
公作 原山
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2009264314A priority Critical patent/JP5500954B2/ja
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Publication of JP2011108948A5 publication Critical patent/JP2011108948A5/ja
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    • H10W72/012—
    • H10W70/655—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

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  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2009264314A 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法 Active JP5500954B2 (ja)

Priority Applications (1)

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JP2009264314A JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009264314A JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Publications (3)

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JP2011108948A JP2011108948A (ja) 2011-06-02
JP2011108948A5 JP2011108948A5 (enExample) 2012-10-04
JP5500954B2 true JP5500954B2 (ja) 2014-05-21

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ID=44232099

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6088789B2 (ja) * 2012-10-26 2017-03-01 新光電気工業株式会社 粘着材供給装置及びその製造方法
KR102060831B1 (ko) 2013-02-27 2019-12-30 삼성전자주식회사 플립 칩 패키징 방법, 그리고 상기 플립 칩 패키징 방법에 적용되는 플럭스 헤드 및 그 제조 방법
KR101575641B1 (ko) 2014-04-21 2015-12-08 주식회사 루멘스 솔더 패터닝 시스템 및 솔더 패터닝 방법
KR102206228B1 (ko) * 2020-03-27 2021-01-22 (주)에스에스피 탄성패드를 이용한 플럭스툴
WO2021194093A1 (ko) * 2020-03-27 2021-09-30 (주) 에스에스피 탄성패드를 이용한 플럭스툴
JP7698537B2 (ja) * 2021-09-22 2025-06-25 ファスフォードテクノロジ株式会社 ディッピング装置、ダイボンディング装置および半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0720383Y2 (ja) * 1987-07-21 1995-05-15 株式会社明電舎 水車ガイドベ−ンの異常検出装置
JP2001135925A (ja) * 1999-11-04 2001-05-18 Nec Corp フラックス供給装置及び供給方法
JP2004047874A (ja) * 2002-07-15 2004-02-12 Nec Semiconductors Kyushu Ltd フラックス転写装置
JP4653787B2 (ja) * 2007-08-08 2011-03-16 株式会社東芝 複製スタンパおよびその製造方法

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JP2011108948A (ja) 2011-06-02

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